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Электронный компонент: TDA3616T/N1

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DATA SHEET
Product specification
Supersedes data of 2000 Jan 14
File under Integrated Circuits, IC01
2001 Feb 02
INTEGRATED CIRCUITS
TDA3616
Multiple voltage regulator with
battery detection
2001 Feb 02
2
Philips Semiconductors
Product specification
Multiple voltage regulator with battery
detection
TDA3616
FEATURES
General
One V
P
-state controlled regulator
Battery detection circuit
Regulator, reset and battery outputs operate during load
dump
Supply voltage range from
-
18 to +50 V
Low quiescent current (battery detection switched off)
High ripple rejection
Dual reset output
Backup circuit
Adjustable reset delay timer.
Protections
Reverse polarity safe (down to
-
18 V without high
reverse current)
Able to withstand voltages up to 18 V at the output
(supply line may be short-circuited)
ESD protected on all pins
Load dump protection
Foldback current limit protection for regulator
The regulator output is DC short-circuited safe to ground
and V
P
.
GENERAL DESCRIPTION
The TDA3616 is a low power voltage regulator. It contains
the following:
One fixed voltage regulator with a foldback current
protection, intended to supply a microprocessor, that
also operates during load dump
A provision for use of a reserve supply capacitor that will
hold enough energy for the regulator to allow a
microcontroller to prepare for loss of supply voltage
Reset signals which can be used to interface with the
microprocessor
A supply pin that can withstand load dump pulses and
negative supply voltages
Defined start-up behaviour; regulator will be switched on
at a supply voltage higher than 7.5 V and off when the
output voltage of the regulator drops below 2.4 V.
QUICK REFERENCE DATA
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
Supply
V
P
supply voltage
operating
regulator on
5.6
14.4
25
V
jump start
t
10 minutes
-
-
30
V
load dump protection
t
50 ms; t
r
2.5 ms
-
-
50
V
I
q
quiescent supply current
standby mode
-
95
125
A
standby mode; T
amb
= 25
C
-
95
120
A
Regulator
V
o
output voltage
0.5 mA
I
REG
150 mA;
7 V
V
P
18 V; T
amb
= 25
C
4.8
5.0
5.2
V
0.5 mA
I
REG
150 mA;
7 V
V
P
18 V
4.75
5.0
5.25
V
I
REG
= 30 mA;
18 V
V
P
50 V; load dump
4.75
5.0
5.25
V
V
drop
drop-out voltage
I
REG
= 150 mA; V
P
= 5 V;
T
amb
= 25
C
-
0.6
1.0
V
2001 Feb 02
3
Philips Semiconductors
Product specification
Multiple voltage regulator with battery
detection
TDA3616
ORDERING INFORMATION
BLOCK DIAGRAM
TYPE
NUMBER
PACKAGE
NAME
DESCRIPTION
VERSION
TDA3616T
SO20
plastic small outline package; 20 leads; body width 7.5 mm
SOT163-1
TDA3616SF
SIL9MP
plastic single in-line medium power package with fin; 9 leads
SOT110-1
handbook, full pagewidth
MGL933
REGULATOR
LOAD DUMP
PROTECTION
BACKUP SWITCH
REFERENCE
7 (9)
&
GND
TDA3616T
REG
REG
RES2
RES1
(14.4 V)
(1) 14
(3) 16
BU
(5) 18
BATTERY
BUFFER
VO(bat)
VI(bat)
VC
VP
(2) 15
(7) 5
4 (6)
6 (8)
7
4
17 (4)
i.c.
1, 10,
11, 20
n.c.
2, 3, 8, 9,
12, 13, 19
3.1
k
3.1
k
47 k
Fig.1 Block diagram.
The pin numbers given in parenthesis refer to the TDA3616SF version.
2001 Feb 02
4
Philips Semiconductors
Product specification
Multiple voltage regulator with battery
detection
TDA3616
PINNING
Note
1. The i.c. pins are connected to each other by the leadframe and can be kept floating or can be connected to ground.
SYMBOL
PIN
DESCRIPTION
SOT163-1
SOT110-1
i.c.
1, 10, 11, and 20
-
interconnected; heat spreader; note 1
n.c.
2, 3, 8, 9, 12, 13
and 19
-
not connected; heat spreader
V
I(bat)
4
6
battery input voltage
V
O(bat)
5
7
battery detection output voltage
V
C
6
8
reset delay capacitor
GND
7
9
ground (0 V)
RES2
14
1
reset 2 output
RES1
15
2
reset 1 output
REG
16
3
regulator output
V
P
17
4
supply voltage
BU
18
5
backup
Fig.2 Pin configuration (SOT163-1).
The i.c. and n.c. pins can be connected to a heat spreader.
handbook, halfpage
i.c.
n.c.
n.c.
n.c.
n.c.
i.c.
i.c.
n.c.
BU
VP
RES1
RES2
REG
n.c.
n.c.
i.c.
1
2
3
4
5
6
7
8
9
10
11
12
20
19
18
17
16
15
14
13
TDA3616T
MGR093
VI(bat)
VO(bat)
VC
GND
handbook, halfpage
TDA3616SF
MGL930
1
2
3
4
5
6
7
8
9
RES2
RES1
REG
VP
BU
VI(bat)
VO(bat)
VC
GND
Fig.3 Pin configuration (SOT110-1).
2001 Feb 02
5
Philips Semiconductors
Product specification
Multiple voltage regulator with battery
detection
TDA3616
FUNCTIONAL DESCRIPTION
The TDA3616 (see Fig.1) is a voltage regulator intended
to supply a microprocessor (e.g. in car radio applications).
Because of low-voltage operation of the application, a
low-voltage drop regulator is used.
This regulator will switch-on when the backup voltage
(see Section "Backup circuit") exceeds 7.5 V for the first
time and will switch-off again when the output voltage of
the regulator drops below 2.4 V. When the regulator is
switched on, the RES1 and RES2 outputs (RES2 can only
be HIGH when RES1 is HIGH) will go HIGH after a fixed
delay time (fixed by an external delay capacitor) to
generate a reset to the microprocessor.
Pin RES1 will go HIGH via an internal pull-up resistor of
3.1 k
, and is used to initialize the microprocessor.
Pin RES2 is used to indicate that the regulator output
voltage is within its voltage range. This start-up feature is
built-in to secure a smooth start-up of the microprocessor
at first connection, without uncontrolled switching of the
regulator during the start-up sequence.
The charge of the backup capacitor can be used to supply
the regulator and logic circuits for a short period of time
when the supply falls to 0 V (the time depends on the value
of the storage capacitor). The regulator is switched off at a
backup voltage of approximately 2.7 V. From this time
onwards, the backup charge will only be used for
maintaining reset functions. Due to this, the reset outputs
will remain LOW until the output of the regulator is dropped
to 0 V.
All output pins are fully protected. The regulator is
protected against load dump and short-circuit (foldback
current protection). At load dump, the battery detection
circuit will remain operating.
Interfacing with the microprocessor can be accomplished
by means of a battery Schmitt trigger and output buffer
(simple full/semi on/off logic applications). The battery
output will go HIGH when the battery input voltage
exceeds the high threshold level.
The timing diagrams are shown in Fig.4.
Fig.4 Timing diagrams.
handbook, full pagewidth
MGR095
battery output
battery input
reset 1
reset 2
regulator
VBU
VP
reset delay
capacitor
2 V
2 V
4.75 V
18 V
2.4 V
2.05 V
1.95 V
2001 Feb 02
6
Philips Semiconductors
Product specification
Multiple voltage regulator with battery
detection
TDA3616
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
THERMAL CHARACTERISTICS
QUALITY SPECIFICATION
Quality specification in accordance with
"SNW-FQ-611E".
SYMBOL
PARAMETER
CONDITIONS
MIN.
MAX.
UNIT
V
P
supply voltage
operating
regulator on
-
25
V
jump start
t
10 minutes
-
30
V
load dump protection
t
50 ms; t
r
2.5 ms
-
50
V
V
rp
reverse polarity voltage
non-operating
-
-
18
V
V
I(bat)p
positive pulse voltage at battery input
V
P
= 14.4 V; R
I
= 5 k
-
50
V
V
I(bat)n
negative pulse voltage at battery input
V
P
= 14.4 V; R
I
= 10 k
;
C
l
= 1 nF
-
-
100
V
P
tot
total power dissipation
V
P
= 12.4 V
-
2.5
W
T
stg
storage temperature
non-operating
-
55
+150
C
T
amb
ambient temperature
operating
-
40
+105
C
T
j
junction temperature
operating
-
40
+150
C
SYMBOL
PARAMETER
CONDITIONS
VALUE
UNIT
R
th(j-p)
thermal resistance from junction to pin/tab
TDA3616T
20
K/W
TDA3616SF
12
K/W
R
th(j-a)
thermal resistance from junction to ambient
TDA3616T
10 cm
2
2-sided copper
area connected to pins
50
K/W
TDA3616SF
in free air
50
K/W
2001 Feb 02
7
Philips Semiconductors
Product specification
Multiple voltage regulator with battery
detection
TDA3616
CHARACTERISTICS
V
P
= 14.4 V; I
REG
= 0.5 mA;
-
40
C < T
amb
< +105
C; measurements taken in test circuit of Fig.7; unless otherwise
specified.
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
Supply
V
P
supply voltage
operating
regulator on; note 1
5.6
14.4
25
V
jump start
t
10 minutes
-
-
30
V
load dump protection
t
50 ms; t
r
2.5 ms
-
-
50
V
I
q
quiescent supply current
V
P
= 12.4 V; T
amb
= 25
C; note 2
-
95
120
A
V
P
= 12.4 V; note 2
-
95
125
A
V
P
= 14.4 V; note 2
-
100
-
A
V
P
= 50 V; load dump
-
5
20
mA
Schmitt trigger for regulator and reset 1
V
th(r)
rising threshold voltage
R
L(REG)
= 1 k
6.2
7.5
8.1
V
V
th(f)
falling threshold voltage
I
REG
= 5 mA
2.1
2.4
2.7
V
I
REG
= 30 mA
-
2.25
-
V
V
hys
hysteresis voltage
-
5.1
-
V
Schmitt trigger for battery detection
V
th(r)
rising threshold voltage
T
amb
= 25
C
2.0
2.1
2.2
V
2.0
2.1
2.25
V
V
th(f)
falling threshold voltage
T
amb
= 25
C
1.9
2.0
2.1
V
1.9
2.0
2.15
V
V
hys
hysteresis voltage
-
0.1
-
V
Schmitt trigger for reset 2
V
th(r)
rising threshold voltage
note 3
4.55
4.8
5.05
V
V
th(f)
falling threshold voltage
note 3
4.5
4.75
5.0
V
V
hys
hysteresis voltage
-
0.05
-
V
V
track
voltage tracking with V
REG
I
sink
= 0 mA; note 4
-
65
0
+65
mV
Reset 1 and reset 2 buffers
I
sink(L)
LOW-level sink current
V
RES
0.5 V; note 3
2
15
-
mA
R
pu(int)
internal pull-up resistance
T
amb
= 25
C
2.2
3.1
4.0
k
1.9
3.1
4.6
k
Reset delay
R
pu(int)
internal pull-up resistance
T
amb
= 25
C; note 5
-
47
-
k
V
th(r)
rising threshold voltage
1.4
2.0
2.8
V
t
d
delay time
C
d
= 100 nF; note 6; see Fig.9
-
2.6
-
ms
Battery buffer
V
OL
LOW-level output voltage
I
I
= 0 mA
0
0.05
0.5
V
V
OH
HIGH-level output voltage
I
o
= 5
A; note 7
-
5.0
5.2
V
I
OL
LOW-level output current
V
OL
0.5 V
0.2
0.5
-
mA
I
OH
HIGH-level output current
V
OH
4 V; see Fig.6
1
12
-
mA
2001 Feb 02
8
Philips Semiconductors
Product specification
Multiple voltage regulator with battery
detection
TDA3616
Notes
1. Minimum operating voltage, only if V
P
has exceeded 7.5 V.
2. The quiescent current is measured in standby mode. Therefore, the battery input is connected to a low voltage
source and R
L(REG)
=
.
3. The voltage of the regulator sinks as a result of a supply voltage drop.
4. Only one band gap circuit is used as a reference for both regulator and Schmitt trigger for reset. Due to this a tracking
exists between the reset Schmitt trigger levels and the output voltage of the regulator.
5. The temperature coefficient of the internal resistor is 0.2%/K.
6. The delay time can be calculated with the following formula:
7. The battery output voltage will be equal or less than the output voltage of the regulator.
8. The drop-out voltage of the regulator is measured between V
P
and V
REG
.
9. At current limit, I
l
is held constant (behaviour according to dashed line in Fig.5).
10. The foldback current protection limits the dissipated power at short-circuit (see Fig.5).
11. The backup switch can deliver an additional current of 100 mA, guaranteed when the regulator is loaded with nominal
loads (I
REG
150 mA).
Regulator (I
REG
= 5 mA; unless otherwise specified)
V
o
output voltage
0.5 mA
I
REG
150 mA;
7 V
V
P
18 V; T
amb
= 25
C
4.8
5.0
5.2
V
0.5 mA
I
REG
150 mA;
7 V
V
P
18 V
4.75
5.0
5.25
V
I
REG
= 30 mA; 18 V
V
P
50 V;
load dump
4.75
5.0
5.25
V
I
o
output current
V
P
> 25 V; load dump
-
-
100
mA
V
LN
line voltage regulation
7 V
V
P
18 V
-
3
50
mV
V
L
load voltage regulation
0.5 mA
I
REG
150 mA;
T
amb
= 25
C
-
-
70
mV
0.5 mA
I
REG
150 mA
-
-
85
mV
SVRR
supply voltage ripple rejection
f
i
= 200 Hz; V
i
= 2 V (p-p); I
o
= 5 mA
55
60
-
dB
V
drop
drop-out voltage
I
REG
= 150 mA; V
P
= 5 V;
T
amb
= 25
C; note 8
-
0.6
1.0
V
I
REG
= 150 mA; V
P
= 5.5 V; note 8
-
0.9
1.2
V
I
l
current limit
V
REG
> 4.5 V; V
P
> 10 V; note 9
0.25
0.6
1
A
I
sc
short-circuit current
R
L(REG)
0.5
; T
amb
= 25
C;
note 10
40
80
-
mA
Backup switch
I
DC
DC continuous current
V
BU
> 5 V; note 11
0.1
0.2
-
A
I
r
reverse current
V
P
= 0 V; V
BU
= 12.4 V
-
-
200
A
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
t
d
R
pu int
(
)
C
d
V
REG
V
REG
V
thr
(
)
-----------------------------------
ln
=
2001 Feb 02
9
Philips Semiconductors
Product specification
Multiple voltage regulator with battery
detection
TDA3616
Fig.5 Foldback current protection.
handbook, halfpage
50 mA
MGL434
5.0 V
1 V
VREG
Isc
IREG
Il
handbook, halfpage
3.25
3.75
4.25
5.25
VO(bat)(V)
IO(bat)
(mA)
16
12
4
0
8
4.75
MGL932
Fig.6 Battery buffer HIGH-level output current as a function of V
O(bat)
.
T
amb
= 27
C.
2001 Feb 02
10
Philips Semiconductors
Product specification
Multiple voltage regulator with battery
detection
TDA3616
TEST AND APPLICATION INFORMATION
Test information
handbook, full pagewidth
MGR097
reset 1 output
reset 2 output
battery output voltage
RL(RES1)
1 k
10 k
RI
15
16
14
5
6
17
7
TDA3616T
GND
VP
VP
VC
battery input voltage
4
VI(bat)
18
back-up capacitor
regulator output
CL
10
F
CP
10
F
(1)
(2)
CI
1 nF
RL(REG)
10 k
CBU
150 nF
Fig.7 Test circuit for TDA3616T.
(1) Capacitor not required for stability.
(2) R
L(REG)
= 0.5
at short-circuit.
2001 Feb 02
11
Philips Semiconductors
Product specification
Multiple voltage regulator with battery
detection
TDA3616
Application information
N
OISE
The noise at the output of the regulator depends on the
bandwidth of the regulator, which can be adjusted by the
output capacitor C
L
. Table 1 shows the noise figures.
The noise on the supply line depends on the value of the
supply capacitor C
P
and is caused by a current noise (the
output noise of the regulator is translated into a current
noise by the output capacitor). When a high frequency
capacitor of 220 nF (with an electrolytic capacitor of
100
F connected in parallel) is connected directly
between pins V
P
and GND the noise is minimized.
Table 1
Noise figures
Note
1. Measured at a bandwidth of 10 Hz to 100 kHz.
S
TABILITY
The regulator is stabilized by the output capacitor C
L
.
The value of the output capacitor can be selected using
the diagram shown in Fig.8. The following two examples
show the effects of the stabilization circuit using different
values for the output capacitor.
Remark: The behaviour of ESR as a function of the
temperature must be known.
Example 1
The regulator is stabilized using an electrolytic output
capacitor of 68
F (ESR = 0.5
). At T
amb
=
-
40
C the
capacitor value is decreased to 22
F and the ESR is
increased to 3.5
. The regulator will remain stable at a
temperature of T
amb
=
-
40
C.
Example 2
The regulator is stabilized using an electrolytic output
capacitor of 10
F (ESR = 3.3
). At T
amb
=
-
40
C the
capacitor value is decreased to 3
F and the ESR is
increased to 23.1
. The regulator will be unstable at a
temperature of T
amb
=
-
40
C. This can be solved by using
a tantalum capacitor of 10
F.
I
O
(mA)
NOISE FIGURE (
V)
(1)
C
L
= 10
F
C
L
= 47
F
C
L
= 100
F
0.5
58
50
45
50
250
200
180
handbook, full pagewidth
2
0
1
0.68
(1)
(2)
10
output capacitor (
F)
MBK118
4
6
8
stable region
100
1000
ESR
(
)
Fig.8 Curve for selecting the value of the output capacitor.
(1) Maximum Equivalent Series Resistance (ESR).
(2) Minimum ESR.
2001 Feb 02
12
Philips Semiconductors
Product specification
Multiple voltage regulator with battery
detection
TDA3616
A
PPLICATION CIRCUIT
In Fig.9 the total quiescent current equals I
q
+ I
Rdivider
.
The specified quiescent current equals I
q
. When the
supply voltage is connected, the regulator will switch-on
when the supply voltage exceeds 7.5 V. With a timing
capacitor connected to pin V
C
the reset can be delayed
(the timer starts at the same moment as the regulator is
switched on).
Forced reset can be accomplished by short-circuiting the
timer capacitor by using the push-button switch. When the
push-button is released again, the timer restarts (only
when the regulator is on) causing a second reset on both
RES1 and RES2.
The maximum output current of the regulator equals:
When T
amb
= 85
C and V
P
= 16 V, the maximum output
current equals 118 mA. At lower ambient temperature
(T
amb
< 0) the maximum output current equals 250 mA.
For successful operation of the IC (maximum output
current capability), special attention has to be paid to the
copper area required as heatsink (connected to
pins 1, 10, 11 and 20), the thermal capacity of the
heatsink and its ability to transfer heat to the external
environment.
It is possible to reduce the total thermal resistance from
120 K/W to 50 K/W).
Backup circuit
The backup function is used for supplying the regulator
and logic circuits (reset 1 and 2) when the supply voltage
is disconnected. For stability a minimum capacitor value
of 150 nF is needed.
With a supply voltage of 14.4 V the backup capacitor will
be fully charged until approximately 14.2 V. At the moment
the supply voltage is lower than the voltage on pin BU the
backup switch will be opened (this backup switch acts like
an ideal diode) and the charge of the backup capacitor is
used for supplying the regulator and the logic circuits.
The backup capacitor is mainly discharged by the load of
the regulator. After a certain period of time the regulator
output will be disabled and the backup capacitor will only
be discharged by the quiescent current of the IC itself.
In combination with the battery detection Schmitt trigger,
an early warning can be given to the microprocessor to
indicate that the battery voltage has dropped down to an
unacceptable low value, causing the microcontroller to run
on backup charge. The early warning level can be
programmed with resistors R1 and R2; see Fig.9.
I
O max
(
)
150
T
amb
R
th(j-a)
V
P
V
REG
(
)
-------------------------------------------------------
150
T
amb
50
V
P
5
(
)
---------------------------------- [mA]
=
=
handbook, full pagewidth
MGL931
TDA3616T
REG
RES1
RES2
(2) 15
(3) 16
VO(bat)
VI(bat)
VC
VP
(1) 14
7 (9)
(7) 5
4 (6)
6 (8)
forced reset
used for
8 V detector
17
(4)
BU
18
(5)
8 V detector
on/off
(closed = on)
R1
360 k
R2
100 k
CL
10
F
2200
F
CBU
1000
F
(minimum value of 150 nF
needed for stability)
Cd
choke
coil
Fig.9 Typical application.
The pin numbers given in parenthesis refer to the TDA3616SF version.
2001 Feb 02
13
Philips Semiconductors
Product specification
Multiple voltage regulator with battery
detection
TDA3616
PACKAGE OUTLINES
UNIT
A
max.
A
1
A
2
A
3
b
p
c
D
(1)
E
(1)
(1)
e
H
E
L
L
p
Q
Z
y
w
v
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC
JEDEC
EIAJ
mm
inches
2.65
0.30
0.10
2.45
2.25
0.49
0.36
0.32
0.23
13.0
12.6
7.6
7.4
1.27
10.65
10.00
1.1
1.0
0.9
0.4
8
0
o
o
0.25
0.1
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
Note
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
1.1
0.4
SOT163-1
10
20
w
M
b
p
detail X
Z
e
11
1
D
y
0.25
075E04
MS-013
pin 1 index
0.10
0.012
0.004
0.096
0.089
0.019
0.014
0.013
0.009
0.51
0.49
0.30
0.29
0.050
1.4
0.055
0.419
0.394
0.043
0.039
0.035
0.016
0.01
0.25
0.01
0.004
0.043
0.016
0.01
0
5
10 mm
scale
X
A
A
1
A
2
H
E
L
p
Q
E
c
L
v
M
A
(A )
3
A
SO20: plastic small outline package; 20 leads; body width 7.5 mm
SOT163-1
97-05-22
99-12-27
2001 Feb 02
14
Philips Semiconductors
Product specification
Multiple voltage regulator with battery
detection
TDA3616
UNIT
A
A
max.
2
A
3
b
1
D
1
b
2
b
c
D
(1)
E
(1)
Z
max.
(1)
e
L
P
P
1
q
1
q
2
q
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC
JEDEC
EIAJ
mm
18.5
17.8
3.7
8.7
8.0
A
4
15.8
15.4
1.40
1.14
0.67
0.50
1.40
1.14
0.48
0.38
21.8
21.4
21.4
20.7
6.48
6.20
3.4
3.2
2.54
1.0
5.9
5.7
4.4
4.2
3.9
3.4
15.1
14.9
Q
1.75
1.55
DIMENSIONS (mm are the original dimensions)
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
2.75
2.50
SOT110-1
92-11-17
95-02-25
0
5
10 mm
scale
0.25
w
D
E
A
A
c
A
2
3
A
4
q
1
q
2
L
Q
w
M
b
b
1
b
2
D
1
P
q
1
Z
e
1
9
P
seating plane
pin 1 index
SIL9MPF: plastic single in-line medium power package with fin; 9 leads
SOT110-1
2001 Feb 02
15
Philips Semiconductors
Product specification
Multiple voltage regulator with battery
detection
TDA3616
SOLDERING
Introduction
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our
"Data Handbook IC26; Integrated Circuit Packages"
(document order number 9398 652 90011).
There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mount components are mixed on
one printed-circuit board. Wave soldering can still be used
for certain surface mount ICs, but it is not suitable for fine
pitch SMDs. In these situations reflow soldering is
recommended.
Through-hole mount packages
S
OLDERING BY DIPPING OR BY SOLDER WAVE
The maximum permissible temperature of the solder is
260
C; solder at this temperature must not be in contact
with the joints for more than 5 seconds. The total contact
time of successive solder waves must not exceed
5 seconds.
The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified maximum storage temperature (T
stg(max)
). If the
printed-circuit board has been pre-heated, forced cooling
may be necessary immediately after soldering to keep the
temperature within the permissible limit.
M
ANUAL SOLDERING
Apply the soldering iron (24 V or less) to the lead(s) of the
package, either below the seating plane or not more than
2 mm above it. If the temperature of the soldering iron bit
is less than 300
C it may remain in contact for up to
10 seconds. If the bit temperature is between
300 and 400
C, contact may be up to 5 seconds.
Surface mount packages
R
EFLOW SOLDERING
Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.
Several methods exist for reflowing; for example,
convection or convection/infrared heating in a conveyor
type oven. Throughput times (preheating, soldering and
cooling) vary between 100 and 200 seconds depending
on heating method.
Typical reflow peak temperatures range from
215 to 250
C. The top-surface temperature of the
packages should preferable be kept below 220
C for
thick/large packages, and below 235
C for small/thin
packages.
W
AVE SOLDERING
Conventional single wave soldering is not recommended
for surface mount devices (SMDs) or printed-circuit boards
with a high component density, as solder bridging and
non-wetting can present major problems.
To overcome these problems the double-wave soldering
method was specifically developed.
If wave soldering is used the following conditions must be
observed for optimal results:
Use a double-wave soldering method comprising a
turbulent wave with high upward pressure followed by a
smooth laminar wave.
For packages with leads on two sides and a pitch (e):
larger than or equal to 1.27 mm, the footprint
longitudinal axis is preferred to be parallel to the
transport direction of the printed-circuit board;
smaller than 1.27 mm, the footprint longitudinal axis
must be parallel to the transport direction of the
printed-circuit board.
The footprint must incorporate solder thieves at the
downstream end.
For packages with leads on four sides, the footprint must
be placed at a 45
angle to the transport direction of the
printed-circuit board. The footprint must incorporate
solder thieves downstream and at the side corners.
During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.
Typical dwell time is 4 seconds at 250
C.
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.
M
ANUAL SOLDERING
Fix the component by first soldering two
diagonally-opposite end leads. Use a low voltage (24 V or
less) soldering iron applied to the flat part of the lead.
Contact time must be limited to 10 seconds at up to
300
C. When using a dedicated tool, all other leads can
be soldered in one operation within 2 to 5 seconds
between 270 and 320
C.
2001 Feb 02
16
Philips Semiconductors
Product specification
Multiple voltage regulator with battery
detection
TDA3616
Suitability of IC packages for wave, reflow and dipping soldering methods
Notes
1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum
temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the
"Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods".
2. For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit board.
3. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink
(at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version).
4. If wave soldering is considered, then the package must be placed at a 45
angle to the solder wave direction.
The package footprint must incorporate solder thieves downstream and at the side corners.
5. Wave soldering is only suitable for LQFP, QFP and TQFP packages with a pitch (e) equal to or larger than 0.8 mm;
it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
6. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
MOUNTING
PACKAGE
SOLDERING METHOD
WAVE
REFLOW
(1)
DIPPING
Through-hole mount DBS, DIP, HDIP, SDIP, SIL
suitable
(2)
-
suitable
Surface mount
BGA, HBGA, LFBGA, SQFP, TFBGA
not suitable
suitable
-
HBCC, HLQFP, HSQFP, HSOP, HTQFP,
HTSSOP, HVQFN, SMS
not suitable
(3)
suitable
-
PLCC
(4)
, SO, SOJ
suitable
suitable
-
LQFP, QFP, TQFP
not recommended
(4)(5)
suitable
-
SSOP, TSSOP, VSO
not recommended
(6)
suitable
-
2001 Feb 02
17
Philips Semiconductors
Product specification
Multiple voltage regulator with battery
detection
TDA3616
DATA SHEET STATUS
Note
1. Please consult the most recently issued data sheet before initiating or completing a design.
DATA SHEET STATUS
PRODUCT
STATUS
DEFINITIONS
(1)
Objective specification
Development
This data sheet contains the design target or goal specifications for
product development. Specification may change in any manner without
notice.
Preliminary specification
Qualification
This data sheet contains preliminary data, and supplementary data will be
published at a later date. Philips Semiconductors reserves the right to
make changes at any time without notice in order to improve design and
supply the best possible product.
Product specification
Production
This data sheet contains final specifications. Philips Semiconductors
reserves the right to make changes at any time without notice in order to
improve design and supply the best possible product.
DEFINITIONS
Short-form specification
The data in a short-form
specification is extracted from a full data sheet with the
same type number and title. For detailed information see
the relevant data sheet or data handbook.
Limiting values definition
Limiting values given are in
accordance with the Absolute Maximum Rating System
(IEC 60134). Stress above one or more of the limiting
values may cause permanent damage to the device.
These are stress ratings only and operation of the device
at these or at any other conditions above those given in the
Characteristics sections of the specification is not implied.
Exposure to limiting values for extended periods may
affect device reliability.
Application information
Applications that are
described herein for any of these products are for
illustrative purposes only. Philips Semiconductors make
no representation or warranty that such applications will be
suitable for the specified use without further testing or
modification.
DISCLAIMERS
Life support applications
These products are not
designed for use in life support appliances, devices, or
systems where malfunction of these products can
reasonably be expected to result in personal injury. Philips
Semiconductors customers using or selling these products
for use in such applications do so at their own risk and
agree to fully indemnify Philips Semiconductors for any
damages resulting from such application.
Right to make changes
Philips Semiconductors
reserves the right to make changes, without notice, in the
products, including circuits, standard cells, and/or
software, described or contained herein in order to
improve design and/or performance. Philips
Semiconductors assumes no responsibility or liability for
the use of any of these products, conveys no licence or title
under any patent, copyright, or mask work right to these
products, and makes no representations or warranties that
these products are free from patent, copyright, or mask
work right infringement, unless otherwise specified.
2001 Feb 02
18
Philips Semiconductors
Product specification
Multiple voltage regulator with battery
detection
TDA3616
NOTES
2001 Feb 02
19
Philips Semiconductors
Product specification
Multiple voltage regulator with battery
detection
TDA3616
NOTES
Philips Electronics N.V.
SCA
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.
Internet: http://www.semiconductors.philips.com
2001
71
Philips Semiconductors a worldwide company
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Printed in The Netherlands
753503/03/pp
20
Date of release:
2001 Feb 02
Document order number:
9397 750 08035