Document Outline
- GENERAL DESCRIPTION
- QUICK REFERENCE DATA
- PACKAGE OUTLINE
- RATINGS
- CHARACTERISTICS
- PACKAGE OUTLINE
- SOLDERING
- DEFINITIONS
- LIFE SUPPORT APPLICATIONS
DATA SHEET
Product specification
File under Integrated Circuits, IC02
March 1986
INTEGRATED CIRCUITS
TDA2555
TDA2557
Dual TV sound demodulator circuits
March 1986
2
Philips Semiconductors
Product specification
Dual TV sound demodulator circuits
TDA2555
TDA2557
GENERAL DESCRIPTION
The circuits incorporate two FM demodulator systems to perform the demodulator functions required in a dual sound
carrier TV system for demodulating the sound carriers.
The difference between TDA2555 and TDA2557 is the number of stages of the limiting amplifier.
Eight (TDA2555) or five (TDA2557) stage limiting amplifier
Quadrature demodulator for FM detection
De-emphasis stage
Output amplifier
Mute function for each FM demodulator
QUICK REFERENCE DATA
PACKAGE OUTLINE
18-lead DIL; plastic (SOT102); SOT102-1; 1996 November 19.
Supply voltage (pins 13 and 15)
V
P
typ.
12
V
Supply current (pins 13 and 15)
I
P
typ.
24,5
mA
AF output voltage (pins 2 and 8)
V
o(rms)
typ.
600
mV
Total harmonic distortion (note 1)
THD
<
0,1
%
Signal to weighted noise ratio
(S
+
N)/N
typ.
70
dB
March 1986
3
Philips Semiconductors
Product specification
Dual TV sound demodulator circuits
TDA2555
TDA2557
Fig.1 Block diagram.
TDA2555 with 8-stage limiting amplifier;
TDA2557 with 5-stage limiting amplifier.
March 1986
4
Philips Semiconductors
Product specification
Dual TV sound demodulator circuits
TDA2555
TDA2557
RATINGS
Limiting values in accordance with the Absolute Maximum System (IEC 134)
Supply voltage (pins 13 and 15)
V
P
max.
13,2
V
Total power dissipation
P
tot
max.
400
mW
Storage temperature range
T
stg
-
40 to
+
150
C
Operating ambient temperature
T
amb
0 to
+
70
C
March 1986
5
Philips Semiconductors
Product specification
Dual TV sound demodulator circuits
TDA2555
TDA2557
CHARACTERISTICS
V
P
= V
13, 15-14
= 12 V; T
amb
= 25
C; f
IF1
= 5,5 MHz; f
IF2
= 5,74 MHz; f
m1
= 1 kHz;
f =
30 kHz;
V
i(rms)
= 5 mV for TDA2555;
V
i(rms)
= 10 mV for TDA2557;
see test circuit Fig.3, voltages with respect to ground (pin 14), unless otherwise specified.
PARAMETER
SYMBOL
MIN.
TYP.
MAX.
UNIT
Total current consumption
I
13, 15
18
24,5
30
mA
LIMITING AMPLIFIER
Maximum input voltage
V
11-12(rms)
V
16-17(rms)
-
200
-
mV
Input voltage for start of limiting
(3 dB AF signal reduction)
TDA2555
V
11-12(rms)
V
16-17(rms)
-
50
100
V
TDA2557
V
11-12(rms)
V
16-17(rms)
-
250
500
V
DC voltage
(input limiting amplifier) pins
11, 12, 16, 17 to 14
V
i
-
2,0
-
V
DC voltage
(feedback loop)
V
10,18-14
-
2,0
-
V
FM DEMODULATOR
IF reference signal voltage
V
3-4(rms)
V
6-7(rms)
-
200
-
mV
DC voltage
V
3,4,6,7-14
-
3,1
-
V
AF output voltage
V
2-14(rms)
450
600
750
mV
Difference of output signals
-
0,1
0,5
dB
Total harmonic distortion
at outputs AF1 and AF2 (note 1)
THD
-
-
0,5
%
A.M. suppression
at outputs AF1 and AF2, f
FM
= 70 Hz;
f =
50 kHz; f
AM
= 1 kHz; m = 0,3
AMS
50
-
-
dB
Signal to noise ratio
at outputs AF1 and AF2
(CCIR weighted, quasi peak)
(S
+
N)/N
65
70
-
dB
Residual IF-signal
without de-emphasis
V
2,8-14(rms)
-
30
-
mV
Ripple rejection
at outputs AF1 and AF2
f = 50 Hz to 20 kHz; V
i(rms)
= 200 mV
RR
-
40
-
dB
V
2
14
V
8
14
----------------
March 1986
6
Philips Semiconductors
Product specification
Dual TV sound demodulator circuits
TDA2555
TDA2557
Notes to the characteristics
1. THD
<
0,1% requires a double tuned demodulator circuit (Q
L
= 20). With a single tuned circuit a THD of
<
0,5% is
possible (see Fig.1 and Fig.3).
2. If higher a.c. output current is required an external resistor must be applied from output (pins 2 and 8) to ground
(min. 2 k
) in order to improve the THD performance (
-
I
2,8
<
4 mA).
3. The de-emphasis time constant is 50
s.
4. Crosstalk attenuation is defined as:
5. In the MUTE state the a.f. output level attenuation is more than 60 dB. The MUTE function is only guaranteed for an
r.m.s. value of the input voltage lower than 60 mV. See also Fig.2.
AUDIO OUTPUT STAGE
emitter follower with 1,0 mA bias current
DC output voltage
V
2,8-14
3,0
4,0
5,0
V
External DC load resistance
R
2,8-14
2
-
-
k
AC output current (note 2)
-
I
2,8-14(p-p)
-
-
0,5
mA
De-emphasis input resistance (note 3)
R
1,9-14
0,8
1,0
1,2
k
DC voltage (de-emphasis)
V
1,9-14
3,7
4,7
5,7
V
Crosstalk attenuation
f = 1 kHz (note 4)
12,21
60
-
-
dB
Crosstalk attenuation
f = 10 kHz (note 4)
12,21
60
-
-
dB
Output impedance
R
2,8-14
-
25
-
AF output level (Fig.2, note 5)
MUTE function
V
i(rms)
<
60 mV
60
-
-
dB
Switching input current
V
5-14
= 0 V
-
I
5
-
-
500
A
V
5-14
= V
P
I
5
-
-
500
A
Internal d.c. voltage
no mute (pin 5 not connected)
V
5-14
-
6,2
-
V
PARAMETER
SYMBOL
MIN.
TYP.
MAX.
UNIT
o
12
V
2
14
unmodulated
V
8
14
--------------------------------------------------------
=
o
21
V
8
14
unmodulated
V
2
14
--------------------------------------------------------
=
.
March 1986
7
Philips Semiconductors
Product specification
Dual TV sound demodulator circuits
TDA2555
TDA2557
Fig.2 Mute function.
March 1986
8
Philips Semiconductors
Product specification
Dual TV sound demodulator circuits
TDA2555
TDA2557
Fig.3 Test and application circuit.
March 1986
9
Philips Semiconductors
Product specification
Dual TV sound demodulator circuits
TDA2555
TDA2557
PACKAGE OUTLINE
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC
JEDEC
EIAJ
SOT102-1
93-10-14
95-01-23
UNIT
A
max.
1
2
b
1
(1)
(1)
(1)
b
2
c
D
E
e
M
Z
H
L
mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
A
min.
A
max.
b
max.
w
M
E
e
1
1.40
1.14
0.53
0.38
0.32
0.23
21.8
21.4
6.48
6.20
3.9
3.4
0.254
2.54
7.62
8.25
7.80
9.5
8.3
0.85
4.7
0.51
3.7
inches
0.055
0.044
0.021
0.015
0.013
0.009
1.40
1.14
0.055
0.044
0.86
0.84
0.26
0.24
0.15
0.13
0.01
0.10
0.30
0.32
0.31
0.37
0.33
0.033
0.19
0.020
0.15
M
H
c
(e )
1
M
E
A
L
seating plane
A
1
w
M
b
1
b
2
e
D
A
2
Z
18
1
10
9
b
E
pin 1 index
0
5
10 mm
scale
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
DIP18: plastic dual in-line package; 18 leads (300 mil)
SOT102-1
March 1986
10
Philips Semiconductors
Product specification
Dual TV sound demodulator circuits
TDA2555
TDA2557
SOLDERING
Introduction
There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and
surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for
surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often
used.
This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our
"IC Package Databook" (order code 9398 652 90011).
Soldering by dipping or by wave
The maximum permissible temperature of the solder is 260
C; solder at this temperature must not be in contact with the
joint for more than 5 seconds. The total contact time of successive solder waves must not exceed 5 seconds.
The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the
specified maximum storage temperature (T
stg max
). If the printed-circuit board has been pre-heated, forced cooling may
be necessary immediately after soldering to keep the temperature within the permissible limit.
Repairing soldered joints
Apply a low voltage soldering iron (less than 24 V) to the lead(s) of the package, below the seating plane or not more
than 2 mm above it. If the temperature of the soldering iron bit is less than 300
C it may remain in contact for up to
10 seconds. If the bit temperature is between 300 and 400
C, contact may be up to 5 seconds.
DEFINITIONS
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
Data sheet status
Objective specification
This data sheet contains target or goal specifications for product development.
Preliminary specification
This data sheet contains preliminary data; supplementary data may be published later.
Product specification
This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
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