DATA SHEET
Product specification
File under Integrated Circuits, IC01
July 1994
INTEGRATED CIRCUITS
TDA1515BQ
24 W BTL or 2 x 12 W stereo
car radio power amplifier
July 1994
2
Philips Semiconductors
Product specification
24 W BTL or 2 x 12 W stereo
car radio power amplifier
TDA1515BQ
The TDA1515BQ is a monolithic integrated class-B output amplifier in a 13-lead single in-line (SIL) plastic power
package. The device is primarily developed for car radio applications, and also to drive low-impedance loads (down to
1,6
). At a supply voltage V
P
= 14,4 V, an output power of 24 W can be delivered into a 4
BTL (Bridge Tied Load),
or, when used as stereo amplifier, it delivers 2
12 W into 2
or 2
7 W into 4
.
Special features are:
flexibility in use
-
mono BTL as well as stereo
high output power
low offset voltage at the output (important for BTL)
large usable gain variation
very good ripple rejection
internal limited bandwidth for high frequencies
low stand-by current possibility (typ. 1
A), to simplify required switches; TTL drive possible
low number and small sized external components
high reliability.
The following currently required protections are incorporated in the circuit. These protections also have positive influence
on reliability in the applications.
load dump protection
a.c. and d.c. short-circuit safe to ground up to V
P
=
18 V
thermal protection
speaker protection in bridge configuration
SOAR protection
outputs short-circuit safe to ground in BTL
reverse polarity safe.
July 1994
3
Philips Semiconductors
Product specification
24 W BTL or 2 x 12 W stereo
car radio power amplifier
TDA1515BQ
QUICK REFERENCE DATA
PACKAGE OUTLINE
13-lead SIL-bent-to-DIL; plastic power (SOT141C); SOT141-6; 1996 July 19.
Supply voltage range (operating)
V
P
6 to 18 V
Supply voltage (non-operating)
V
P
max.
28 V
Supply voltage (non-operating; load dump protection)
V
P
max.
45 V
Repetitive peak output current
I
ORM
max.
4 A
Total quiescent current
I
tot
typ.
75 mA
Stand-by current
I
sb
typ.
1
A
Switch-on current
I
so
<
100
A
Input impedance
|Z
i
|
>
1 M
Bridge tied load application (BTL)
V
P
=
14,4
13,2 V
Output power at R
L
= 4
(with bootstrap)
d
tot
= 0,5%
P
o
typ.
18
15 W
d
tot
= 10%
P
o
typ.
24
20 W
Supply voltage ripple rejection; R
S
= 0
; f = 100 Hz
RR
typ.
50
50 dB
D.C. output offset voltage between the outputs
|
V
5-9
|
<
50
50 mV
Stereo application
Output power at d
tot
= 10% (with bootstrap)
R
L
= 4
P
o
typ.
7
6 W
R
L
= 2
P
o
typ.
12
10 W
Output power at d
tot
= 0,5% (with bootstrap)
R
L
= 4
P
o
typ.
5,5
4,5 W
R
L
= 2
P
o
typ.
9
7,5 W
Channel separation
>
40
40 dB
Noise output voltage; R
S
= 10 k
; according to IEC curve-A
V
n
typ.
0,2
0,2 mV
July 1994
4
Philips Semiconductors
Product specification
24 W BTL or 2 x 12 W stereo
car radio power amplifier
TDA1515BQ
Fig.1 Internal block diagram; the heavy lines indicate the signal paths.
RATINGS
Limiting values in accordance with the Absolute Maximum System (IEC 134)
Supply voltage; operating (pin 10)
V
P
max.
18 V
Supply voltage; non-operating
V
P
max.
28 V
Supply voltage; during 50 ms (load dump protection)
V
P
max.
45 V
Peak output current
I
OM
max.
6 A
Total power dissipation
see derating curve Fig.2
Storage temperature range
T
stg
-
55 to + 150
C
Crystal temperature
T
c
max.
150
C
A.C. and d.c. short-circuit safe voltage
max.
18 V
Reverse polarity
max.
10 V
July 1994
5
Philips Semiconductors
Product specification
24 W BTL or 2 x 12 W stereo
car radio power amplifier
TDA1515BQ
Fig.2 Power derating curves.
HEATSINK DESIGN EXAMPLE
The derating of 3 K/W of the encapsulation requires the following external heatsink (for sine-wave drive):
24 W BTL (4
) or 2
12 W stereo (2
)
maximum sine-wave dissipation: 12 W
T
amb
=
65
C maximum
2
7 W stereo (4
)
maximum sine-wave dissipation: 6 W
T
amb
=
65
C maximum
R
th h-a
150
65
12
----------------------
3
4 K/W
=
=
=
R
th h-a
150
65
6
----------------------
3
11 K/W
=
=
=
July 1994
6
Philips Semiconductors
Product specification
24 W BTL or 2 x 12 W stereo
car radio power amplifier
TDA1515BQ
D.C. CHARACTERISTICS
A.C. CHARACTERISTICS
T
amb
= 25
C; V
P
= 14,4 V; f = 1 kHz; unless otherwise specified
Supply voltage range (pin 10)
V
P
6 to 18 V
Repetitive peak output current
I
ORM
<
4 A
Total quiescent current
I
tot
typ.
75 mA
Switching level 11:
OFF
V
11
<
1,8 V
ON
V
11
>
3 V
Impedance between pins 10 and 6; 10 and 8 (stand-by position V
11
< 1,8 V)
|Z
OFF
|
>
100 k
Stand-by current at V
11
= 0 to 0,8 V
I
sb
typ.
1
A
<
100
A
Switch-on current (pin 11) at V
11
V
10
(note 1)
I
so
typ.
10
A
<
100
A
Bridge tied load application (BTL); see Fig.3
Output power at R
L
= 4
(with bootstrap)
V
P
= 14,4 V; d
tot
= 0,5%
P
o
>
15,5 W
typ.
18 W
V
P
= 14,4 V; d
tot
= 10%
P
o
>
20 W
typ.
24 W
V
P
= 13,2 V; d
tot
= 0,5%
P
o
typ.
15 W
V
P
= 13,2 V; d
tot
= 10%
P
o
typ.
20 W
Open loop voltage gain
G
o
typ.
75 dB
Closed loop voltage gain (note 2)
G
c
typ.
40 (
0,5) dB
Output power without bootstrap (note 9)
V
P
= 14,4 V; d
tot
= 10%
P
o
typ.
15 W
V
P
= 14,4 V; d
tot
= 0,5%
P
o
typ.
12 W
V
P
= 13,2 V; d
tot
= 10%
P
o
typ.
12 W
V
P
= 13,2 V; d
tot
= 0,5%
P
o
typ.
9 W
Frequency response at
-
3 dB (note 3)
B
20 Hz to min. 20 kHz
Input impedance (note 4)
|Z
i
|
>
1 M
Noise input voltage (r.m.s. value) at f = 20 Hz to 20 kHz
R
S
= 0
V
n(rms)
typ.
0,2 mV
R
S
= 10 k
V
n(rms)
typ.
0,35 mV
<
0,8 mV
R
S
= 10 k
; according to IEC 179 curve A
V
n
typ.
0,25 mV
Supply voltage ripple rejection (note 5)
f = 100 Hz
RR
>
42 dB
typ.
50 dB
July 1994
7
Philips Semiconductors
Product specification
24 W BTL or 2 x 12 W stereo
car radio power amplifier
TDA1515BQ
Notes
1. The internal circuit impedance at pin 11 is
>
5 k
if V
11
>
V
10
.
2. Closed loop voltage gain can be chosen between 32 and 56 dB (BTL), and is determined by external components.
For further gain reduction see Application Report.
3. Frequency response externally fixed.
4. The input impedance in the test circuit (Fig.3) is typ. 100 k
.
5. Supply voltage ripple rejection measured with a source impedance of 0
(maximum ripple amplitude: 2 V).
6. Output power is measured directly at the output pins of the IC.
7. Closed loop voltage gain can be chosen between 26 and 50 dB (stereo), and is determined by external components.
8. A resistor of 56 k
between pins 3 and 7 to reach symmetrical clipping.
9. Without bootstrap the 100
F capacitor between pins 5 and 6 (8 and 9) can be omitted. Pins 6, 8 and 10 have to be
interconnected.
D.C. output offset voltage between the outputs
|
V
5-9
|
<
50 mV
typ.
2 mV
Loudspeaker protection (all conditions)
maximum d.c. voltage (across the load)
|
V
5-9
|
<
1 V
Power bandwidth;
-
1 dB; d
tot
= 0,5%
B
30 Hz to 40 kHz
Stereo application; see Fig.4
Output power at d
tot
= 10%; with bootstrap (note 6)
V
P
= 14,4 V; R
L
= 4
P
o
>
6 W
typ.
7 W
V
P
= 14,4 V; R
L
= 2
P
o
>
10 W
typ.
12 W
V
P
= 13,2 V; R
L
= 4
P
o
typ.
6 W
V
P
= 13,2 V; R
L
= 2
P
o
typ.
10 W
Output power at d
tot
= 0,5%; with bootstrap (note 6)
V
P
= 14,4 V; R
L
= 4
P
o
typ.
5,5 W
V
P
= 14,4 V; R
L
= 2
P
o
typ.
9 W
V
P
= 13,2 V; R
L
= 4
P
o
typ.
4,5 W
V
P
= 13,2 V; R
L
= 2
P
o
typ.
7,5 W
Output power at d
tot
= 10%; without bootstrap
V
P
= 14,4 V; R
L
= 4
(notes 6, 8 and 9)
P
o
typ.
6 W
Frequency response at
-
3 dB (note 3)
B
40 Hz to min. 20 kHz
Supply voltage ripple rejection (note 5)
RR
typ.
50 dB
Channel separation; R
S
= 10 k
; f = 1 kHz
>
40 dB
typ.
50 dB
Closed loop voltage gain (note 7)
G
c
typ.
40 dB
Noise output voltage (r.m.s. value) at f = 20 Hz to 20 kHz
R
S
= 0
V
n(rms)
typ.
0,15 mV
R
S
= 10 k
V
n(rms)
typ.
0,25 mV
R
S
= 10 k
; according to IEC 179 curve A
V
n
typ.
0,2 mV
July 1994
8
Philips Semiconductors
Product specification
24 W BTL or 2 x 12 W stereo
car radio power amplifier
TDA1515BQ
Fig.3 Test/application circuit bridge tied load (BTL).
(1) Belongs to power supply.
handbook, full pagewidth
stand-by switch
0.1
F
100
F
100
F
100 k
100 k
47
F
0.1
F
0.1
F
100 k
100 k
1 k
0.1
F
4.7
10
F
R L
1 mF
1 mF
1 k
0.1
F
4.7
10
F
(1)
VP
TDA1515BQ
MLA320 - 1
R L
4
3
11
10
12
13
2
1
6
5
9
8
7
Fig.4 Test/application circuit stereo.
(1) Belongs to power supply.
July 1994
9
Philips Semiconductors
Product specification
24 W BTL or 2 x 12 W stereo
car radio power amplifier
TDA1515BQ
PACKAGE OUTLINE
UNIT
A
e
1
A
2
b
p
c
D
(1)
E
(1)
Z
(1)
d
e
D
h
L
L
3
m
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC
JEDEC
EIAJ
mm
17.0
15.5
4.6
4.2
0.75
0.60
0.48
0.38
24.0
23.6
20.0
19.6
10
3.4
v
0.8
12.2
11.8
1.7
e
2
5.08
2.4
1.6
E
h
6
2.00
1.45
2.1
1.8
3.4
3.1
4.3
DIMENSIONS (mm are the original dimensions)
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
12.4
11.0
SOT141-6
0
5
10 mm
scale
Q
j
0.25
w
0.03
x
D
L
E
A
c
A
2
m
L
3
Q
w
M
b
p
1
d
D
Z
e
2
e
e
x
h
1
13
j
Eh
non-concave
view B: mounting base side
92-11-17
95-03-11
DBS13P: plastic DIL-bent-SIL power package; 13 leads (lead length 12 mm)
SOT141-6
v
M
B
July 1994
10
Philips Semiconductors
Product specification
24 W BTL or 2 x 12 W stereo
car radio power amplifier
TDA1515BQ
SOLDERING
Introduction
There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our
"IC Package Databook" (order code 9398 652 90011).
Soldering by dipping or by wave
The maximum permissible temperature of the solder is
260
C; solder at this temperature must not be in contact
with the joint for more than 5 seconds. The total contact
time of successive solder waves must not exceed
5 seconds.
The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified maximum storage temperature (T
stg max
). If the
printed-circuit board has been pre-heated, forced cooling
may be necessary immediately after soldering to keep the
temperature within the permissible limit.
Repairing soldered joints
Apply a low voltage soldering iron (less than 24 V) to the
lead(s) of the package, below the seating plane or not
more than 2 mm above it. If the temperature of the
soldering iron bit is less than 300
C it may remain in
contact for up to 10 seconds. If the bit temperature is
between 300 and 400
C, contact may be up to 5 seconds.
DEFINITIONS
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
Data sheet status
Objective specification
This data sheet contains target or goal specifications for product development.
Preliminary specification
This data sheet contains preliminary data; supplementary data may be published later.
Product specification
This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
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