Document Outline
- GENERAL DESCRIPTION
- QUICK REFERENCE DATA
- PACKAGE OUTLINE
- PINNING
- FUNCTIONAL DESCRIPTION
- RATINGS
- DC CHARACTERISTICS
- AC CHARACTERISTICS
- APPLICATION INFORMATION
- PACKAGE OUTLINE
- SOLDERING
- DEFINITIONS
- LIFE SUPPORT APPLICATIONS
DATA SHEET
Product specification
File under Integrated Circuits, IC01
July 1994
INTEGRATED CIRCUITS
TDA1552Q
2 x 22 W BTL stereo car radio
power amplifier
July 1994
2
Philips Semiconductors
Product specification
2 x 22 W BTL stereo car radio power
amplifier
TDA1552Q
GENERAL DESCRIPTION
The TDA1552Q is an integrated class-B output amplifier in a 13-lead single-in-line (SIL) plastic power package.
The circuit contains 2 x 22 W amplifiers in Bridge Tied Load (BTL) configuration. The device is primarily developed for
car radio applications.
Features
Requires very few external components
High output power
Low offset voltage at outputs
Fixed gain
Good ripple rejection
Mute/stand-by switch
Load dump protection
AC and DC short-circuit-safe to ground and V
P
Thermally protected
Reverse polarity safe
Capability to handle high energy on outputs (V
P
= 0 V)
Protected against electrostatic discharge
No switch-on/switch-off plop
Low thermal resistance
Flexible leads.
QUICK REFERENCE DATA
PACKAGE OUTLINE
13-lead SIL-bent-to-DIL; plastic power (SOT141R); SOT 141-6; 1996 July 23.
PARAMETER
CONDITIONS
SYMBOL
MIN.
TYP.
MAX.
UNIT
Supply voltage range
operating
V
P
6.0
14.4
18.0
V
non-operating
V
P
-
-
30
V
load dump protected
V
P
-
-
45
V
Repetitive peak output
current
I
ORM
-
-
4
A
Total quiescent current
I
tot
-
80
160
mA
Stand-by current
I
sb
-
0.1
100
A
Switch-on current
I
sw
-
-
60
A
Input impedance
|Z
I
|
50
60
75
k
Junction temperature
T
j
-
-
150
C
Stereo application
Output power
R
L
= 4
; THD = 10% P
o
20
22
-
W
Supply voltage ripple
rejection
R
S
= 0
f = 100 Hz to 10 kHz
RR
48
-
-
dB
DC output offset voltage
|
V
O
|
-
-
150
mV
Channel separation
40
-
-
dB
Channel unbalance
|
G
v
|
-
-
1
dB
July 1994
3
Philips Semiconductors
Product specification
2 x 22 W BTL stereo car radio power
amplifier
TDA1552Q
Fig.1 Block diagram.
handbook, full pagewidth
mute/stand-by
MLB952
output 1A
Vref
x1
VA
stand-by
switch
VP
mute
switch
stand-by
reference
voltage
3
10
VP1
VP2
18 k
2
k
18 k
15 k
15 k
2
k
18 k
2
k
18 k
2
k
60
k
60
k
mute switch
VA
Cm
power stage
mute switch
VA
Cm
power stage
4
6
11
12
mute switch
VA
Cm
power stage
mute switch
VA
Cm
power stage
9
7
Vref
2
5
8
ground (signal)
GND1
GND2
power ground (substrate)
output 2B
output 2A
not connected
output 1B
input 1
input 2
13
1
TDA1552Q
July 1994
4
Philips Semiconductors
Product specification
2 x 22 W BTL stereo car radio power
amplifier
TDA1552Q
PINNING
FUNCTIONAL DESCRIPTION
The TDA1552Q contains two identical amplifiers with differential input stages and can be used for bridge applications.
The gain of each amplifier is fixed at 26 dB. A special feature of this device is:
Mute/stand-by switch
low stand-by current (< 100
A)
low mute/stand-by switching current (low cost supply switch)
mute facility.
RATINGS
Limiting values in accordance with the Absolute Maximum System (IEC 134)
1
IP1
input 1
8
GND2
power ground 2 (substrate)
2
GND
ground (signal)
9
OUT2B
output 2B
3
V
P1
positive supply voltage 1
10
V
P2
positive supply voltage 2
4
OUT1A
output 1A
11
M/SS
mute/stand-by switch
5
GND1
power ground 1 (substrate)
12
n.c.
not connected
6
OUT1B
output 1B
13
IP2
input 2
7
OUT2A
output 2A
PARAMETER
CONDITIONS
SYMBOL
MIN.
MAX.
UNIT
Supply voltage
operating
V
P
-
18
V
non-operating
V
P
-
30
V
load dump protected
during 50 ms;
t
r
2.5 ms
V
P
-
45
V
Non-repetitive peak output current
I
OSM
-
6
A
Repetitive peak output current
I
ORM
-
4
A
Storage temperature range
T
stg
-
55
+
150
C
Junction temperature
T
j
-
150
C
AC and DC short-circuit-safe voltage
V
PSC
-
18
V
Energy handling capability at outputs
V
P
= 0 V
-
200
mJ
Reverse polarity
V
PR
-
6
V
Total power dissipation
see Fig.2
P
tot
-
60
W
July 1994
5
Philips Semiconductors
Product specification
2 x 22 W BTL stereo car radio power
amplifier
TDA1552Q
Fig.2 Power derating curve.
July 1994
6
Philips Semiconductors
Product specification
2 x 22 W BTL stereo car radio power
amplifier
TDA1552Q
DC CHARACTERISTICS
V
P
= 14.4 V; T
amb
= 25
C; measurements taken using Fig.3; unless otherwise specified
PARAMETER
CONDITIONS
SYMBOL
MIN.
TYP.
MAX.
UNIT
Supply
Supply voltage range
note 1
V
P
6.0
14.4
18.0
V
Total quiescent current
I
tot
-
80
160
mA
DC output voltage
note 2
V
O
-
6.9
-
V
DC output offset voltage
|
V
O
|
-
-
150
mV
Mute/stand-by switch
Switch-on voltage level
V
ON
8.5
-
-
V
Mute condition
V
mute
3.3
-
6.4
V
Output signal in mute
V
I
= 1 V (max);
position
f = 1 kHz
V
O
-
-
2
mV
DC output offset voltage
(between pins 4 to 6 and 7 to 9)
|
V
O
|
-
-
150
mV
Stand-by condition
V
sb
0
-
2
V
DC current in
V
II
< 0.5 V
I
sb
-
-
100
A
stand-by condition
0.5 V
V
II
< 2 V
I
sb
-
-
500
A
Switch-on current
I
sw
-
25
60
A
Supply current
short-circuit
to GND
note 3
I
P
-
5.5
-
mA
July 1994
7
Philips Semiconductors
Product specification
2 x 22 W BTL stereo car radio power
amplifier
TDA1552Q
AC CHARACTERISTICS
V
P
= 14.4 V; R
L
= 4
; f = 1 kHz; T
amb
= 25
C; measurements taken using Fig.3; unless otherwise specified
Notes to the characteristics
1. The circuit is DC adjusted at V
P
= 6 V to 18 V and AC operating at V
P
= 8.5 V to 18 V.
2. At 18 V < V
P
< 30 V the DC output voltage
V
P
/2.
3. Conditions:
a) V
11
= 0 V
b) short-circuit to GND
c) switch V
11
to MUTE or ON condition (rise time
10
s).
4. Frequency response externally fixed.
5. Ripple rejection measured at the output with a source impedance of 0
(maximum ripple amplitude of 2 V).
6. Frequency f = 100 Hz.
7. Frequency between 1 kHz and 10 kHz.
8. Noise voltage measured in a bandwidth of 20 Hz to 20 kHz.
9. Noise output voltage independent of R
S
(V
I
= 0 V).
PARAMETER
CONDITIONS
SYMBOL
MIN.
TYP.
MAX.
UNIT
Output power
THD = 0.5%
P
o
15
17
-
W
THD = 10%
P
o
20
22
-
W
Output power at V
P
= 13.2 V
THD = 0.5%
P
o
-
12
-
W
THD = 10%
P
o
-
17
-
W
Total harmonic distortion
P
o
= 1 W
THD
-
0.1
-
%
Power bandwidth
THD = 0.5%
P
o
=
-
1 dB
w.r.t. 15 W
B
w
-
20 to
-
Hz
15000
Low frequency roll-off
note 4
-
1 dB
f
L
-
25
-
Hz
High frequency roll-off
-
1 dB
f
H
20
-
-
kHz
Closed loop voltage gain
G
v
25
26
27
dB
Supply voltage ripple rejection
notes 5, 6
RR
42
-
-
dB
ON
notes 5, 7
RR
48
-
-
dB
mute
notes 5, 6, 7
RR
48
-
-
dB
stand-by
notes 5, 6, 7
RR
80
-
-
dB
Input impedance
|Z
i
|
50
60
75
k
Noise output voltage
(RMS value)
ON
R
S
= 0
; note 8
V
no(rms)
-
70
120
V
ON
R
S
= 10 k
; note 8 V
no(rms)
-
100
-
V
mute
notes 8, 9
V
no(rms)
-
60
-
A
Channel separation
40
-
-
dB
Channel unbalance
|
G
v
|
-
-
1
dB
July 1994
8
Philips Semiconductors
Product specification
2 x 22 W BTL stereo car radio power
amplifier
TDA1552Q
APPLICATION INFORMATION
Fig.3 Application circuit diagram.
handbook, full pagewidth
MLB951
100
nF
mute/stand-by switch
12
11
3
10
220 nF
1
4
6
220 nF
13
9
7
5
8
VP
TDA1552Q
2200
F
14.4 V
not connected
R = 4
L
R = 4
L
60
k
60
k
reference
voltage
2
ground (signal)
input 2
input 1
power ground (substrate)
July 1994
9
Philips Semiconductors
Product specification
2 x 22 W BTL stereo car radio power
amplifier
TDA1552Q
PACKAGE OUTLINE
UNIT
A
e
1
A
2
b
p
c
D
(1)
E
(1)
Z
(1)
d
e
D
h
L
L
3
m
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC
JEDEC
EIAJ
mm
17.0
15.5
4.6
4.2
0.75
0.60
0.48
0.38
24.0
23.6
20.0
19.6
10
3.4
v
0.8
12.2
11.8
1.7
e
2
5.08
2.4
1.6
E
h
6
2.00
1.45
2.1
1.8
3.4
3.1
4.3
DIMENSIONS (mm are the original dimensions)
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
12.4
11.0
SOT141-6
0
5
10 mm
scale
Q
j
0.25
w
0.03
x
D
L
E
A
c
A
2
m
L
3
Q
w
M
b
p
1
d
D
Z
e
2
e
e
x
h
1
13
j
Eh
non-concave
view B: mounting base side
92-11-17
95-03-11
DBS13P: plastic DIL-bent-SIL power package; 13 leads (lead length 12 mm)
SOT141-6
v
M
B
July 1994
10
Philips Semiconductors
Product specification
2 x 22 W BTL stereo car radio power
amplifier
TDA1552Q
SOLDERING
Introduction
There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our
"IC Package Databook" (order code 9398 652 90011).
Soldering by dipping or by wave
The maximum permissible temperature of the solder is
260
C; solder at this temperature must not be in contact
with the joint for more than 5 seconds. The total contact
time of successive solder waves must not exceed
5 seconds.
The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified maximum storage temperature (T
stg max
). If the
printed-circuit board has been pre-heated, forced cooling
may be necessary immediately after soldering to keep the
temperature within the permissible limit.
Repairing soldered joints
Apply a low voltage soldering iron (less than 24 V) to the
lead(s) of the package, below the seating plane or not
more than 2 mm above it. If the temperature of the
soldering iron bit is less than 300
C it may remain in
contact for up to 10 seconds. If the bit temperature is
between 300 and 400
C, contact may be up to 5 seconds.
DEFINITIONS
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
Data sheet status
Objective specification
This data sheet contains target or goal specifications for product development.
Preliminary specification
This data sheet contains preliminary data; supplementary data may be published later.
Product specification
This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
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