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Электронный компонент: TDA1592

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DATA SHEET
Preliminary specification
Supersedes data of June 1993
File under Integrated Circuits, IC01
1996 May 31
INTEGRATED CIRCUITS
TDA1592
PLL stereo decoder and noise
blanker
1996 May 31
2
Philips Semiconductors
Preliminary specification
PLL stereo decoder and noise blanker
TDA1592
FEATURES
Adjustment-free voltage controlled PLL oscillator for
ceramic resonator (f = 456 kHz)
Pilot signal dependent mono/stereo switching
Analog control of mono/stereo change over
[stereo blend, Stereo Noise Controller (SNC)]
Adjacent channel noise suppression (114 kHz)
Pilot canceller
Analog control of de-emphasis; High Cut Control (HCC)
Reduced and controlled de-emphasis for AM operation
(pin 7 to GND)
Applicable as source selector for AM/FM/cassette
switching
Soft mute for silent tuning
Separate interference noise detector
Integrated input low-pass filter for delayed noise
blanking
Noise blanking at MPX-demodulator outputs.
GENERAL DESCRIPTION
The TDA1592 is a monolithic bipolar integrated circuit
providing the stereo decoder function and noise blanking
for FM car radio applications.
The device operates in a power supply range of
7.5 to 12 V.
QUICK REFERENCE DATA
ORDERING INFORMATION
SYMBOL
PARAMETER
MIN.
TYP.
MAX.
UNIT
V
P
supply voltage (pin 5)
7.5
10
12
V
I
P
supply current
-
15
20
mA
V
o(rms)
audio output signal (RMS value)
800
900
1000
mV
THD
total harmonic distortion
-
0.1
0.3
%
S/N
signal-to-noise ratio
-
82
-
dB
cs
channel separation
30
40
-
dB
V
trigg
interference voltage trigger level
-
10
-
mV
TYPE
NUMBER
PACKAGE
NAME
DESCRIPTION
VERSION
TDA1592
DIP20
plastic dual in-line package; 20 leads (300 mil)
SOT146-1
TDA1592T
SO20
plastic small outline package; 20 leads; body width 7.5 mm
SOT163-1
1996 May 31
3
Philips Semiconductors
Preliminary specification
PLL stereo decoder and noise blanker
TDA1592
BLOCK DIAGRAM
handbook, full pagewidth
MED724
7.4 k
7.4 k
164 k
47 k
68 k
27 k
100 k
33 k
820
k
27 k
47 k
6.8 k
47 k
100 nF
100 nF
47
nF
68
pF
33 pF
100 nF
100 nF
10 nF
6.8
k
75
k
750
k
6.8
nF
6.8
nF
2-POLE
FILTER
(30 kHz)
MUTE
PILOT
CANCEL
GATE
AND
HCC
19
19
19
38
LOGIC
INTERFERENCE
DETECTOR
HIGH-PASS
AMPLIFIER
(120 kHz)
PULSE
FORMER
NOISE AND AGC
DETECTOR
I ref
POWER
SUPPLY
PHASE
DETECTOR
PILOT
DETECTOR
4-POLE
FILTER
(80 kHz)
VCO
SWITCH
SNC
V
ref
V
ref
V
ref
V
ref
V
ref
R
in
R
out R
CSB
456 F11
BC548
R
out L
MPX input
mono
pilot
indicator
V
ref
V
SNC
V
HCC
auxiliary
input
R
out
V
P
interference
input
VCO
off
mute
auxiliary
input
L
out
20
19
18
17
16
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
AGC
TDA1592
Fig.1 Block diagram with external components, also used as test circuit.
1996 May 31
4
Philips Semiconductors
Preliminary specification
PLL stereo decoder and noise blanker
TDA1592
PINNING
SYMBOL
PIN
DESCRIPTION
PLL
1
phase locked loop filter
OSC
2
oscillator input/output pin for
ceramic resonator
GND
3
ground (0 V)
I
ref
4
reference current
V
P
5
supply voltage (+10 V)
INFI
6
interference signal input
PUFO
7
pulse former time constant; VCO
off
NDET
8
noise detector time constant; mute
on
FB-L
9
AF feedback input for left audio
signal
V
oL
10
AF output signal left
V
oR
11
AF output signal right
FB-R
12
AF feedback input for right audio
signal
C
DEEL
13
de-emphasis capacitor for left
channel
C
DEER
14
de-emphasis capacitor for right
channel
HCC
15
HCC input for de-emphasis control
SNC
16
stereo blend input
V
ref
17
externally applied reference
voltage of 1 to 5 V
IDENT
18
identification output (HIGH = pilot
existing; stereo)
PILOT
19
pilot detector level (forced mono
input)
V
i MPX
20
MPX input signal from IF
demodulator
Fig.2 Pin configuration.
handbook, halfpage
PLL
OSC
GND
Iref
VP
INFI
PUFO
NDET
FB-L
VoL
Vi MPX
PILOT
IDENT
Vref
HCC
CDEER
SNC
CDEEL
FB-R
VoR
1
2
3
4
5
6
7
8
9
10
11
12
20
19
18
17
16
15
14
13
TDA1592
MED726
1996 May 31
5
Philips Semiconductors
Preliminary specification
PLL stereo decoder and noise blanker
TDA1592
FUNCTIONAL DESCRIPTION
The MPX input of the TDA1592 (pin 20) is the null-node of
an operational amplifier with internal feedback resistor.
Adapting the stereo decoder input to the level of the FM
demodulator output is realized by the value of input
resistor R
in
(see Fig.3). The total gain of the stereo
decoder is applicable by varying the feedback resistors
R
out
(pins 9, 10, 11 and 12) of the output operational
amplifiers (see Fig.4).
The input amplifier is followed by an integrated 4
th
order
Bessel low-pass filter with a cut-off frequency of 80 kHz.
It provides necessary signal delay for noise blanking and
damping of high frequency interferences at the stereo
decoder input.
The soft mute facility (pin 8) provides silent tuning for RDS
processing. The mute time constant may be adjusted from
pin 8. In mute position and the VCO switched off (pin 7),
the output amplifiers can be used for cassette playback,
AM stereo purpose or other signal sources.
The voltage to current converted MPX signal is fed to
phase detector, pilot detector and pilot canceller circuits.
The oscillator is alignment-free with an external ceramic
resonator at 456 kHz as reference (pin 2). The required
19 kHz and 38 kHz signals are generated by division of the
oscillator output signal in a logical circuit. For regeneration
of the 38 kHz subcarrier, a PLL is used. The 19 kHz
quadrature phase signal is fed to the 19 kHz
phase detector, where it is compared with the incoming
pilot tone. The DC output signal of the phase detector
(pin 1) controls the oscillator (PLL).
The pilot presence detector is driven by internally
generated in-phase 19 kHz. Its pilot-dependent DC output
voltage (pin 19) is fed to a threshold switch, which
activates the pilot indicator logic output (pin 18) and turns
the stereo decoder to stereo operation. The same
DC voltage is used to control the amplitude of an
anti-phase internally generated 19 kHz signal. In the
pilot canceller, the pilot tone is compensated by this
anti-phase 19 kHz signal.
The pilot cancelled signal is fed to the multiplex decoder.
There, the side signal is demodulated and combined with
the main signal in a matrix to left and right audio channel.
Compensation for roll-off in the incoming MPX signal
caused by IF filters and FM demodulator is realized by
corresponding side signal amplification.
A smooth mono to stereo take-over, which is controlled by
the level detector voltage of the IF part, is achieved by the
SNC (pins 16 and 17; see Fig.6).
From the output of the MPX demodulator the signals are
fed to 2-pole low-pass filters with a cut-off frequency of
30 kHz to provide additional signal delay for noise blanking
and attenuation of the subcarrier and its harmonics.
These filters are followed by the noise suppression gates,
which are combined with de-emphasis and HCC. The
de-emphasis is defined by internal resistors (aligned by an
external current) and external capacitors (pins 13 and 14).
For HCC, the de-emphasis time constant can be changed
to higher values (pins 15 and 17; see Figs 7 to 9). This
function is controlled by an analog input signal, derived
from the level detector voltage of the IF part. When the
VCO is turned off (pin 7 to GND), de-emphasis is reduced
to 20
s for full frequency response when AM-AF is fed
through the stereo decoder. De-emphasis remains
controllable.
From the gate circuits audio is fed through internal series
resistors to the inverting inputs of the output operational
amplifiers (pins 9 and 12), which can also be used as
signal inputs for cassette playback or other sources when
the mute is activated. The gain of these amplifiers is
defined by external feedback resistors R
out
(pins 9, 10, 11 and 12).
The input of the ignition noise blanker is the null node of an
operational amplifier (pin 6). It can be driven by the level
detector output of the FM-IF limiter and/or the MPX signal.
Its sensitivity is dependent on the value of the series input
resistor at pin 6.
The operational amplifier output signal is fed through an
integrated 120 kHz high-pass filter, becomes amplified
and is then fed in parallel to the noise detector and the
interference detector. The noise detector is a negative
peak detector. Its output (pin 8) controls the trigger
sensitivity (prevention to false triggering at noisy input
signals) and the attenuation of the input operational
amplifier. The output of the interference detector, when
receiving a steep pulse, triggers a mono flip-flop, which is
a part of the pulse former circuit. The time constant of the
mono flip-flop is defined by an external capacitor (pin 7)
and its output activates the blanking gates in the audio.
1996 May 31
6
Philips Semiconductors
Preliminary specification
PLL stereo decoder and noise blanker
TDA1592
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
Note
1. Equivalent to discharging a 200 pF capacitor through a 0
series resistor.
CHARACTERISTICS
V
P
= 10 V; T
amb
= 25
C; input signal V
i MPX(p-p)
= 1.7 V; m = 100% (
f =
75 kHz, f
mod
= 1 kHz); de-emphasis of 50
s
and series resistor at input R
1
= 164 k
; measurements taken in Fig.1; unless otherwise specified.
SYMBOL
PARAMETER
MIN.
MAX.
UNIT
V
P
supply voltage (pin 5)
0
13.2
V
P
tot
total power dissipation
0
0.25
W
T
stg
storage temperature
-
55
+150
C
T
amb
operating ambient temperature
-
40
+85
C
V
es
electrostatic handling for all pins; note 1
-
400
+400
V
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
V
P
supply voltage (pin 5)
7.5
10
12
V
I
P
supply current
-
15
20
mA
Stereo decoder
V
i MPX(p-p)
MPX input signal
-
1.7
-
V
V
i MPX(p-p)
overdrive margin of MPX input signal
THD = 1%
6
-
-
dB
V
o(rms)
AF mono output signal at pins 10 and 11
(RMS value)
without pilot
800
900
1000
mV
V
o
overdrive margin of output signal
THD = 1%
6
-
-
dB
V
10-11
/V
o
difference of output voltage levels
-
-
1
dB
V
o 10,11
DC output voltage (pins 10 and 11)
3.2
3.7
4.2
V
R
o 10,11
output resistance
-
150
-
I
o
output current
330
400
-
A
R
2,3
maximum feedback resistor
-
-
68
k
V
4,3
reference voltage
3.7
3.8
3.9
V
cs
channel separation
pin 16 open-circuit;
see Fig.6
30
40
-
dB
THD
total harmonic distortion
-
0.1
0.3
%
S/N
signal-to-noise ratio
f = 20 to 16000 Hz
77
82
-
dB
19
pilot signal suppression
f = 19 kHz
40
50
-
dB
38
subcarrier suppression
f = 38 kHz
35
50
-
dB
57
f = 57 kHz
46
-
-
dB
76
f = 76 kHz
-
60
-
dB
IM2
intermodulation for f
spur
= 1 kHz
f
mod
= 10 kHz; note 1
-
60
-
dB
IM3
f
mod
= 13 kHz
-
58
-
dB
57 VF
traffic radio (VWF)
f = 57 kHz; note 2
-
70
-
dB
67
SCA (Subsidiary Communications
Authorization)
f = 67 kHz; note 3
70
-
-
dB
1996 May 31
7
Philips Semiconductors
Preliminary specification
PLL stereo decoder and noise blanker
TDA1592
114
ACI (Adjacent Channel Interference)
f = 114 kHz; note 4
-
80
-
dB
190
f = 190 kHz; note 4
-
70
-
dB
PSRR
power supply ripple rejection
f = 100 Hz;
V
ripple (rms)
= 100 mV
-
35
-
dB
VCO (pin 2)
f
osc
oscillator frequency (ceramic resonator)
-
456
-
kHz
frequency range of free running oscillator
451
-
459
kHz
f/f
capture and holding range
-
0.65
-
%
V
7
VCO-off voltage (pin 7)
0
-
0.6
V
Mono/stereo control (pins 16, 17 and 19)
V
i pilot
pilot threshold voltage for automatic switching
by pilot input voltage (RMS value)
stereo on
-
24
30
mV
stereo off
8
20
-
mV
HYS
hysteresis of pilot threshold voltage
-
2
-
dB
V
19
switching voltage for external mono control
(pin 19)
-
-
0.7
V
V
ref
reference input voltage range (pin 17)
1
-
5
V
V
16-17
control voltage for channel separation due to
pin 17 (V
ref
)
cs
= 6 dB; see Fig.5
-
80
-
100
-
120
mV
cs
= 20 dB; see Fig.5
-
40
-
55
-
70
mV
Pilot indicator logic level output (pin 18)
V
18
LOW voltage
I
18
= 500
A
-
250
400
mV
I
18
HIGH current
V
18
= 10 V
-
-
1
A
Muting (pin 8)
MUTE
att
mute attenuation (pin 8)
V
8
< 1.6 V
80
-
-
dB
V
8
> 4 V
-
-
0.2
dB
V
o(offset)
DC offset voltage (pins 10 and 11)
after muting
-
-
50
mV
HCC (pin 15)
CR
deem
control range of de-emphasis
see Figs 7 and 8
for European standard
C
deem
= 6.8 nF
50
-
150
s
for USA standard
C
deem
= 10 nF
75
-
225
s
V
15-17
control voltage (pin 15 due to pin 17) in both
standards
lower value CR
deem
-
0
-
mV
upper value CR
deem
-
-
300
-
mV
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
1996 May 31
8
Philips Semiconductors
Preliminary specification
PLL stereo decoder and noise blanker
TDA1592
Notes
1. Intermodulation suppression [Beat Frequency Components (BFC)]:
;
;
measured with 91% mono signal; f
mod
= 10 kHz or 13 kHz; 9% pilot signal.
2. ARI suppression:
measured with 91% stereo signal; f
mod
= 1 kHz; 9% pilot signal; 5% ARI subcarrier
(f
s
= 57 kHz; f
mod
= 23 Hz; AM m = 0.6).
3. Subsidiary Communication Authorization (SCA):
;
measured with 81% mono signal; f
mod
= 1 kHz; 9% pilot signal; 10% SCA subcarrier (f
s
= 67 kHz, unmodulated).
4. Adjacent Channel Interference (ACI):
;
;
measured with 90% mono signal; f
mod
= 1 kHz; 9% pilot signal; 1% spurious signal
(f
s
= 110 kHz or 186 kHz, unmodulated).
HCC (pin 15, pin 7 to GND)
CR
deem
control range of de-emphasis
see Fig.9
for European standard
C
deem
= 6.8 nF
15
-
90
s
for USA standard
C
deem
= 10 nF
22
-
135
s
V
15-17
control voltage (pin 15 due to pin 17) in both
standards
lower value CR
deem
-
0
-
mV
upper value CR
deem
-
-
300
-
mV
V
10
,
V
11
DC offset voltage at AF outputs (AM on/off)
-
-
200
mV
Noise interference detector
V
pulse
trigger sensitivity
pulse
= 10
s
-
10
-
mV
V
8
trigger threshold voltage offset as a function of
V
trigg
f
int
= 120 kHz
V
interf.in
= 10 mV
150
200
250
mV
V
interf.in
= 100 mV
550
650
750
mV
t
sup
AF suppression time; pulse width
-
40
-
s
I
13,14
input offset current (pins 13 and 14)
during AF suppression
time
-
20
-
nA
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
IM2
V
o(signal)
at 1 kHz
(
)
V
o(spurious)
at 1 kHz
(
)
--------------------------------------------------------
=
f
s
2
10 kHz
(
)
19 kHz
=
IM3
V
o(signal)
at 1 kHz
(
)
V
o(spurious)
at 1 kHz
(
)
--------------------------------------------------------
=
f
s
3
13 kHz
(
)
38 kHz
=
57
ARI
V
o(signal)
at 1 kHz
(
)
V
o(spurious)
at 1 kHz
23 Hz
(
)
-----------------------------------------------------------------------------
=
67
V
o(signal)
at 1 kHz
(
)
V
o(spurious)
at 9 kHz
(
)
--------------------------------------------------------
=
f
s
2
38 kHz
(
)
67 kHz
=
114
V
o(signal)
at 1 kHz
(
)
V
o(spurious)
at 4 kHz
(
)
--------------------------------------------------------
=
f
s
110 kHz
3
38 kHz
(
)
=
190
V
o(signal)
at 1 kHz
(
)
V
o(spurious)
at 4 kHz
(
)
--------------------------------------------------------
=
f
s
186 kHz
5
38 kHz
(
)
=
1996 May 31
9
Philips Semiconductors
Preliminary specification
PLL stereo decoder and noise blanker
TDA1592
Fig.3 Input signal as a function of series input resistor R
in
.
handbook, halfpage
0
0
100
300
4
3
1
2
MED727
200
Vi MPX(p-p)
(V)
Rin (k
)
Fig.4 Overall signal gain as a function of feedback resistors R
out
(R
in
= 164 k
).
handbook, halfpage
0
20
40
60
-
4
+
4
MED728
+
2
0
-
2
G
(dB)
Rout (k
)
1996 May 31
10
Philips Semiconductors
Preliminary specification
PLL stereo decoder and noise blanker
TDA1592
Fig.5 Channel separation as a function of audio frequency.
(1) Coupling capacitor C
K
at pin 20 = 10
F.
(2) Coupling capacitor C
K
at pin 20 = 0.1
F.
handbook, full pagewidth
0
50
10
5
MED729
10
4
10
3
10
2
10
10
20
30
40
cs
(dB)
AFout (Hz)
(2)
(1)
Fig.6 Stereo blend characteristic (SNC).
handbook, halfpage
-
200
-
100
50
0
MED730
0
10
20
30
40
cs
(dB)
control voltage V16-17 (mV)
Fig.7 HCC with f
mod
= 10 kHz.
handbook, halfpage
-
300
-
200
0
0
-
10
MED731
-
100
-
8
-
6
-
4
-
2
Vo
(dB)
control voltage V15-17 (mV)
1996 May 31
11
Philips Semiconductors
Preliminary specification
PLL stereo decoder and noise blanker
TDA1592
Fig.8 HCC with pre-emphasis as a function of audio frequency.
(1) V
15-17
= 0.
(2) V
15-17
=
-
300 mV.
handbook, full pagewidth
2
10
5
MED732
10
4
10
3
10
2
10
-
2
-
4
-
6
-
8
-
10
-
12
0
AFout (Hz)
Vo
(dB)
(2)
(1)
Fig.9 HCC as a function of audio frequency (pin 7 connected to GND; without pre-emphasis).
(1) V
15-17
= 0.
(2) V
15-17
=
-
300 mV.
handbook, full pagewidth
10
5
MED733
10
4
10
3
10
2
10
AFout (Hz)
2
-
2
-
4
-
6
-
8
-
10
-
12
-
14
-
16
-
18
0
Vo
(dB)
(2)
(1)
1996 May 31
12
Philips Semiconductors
Preliminary specification
PLL stereo decoder and noise blanker
TDA1592
INTERNAL PIN CONFIGURATION
Fig.10 Internal circuitry.
handbook, full pagewidth
MED725
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
3.8 V
Vi MPX
4.5 V (0.4 V)
PILOT
IDENT
1 to 5 V
Vref
1 to 5 V
SNC
1 to 5 V
HCC
3.8 V
CDEER
3.8 V
CDEEL
3.8 V
FB-R
3.6 V
VoR
4.3 V (4.6 V)
PLL
3.6 V
OSC
GND
3.8 V
Iref
VP
2.1 V ( 3
VBE)
INFI
2.1 V ( 3
VBE)
PUFO
VP
-
2.2 V
NDET
3.8 V
FB-L
3.6 V
VoL
400
A
400
A
14
A
400
A
TDA1592
1996 May 31
13
Philips Semiconductors
Preliminary specification
PLL stereo decoder and noise blanker
TDA1592
TEST INFORMATION
Fig.11 TDA1592 test board (component side).
handbook, full pagewidth
MED734
interference IN
CSB456F11
47
BC548
47 nF
220
nF
AUX IN
right
AUX IN
left
right
OUT
left
OUT
220 nF
220 nF
220 nF
6.8
nF
+
VP
GND
Pilot
indicator
HCC
SNC
Vref
100 nF
mono
MPX IN
VCO off
mute
820
68 pF
10 nF
100 nF
100 nF
100 nF
33 pF
TDA1592
6.8 nF
68 k
82 k
10
k
12
k
820 k
82
k
100 k
100 k
100 k
27 k
27 k
k
k
27
k
47
k
33
k
47 k
47 k
27 k
10
100
F
101
mm
76 mm
1996 May 31
14
Philips Semiconductors
Preliminary specification
PLL stereo decoder and noise blanker
TDA1592
PACKAGE OUTLINES
UNIT
A
max.
1
2
b
1
c
D
E
e
M
H
L
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC
JEDEC
EIAJ
mm
inches
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
SOT146-1
92-11-17
95-05-24
A
min.
A
max.
b
Z
max.
w
M
E
e
1
1.73
1.30
0.53
0.38
0.36
0.23
26.92
26.54
6.40
6.22
3.60
3.05
0.254
2.54
7.62
8.25
7.80
10.0
8.3
2.0
4.2
0.51
3.2
0.068
0.051
0.021
0.015
0.014
0.009
1.060
1.045
0.25
0.24
0.14
0.12
0.01
0.10
0.30
0.32
0.31
0.39
0.33
0.078
0.17
0.020
0.13
SC603
M
H
c
(e )
1
M
E
A
L
seating plane
A
1
w
M
b
1
e
D
A
2
Z
20
1
11
10
b
E
pin 1 index
0
5
10 mm
scale
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
(1)
(1)
(1)
DIP20: plastic dual in-line package; 20 leads (300 mil)
SOT146-1
1996 May 31
15
Philips Semiconductors
Preliminary specification
PLL stereo decoder and noise blanker
TDA1592
UNIT
A
max.
A
1
A
2
A
3
b
p
c
D
(1)
E
(1)
(1)
e
H
E
L
L
p
Q
Z
y
w
v
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC
JEDEC
EIAJ
mm
inches
2.65
0.30
0.10
2.45
2.25
0.49
0.36
0.32
0.23
13.0
12.6
7.6
7.4
1.27
10.65
10.00
1.1
1.0
0.9
0.4
8
0
o
o
0.25
0.1
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
Note
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
1.1
0.4
SOT163-1
92-11-17
95-01-24
10
20
w
M
b
p
detail X
Z
e
11
1
D
y
0.25
075E04
MS-013AC
pin 1 index
0.10
0.012
0.004
0.096
0.089
0.019
0.014
0.013
0.009
0.51
0.49
0.30
0.29
0.050
1.4
0.055
0.42
0.39
0.043
0.039
0.035
0.016
0.01
0.25
0.01
0.004
0.043
0.016
0.01
0
5
10 mm
scale
X
A
A
1
A
2
H
E
L
p
Q
E
c
L
v
M
A
(A )
3
A
SO20: plastic small outline package; 20 leads; body width 7.5 mm
SOT163-1
1996 May 31
16
Philips Semiconductors
Preliminary specification
PLL stereo decoder and noise blanker
TDA1592
SOLDERING
Introduction
There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our
"IC Package Databook" (order code 9398 652 90011).
DIP
S
OLDERING BY DIPPING OR BY WAVE
The maximum permissible temperature of the solder is
260
C; solder at this temperature must not be in contact
with the joint for more than 5 seconds. The total contact
time of successive solder waves must not exceed
5 seconds.
The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified maximum storage temperature (T
stg max
). If the
printed-circuit board has been pre-heated, forced cooling
may be necessary immediately after soldering to keep the
temperature within the permissible limit.
R
EPAIRING SOLDERED JOINTS
Apply a low voltage soldering iron (less than 24 V) to the
lead(s) of the package, below the seating plane or not
more than 2 mm above it. If the temperature of the
soldering iron bit is less than 300
C it may remain in
contact for up to 10 seconds. If the bit temperature is
between 300 and 400
C, contact may be up to 5 seconds.
SO
R
EFLOW SOLDERING
Reflow soldering techniques are suitable for all SO
packages.
Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.
Several techniques exist for reflowing; for example,
thermal conduction by heated belt. Dwell times vary
between 50 and 300 seconds depending on heating
method. Typical reflow temperatures range from
215 to 250
C.
Preheating is necessary to dry the paste and evaporate
the binding agent. Preheating duration: 45 minutes at
45
C.
W
AVE SOLDERING
Wave soldering techniques can be used for all SO
packages if the following conditions are observed:
A double-wave (a turbulent wave with high upward
pressure followed by a smooth laminar wave) soldering
technique should be used.
The longitudinal axis of the package footprint must be
parallel to the solder flow.
The package footprint must incorporate solder thieves at
the downstream end.
During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.
Maximum permissible solder temperature is 260
C, and
maximum duration of package immersion in solder is
10 seconds, if cooled to less than 150
C within
6 seconds. Typical dwell time is 4 seconds at 250
C.
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.
R
EPAIRING SOLDERED JOINTS
Fix the component by first soldering two diagonally-
opposite end leads. Use only a low voltage soldering iron
(less than 24 V) applied to the flat part of the lead. Contact
time must be limited to 10 seconds at up to 300
C. When
using a dedicated tool, all other leads can be soldered in
one operation within 2 to 5 seconds between
270 and 320
C.
1996 May 31
17
Philips Semiconductors
Preliminary specification
PLL stereo decoder and noise blanker
TDA1592
DEFINITIONS
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
Data sheet status
Objective specification
This data sheet contains target or goal specifications for product development.
Preliminary specification
This data sheet contains preliminary data; supplementary data may be published later.
Product specification
This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
1996 May 31
18
Philips Semiconductors
Preliminary specification
PLL stereo decoder and noise blanker
TDA1592
NOTES
1996 May 31
19
Philips Semiconductors
Preliminary specification
PLL stereo decoder and noise blanker
TDA1592
NOTES
Internet: http://www.semiconductors.philips.com/ps/
(1)
ADDRESS CONTENT SOURCE May 31, 1996
Philips Semiconductors a worldwide company
Philips Electronics N.V. 1996
SCA49
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Printed in The Netherlands
517021/1200/02/pp20
Date of release: 1996 May 31
Document order number:
9397 750 00875