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Электронный компонент: TDA1517

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DATA SHEET
Product specification
Supersedes data of 1995 Dec 15
File under Integrated Circuits, IC01
1998 Apr 28
INTEGRATED CIRCUITS
TDA1517; TDA1517P
2
6 W stereo power amplifier
1998 Apr 28
2
Philips Semiconductors
Product specification
2
6 W stereo power amplifier
TDA1517; TDA1517P
FEATURES
Requires very few external components
High output power
Fixed gain
Good ripple rejection
Mute/standby switch
AC and DC short-circuit safe to ground and V
P
Thermally protected
Reverse polarity safe
Capability to handle high energy on outputs (V
P
= 0 V)
No switch-on/switch-off plop
Electrostatic discharge protection.
GENERAL DESCRIPTION
The TDA1517 is an integrated class-B dual output
amplifier in a plastic single in-line medium power package
with fin (SIL9MPF) and a plastic heat-dissipating dual
in-line package (HDIP18). The device is primarily
developed for multi-media applications.
QUICK REFERENCE DATA
ORDERING INFORMATION
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
V
P
supply voltage
6.0
14.4
18.0
V
I
ORM
repetitive peak output current
-
-
2.5
A
I
q(tot)
total quiescent current
-
40
80
mA
I
sb
standby current
-
0.1
100
A
I
sw
switch-on current
-
-
40
A
|
Z
I
|
input impedance
50
-
-
k
P
o
output power
R
L
= 4
; THD = 0.5%
-
5
-
W
R
L
= 4
; THD = 10%
-
6
-
W
SVRR
supply voltage ripple rejection
f
i
= 100 Hz to 10 kHz
48
-
-
dB
cs
channel separation
40
-
-
dB
G
v
closed loop voltage gain
19
20
21
dB
V
no(rms)
noise output voltage (RMS value)
-
50
-
V
T
c
crystal temperature
-
-
150
C
TYPE
NUMBER
PACKAGE
NAME
DESCRIPTION
VERSION
TDA1517
SIL9MPF
plastic single in-line medium power package with fin; 9 leads
SOT110-1
TDA1517P
HDIP18
plastic heat-dissipating dual in-line package; 18 leads
SOT398-1
1998 Apr 28
3
Philips Semiconductors
Product specification
2
6 W stereo power amplifier
TDA1517; TDA1517P
BLOCK DIAGRAM
Fig.1 Block diagram.
handbook, full pagewidth
mute/stand-by
switch input
MLC351
output 1
15 k
15 k
x 1
VA
stand-by
switch
VP
mute
switch
stand-by
reference
voltage
18 k
18 k
2
k
60
k
mute switch
Cm
power stage
4
8
mute switch
VA
VA
Cm
2
k
60
k
power stage
6
2
7
5
SGND
signal
ground
PGND
output 2
non-inverting
input 1
non-inverting
input 2
9
supply voltage
ripple rejection
output
3
1
TDA1517
mute
reference
voltage
input
reference
voltage
VP
power
ground
(substrate)
1998 Apr 28
4
Philips Semiconductors
Product specification
2
6 W stereo power amplifier
TDA1517; TDA1517P
PINNING
SYMBOL
PIN
DESCRIPTION
-
INV1
1
non-inverting input 1
SGND
2
signal ground
SVRR
3
supply voltage ripple rejection output
OUT1
4
output 1
PGND
5
power ground
OUT2
6
output 2
V
P
7
supply voltage
M/SS
8
mute/standby switch input
-
INV2
9
non-inverting input 2
Fig.2 Pin configuration for SOT110-1.
ndbook, halfpage
MLC352
1
2
3
4
5
6
7
8
9
P
V
OUT2
SGND
INV1
INV2
TDA1517
OUT1
M/SS
SVRR
PGND
Fig.3 Pin configuration for SOT398-1.
Pins 10 to 18 should be connected to GND or floating.
ndbook, halfpage
MLC353
1
2
3
4
5
6
7
8
9
18
17
16
15
14
13
12
11
10
P
V
OUT2
SGND
INV1
INV2
TDA1517P
OUT1
M/SS
SVRR
PGND
FUNCTIONAL DESCRIPTION
The TDA1517 contains two identical amplifiers with
differential input stages. The gain of each amplifier is fixed
at 20 dB. A special feature of the device is the
mute/standby switch which has the following features:
Low standby current (<100
A)
Low mute/standby switching current
(low cost supply switch)
Mute condition.
1998 Apr 28
5
Philips Semiconductors
Product specification
2
6 W stereo power amplifier
TDA1517; TDA1517P
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
THERMAL RESISTANCE
SYMBOL
PARAMETER
CONDITIONS
MIN.
MAX.
UNIT
V
P
supply voltage
-
18
V
V
P(sc)
AC and DC short-circuit safe voltage
-
18
V
V
P(r)
reverse polarity
-
6
V
ERG
O
energy handling capability at outputs
V
P
= 0 V
-
200
mJ
I
OSM
non-repetitive peak output current
-
4
A
I
ORM
repetitive peak output current
-
2.5
A
P
tot
total power dissipation
see Fig.4
-
15
W
T
stg
storage temperature
-
55
+150
C
T
amb
operating ambient temperature
-
40
+85
C
T
c
crystal temperature
-
150
C
SYMBOL
TYPE NUMBER
PARAMETER
VALUE
UNIT
R
th j-c
TDA1517
thermal resistance from junction to case
8
K/W
R
th j-p
TDA1517P
thermal resistance from junction to pins
15
K/W
R
th j-a
TDA1517; TDA1517P thermal resistance from junction to ambient 50
K/W
Fig.4 Power derating curve.
(1) R
th j-c
= 8 K/W.
(2) R
th j-p
= 15 K/W.
handbook, halfpage
25
0
50
150
12
0
MLC354
100
T ( C)
o
amb
P
(W)
18
6
(1)
(2)
1998 Apr 28
6
Philips Semiconductors
Product specification
2
6 W stereo power amplifier
TDA1517; TDA1517P
DC CHARACTERISTICS
V
P
= 14.4 V; T
amb
= 25
C; measured in Fig.6; unless otherwise specified.
Note
1. The circuit is DC adjusted at V
P
= 6 to 18 V and AC operating at V
P
= 8.5 to 18 V.
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
Supply
V
P
supply voltage
note 1
6.0
14.4
18.0
V
I
q(tot)
total quiescent current
-
40
80
mA
V
O
DC output voltage
-
6.95
-
V
Mute/standby switch
V
8
switch-on voltage level
see Fig.5
8.5
-
-
V
Mute condition
V
O
output signal in mute position
V
I(max)
= 1 V; f
i
= 20 Hz to 15 kHz
-
-
2
mV
Standby condition
I
sb
DC current in standby condition
-
-
100
A
V
sw
switch-on current
-
12
40
A
1998 Apr 28
7
Philips Semiconductors
Product specification
2
6 W stereo power amplifier
TDA1517; TDA1517P
AC CHARACTERISTICS
V
P
= 14.4 V; R
L
= 4
; f = 1 kHz; T
amb
= 25
C; measured in Fig.6; unless otherwise specified.
Notes
1. Output power is measured directly at the output pins of the IC.
2. Frequency response externally fixed.
3. Ripple rejection measured at the output with a source impedance of 0
, maximum ripple amplitude of 2 V (p-p) and
a frequency between 100 Hz and 10 kHz.
4. Noise voltage measured in a bandwidth of 20 Hz to 20 kHz.
5. Noise output voltage independent of R
s
(V
I
= 0 V).
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
P
o
output power
THD = 0.5%; note 1
4
5
-
W
THD = 10%; note 1
5.5
6.0
-
W
THD
total harmonic distortion
P
o
= 1 W
-
0.1
-
%
f
lr
low frequency roll-off
at
-
3 dB; note 2
-
45
-
Hz
f
hr
high frequency roll-off
at
-
1 dB
20
-
-
kHz
G
v
closed loop voltage gain
19
20
21
dB
SVRR
supply voltage ripple rejection
note 3
on
48
-
-
dB
mute
48
-
-
dB
standby
80
-
-
dB
|
Z
i
|
input impedance
50
60
75
k
V
no
noise output voltage
on
R
s
= 0
; note 4
-
50
-
V
on
R
s
= 10
; note 4
-
70
100
V
mute
note 5
-
50
-
V
cs
channel separation
R
s
= 10
40
-
-
dB
|
G
v
|
channel unbalance
-
0.1
1
dB
1998 Apr 28
8
Philips Semiconductors
Product specification
2
6 W stereo power amplifier
TDA1517; TDA1517P
Fig.5 Standby, mute and on conditions.
handbook, halfpage
8.5
0
MLC355
V
18
6.4
3.3
2
11
(V)
,,,,,,,
,,,,,,,
,,,,,,,
,,,,,,,
,,,,,,,
,,,,,,,
,,,,,,,
,,,,,,,
ON (I = 40 mA)
P
mute (I = 40 mA)
P
standby (I 100
A)
P
APPLICATION INFORMATION
Fig.6 Application circuit diagram.
handbook, full pagewidth
MLC356
100 nF
P
V
TDA1517
8
7
standby switch
220 nF
input 1
1000
F
1000
F
input
reference
voltage
2
5
signal
ground
power
ground
1
9
220 nF
input 2
4
6
3
2200
F
internal
1/2 VP
100
F
60 k
60 k
20 dB
20 dB
1998 Apr 28
9
Philips Semiconductors
Product specification
2
6 W stereo power amplifier
TDA1517; TDA1517P
PACKAGE OUTLINES
UNIT
A
A
max.
2
A
3
b
1
D
1
b
2
b
c
D
(1)
E
(1)
Z
max.
(1)
e
L
P
P
1
q
1
q
2
q
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC
JEDEC
EIAJ
mm
18.5
17.8
3.7
8.7
8.0
A
4
15.8
15.4
1.40
1.14
0.67
0.50
1.40
1.14
0.48
0.38
21.8
21.4
21.4
20.7
6.48
6.20
3.4
3.2
2.54
1.0
5.9
5.7
4.4
4.2
3.9
3.4
15.1
14.9
Q
1.75
1.55
DIMENSIONS (mm are the original dimensions)
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
2.75
2.50
SOT110-1
92-11-17
95-02-25
0
5
10 mm
scale
0.25
w
D
E
A
A
c
A
2
3
A
4
q
1
q
2
L
Q
w
M
b
b
1
b
2
D
1
P
q
1
Z
e
1
9
P
seating plane
pin 1 index
SIL9MPF: plastic single in-line medium power package with fin; 9 leads
SOT110-1
1998 Apr 28
10
Philips Semiconductors
Product specification
2
6 W stereo power amplifier
TDA1517; TDA1517P
UNIT
A
max.
1
2
b
1
(1)
(1)
(1)
b
2
c
D
E
e
M
Z
H
L
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC
JEDEC
EIAJ
mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
SOT398-1
94-04-13
95-01-25
A
min.
A
max.
b
max.
w
M
E
e
1
1.40
1.14
0.67
0.50
0.47
0.38
21.85
21.35
6.5
6.2
3.9
3.1
0.25
2.54
7.62
8.32
8.02
8.7
7.7
1.0
4.7
0.51
3.7
inches
0.06
0.04
0.03
0.02
0.02
0.01
1.05
0.75
0.04
0.03
0.87
0.84
0.26
0.24
0.15
0.12
0.01
0.10
0.30
0.33
0.32
0.34
0.30
0.04
0.19
0.02
0.15
M
H
c
(e )
1
M
E
w
M
b
1
b
2
e
A
A
1
A
2
L
seating plane
Z
D
E
18
1
10
9
b
pin 1 index
0
5
10 mm
scale
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
HDIP18: plastic heat-dissipating dual in-line package; 18 leads
SOT398-1
1998 Apr 28
11
Philips Semiconductors
Product specification
2
6 W stereo power amplifier
TDA1517; TDA1517P
SOLDERING
Introduction
There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our
"Data Handbook IC26; Integrated Circuit Packages"
(order code 9398 652 90011).
Soldering by dipping or by wave
The maximum permissible temperature of the solder is
260
C; solder at this temperature must not be in contact
with the joint for more than 5 seconds. The total contact
time of successive solder waves must not exceed
5 seconds.
The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified maximum storage temperature (T
stg max
). If the
printed-circuit board has been pre-heated, forced cooling
may be necessary immediately after soldering to keep the
temperature within the permissible limit.
Repairing soldered joints
Apply a low voltage soldering iron (less than 24 V) to the
lead(s) of the package, below the seating plane or not
more than 2 mm above it. If the temperature of the
soldering iron bit is less than 300
C it may remain in
contact for up to 10 seconds. If the bit temperature is
between 300 and 400
C, contact may be up to 5 seconds.
DEFINITIONS
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
Data sheet status
Objective specification
This data sheet contains target or goal specifications for product development.
Preliminary specification
This data sheet contains preliminary data; supplementary data may be published later.
Product specification
This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
Internet: http://www.semiconductors.philips.com
Philips Semiconductors a worldwide company
Philips Electronics N.V. 1998
SCA59
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
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Printed in The Netherlands
545102/25/03/pp12
Date of release: 1998 Apr 28
Document order number:
9397 750 03772