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Электронный компонент: TDA1563Q/N1

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DATA SHEET
Product specification
Supersedes data of 1998 Jul 14
File under Integrated Circuits, IC01
2000 Feb 09
INTEGRATED CIRCUITS
TDA1563Q
2
25 W high efficiency car radio
power amplifier
2000 Feb 09
2
Philips Semiconductors
Product specification
2
25 W high efficiency car radio power
amplifier
TDA1563Q
FEATURES
Low dissipation due to switching from Single-Ended
(SE) to Bridge-Tied Load (BTL) mode
Differential inputs with high Common Mode Rejection
Ratio (CMRR)
Mute/standby/operating (mode select pin)
Zero crossing mute circuit
Load dump protection circuit
Short-circuit safe to ground, to supply voltage and
across load
Loudspeaker protection circuit
Device switches to SE operation at excessive junction
temperatures
Thermal protection at high junction temperature (170
C)
Diagnostic information (clip detection and
protection/temperature)
Clipping information can be selected between
THD = 2.5% or 10%
GENERAL DESCRIPTION
The TDA1563Q is a monolithic power amplifier in a
17-lead DIL-bent-SIL plastic power package. It contains
two identical 25 W amplifiers. The dissipation is minimized
by switching from SE to BTL mode when a higher output
voltage swing is needed. The device is primarily
developed for car radio applications.
QUICK REFERENCE DATA
ORDERING INFORMATION
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
V
P
supply voltage
DC biased
6
14.4
18
V
non-operating
-
-
30
V
load dump
-
-
45
V
I
ORM
repetitive peak output current
-
-
4
A
I
q(tot)
total quiescent current
R
L
=
-
95
150
mA
I
stb
standby current
-
1
50
A
Z
i
input impedance
90
120
150
k
P
o
output power
R
L
= 4
; EIAJ
-
38
-
W
R
L
= 4
; THD = 10%
23
25
-
W
V
selclip
R
L
= 4
; THD = 2.5%
18
20
-
W
G
v
closed loop voltage gain
25
26
27
dB
CMRR
common mode rejection ratio
f = 1 kHz; R
s
= 0
-
80
-
dB
SVRR
supply voltage ripple rejection
f = 1 kHz; R
s
= 0
45
65
-
dB
V
O
DC output offset voltage
-
-
100
mV
cs
channel separation
R
s
= 0
40
70
-
dB
G
v
channel unbalance
-
-
1
dB
TYPE
NUMBER
PACKAGE
NAME
DESCRIPTION
VERSION
TDA1563Q
DBS17P
plastic DIL-bent-SIL power package; 17 leads (lead length 12 mm)
SOT243-1
2000 Feb 09
3
Philips Semiconductors
Product specification
2
25 W high efficiency car radio power
amplifier
TDA1563Q
BLOCK DIAGRAM
handbook, full pagewidth
MGR173
+
-
+
-
+
-
+
-
MUTE
VI
VI
VI
IV
IV
VI
SLAVE
CONTROL
17
16
IN2
+
3
CIN
IN2
-
60
k
60
k
60
k
60
k
25 k
Vref
OUT2
-
OUT2
+
10
11
CSE
4
+
-
+
-
+
-
+
-
MUTE
SLAVE
CONTROL
1
2
IN1
+
IN1
-
OUT1
+
OUT1
-
8
7
+
-
VP
STANDBY
LOGIC
CLIP AND
DIAGNOSTIC
6
12
14
15
MODE
SC
DIAG
CLIP
GND
9
VP2
13
VP1
5
TDA1563Q
Fig.1 Block diagram.
2000 Feb 09
4
Philips Semiconductors
Product specification
2
25 W high efficiency car radio power
amplifier
TDA1563Q
PINNING
SYMBOL
PIN
DESCRIPTION
IN1+
1
non-inverting input 1
IN1
-
2
inverting input 1
CIN
3
common input
CSE
4
electrolytic capacitor for SE mode
V
P1
5
supply voltage 1
MODE
6
mute/standby/operating
OUT1
-
7
inverting output 1
OUT1+
8
non-inverting output 1
GND
9
ground
OUT2
-
10
inverting output 2
OUT2+
11
non-inverting output 2
SC
12
selectable clip
V
P2
13
supply voltage 2
DIAG
14
diagnostic: protection/temperature
CLIP
15
diagnostic: clip detection
IN2
-
16
inverting input 2
IN2+
17
non-inverting input 2
handbook, halfpage
TDA1563Q
MGR174
IN1
+
IN1
-
CIN
CSE
VP1
MODE
OUT1
-
OUT1
+
GND
OUT2
-
OUT2
+
SC
VP2
DIAG
CLIP
IN2
-
IN2
+
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
Fig.2 Pin configuration.
2000 Feb 09
5
Philips Semiconductors
Product specification
2
25 W high efficiency car radio power
amplifier
TDA1563Q
FUNCTIONAL DESCRIPTION
The TDA1563Q contains two identical amplifiers with
differential inputs. At low output power (up to output
amplitudes of 3 V (RMS) at V
P
= 14.4 V), the device
operates as a normal SE amplifier. When a larger output
voltage swing is needed, the circuit switches to BTL
operation.
With a sine wave input signal, the dissipation of a
conventional BTL amplifier up to 2 W output power is more
than twice the dissipation of the TDA1563Q (see Fig.10).
In normal use, when the amplifier is driven with music-like
signals, the high (BTL) output power is only needed for a
small percentage of the time. Assuming that a music signal
has a normal (Gaussian) amplitude distribution, the
dissipation of a conventional BTL amplifier with the same
output power is approximately 70% higher (see Fig.11).
The heatsink has to be designed for use with music
signals. With such a heatsink, the thermal protection will
disable the BTL mode when the junction temperature
exceeds 150
C. In this case, the output power is limited to
5 W per amplifier.
The gain of each amplifier is internally fixed at 26 dB. With
the MODE pin, the device can be switched to the following
modes:
Standby with low standby current (<50
A)
Mute condition, DC adjusted
On, operation.
The information on pin 12 (selectable clip) determines at
which distortion figures a clip detection signal will be
generated at the clip output. A logic 0 applied to pin 12 will
select clip detection at THD = 10%, a logic 1 selects
THD = 2.5%. A logic 0 can be realised by connecting this
pin to ground. A logic 1 can be realised by connecting it to
V
logic
(see Fig.7) or the pin can also be left open. Pin 12
may not be connected to V
P
because its maximum input
voltage is 18 V (V
P
> 18 V under load dump conditions).
The device is fully protected against a short circuit of the
output pins to ground and to the supply voltage. It is also
protected against a short circuit of the loudspeaker and
against high junction temperatures. In the event of a
permanent short circuit to ground or the supply voltage, the
output stage will be switched off, causing low dissipation.
With a permanent short circuit of the loudspeaker, the
output stage will be repeatedly switched on and off. In the
`on' condition, the duty cycle is low enough to prevent
excessive dissipation.
To avoid plops during switching from `mute' to `on' or from
`on' to `mute/standby' while an input signal is present, a
built-in zero-crossing detector only allows switching at
zero input voltage. However, when the supply voltage
drops below 6 V (e.g. engine start), the circuit mutes
immediately, avoiding clicks from the electronic circuit
preceding the power amplifier.
The voltage of the SE electrolytic capacitor (pin 4) is kept
at 0.5V
P
by a voltage buffer (see Fig.1). The value of this
capacitor has an important influence on the output power
in SE mode. Especially at low signal frequencies, a high
value is recommended to minimize dissipation.
The two diagnostic outputs (clip and diag) are
open-collector outputs and require a pull-up resistor.
The clip output will be LOW when the THD of the output
signal is higher than the selected clip level (10% or 2.5%).
The diagnostic output gives information:
about short circuit protection:
When a short circuit (to ground or the supply voltage)
occurs at the outputs (for at least 10
s), the output
stages are switched off to prevent excessive
dissipation. The outputs are switched on again
approximately 50 ms after the short circuit is
removed. During this short circuit condition, the
protection pin is LOW.
When a short circuit occurs across the load (for at
least 10
s), the output stages are switched off for
approximately 50 ms. After this time, a check is made
to see whether the short circuit is still present.
The power dissipation in any short circuit condition is
very low.
during startup/shutdown, when the device is internally
muted.
temperature detection: This signal (junction temperature
> 145
C) indicates that the temperature protection will
become active. The temperature detection signal can be
used to reduce the input signal and thus reduce the
power dissipation.
2000 Feb 09
6
Philips Semiconductors
Product specification
2
25 W high efficiency car radio power
amplifier
TDA1563Q
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
THERMAL CHARACTERISTICS
Note
1. The value of R
th(c-h)
depends on the application (see Fig.3).
SYMBOL
PARAMETER
CONDITIONS
MIN.
MAX.
UNIT
V
P
supply voltage
operating
-
18
V
non-operating
-
30
V
load dump; t
r
>
2.5 ms
-
45
V
V
P(sc)
short-circuit safe voltage
-
18
V
V
rp
reverse polarity voltage
-
6
V
I
ORM
repetitive peak output current
-
4
A
P
tot
total power dissipation
-
60
W
T
stg
storage temperature
-
55
+150
C
T
vj
virtual junction temperature
-
150
C
T
amb
ambient temperature
-
40
-
C
SYMBOL
PARAMETER
CONDITIONS
VALUE
UNIT
R
th(j-c)
thermal resistance from junction to case
see note 1
1.3
K/W
R
th(j-a)
thermal resistance from junction to ambient
40
K/W
Heatsink design
There are two parameters that determine the size of the
heatsink. The first is the rating for the virtual junction
temperature and the second is the ambient temperature at
which the amplifier must still deliver its full power in the
BTL mode.
With a conventional BTL amplifier, the maximum power
dissipation with a music-like signal (at each amplifier) will
be approximately two times 6.5 W.
At a virtual junction temperature of 150
C and a maximum
ambient temperature of 65
C, R
th(vj-c)
= 1.3 K/W and
R
th(c-h)
= 0.2 K/W, the thermal resistance of the heatsink
should be:
Compared to a conventional BTL amplifier, the TDA1563Q
has a higher efficiency. The thermal resistance of the
heatsink should be:
150
65
2
6.5
----------------------
1.3
0.2
5 K/W
=
150
65
2
6.5
----------------------
1.3
0.2
5 K/W
=
1.7
145
65
2
6.5
----------------------
1.3
0.2
9 K/W
=
handbook, halfpage
3.6 K/W
0.6 K/W
3.6 K/W
virtual junction
OUT 1
OUT 1
case
3.6 K/W
0.6 K/W
3.6 K/W
OUT 2
OUT 2
MGC424
0.1 K/W
Fig.3 Thermal equivalent resistance network.
2000 Feb 09
7
Philips Semiconductors
Product specification
2
25 W high efficiency car radio power
amplifier
TDA1563Q
DC CHARACTERISTICS
V
P
= 14.4 V; T
amb
= 25
C; measured in Fig.7; unless otherwise specified.
Notes
1. The circuit is DC biased at V
P
= 6 to 18 V and AC operating at V
P
= 8 to 18 V.
2. If the junction temperature exceeds 150
C, the output power is limited to 5 W per channel.
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX. UNIT
Supplies
V
P
supply voltage
note 1
6
14.4
18
V
I
q(tot)
total quiescent current
R
L
=
-
95
150
mA
I
stb
standby current
-
1
50
A
V
C
average electrolytic capacitor voltage at pin 4
-
7.1
-
V
V
O
DC output offset voltage
on state
-
-
100
mV
mute state
-
-
100
mV
Mode select switch (see Fig.4)
V
ms
voltage at mode select pin (pin 6)
standby condition
0
-
1
V
mute condition
2
-
3
V
operating condition
4
5
V
P
V
I
ms
switch current through pin 6
V
ms
= 5 V
-
25
40
A
Diagnostic
V
diag
output voltage at diagnostic outputs (pins 14 and
15): protection/temperature and detection
during any fault condition
-
-
0.5
V
I
diag
current through pin 14 or 15
during any fault condition
2
-
-
mA
V
SC
input voltage at selectable clip pin (pin 12)
clip detect at THD = 10%
-
-
0.5
V
clip detect at THD = 2.5% 1.5
-
18
V
Protection
T
pre
prewarning temperature
-
145
-
C
T
dis(BTL)
BTL disable temperature
note 2
-
150
-
C
2000 Feb 09
8
Philips Semiconductors
Product specification
2
25 W high efficiency car radio power
amplifier
TDA1563Q
Fig.4 Switching levels of the mode select switch.
handbook, halfpage
MGR176
18
Vmode
4
3
2
1
0
Mute
Operating
Standby
2000 Feb 09
9
Philips Semiconductors
Product specification
2
25 W high efficiency car radio power
amplifier
TDA1563Q
AC CHARACTERISTICS
V
P
= 14.4 V; R
L
= 4
; CSE = 1000
F; f = 1 kHz; T
amb
= 25
C; measured in Fig.7; unless otherwise specified.
Notes
1. The distortion is measured with a bandwidth of 10 Hz to 30 kHz.
2. Frequency response externally fixed (input capacitors determine low frequency roll-off).
3. The SE to BTL switch voltage level depends on V
P
.
4. Noise output voltage measured with a bandwidth of 20 Hz to 20 kHz.
5. Noise output voltage is independent of R
s
.
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX. UNIT
P
o
output power
THD = 0.5%
15
19
-
W
THD = 10%
23
25
-
W
EIAJ
-
38
-
W
V
P
= 13.2 V; THD = 0.5%
-
16
-
W
V
P
= 13.2 V; THD = 10%
-
20
-
W
THD
total harmonic distortion
P
o
= 1 W; note 1
-
0.1
-
%
P
d
dissipated power
see Figs 10 and 11
W
B
p
power bandwidth
THD = 1%; P
o
=
-
1 dB
with respect to 15 W
-
20 to 15 000
-
Hz
f
ro(l)
low frequency roll-off
-
1 dB; note 2
-
25
-
Hz
f
ro(h)
high frequency roll-off
-
1 dB
130
-
-
kHz
G
v
closed loop voltage gain
P
o
= 1 W
25
26
27
dB
SVRR
supply voltage ripple rejection
R
s
= 0
; V
ripple
= 2 V (p-p)
on/mute
45
65
-
dB
standby; f = 100 Hz to 10 kHz 80
-
-
dB
CMRR
common mode rejection ratio
R
s
= 0
-
80
-
dB
Z
i
input impedance
90
120
150
k
Z
i
mismatch in input impedance
-
1
-
%
V
SE-BTL
SE to BTL switch voltage level
note 3
-
3
-
V
V
o(mute)
output voltage mute (RMS value)
V
i
= 1 V (RMS)
-
100
150
V
V
n(o)
noise output voltage
on; R
s
= 0
; note 4
-
100
150
V
on; R
s
= 10 k
; note 4
-
105
-
V
mute; note 5
-
100
150
V
cs
channel separation
R
s
= 0
; P
o
= 15 W
40
70
-
dB
G
v
channel unbalance
-
-
1
dB
2000 Feb 09
10
Philips Semiconductors
Product specification
2
25 W high efficiency car radio power
amplifier
TDA1563Q
Fig.5 Clip detection waveforms.
handbook, halfpage
MGR177
Vo
CLIP
0
0
t
Fig.5 Clip detection waveforms.
Fig.6 Protection waveforms.
handbook, halfpage
MGR178
maximum current
short circuit to supply pins
short circuit
to ground
short circuit
removed
50
ms
50
ms
50
ms
10
s
Io
DIAG
0
max
max
t
t
2000 Feb 09
11
Philips Semiconductors
Product specification
2
25 W high efficiency car radio power
amplifier
TDA1563Q
TEST AND APPLICATION INFORMATION
handbook, full pagewidth
MGR180
3
CIN
25 k
60
k
60
k
60
k
60
k
Vref
OUT2
-
OUT2
+
10
11
CSE
4
2
IN1
-
1
IN1
+
OUT1
+
OUT1
-
8
7
STANDBY
LOGIC
CLIP AND
DIAGNOSTIC
6
12
14
15
MODE
SC
DIAG
CLIP
9
GND
VP2
13
VP1
5
TDA1563Q
1
F
1000
F
220 nF
0.5Rs
220 nF
0.5Rs
+
-
+
-
Vms
VP
Vlogic
Rpu
Rpu
10%
2.5%
16
IN2
-
17
IN2
+
220 nF
0.5Rs
100 nF
100 nF
3.9
4
3.9
100 nF
100 nF
3.9
4
3.9
220 nF
0.5Rs
+
-
+
-
220 nF
2200
F
signal ground
power ground
Fig.7 Application diagram.
Connect Boucherot filter to pin 8 or pin 10 with the shortest possible connection.
2000 Feb 09
12
Philips Semiconductors
Product specification
2
25 W high efficiency car radio power
amplifier
TDA1563Q
handbook, full pagewidth
76.20
35.56
TDA1563Q
RL-98
MGR189
+
-
Out2
+
-
Out2
+
-
In2
+
-
In1
Clip
Vp
GND
gnd
gnd
Prot
2.5%
10%
Mode
Mute
On
Off
Clip
Fig.8 PCB layout (component side) for the application of Fig.7.
Dimensions in mm.
2000 Feb 09
13
Philips Semiconductors
Product specification
2
25 W high efficiency car radio power
amplifier
TDA1563Q
handbook, full pagewidth
76.20
35.56
MGR190
Vp
GND
2
25 W high efficiency
1
F
1
17
Out2
Out1
In1
In2
220 nF
220 nF
220 nF
Fig.9 PCB layout (soldering side) for the application of Fig.7.
Dimensions in mm.
2000 Feb 09
14
Philips Semiconductors
Product specification
2
25 W high efficiency car radio power
amplifier
TDA1563Q
handbook, halfpage
0
10
Po (W)
25
0
5
10
15
20
2
Pd
(W)
4
6
8
MBH692
(1)
(2)
Fig.10 Dissipation; sine wave driven.
Input signal 1 kHz, sinusoidal; V
P
= 14.4 V.
(1) For a conventional BTL amplifier.
(2) For TDA1563Q.
handbook, halfpage
0
10
Po (W)
25
0
5
10
15
20
2
Pd
(W)
4
6
8
MBH693
(1)
(2)
Fig.11 Dissipation; pink noise through IEC-268
filter.
(1) For a conventional BTL amplifier.
(2) For TDA1563Q.
430
input
output
330
3.3
k
3.3
k
10
k
91
nF
68
nF
470 nF
2.2
F
2.2
F
MGC428
Fig.12 IEC-268 filter.
2000 Feb 09
15
Philips Semiconductors
Product specification
2
25 W high efficiency car radio power
amplifier
TDA1563Q
handbook, full pagewidth
MGR181
3
CIN
25 k
60
k
60
k
60
k
60
k
Vref
OUT2
-
OUT2
+
10
11
CSE
4
2
IN1
-
1
IN1
+
OUT1
+
OUT1
-
8
7
STANDBY
LOGIC
CLIP AND
DIAGNOSTIC
6
12
14
15
MODE
SC
DIAG
CLIP
VP2
13
VP1
5
TDA1563Q
1
F
1000
F
220 nF
220 nF
IEC-268
FILTER
pink
noise
+
-
+
-
Vms
VP
Vlogic
Rpu
Rpu
16
IN2
-
17
IN2
+
220 nF
100 nF
100 nF
3.9
4
3.9
100 nF
100 nF
3.9
4
3.9
220 nF
+
-
+
-
220 nF
2200
F
signal ground
power ground
9
GND
Fig.13 Test and application diagram for dissipation measurements with a music-like signal (pink noise).
2000 Feb 09
16
Philips Semiconductors
Product specification
2
25 W high efficiency car radio power
amplifier
TDA1563Q
handbook, halfpage
0
150
100
50
0
8
Vp (V)
Iq
(mA)
24
16
MDA845
Fig.14 Quiescent current as a function of V
P
.
V
ms
= 5 V; R
I
=
.
handbook, halfpage
0
2
Vms (V)
Ip
(mA)
4
6
250
0
200
150
100
50
MDA844
Fig.15 I
P
as a function of V
ms
(pin 3).
V
P
= 14.4 V; V
i
= 25 mV
handbook, halfpage
8
18
60
0
20
40
10
Po
(W)
Vp (V)
12
14
16
MDA843
(1)
(2)
(3)
Fig.16 Output power as a function of V
P
.
(1) EIAJ, 100 Hz.
(2) THD = 10 %.
(3) THD = 0.5 %.
handbook, halfpage
10
1
10
-
1
10
-
1
10
-
2
10
-
2
MDA842
1
10
THD + N
(%)
10
2
(1)
(2)
(3)
Po (W)
Fig.17 THD + noise as a function of P
o
.
(1) f = 10 kHz.
(2) f = 1 kHz.
(3) f = 100 Hz.
2000 Feb 09
17
Philips Semiconductors
Product specification
2
25 W high efficiency car radio power
amplifier
TDA1563Q
handbook, halfpage
10
1
10
-
1
10
-
2
MDA841
10
10
2
10
3
10
4
THD + N
(%)
f (Hz)
10
5
(1)
(2)
Fig.18 THD + noise as a function of frequency.
(1) P
o
= 10 W.
(2) P
o
= 1 W.
handbook, halfpage
20
22
24
26
Gv
(dB)
f (Hz)
28
MDA840
10
10
2
10
3
10
4
10
5
10
6
Fig.19 Gain as a function of frequency.
V
i
= 100 mV.
handbook, halfpage
-
90
-
70
-
50
-
30
-
10
MDA838
10
f (Hz)
cs
(dB)
10
2
10
3
10
4
10
5
(1)
(2)
Fig.20 Channel separation as a function of
frequency.
(1) P
o
= 10 W.
(2) P
o
= 1 W.
handbook, halfpage
-
80
-
60
-
40
-
20
0
MDA839
10
f (Hz)
SVRR
(dB)
10
2
10
3
10
4
10
5
Fig.21 SVRR as a function of frequency.
V
ripple(p-p)
= 2 V.
2000 Feb 09
18
Philips Semiconductors
Product specification
2
25 W high efficiency car radio power
amplifier
TDA1563Q
handbook, halfpage
0
8
Vp (V)
Po
(W)
24
0.8
0.6
0.2
0
0.4
16
MDA846
Fig.22 AC operating as a function of V
P
.
V
i
= 70 mV.
2000 Feb 09
19
Philips Semiconductors
Product specification
2
25 W high efficiency car radio power
amplifier
TDA1563Q
handbook, full pagewidth
MGL914
0
1
2
t (ms)
3
1/2 VP
1/2 VP
0
-
VP
VP
VP
0
VP
Vload
Vmaster
Vslave
0
Fig.23 Output waveforms.
See Fig.7:
V
load
= V
7
-
V
8
or V
11
-
V
10
V
master
= V
7
or V
11
V
slave
= V
8
or V
10
2000 Feb 09
20
Philips Semiconductors
Product specification
2
25 W high efficiency car radio power
amplifier
TDA1563Q
APPLICATION NOTES
Example of the TDA1563Q in a car radio system
solution
The PCB shown here is used to demonstrate an audio
system solution with Philips Semiconductors devices for
car audio applications. The board includes the SAA7705H:
a high-end CarDSP (Digital Signal Processor), the
TDA3617J: a voltage regulator providing 9 V, 5 V and
3.3 V outputs, and two TDA1563Qs to provide four 25 W
power outputs. A complete kit (application report, software
and demo board) of this "car-audio chip-set demonstrator"
is available.
The TDA1563Q is a state of the art device, which is
different to conventional amplifiers in power dissipation
because it switches between SE mode and conventional
BTL mode, depending on the required output voltage
swing. As a result, the PCB layout is more critical than with
conventional amplifiers.
N
OTES AND LAYOUT DESIGN RECOMMENDATIONS
1. The TDA1563Q mutes automatically during switch-on
and switch-off and suppresses biasing clicks coming
from the CarDSP circuit preceding the power amplifier.
Therefore, it is not necessary to use a plop reduction
circuit for the CarDSP. To mute or to enlarge the mute
time of the system, the voltage at the mode pin of the
amplifiers should be kept between 2 V and 3 V.
2. The input reference capacitor at pin 3 is specified as
1
F but has been increased to 10
F to improve the
switch-on plop performance of the amplifiers. By doing
this, the minimum switch-on time increases from
standby, via internal mute, to operating from 150 ms to
600 ms.
3. It is important that the copper tracks to and from the
electrolytic capacitors (SE capacitors and supply
capacitors) are close together. Because of the
switching principle, switching currents flow here.
Combining electrolytic capacitors in a 4-channel
application is not recommended.
4. Filters at the outputs are necessary for stability
reasons. The filters at output pins 8 and 10 to ground
should be connected as close as possible to the
device (see layout of PCB).
5. Connect the supply decoupling capacitors of 220 nF
as closely as possible to the TDA1563Qs.
6. Place the tracks of the differential inputs as close
together as possible. If disturbances are injected at the
inputs, they will be amplified 20 times. Oscillation may
occur if this is not done properly.
7. The SE line output signal of the CarDSP here is
offered as a quasi differential input signal to the
amplifiers by splitting the 100
unbalance series
resistance into two 47
balanced series resistances.
The return track from the minus inputs of the amplifiers
are not connected to ground (plane) but to the line out
reference voltage of the CarDSP, VrefDA.
8. The output signal of the CarDSP needs an additional
1st order filter. This is done by the two balanced series
resistances of 47
(see note 7) and a ceramic
capacitor of 10 nF. The best position to place these
10 nF capacitors is directly on the input pins of the
amplifiers. Now, any high frequency disturbance at the
inputs of the amplifiers will be rejected.
9. Only the area underneath the CarDSP is a ground
plane. A ground plane is necessary in PCB areas
where high frequency digital noise occurs. The audio
outputs are low frequency signals. For these outputs,
it is better to use two tracks (feed and return) as closely
as possible to each other to make the disturbances
common mode. The amplifiers have differential inputs
with a very high common mode rejection.
10. The ground pin of the voltage regulator is the
reference for the regulator outputs. This ground
reference should be connected to the ground plane of
the CarDSP by one single track. The ground plane of
the CarDSP may not be connected to "another" ground
by a second connection.
11. Prevent power currents from flowing through the
ground connection between CarDSP and voltage
regulator. The currents in the ground from the
amplifiers are directly returned to the ground pin of the
demo board. By doing this so, no ground interference
between the components will occur.
2000 Feb 09
21
Philips Semiconductors
Product specification
2
25 W high efficiency car radio power
amplifier
TDA1563Q
handbook, full pagewidth
MGS827
+
+
+
-
+
-
+
-
+
-
Car DSP
SAA7704/05/08
on bottom side
Line-in
Left
10%
2.5%
Right
Power ON
Mute
RL
10 V to 16 V
Vbattery
FL
RR
GND
FR
Front
Rear
VBATT
Error On
TDA1563Q
TDA1563Q
TDA3617J
Diag Clip
I
2
C
(4)
(5)
(8)
(6)
4
25 W into 4 Ohms
DSP
Car-audio chip-set demonstrator
Car-audio chip-set demonstrator
Bottom copper layer
Top copper layer
PHILIPS Semiconductors
(3)
(3)
Version 0.1
IO-98
Fig.24 PCB layout.
2000 Feb 09
22
Philips Semiconductors
Product specification
2
25 W high efficiency car radio power
amplifier
TDA1563Q
handbook, full pagewidth
MGS825
82 k
1 M
1 M
10 k
10 k
15 k
220
220
100 pF
100
pF
TDA3617J
I
2
C
56
A0
24
CD2WS
25
CD2DATA
26
CD2CL
27
CD1WS
28
PLANE
PLANE
PLANE
220 nF
PLANE
PLANE
CD1DATA
29
CD1CL
43
RTCB
44
SHTCB
4
3
FML
61
PLANE
SELFR
AML
42
DSPRESET
18
pF
PLANE
64
OSCOUT
18
pF
PLANE
47 nF
22
F
1
F
PLANE
PLANE
3.3 V DIG
63
X1
OSCIN
PLANE
62
V
SS(OSC)
65
100 nF
V
DD(OSC)
58
SDA
57
SCL
76
VDACN2
74
V
DDA1
45
TSCAN
Car DSP
SAA7704/05 / 08H
CDGND
77
TAPEL
69
6
PLANE
5 V
8
7
1 to 5
TAPER
68
AMAFL
67
8.2 k
70
1
F
330 pF
71
15 k
1
F
SDA
SCL
LEFT
LINE
IN
RIGHT
CD-GND
MICROCONTROLLER
VOLTAGE REGULATOR
8.2 k
CDLI
72
330 pF
4.7 k
CDLB
CDRI
CDRB
73
VDACN1
2
VDACP
1
AMAFR
66
VREFAD
78
75
V
SSA1
100 nF
3.3 V ANA
clip
3.3 V ANA
BLM21A10
BLM21A10
100
F
100
5 V
VBATT
VBATT
100
3.3 V DIG
PLANE
21
TP5
22
V
DDD5V1
23
V
SSD5V1
22 nF
PLANE
36
V
DDD5V2
37
V
SSD5V2
22 nF
PLANE
46
V
DDD5V3
47
V
SSD5V3
48
V
DDD3V1
51
V
DDD3V2
52
V
DDD3V3
55
V
DDD3V4
49
V
SSD3V1
11
V
DDA2
50
V
SSD3V2
53
V
SSD3V3
54
V
SSD3V4
22 nF
PLANE
100 nF
100 nF
PLANE
PLANE
16
FLV
15
FLI
2.2
nF
47
47
47
47
47
47
47
47
13
FRV
14
2.2
nF
6
FRI
RRI
7
RRV
2.2
nF
9
RLV
8
RLI
2.2
nF
12
VREFDA
10
VSSA2
22
F
4.7 k
diagnostic
mute
4.7 k
error
5 V
3.3 V DIG
3.3 V ANA
47 nF
REG2
47
F
GND
GND
6
HOLD
7
Ven2
Ven3
VP
9
REG3
5
47 nF
47
F
8
GND
1
GND
3
PLANE GND
Ven1
2
GND
220 nF
GND
BAS16/A6
BC848B/1k
4.7 k
power
on
power
5 V
A
B
C
D
E
F
G
H
I
J
K
Fig.25 Car-audio chip-set demonstrator (continued in Fig.26).
2000 Feb 09
23
Philips Semiconductors
Product specification
2
25 W high efficiency car radio power
amplifier
TDA1563Q
handbook, full pagewidth
MGS826
3.9
3.9
3.9
3.9
100 nF
100 nF
220 nF
(16 V)
(16 V)
100 nF
100 nF
PGND
PGND
2
HIGH EFFICIENCY POWER AMPLIFIER
PGND
PGND
VBATT
GND
TDA1563Q
7
OUT1
-
1000
F
2200
F
8
OUT1
+
OUT
-
OUT
+
10
OUT2
-
11
OUT2
+
MODE
4
6
CLIP
15
DIAG
14
SC
12
IN2
-
16
9
VP2
13
VP1
5
CSE
OUT
-
OUT
+
10 nF
220 nF
IN2
+
17
220 nF
IN1
-
2
10 nF
220 nF
IN1
+
1
CIN
3
220 nF
3.9
3.9
3.9
3.9
100 nF
100 nF
220 nF
(16 V)
(16 V)
100 nF
100 nF
PGND
FRONT
LEFT
FRONT
RIGHT
REAR
RIGHT
REAR
LEFT
PGND
PGND
VBATT
VBATT
10%
2.5%
GND
TDA1563Q
7
OUT1
-
1000
F
2200
F
8
OUT1
+
OUT
-
OUT
+
10
OUT2
-
11
OUT2
+
MODE
4
6
CLIP
15
DIAG
14
SC
12
IN2
+
17
9
VP2
13
VP1
5
CSE
OUT
-
OUT
+
GND
V battery
10 nF
220 nF
IN2
-
16
220 nF
IN1
+
1
10 nF
220 nF
IN1
-
2
CIN
3
220 nF
10
F
10
F
100
H/6A
GND
clip select
5 V
GND
PGND
A
B
C
D
E
F
G
H
I
J
K
Fig.26 Car-audio chip-set demonstrator (continued from Fig.25).
2000 Feb 09
24
Philips Semiconductors
Product specification
2
25 W high efficiency car radio power
amplifier
TDA1563Q
Advantages of high efficiency
Power conversion improvement (power supply)
Usually, the fact that the reduction of dissipation is
directly related to supply current reduction is neglected.
One advantage is less voltage drop in the whole supply
chain. Another advantage is less stress for the coil in the
supply line. Even the adapter or supply circuit remains
cooler than before as a result of the reduced heat
dissipation in the whole chain because more supply
current will be converted to output power.
Power dissipation reduction
This is the best known advantage of high efficiency
amplifiers.
Heatsink size reduction
The heatsink size of a conventional amplifier may be
reduced by approximately 50% at V
P
= 14.4 V when the
TDA1563Q is used. In this case, the maximum heatsink
temperature will remain the same.
Heatsink temperature reduction
The power dissipation and the thermal resistance of the
heatsink determine the heatsink temperature rise. When
the same heatsink size is used as in a conventional
amplifier, the maximum heatsink temperature
decreases and also the maximum junction temperature,
which extends the life of this semiconductor device.
The maximum dissipation with music-like input signals
decreases by 40%.
It is clear that the use of the TDA1563Q saves a significant
amount of energy. The maximum supply current
decreases by approximately 32%, which reduces the
dissipation in the amplifier as well in the whole supply
chain. The TDA1563Q allows a heatsink size reduction of
approximately 50% or a heatsink temperature decrease of
40% when the heatsink size is not changed.
Advantage of the concept used by the TDA1563Q
The TDA1563Q is highly efficient under all conditions,
because it uses a SE capacitor to create a non-dissipating
half supply voltage. Other concepts rely on both input
signals being the same in amplitude and phase. With the
concept of an SE capacitor, it does not matter what kind of
signal processing is done on the input signals.
For example, amplitude difference, phase shift or delays
between both input signals, or other DSP processing, have
no impact on the efficiency.
handbook, halfpage
MGS824
Supply
current
reduction of
32%
Heatsink
size
reduction of
50%
Same heatsink
size
Same junction
temperature
Heatsink
temperature
reduction of
40%
Power
dissipation
reduction of 40%
at Po = 1.6 W
VP = 14.4 V
choice
Fig.27 Heatsink design
2000 Feb 09
25
Philips Semiconductors
Product specification
2
25 W high efficiency car radio power
amplifier
TDA1563Q
INTERNAL PIN CONFIGURATIONS
PIN
NAME
EQUIVALENT CIRCUIT
1, 2, 16,
17 and 3
IN1+, IN1
-
, IN2
-
,
IN2+ and CIN
4
C
SE
6
MODE
7, 11
OUT1
-
, OUT2+
MGR182
1, 2, 16, 17
3
VP1, VP2
VP1, VP2
MGR183
4
VP2
VP1
MGR184
6
MGR185
4
VP1, VP2
7, 11
2000 Feb 09
26
Philips Semiconductors
Product specification
2
25 W high efficiency car radio power
amplifier
TDA1563Q
8, 10
OUT1+, OUT2
-
12
SC
14, 15
PROT, CLIP
PIN
NAME
EQUIVALENT CIRCUIT
MGR186
4
VP1, VP2
8, 10
MGR187
12
VP2
MGR188
14, 15
VP2
2000 Feb 09
27
Philips Semiconductors
Product specification
2
25 W high efficiency car radio power
amplifier
TDA1563Q
PACKAGE OUTLINE
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC
JEDEC
EIAJ
DIMENSIONS (mm are the original dimensions)
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
SOT243-1
0
5
10 mm
scale
D
L
E
A
c
A
2
L
3
Q
w
M
b
p
1
d
D
Z
e
e
x
h
1
17
j
Eh
non-concave
97-12-16
99-12-17
DBS17P: plastic DIL-bent-SIL power package; 17 leads (lead length 12 mm)
SOT243-1
view B: mounting base side
m
2
e
v
M
B
UNIT
A
e
1
A
2
b
p
c
D
(1)
E
(1)
Z
(1)
d
e
D
h
L
L
3
m
mm
17.0
15.5
4.6
4.4
0.75
0.60
0.48
0.38
24.0
23.6
20.0
19.6
10
2.54
v
0.8
12.2
11.8
1.27
e
2
5.08
2.4
1.6
E
h
6
2.00
1.45
2.1
1.8
3.4
3.1
4.3
12.4
11.0
Q
j
0.4
w
0.03
x
2000 Feb 09
28
Philips Semiconductors
Product specification
2
25 W high efficiency car radio power
amplifier
TDA1563Q
SOLDERING
Introduction to soldering through-hole mount
packages
This text gives a brief insight to wave, dip and manual
soldering. A more in-depth account of soldering ICs can be
found in our
"Data Handbook IC26; Integrated Circuit
Packages" (document order number 9398 652 90011).
Wave soldering is the preferred method for mounting of
through-hole mount IC packages on a printed-circuit
board.
Soldering by dipping or by solder wave
The maximum permissible temperature of the solder is
260
C; solder at this temperature must not be in contact
with the joints for more than 5 seconds.
The total contact time of successive solder waves must not
exceed 5 seconds.
The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified maximum storage temperature (T
stg(max)
). If the
printed-circuit board has been pre-heated, forced cooling
may be necessary immediately after soldering to keep the
temperature within the permissible limit.
Manual soldering
Apply the soldering iron (24 V or less) to the lead(s) of the
package, either below the seating plane or not more than
2 mm above it. If the temperature of the soldering iron bit
is less than 300
C it may remain in contact for up to
10 seconds. If the bit temperature is between
300 and 400
C, contact may be up to 5 seconds.
Suitability of through-hole mount IC packages for dipping and wave soldering methods
Note
1. For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit board.
DEFINITIONS
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
PACKAGE
SOLDERING METHOD
DIPPING
WAVE
DBS, DIP, HDIP, SDIP, SIL
suitable
suitable
(1)
Data sheet status
Objective specification
This data sheet contains target or goal specifications for product development.
Preliminary specification
This data sheet contains preliminary data; supplementary data may be published later.
Product specification
This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
2000 Feb 09
29
Philips Semiconductors
Product specification
2
25 W high efficiency car radio power
amplifier
TDA1563Q
NOTES
2000 Feb 09
30
Philips Semiconductors
Product specification
2
25 W high efficiency car radio power
amplifier
TDA1563Q
NOTES
2000 Feb 09
31
Philips Semiconductors
Product specification
2
25 W high efficiency car radio power
amplifier
TDA1563Q
NOTES
Philips Electronics N.V.
SCA
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.
Internet: http://www.semiconductors.philips.com
2000
69
Philips Semiconductors a worldwide company
For all other countries apply to: Philips Semiconductors,
International Marketing & Sales Communications, Building BE-p, P.O. Box 218,
5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825
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Romania: see Italy
Russia: Philips Russia, Ul. Usatcheva 35A, 119048 MOSCOW,
Tel. +7 095 755 6918, Fax. +7 095 755 6919
Singapore: Lorong 1, Toa Payoh, SINGAPORE 319762,
Tel. +65 350 2538, Fax. +65 251 6500
Slovakia: see Austria
Slovenia: see Italy
South Africa: S.A. PHILIPS Pty Ltd., 195-215 Main Road Martindale,
2092 JOHANNESBURG, P.O. Box 58088 Newville 2114,
Tel. +27 11 471 5401, Fax. +27 11 471 5398
South America: Al. Vicente Pinzon, 173, 6th floor,
04547-130 SO PAULO, SP, Brazil,
Tel. +55 11 821 2333, Fax. +55 11 821 2382
Spain: Balmes 22, 08007 BARCELONA,
Tel. +34 93 301 6312, Fax. +34 93 301 4107
Sweden: Kottbygatan 7, Akalla, S-16485 STOCKHOLM,
Tel. +46 8 5985 2000, Fax. +46 8 5985 2745
Switzerland: Allmendstrasse 140, CH-8027 ZRICH,
Tel. +41 1 488 2741 Fax. +41 1 488 3263
Taiwan: Philips Semiconductors, 6F, No. 96, Chien Kuo N. Rd., Sec. 1,
TAIPEI, Taiwan Tel. +886 2 2134 2886, Fax. +886 2 2134 2874
Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd.,
209/2 Sanpavuth-Bangna Road Prakanong, BANGKOK 10260,
Tel. +66 2 745 4090, Fax. +66 2 398 0793
Turkey: Yukari Dudullu, Org. San. Blg., 2.Cad. Nr. 28 81260 Umraniye,
ISTANBUL, Tel. +90 216 522 1500, Fax. +90 216 522 1813
Ukraine: PHILIPS UKRAINE, 4 Patrice Lumumba str., Building B, Floor 7,
252042 KIEV, Tel. +380 44 264 2776, Fax. +380 44 268 0461
United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes,
MIDDLESEX UB3 5BX, Tel. +44 208 730 5000, Fax. +44 208 754 8421
United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409,
Tel. +1 800 234 7381, Fax. +1 800 943 0087
Uruguay: see South America
Vietnam: see Singapore
Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD,
Tel. +381 11 3341 299, Fax.+381 11 3342 553
Printed in The Netherlands
753503/25/02/pp
32
Date of release:
2000 Feb 09
Document order number:
9397 750 06309