DATA SHEET
Product specification
File under Integrated Circuits, IC01
January 1992
INTEGRATED CIRCUITS
TDA1510AQ
24 W BTL or 2 x 12 W stereo car
radio power amplifier
January 1992
2
Philips Semiconductors
Product specification
24 W BTL or 2 x 12 W stereo car radio
power amplifier
TDA1510AQ
GENERAL DESCRIPTION
The TDA1510AQ is a class-B integrated output amplifier encapsulated in a 13-lead single in-line (SlL) plastic power
package. Developed primarily for car radio application, the device can also be used to drive low impedance loads (down
to 1,6
). With a supply voltage (V
P
) of 14,4 V, an output power of 24 W can be delivered into a 4
Bridge Tied Load
(BTL), or when used as a stereo amplifier, 2
12 W into 2
or 2
7 W into 4
.
Features
Flexibility
-
stereo as well as mono BTL
Low offset voltage at the output (important for BTL)
Load dump protection
A.C. short-circuit-safe to ground
Low number, small sized external components
Internal limiting of bandwidth for high frequencies
High output power
Large useable gain variation
Good ripple rejection
Thermal protection
Low stand-by current possibility
High reliability.
QUICK REFERENCE DATA
PACKAGE OUTLINE
TDA1510AQ: 13-lead SIL-bent-to-DIL; plastic power (SOT 141C); SOT141-6; 1996 Aug 01.
PARAMETER
CONDITIONS
SYMBOL
MIN.
TYP.
MAX.
UNIT
Supply voltage range:
operating
V
P
6,0
14,4
18,0
V
non-operating
V
P
-
-
28,0
V
non-operating, load
dump protection
V
P
-
-
45,0
V
Repetitive peak output
current
I
ORM
-
-
4,0
A
Total quiescent current
I
tot
-
75
120
mA
Stand-by current
I
sb
-
-
2
mA
Switch-on current
I
so
0,15
0,35
0,80
mA
Input impedance
pins 1, 2,
12 and 13
|Z
I
|
1
-
-
M
Storage temperature range
T
stg
-
65
-
+
150
C
Crystal temperature
T
c
-
-
150
C
January 1992
3
Philips Semiconductors
Product specification
24 W BTL or 2 x 12 W stereo car radio
power amplifier
TDA1510AQ
Fig.1 Functional diagram; heavy lines indicate signal paths.
January 1992
4
Philips Semiconductors
Product specification
24 W BTL or 2 x 12 W stereo car radio
power amplifier
TDA1510AQ
RATINGS
Limiting values in accordance with the Absolute Maximum System (IEC 134)
PARAMETER
CONDITIONS
SYMBOL
MIN.
MAX.
UNIT
Supply voltage:
operating
pin 10
V
P
-
18
V
non-operating
V
P
-
28
V
non-operating,
load dump protection
during 50 ms
V
P
-
45
V
Peak output current
I
OM
-
6
A
Total power dissipation
see Fig.2
P
tot
Storage temperature range
T
stg
-
65
+
150
C
Crystal temperature
T
c
-
+
150
C
Fig.2 Power derating curves.
January 1992
5
Philips Semiconductors
Product specification
24 W BTL or 2 x 12 W stereo car radio
power amplifier
TDA1510AQ
HEATSINK DESIGN EXAMPLE
The derating of the encapsulation requires the following external heatsink (for sine-wave drive):
(R
th j-mb
) = 3,5 K/W
24 W BTL (4
) or 2
12 W stereo (2
); maximum sine-wave dissipation = 12 W;
T
amb
= 65
C (maximum):
2
7 W stereo (4
); maximum sine-wave dissipation = 6 W; T
amb
= 65
C (maximum):
D.C. CHARACTERISTICS
PARAMETER
CONDITIONS
SYMBOL
MIN.
TYP.
MAX.
UNIT
Supply voltage range
V
P
6,0
14,4
18,0
V
Repetitive peak output current
I
ORM
-
-
4,0
A
Total quiescent current
I
tot
-
75
120
mA
Stand-by current
I
sb
-
-
2
mA
Switch-on current
V
11
V
10
; note 1
I
so
0,15
0,35
0,80
mA
R
th h-a
150
65
12
----------------------
3,5
3,5 K/W
=
=
R
th h-a
150
65
12
----------------------
3,5
10,5 K/W
=
=
January 1992
6
Philips Semiconductors
Product specification
24 W BTL or 2 x 12 W stereo car radio
power amplifier
TDA1510AQ
A.C. CHARACTERISTICS
T
amb
= 25
C; V
P
= 14,4 V; f = 1 kHz; unless otherwise specified
PARAMETER
CONDITIONS
SYMBOL
MIN.
TYP.
MAX.
UNIT
Bridge Tied Load application (BTL)
Output power
with bootstrap
note 6;
R
L
= 4
V
P
= 13,2 V
d
tot
= 0,5%
P
o
-
15,0
-
W
d
tot
= 10%
P
o
-
20,0
-
W
V
P
= 14,4 V
d
tot
= 0,5%
P
o
15,5
18,0
-
W
d
tot
= 10%
P
o
20,0
24,0
-
W
Open loop voltage gain
G
o
-
75
-
dB
Closed loop voltage gain
note 2
G
c
39,5
40,0
40,5
dB
Frequency response
at
-
3 dB; note 3
f
r
-
20 to > 20 k
-
Hz
Input impedance
note 4
|Z
i
|
1
-
-
M
Noise output voltage
(r.m.s. value)
f = 20 Hz to
20 kHz
R
S
= 0
V
n (rms)
-
0,2
-
mV
R
S
= 10
V
n (rms)
-
0,35
0,8
mV
R
S
= 10 k
;
according to
IEC 179 curve A
V
n (rms)
-
0,25
-
mV
Supply voltage ripple rejection
f = 100 Hz; note 5
SVRR
42
50
-
dB
D.C. output offset voltage between
channels
|
V
5-9
|
-
2
50
mV
Power bandwidth
-
1 dB;
d
tot
= 0,5%
B
-
30 to > 40 k
-
Hz
January 1992
7
Philips Semiconductors
Product specification
24 W BTL or 2 x 12 W stereo car radio
power amplifier
TDA1510AQ
Stereo application
Output power; with bootstrap
note 6;
R
L
= 4
V
P
= 13,2 V
d
tot
= 0,5%
P
o
-
4,5
-
W
d
tot
= 10%
P
o
-
6,0
-
W
V
P
= 14,4 V
d
tot
= 0,5%
P
o
4,5
5,5
-
W
d
tot
= 10%
P
o
6,0
7,0
-
W
R
L
= 2
V
P
= 13,2 V
d
tot
= 0,5%
P
o
-
7,5
-
W
d
tot
= 10%
P
o
-
10,0
-
W
V
P
= 14,4 V
d
tot
= 0,5%
P
o
7,75
9,0
-
W
d
tot
= 10%
P
o
10,0
12,0
-
W
Output power; without bootstrap
notes 6, 8 and 9
R
L
= 4
V
P
= 14,4 V
d
tot
= 10%
P
o
-
6
-
W
Frequency response
notes 3 and 6
-
3 dB
f
r
-
40 to > 20 k
-
Hz
Supply voltage ripple rejection
note 5
f = 1 kHz
SVRR
-
50
-
dB
Channel separation
R
S
= 10 k
;
f = 1 kHz
40
50
-
dB
Closed loop voltage gain
note 7
G
c
39,5
40,0
40,5
dB
Noise output voltage
(r.m.s. value)
f = 20 Hz to 20 kHz;
R
S
= 0
V
n (rms)
-
0,15
-
mV
R
S
= 10 k
V
n (rms)
-
0,25
-
mV
R
S
= 10 k
;
according to
IEC179 curve A
V
n (rms)
-
0,2
-
mV
PARAMETER
CONDITIONS
SYMBOL
MIN.
TYP.
MAX.
UNIT
January 1992
8
Philips Semiconductors
Product specification
24 W BTL or 2 x 12 W stereo car radio
power amplifier
TDA1510AQ
Notes to the characteristics
1. If V
11
> V
10
then I
11
must be < 10 mA.
2. Closed loop voltage gain can be chosen between 32 and 56 dB (BTL), and is determined by external components.
3. Frequency response externally fixed.
4. The input impedance in the test circuit (Fig.3) is typ. 100 k
.
5. Supply voltage ripple rejection measured with a source impedance of 0
(maximum ripple amplitude 2 V).
6. Output power is measured directly at the output pins of the IC.
7. Closed loop voltage gain can be chosen between 26 and 50 dB (stereo), and is determined by external components.
8. A resistor of 56 k
between pins 3 and 7 is required for symmetrical clipping.
9. Without bootstrap the 100
F capacitor between pins 5 and 6 and the 100
F capacitor between pins 8 and 9 can
be omitted. Pins 6 and 8 connected to pin 10.
January 1992
9
Philips Semiconductors
Product specification
24 W BTL or 2 x 12 W stereo car radio
power amplifier
TDA1510AQ
APPLICATION INFORMATION
Fig.3 Test and application circuit; Bridge Tied Load (BTL).
(1) belongs to power supply.
Fig.4 Test and application circuit; stereo mode.
(1) belongs to power supply.
January 1992
10
Philips Semiconductors
Product specification
24 W BTL or 2 x 12 W stereo car radio
power amplifier
TDA1510AQ
PACKAGE OUTLINE
UNIT
A
e
1
A
2
b
p
c
D
(1)
E
(1)
Z
(1)
d
e
D
h
L
L
3
m
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC
JEDEC
EIAJ
mm
17.0
15.5
4.6
4.2
0.75
0.60
0.48
0.38
24.0
23.6
20.0
19.6
10
3.4
v
0.8
12.2
11.8
1.7
e
2
5.08
2.4
1.6
E
h
6
2.00
1.45
2.1
1.8
3.4
3.1
4.3
DIMENSIONS (mm are the original dimensions)
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
12.4
11.0
SOT141-6
0
5
10 mm
scale
Q
j
0.25
w
0.03
x
D
L
E
A
c
A
2
m
L
3
Q
w
M
b
p
1
d
D
Z
e
2
e
e
x
h
1
13
j
Eh
non-concave
view B: mounting base side
92-11-17
95-03-11
DBS13P: plastic DIL-bent-SIL power package; 13 leads (lead length 12 mm)
SOT141-6
v
M
B
January 1992
11
Philips Semiconductors
Product specification
24 W BTL or 2 x 12 W stereo car radio
power amplifier
TDA1510AQ
SOLDERING
Introduction
There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our
"IC Package Databook" (order code 9398 652 90011).
Soldering by dipping or by wave
The maximum permissible temperature of the solder is
260
C; solder at this temperature must not be in contact
with the joint for more than 5 seconds. The total contact
time of successive solder waves must not exceed
5 seconds.
The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified maximum storage temperature (T
stg max
). If the
printed-circuit board has been pre-heated, forced cooling
may be necessary immediately after soldering to keep the
temperature within the permissible limit.
Repairing soldered joints
Apply a low voltage soldering iron (less than 24 V) to the
lead(s) of the package, below the seating plane or not
more than 2 mm above it. If the temperature of the
soldering iron bit is less than 300
C it may remain in
contact for up to 10 seconds. If the bit temperature is
between 300 and 400
C, contact may be up to 5 seconds.
DEFINITIONS
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
Data sheet status
Objective specification
This data sheet contains target or goal specifications for product development.
Preliminary specification
This data sheet contains preliminary data; supplementary data may be published later.
Product specification
This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
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