ChipFind - документация

Электронный компонент: TDA1519A

Скачать:  PDF   ZIP
DATA SHEET
Product specification
File under Integrated Circuits, IC01
May 1992
INTEGRATED CIRCUITS
TDA1519A
22 W BTL or 2 x 11 W stereo car
radio power amplifier
May 1992
2
Philips Semiconductors
Product specification
22 W BTL or 2 x 11 W stereo car radio
power amplifier
TDA1519A
GENERAL DESCRIPTION
The TDA1519A is an integrated class-B dual output amplifier in a 9-lead single in-line (SIL) plastic power package.
The device is primarily developed for car radio applications.
Features
Requires very few external components for Bridge Tied
Load (BTL)
Stereo or BTL application
High output power
Low offset voltage at output (important for BTL)
Fixed gain
Good ripple rejection
Mute/stand-by switch
Load dump protection
AC and DC short-circuit-safe to ground and V
P
Thermally protected
Reverse polarity safe
Capability to handle high energy on outputs (V
P
=
0 V)
No switch-on/switch-off plop
Protected against electrostatic discharge
Low thermal resistance
Identical inputs (inverting and non-inverting)
Compatible with TDA1519B (except output power).
QUICK REFERENCE DATA
PARAMETER
CONDITIONS
SYMBOL
MIN.
TYP.
MAX.
UNIT
Supply voltage range
operating
V
P
6.0
14.4
17.5
V
non-operating
V
P
-
-
30
V
load dump protected
V
P
-
-
45
V
Repetitive peak output current
I
ORM
-
-
4
A
Total quiescent current
I
tot
-
40
80
mA
Stand-by current
I
sb
-
0.1
100
A
Switch-on current
I
sw
-
-
40
A
Input impedance
BTL
|Z
I
|
25
-
-
k
stereo
|Z
I
|
50
-
-
k
Stereo application
Output power
THD = 10%; 4
P
o
-
6
-
W
THD = 10%; 2
P
o
-
11
-
W
Channel separation
40
-
-
dB
Noise output voltage
V
no(rms)
-
150
-
V
May 1992
3
Philips Semiconductors
Product specification
22 W BTL or 2 x 11 W stereo car radio
power amplifier
TDA1519A
PACKAGE OUTLINES
9 lead SIL; plastic power (SOT131); SOT131-2; 1996 July 22.
9-lead SIL-bent-to-DIL; plastic power (SOT157); SOT157-2; 1996 July 22.
BTL application
Output power
THD = 10%; 4
P
o
-
22
-
W
Supply voltage ripple rejection
R
S
= 0
f = 100 Hz
RR
34
-
-
dB
f = 1 kHz to 10 kHz
RR
48
-
-
dB
DC output offset voltage
|
V
0
|
-
-
250
mV
Crystal temperature
T
c
-
-
150
C
PARAMETER
CONDITIONS
SYMBOL
MIN.
TYP.
MAX.
UNIT
May 1992
4
Philips Semiconductors
Product specification
22 W BTL or 2 x 11 W stereo car radio
power amplifier
TDA1519A
Fig.1 Block diagram.
May 1992
5
Philips Semiconductors
Product specification
22 W BTL or 2 x 11 W stereo car radio
power amplifier
TDA1519A
PINNING
FUNCTIONAL DESCRIPTION
The TDA1519A contains two identical amplifiers with differential input stages. The gain of each amplifier is fixed at 40 dB.
A special feature of this device is the mute/stand-by switch which has the following features:
Low stand-by current (
<
100
A)
Low mute/stand-by switching current (low cost supply switch)
Mute condition.
RATINGS
Limiting values in accordance with the Absolute Maximum System (IEC 134)
1
NINV
non-inverting input
2
GND1
ground (signal)
3
RR
supply voltage ripple rejection
4
OUT1
output 1
5
GND2
ground (substrate)
6
OUT2
output 2
7
V
P
positive supply voltage
8
M/SS
mute/stand-by switch
9
INV
inverting input
PARAMETER
CONDITIONS
SYMBOL
MIN.
MAX.
UNIT
Supply voltage
operating
V
P
-
17.5
V
non-operating
V
P
-
30
V
load dump protected
during 50 ms;
t
r
2.5 ms
V
P
-
45
V
AC and DC short-circuit-safe voltage
V
PSC
-
18
V
Reverse polarity
V
PR
-
6
V
Energy handling capability at outputs
V
P
= 0 V
-
200
mJ
Non-repetitive peak output current
I
OSM
-
6
A
Repetitive peak output current
I
ORM
-
4
A
Total power dissipation
see Fig.2
P
tot
-
25
W
Crystal temperature
T
c
-
150
C
Storage temperature range
T
stg
-
55
+
150
C
May 1992
6
Philips Semiconductors
Product specification
22 W BTL or 2 x 11 W stereo car radio
power amplifier
TDA1519A
DC CHARACTERISTICS
V
P
=
14.4 V; T
amb
=
25
C; measurements taken using Fig.3; unless otherwise specified
PARAMETER
CONDITIONS
SYMBOL
MIN.
TYP.
MAX.
UNIT
Supply
Supply voltage range
note 1
V
P
6.0
14.4
17.5
V
Total quiescent current
I
tot
-
40
80
mA
DC output voltage
note 2
V
O
-
6.95
-
V
DC output offset voltage
|
V
4-6
|
-
-
250
mV
Mute/stand-by switch
Switch-on voltage level
V
ON
8.5
-
-
V
Mute condition
V
mute
3.3
-
6.4
V
Output signal in mute position
V
I
= 1 V (max.);
f = 20 Hz to
15 kHz
V
O
-
-
20
mV
DC output offset voltage
|
V
4-6
|
-
-
250
mV
Fig.2 Power derating curve.
May 1992
7
Philips Semiconductors
Product specification
22 W BTL or 2 x 11 W stereo car radio
power amplifier
TDA1519A
AC CHARACTERISTICS
V
P
=
14.4 V; R
L
=
4
; f
=
1 kHz; T
amb
=
25
C; measurements taken using Fig.3; unless otherwise specified
Stand-by condition
V
sb
0
-
2
V
DC current in stand-by condition
I
sb
-
-
100
A
Switch-on current
I
sw
-
12
40
A
PARAMETER
CONDITIONS
SYMBOL
MIN.
TYP.
MAX.
UNIT
Stereo application
Output power
note 3
THD = 0.5%
P
o
4
5
-
W
THD = 10%
P
o
5.5
6.0
-
W
Output power at R
L
= 2
note 3
THD = 0.5%
P
o
7.5
8.5
-
W
THD = 10%
P
o
10
11
-
W
Total harmonic distortion
P
o
= 1 W
THD
-
0.1
-
%
Low frequency roll-off
note 4
-
3 dB
f
L
-
45
-
Hz
High frequency roll-off
-
1 dB
f
H
20
-
-
kHz
Closed loop voltage gain
G
v
39
40
41
dB
Supply voltage ripple rejection
ON
notes 5 and 6
RR
40
-
-
dB
ON
notes 5 and 7
RR
45
-
-
dB
mute
notes 5 and 8
RR
45
-
-
dB
stand-by
notes 5 and 8
RR
80
-
-
dB
Input impedance
|Z
i
|
50
60
75
k
Noise output voltage
(RMS value)
note 9
ON
R
S
= 0
V
no(rms)
-
150
-
V
ON
R
S
= 10 k
V
no(rms)
-
250
500
V
mute
note 10
V
no(rms)
-
120
-
V
Channel separation
R
S
= 10 k
40
-
-
dB
Channel unbalance
|
G
v
|
-
0.1
1
dB
PARAMETER
CONDITIONS
SYMBOL
MIN.
TYP.
MAX.
UNIT
May 1992
8
Philips Semiconductors
Product specification
22 W BTL or 2 x 11 W stereo car radio
power amplifier
TDA1519A
AC CHARACTERISTICS
V
P
=
14.4 V; R
L
=
4
; f
=
1 kHz; T
amb
=
25
C; measurements taken using Fig.4; unless otherwise specified
Notes to the characteristics
1. The circuit is DC adjusted at V
P
= 6 V to 17.5 V and AC operating at V
P
=
8.5 V to 17.5 V.
2. At 17.5 V
<
V
P
<
30 V the DC output voltage
V
P
/2.
3. Output power is measured directly at the output pins of the IC.
4. Frequency response externally fixed.
5. Ripple rejection measured at the output with a source impedance of 0
(maximum ripple amplitude of 2 V).
6. Frequency f
=
100 Hz.
7. Frequency between 1 kHz and 10 kHz.
8. Frequency between 100 Hz and 10 kHz.
9. Noise voltage measured in a bandwidth of 20 Hz to 20 kHz.
10. Noise output voltage independent of R
S
(V
I
= 0 V).
PARAMETER
CONDITIONS
SYMBOL
MIN.
TYP.
MAX.
UNIT
BTL application
Output power
note 3
THD = 0.5%
P
o
15
17
-
W
THD = 10%
P
o
20
22
-
W
Output power at V
P
= 13.2 V
note 3
THD = 0.5%
P
o
-
13
-
W
THD = 10%
P
o
-
17.5
-
W
Total harmonic distortion
P
o
= 1 W
THD
-
0.1
-
%
Power bandwidth
THD = 0.5%;
P
o
=
-
1 dB;
35 to
w.r.t. 15 W
B
w
-
15 000
-
Hz
Low frequency roll-off
note 4
-
1 dB
f
L
-
45
-
Hz
High frequency roll-off
-
1 dB
f
H
20
-
-
kHz
Closed loop voltage gain
G
v
45
46
47
dB
Supply voltage ripple rejection
ON
notes 5 and 6
RR
34
-
-
dB
ON
notes 5 and 7
RR
48
-
-
dB
mute
notes 5 and 8
RR
48
-
-
dB
stand-by
notes 5 and 8
RR
80
-
-
dB
Input impedance
|Z
i
|
25
30
38
k
Noise output voltage
(RMS value)
note 9
ON
R
S
= 0
V
no(rms)
-
200
-
V
ON
R
S
= 10 k
V
no(rms)
-
350
700
V
mute
note 10
V
no(rms)
-
180
-
V
May 1992
9
Philips Semiconductors
Product specification
22 W BTL or 2 x 11 W stereo car radio
power amplifier
TDA1519A
APPLICATION INFORMATION
Fig.3 Stereo application circuit diagram.
Fig.4 BTL application circuit diagram.
May 1992
10
Philips Semiconductors
Product specification
22 W BTL or 2 x 11 W stereo car radio
power amplifier
TDA1519A
Fig.5 Total quiescent current (I
tot
) as a function of supply voltage (V
P
).
Fig.6 Output power (P
o
) as a function of supply voltage (V
P
) for BTL application at R
L
=
4
; f
=
1 kHz.
May 1992
11
Philips Semiconductors
Product specification
22 W BTL or 2 x 11 W stereo car radio
power amplifier
TDA1519A
Fig.7
Total harmonic distortion (THD) as a function of output power (P
o
) for BTL application at R
L
=
4
;
f
=
1 kHz.
Fig.8
Total harmonic distortion (THD) as a function of operating frequency (f) for BTL application at R
L
=
4
;
P
o
=
1 W.
May 1992
12
Philips Semiconductors
Product specification
22 W BTL or 2 x 11 W stereo car radio
power amplifier
TDA1519A
PACKAGE OUTLINES
UNIT
A
b
max.
b
p
2
c
D
(1)
E
(1)
Z
(1)
d
e
D
h
L
j
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC
JEDEC
EIAJ
mm
4.6
4.2
1.1
0.75
0.60
0.48
0.38
24.0
23.6
20.0
19.6
10
2.54
12.2
11.8
3.4
3.1
A
max.
1
2.0
E
h
6
2.00
1.45
2.1
1.8
DIMENSIONS (mm are the original dimensions)
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
17.2
16.5
SOT131-2
92-11-17
95-03-11
0
5
10 mm
scale
Q
0.25
w
0.03
x
D
L
A
E
c
A 2
Q
w
M
b
p
d
D
Z
e
x
h
1
9
Eh
non-concave
seating plane
1
b
j
SIL9P: plastic single in-line power package; 9 leads
SOT131-2
view B: mounting base side
B
May 1992
13
Philips Semiconductors
Product specification
22 W BTL or 2 x 11 W stereo car radio
power amplifier
TDA1519A
UNIT
A
A
e
1
2
b
p
c
D
(1)
E
(1)
Z
(1)
d
e
D
h
L
L
3
m
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC
JEDEC
EIAJ
mm
17.0
15.5
4.6
4.2
0.75
0.60
0.48
0.38
24.0
23.6
20.0
19.6
10
5.08
12.2
11.8
2.54
e
2
5.08
2.4
1.6
E
h
6
2.00
1.45
0.8
3.4
3.1
4.3
DIMENSIONS (mm are the original dimensions)
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
12.4
11.0
SOT157-2
0
5
10 mm
scale
v
2.1
1.8
Q
j
0.25
w
0.03
x
D
L
E
A
c
A
2
L
3
Q
w
M
b
p
1
d
D
Z
e
e
x
h
1
9
j
Eh
non-concave
92-10-12
95-03-11
DBS9P: plastic DIL-bent-SIL power package; 9 leads (lead length 12 mm)
SOT157-2
B
view B: mounting base side
m
2
e
v
M
May 1992
14
Philips Semiconductors
Product specification
22 W BTL or 2 x 11 W stereo car radio
power amplifier
TDA1519A
SOLDERING
Introduction
There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our
"IC Package Databook" (order code 9398 652 90011).
Soldering by dipping or by wave
The maximum permissible temperature of the solder is
260
C; solder at this temperature must not be in contact
with the joint for more than 5 seconds. The total contact
time of successive solder waves must not exceed
5 seconds.
The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified maximum storage temperature (T
stg max
). If the
printed-circuit board has been pre-heated, forced cooling
may be necessary immediately after soldering to keep the
temperature within the permissible limit.
Repairing soldered joints
Apply a low voltage soldering iron (less than 24 V) to the
lead(s) of the package, below the seating plane or not
more than 2 mm above it. If the temperature of the
soldering iron bit is less than 300
C it may remain in
contact for up to 10 seconds. If the bit temperature is
between 300 and 400
C, contact may be up to 5 seconds.
DEFINITIONS
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
Data sheet status
Objective specification
This data sheet contains target or goal specifications for product development.
Preliminary specification
This data sheet contains preliminary data; supplementary data may be published later.
Product specification
This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.