1.
General description
The TDA3663 is a fixed 3.3 V voltage regulator with a very low dropout voltage and
quiescent current, which operates over a wide supply voltage range.
2.
Features
s
Fixed 3.3 V, 100 mA regulator
s
Supply voltage range up to 45 V
s
Very low quiescent current of 15
A (typical value)
s
Very low dropout voltage
s
High ripple rejection
s
Protections:
x
Reverse polarity safe (down to
-
25 V without high reverse current)
x
Negative transient of 50 V (R
S
= 10
, t < 100 ms)
x
Able to withstand voltages up to 18 V at the output (supply line may be
short-circuited)
x
ESD protection on all pins
x
DC short-circuit safe to ground and V
P
of the regulator output
x
Temperature protection (at T
j
> 150
C)
3.
Quick reference data
[1]
The regulator output will follow V
P
if V
P
< V
REG
+ V
REG(drop)
.
TDA3663
Very low dropout voltage/quiescent current 3.3 V voltage
regulator
Rev. 05 -- 13 June 2005
Product data sheet
Table 1:
Quick reference data
T
amb
= 25
C; unless otherwise specified.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
Supply
V
P
supply voltage
regulator operating
[1]
3
14.4
45
V
I
q
quiescent supply
current
V
P
= 14.4 V; I
REG
= 0 mA
-
15
30
A
Voltage regulator
V
REG
output voltage
8 V
V
P
22 V; I
REG
= 0.5 mA
3.16
3.3
3.44
V
6 V
V
P
45 V; I
REG
= 0.5 mA;
3.13
3.3
3.47
V
0.5 mA
I
REG
100 mA
3.13
3.3
3.47
V
V
REG(drop)
dropout voltage
V
P
= 3.1 V; I
REG
= 50 mA;
T
amb
85
C
-
0.18
0.3
V
9397 750 15047
Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet
Rev. 05 -- 13 June 2005
2 of 17
Philips Semiconductors
TDA3663
Very low dropout voltage/quiescent current 3.3 V voltage regulator
4.
Ordering information
5.
Block diagram
6.
Pinning information
6.1 Pinning
Table 2:
Ordering information
Type number
Package
Name
Description
Version
TDA3663
SO4
plastic small outline package; 4 leads; body width 3.5 mm
SOT223-1
TDA3663AT
SO8
plastic small outline package; 8 leads; body width 3.9 mm
SOT96-1
Pin numbers in parenthesis refer to TDA3663AT.
Fig 1.
Block diagram
mgs584
REGULATOR
2, 4 (2, 3, 6, 7)
3 (1)
GND
1 (8)
REG
V
P
BAND GAP
TDA3663
(TDA3663AT)
THERMAL
PROTECTION
Fig 2.
Pin configuration for SO4
Fig 3.
Pin configuration for SO8
TDA3663
V
P
GND
REG
GND
001aac941
1
2
3
4
TDA3663AT
REG
V
P
GND
GND
GND
GND
n.c.
n.c.
001aac942
1
2
3
4
6
5
8
7
9397 750 15047
Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet
Rev. 05 -- 13 June 2005
3 of 17
Philips Semiconductors
TDA3663
Very low dropout voltage/quiescent current 3.3 V voltage regulator
6.2 Pin description
[1]
For he SO8 package all GND pins are connected to the lead frame and can also be used to reduce the total
thermal resistance R
th(j-a)
by soldering these pins to a ground plane. The ground plane on the top side of
the PCB acts like a heat spreader.
7.
Functional description
The TDA3663 is a fixed 3.3 V regulator which can deliver output currents up to 100 mA.
The regulator is available in SO8 and SO4 packages. The regulator is intended for
portable, mains and telephone applications. To increase the lifetime of batteries, a
specially built-in clamp circuit keeps the quiescent current of this regulator very low, also
in dropout and full load conditions.
The device remains operational down to very low supply voltages and below this voltage it
switches off.
A temperature protection circuit is included which switches off the regulator output at a
junction temperature above 150
C.
8.
Limiting values
Table 3:
Pin description
Symbol
Pin
Description
SO4
SO8
V
P
1
8
supply voltage
GND
2 and 4
2, 3, 6 and 8
ground
[1]
REG
3
1
regulator output
n.c.
-
4 and 5
not connected
Table 4:
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Parameter
Conditions
Min
Max
Unit
V
P
supply voltage
-
45
V
V
P(rp)
reverse polarity supply
voltage
non-operating
-
-
25
V
P
tot
total power dissipation
TDA3663
temperature of copper
area is 25
C
-
4.1
W
TDA3663AT
T
amb
= 25
C
-
5
W
T
stg
storage temperature
non-operating
-
55
+150
C
T
amb
ambient temperature
operating
-
40
+125
C
T
j
junction temperature
operating
-
40
+150
C
9397 750 15047
Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet
Rev. 05 -- 13 June 2005
4 of 17
Philips Semiconductors
TDA3663
Very low dropout voltage/quiescent current 3.3 V voltage regulator
9.
Thermal characteristics
10. Characteristics
[1]
The regulator output will follow V
P
if V
P
< V
REG
+ V
REG(drop)
.
Table 5:
Thermal characteristics
Symbol
Parameter
Conditions
Typ
Unit
R
th(j-a)
thermal resistance from junction to ambient
SO4
in free air; soldered
100
K/W
SO8
in free air; soldered
155
K/W
R
th(j-c)
thermal resistance from junction to case
SO4
to center pins; soldered
25
K/W
SO8
to center pins; soldered
30
K/W
Table 6:
Characteristics
V
P
= 14.4 V; T
amb
= 25
C; measured with test circuit of
Figure 15
; unless otherwise specified.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
Supply voltage: pin V
P
V
P
supply voltage
regulator operating
[1]
3
14.4
45
V
I
q
quiescent supply current
V
P
= 4.5 V; I
REG
= 0 mA
-
10
-
A
V
P
= 14.4 V; I
REG
= 0 mA
-
15
30
A
6 V
V
P
22 V; I
REG
= 10 mA
-
0.2
0.5
mA
6 V
V
P
22 V; I
REG
= 50 mA
-
1.4
2.5
mA
Regulator output: pin REG
V
REG
output voltage
8 V
V
P
22 V; I
REG
= 0.5 mA
3.16
3.3
3.44
V
0.5 mA
I
REG
100 mA
3.13
3.3
3.47
V
6 V
V
P
45 V; I
REG
= 0.5 mA
3.13
3.3
3.47
V
V
REG(drop)
dropout voltage
V
P
= 3.1 V; T
amb
85
C;
I
REG
= 50 mA
-
0.18
0.3
V
V
REG(stab)
output voltage long-term
stability
per 1000 h
-
20
-
mV
V
REG(line)
line input regulation
voltage
7 V
V
P
22 V; I
REG
= 0.5 mA
-
1
30
mV
7 V
V
P
45 V; I
REG
= 0.5 mA
-
1
50
mV
V
REG(load)
load output regulation
voltage
0.5 mA
I
REG
50 mA
-
10
50
mV
SVRR
supply voltage ripple
rejection
f
i
= 120 Hz;
V
i(ripple)
= 1 V (RMS);
I
REG
= 0.5 mA
50
60
-
dB
I
REG(crl)
output current limit
V
REG
> 2.8 V
0.17
0.25
-
A
I
LO(rp)
output leakage current at
reverse polarity
V
P
=
-
15 V; V
REG
0.3 V
-
1
500
A
9397 750 15047
Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet
Rev. 05 -- 13 June 2005
5 of 17
Philips Semiconductors
TDA3663
Very low dropout voltage/quiescent current 3.3 V voltage regulator
11. Application information
11.1 Noise
The output noise is determined by the value of the output capacitor. The noise figure is
measured at a bandwidth of 10 Hz to 100 kHz (see
Table 7
).
11.2 Stability
For stable operation:
The output capacitor ESR should not exceed 22
(worst-case)
A minimum ESR may be required; see
Table 8
It is recommended not to use below 1 mA output current because of reduced phase
margin
Use electrolytic capacitors for output capacity values of 1
F and above
11.3 Application circuits
The maximum output current of the regulator equals:
When T
amb
= 21
C and V
P
= 14 V the maximum output current equals 116 mA.
The total thermal resistance of the TDA3663 can be decreased from 155 K/W to 30 K/W
for the SO8 version. For the SO4 version it can be decreased from 100 K/W to 25 K/W
when GND pins 2 and 4 of the package are soldered to the printed-circuit board.
Table 7:
Noise figures
Output current I
REG
(mA)
Noise figure (
V)
C2 = 10
F
C2 = 47
F
C2 = 100
F
0.5
550
320
300
50
650
400
400
Table 8:
Minimum ESR values required
I
REG
(mA)
C2 = 100 nF
C2 = 1
F
C2 = 10
F
C2 = 100
F
1
> 0
> 1.5
> 0
> 0
5
> 0
> 0
> 0
> 0
10
> 0
> 0
> 0
> 0
100
> 0
> 0
> 0
> 0
I
REG max
(
)
150
T
amb
R
th j
a
(
)
V
P
V
REG
(
)
----------------------------------------------------------
150
T
amb
100
V
P
3.3
(
)
----------------------------------------
mA
(
)
=
=
9397 750 15047
Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet
Rev. 05 -- 13 June 2005
6 of 17
Philips Semiconductors
TDA3663
Very low dropout voltage/quiescent current 3.3 V voltage regulator
11.3.1 Application circuit with backup function
Sometimes a backup function is needed to supply, for example, a microcontroller for a
short period of time when the supply voltage spikes to 0 V (or even
-
1 V).
This function can easily be built with the TDA3663 by using an output capacitor with a
large value. When the supply voltage is 0 V (or
-
1 V), only a small current will flow into
pin REG from this output capacitor (a few
A).
The application circuit is given in
Figure 4
.
(1) C1 is optional (to minimize supply noise only).
(2) C2
4700
F.
Fig 4.
Application circuit with backup function (SO4 version)
mgs587
V
P
1
3
2, 4
TDA3663
C1(1)
C2(2)
1
F
V
REG
= 3.3 V
9397 750 15047
Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet
Rev. 05 -- 13 June 2005
7 of 17
Philips Semiconductors
TDA3663
Very low dropout voltage/quiescent current 3.3 V voltage regulator
11.4 Additional application information
This section gives typical curves for various parameters measured on the TDA3663AT.
Standard test conditions are: V
P
= 14.4 V; T
amb
= 25
C.
I
REG
= 0 mA.
Fig 5.
Quiescent current as a function of the supply
voltage
Fig 6.
Quiescent current increase as a function of the
high supply voltage
I
REG
= 10 mA.
I
REG
= 50 mA.
Fig 7.
Quiescent current as a function of the supply
voltage
Fig 8.
Quiescent current as a function of the supply
voltage
0
10
V
P
(V)
I
q
(
A)
20
30
25
0
20
15
10
5
mda947
0
10
50
4
3
1
0
2
20
30
V
P
(V)
I
q
(mA)
40
mda949
5
0.36
0.40
0.44
0.48
10
15
V
P
(V)
I
q
(mA)
25
20
mda948
5
1.4
1.6
1.8
2
10
15
V
P
(V)
I
q
(mA)
25
20
mda950
9397 750 15047
Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet
Rev. 05 -- 13 June 2005
8 of 17
Philips Semiconductors
TDA3663
Very low dropout voltage/quiescent current 3.3 V voltage regulator
(1) I
q
at 50 mA load.
(2) I
q
at 10 mA load.
Fig 9.
Quiescent current as a function of the junction
temperature
Fig 10. Quiescent current as a function of the output
current
I
REG
= 0 mA.
Fig 11. Output voltage thermal protection as a function
of the junction temperature
Fig 12. Dropout voltage as a function of the output
current
-
40
0
(1)
(2)
160
2
1.5
0.5
0
1
40
80
T
j
(
C)
I
q
(mA)
120
mda951
0
20
100
4
3
1
0
2
40
60
I
REG
(mA)
I
q
(mA)
80
mda952
-
50
200
4
0
1
3
2
0
50
T
j
(
C)
V
REG
(V)
100
150
mgs695
0
40
I
REG
(mA)
V
REG(drop)
(mV)
80
120
500
400
200
100
300
mda957
9397 750 15047
Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet
Rev. 05 -- 13 June 2005
9 of 17
Philips Semiconductors
TDA3663
Very low dropout voltage/quiescent current 3.3 V voltage regulator
12. Test information
12.1 Quality information
The
General Quality Specification for Integrated Circuits, SNW-FQ-611 is applicable.
12.2 Test circuit
V
P
= 8 V and pulsed load.
I
REG
= 10 mA; C2 = 10
F.
(1) SVRR at R
L
= 100
.
(2) SVRR at R
L
= 500
.
(3) SVRR at R
L
= 10 k
.
Fig 13. Fold back protection mode
Fig 14. Supply voltage ripple rejection as a function of
the ripple frequency
0
4
3
2
1
0
100
V
REG
(V)
I
REG
(mA)
200
300
mgs696
-
70
-
60
-
50
-
40
-
30
mda956
10
SVRR
(dB)
f (Hz)
10
2
10
3
10
4
10
5
(1)
(1)
(2)
(2)
(3)
(3)
(1) C1 is optional (to minimize supply noise only).
Fig 15. Test circuit (SO4)
mgs586
V
P
1
3
2, 4
C2
TDA3663
10
F
C1(1)
1
F
V
REG
= 3.3 V
9397 750 15047
Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet
Rev. 05 -- 13 June 2005
10 of 17
Philips Semiconductors
TDA3663
Very low dropout voltage/quiescent current 3.3 V voltage regulator
13. Package outline
Fig 16. Package outline SOT223-1 (SO4)
UNIT
A2
bp
c
D
(1)
E
(1)
e1
HE
Lp
Q
y
w
v
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC
JEDEC
JEITA
mm
1.7
1.5
A1
0.10
0.02
A3
0.25
1.8
0.85
0.65
b1
3.15
2.95
0.35
0.25
6.7
6.3
3.7
3.3
4.6
e
2.3
7.3
6.7
1.02
0.62
1.0
0.8
Z
1.2
0.7
10
0
0.1
0.1
0.2
L
1.75
DIMENSIONS (mm are the original dimensions)
SOT223-1
TO-261
99-12-15
03-02-19
w
M
bp
Z
D
b1
e1
e
A
A1
A2
(A3)
Lp
L
Q
detail X
HE
E
v
M
A
A
c
y
0
2
4 mm
scale
A
max.
X
1
3
2
4
SO4: plastic small outline package; 4 leads; body width 3.5 mm
SOT223-1
Note
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
9397 750 15047
Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet
Rev. 05 -- 13 June 2005
11 of 17
Philips Semiconductors
TDA3663
Very low dropout voltage/quiescent current 3.3 V voltage regulator
Fig 17. Package outline SOT96-1 (SO8)
UNIT
A
max.
A
1
A
2
A
3
b
p
c
D
(1)
E
(2)
(1)
e
H
E
L
L
p
Q
Z
y
w
v
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC
JEDEC
JEITA
mm
inches
1.75
0.25
0.10
1.45
1.25
0.25
0.49
0.36
0.25
0.19
5.0
4.8
4.0
3.8
1.27
6.2
5.8
1.05
0.7
0.6
0.7
0.3
8
0
o
o
0.25
0.1
0.25
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
Notes
1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.
2. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included.
1.0
0.4
SOT96-1
X
w
M
A
A
1
A
2
b
p
D
H
E
L
p
Q
detail X
E
Z
e
c
L
v
M
A
(A )
3
A
4
5
pin 1 index
1
8
y
076E03
MS-012
0.069
0.010
0.004
0.057
0.049
0.01
0.019
0.014
0.0100
0.0075
0.20
0.19
0.16
0.15
0.05
0.244
0.228
0.028
0.024
0.028
0.012
0.01
0.01
0.041
0.004
0.039
0.016
0
2.5
5 mm
scale
SO8: plastic small outline package; 8 leads; body width 3.9 mm
SOT96-1
99-12-27
03-02-18
9397 750 15047
Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet
Rev. 05 -- 13 June 2005
12 of 17
Philips Semiconductors
TDA3663
Very low dropout voltage/quiescent current 3.3 V voltage regulator
14. Soldering
14.1 Introduction to soldering surface mount packages
This text gives a very brief insight to a complex technology. A more in-depth account of
soldering ICs can be found in our
Data Handbook IC26; Integrated Circuit Packages
(document order number 9398 652 90011).
There is no soldering method that is ideal for all surface mount IC packages. Wave
soldering can still be used for certain surface mount ICs, but it is not suitable for fine pitch
SMDs. In these situations reflow soldering is recommended.
14.2 Reflow soldering
Reflow soldering requires solder paste (a suspension of fine solder particles, flux and
binding agent) to be applied to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement. Driven by legislation and
environmental forces the worldwide use of lead-free solder pastes is increasing.
Several methods exist for reflowing; for example, convection or convection/infrared
heating in a conveyor type oven. Throughput times (preheating, soldering and cooling)
vary between 100 seconds and 200 seconds depending on heating method.
Typical reflow peak temperatures range from 215
C to 270
C depending on solder paste
material. The top-surface temperature of the packages should preferably be kept:
below 225
C (SnPb process) or below 245
C (Pb-free process)
for all BGA, HTSSON..T and SSOP..T packages
for packages with a thickness
2.5 mm
for packages with a thickness < 2.5 mm and a volume
350 mm
3
so called
thick/large packages.
below 240
C (SnPb process) or below 260
C (Pb-free process) for packages with a
thickness < 2.5 mm and a volume < 350 mm
3
so called small/thin packages.
Moisture sensitivity precautions, as indicated on packing, must be respected at all times.
14.3 Wave soldering
Conventional single wave soldering is not recommended for surface mount devices
(SMDs) or printed-circuit boards with a high component density, as solder bridging and
non-wetting can present major problems.
To overcome these problems the double-wave soldering method was specifically
developed.
If wave soldering is used the following conditions must be observed for optimal results:
Use a double-wave soldering method comprising a turbulent wave with high upward
pressure followed by a smooth laminar wave.
For packages with leads on two sides and a pitch (e):
larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be
parallel to the transport direction of the printed-circuit board;
9397 750 15047
Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet
Rev. 05 -- 13 June 2005
13 of 17
Philips Semiconductors
TDA3663
Very low dropout voltage/quiescent current 3.3 V voltage regulator
smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the
transport direction of the printed-circuit board.
The footprint must incorporate solder thieves at the downstream end.
For packages with leads on four sides, the footprint must be placed at a 45
angle to
the transport direction of the printed-circuit board. The footprint must incorporate
solder thieves downstream and at the side corners.
During placement and before soldering, the package must be fixed with a droplet of
adhesive. The adhesive can be applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the adhesive is cured.
Typical dwell time of the leads in the wave ranges from 3 seconds to 4 seconds at 250
C
or 265
C, depending on solder material applied, SnPb or Pb-free respectively.
A mildly-activated flux will eliminate the need for removal of corrosive residues in most
applications.
14.4 Manual soldering
Fix the component by first soldering two diagonally-opposite end leads. Use a low voltage
(24 V or less) soldering iron applied to the flat part of the lead. Contact time must be
limited to 10 seconds at up to 300
C.
When using a dedicated tool, all other leads can be soldered in one operation within
2 seconds to 5 seconds between 270
C and 320
C.
14.5 Package related soldering information
[1]
For more detailed information on the BGA packages refer to the
(LF)BGA Application Note (AN01026);
order a copy from your Philips Semiconductors sales office.
[2]
All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the
maximum temperature (with respect to time) and body size of the package, there is a risk that internal or
external package cracks may occur due to vaporization of the moisture in them (the so called popcorn
effect). For details, refer to the Drypack information in the
Data Handbook IC26; Integrated Circuit
Packages; Section: Packing Methods.
[3]
These transparent plastic packages are extremely sensitive to reflow soldering conditions and must on no
account be processed through more than one soldering cycle or subjected to infrared reflow soldering with
peak temperature exceeding 217
C
10
C measured in the atmosphere of the reflow oven. The package
body peak temperature must be kept as low as possible.
Table 9:
Suitability of surface mount IC packages for wave and reflow soldering methods
Package
[1]
Soldering method
Wave
Reflow
[2]
BGA, HTSSON..T
[3]
, LBGA, LFBGA, SQFP,
SSOP..T
[3]
, TFBGA, VFBGA, XSON
not suitable
suitable
DHVQFN, HBCC, HBGA, HLQFP, HSO, HSOP,
HSQFP, HSSON, HTQFP, HTSSOP, HVQFN,
HVSON, SMS
not suitable
[4]
suitable
PLCC
[5]
, SO, SOJ
suitable
suitable
LQFP, QFP, TQFP
not recommended
[5] [6]
suitable
SSOP, TSSOP, VSO, VSSOP
not recommended
[7]
suitable
CWQCCN..L
[8]
, PMFP
[9]
, WQCCN..L
[8]
not suitable
not suitable
9397 750 15047
Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet
Rev. 05 -- 13 June 2005
14 of 17
Philips Semiconductors
TDA3663
Very low dropout voltage/quiescent current 3.3 V voltage regulator
[4]
These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the
solder cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink
on the top side, the solder might be deposited on the heatsink surface.
[5]
If wave soldering is considered, then the package must be placed at a 45
angle to the solder wave
direction. The package footprint must incorporate solder thieves downstream and at the side corners.
[6]
Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
[7]
Wave soldering is suitable for SSOP, TSSOP, VSO and VSSOP packages with a pitch (e) equal to or larger
than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
[8]
Image sensor packages in principle should not be soldered. They are mounted in sockets or delivered
pre-mounted on flex foil. However, the image sensor package can be mounted by the client on a flex foil by
using a hot bar soldering process. The appropriate soldering profile can be provided on request.
[9]
Hot bar soldering or manual soldering is suitable for PMFP packages.
9397 750 15047
Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet
Rev. 05 -- 13 June 2005
15 of 17
Philips Semiconductors
TDA3663
Very low dropout voltage/quiescent current 3.3 V voltage regulator
15. Revision history
Table 10:
Revision history
Document ID
Release date
Data sheet status
Change notice Doc. number
Supersedes
TDA3663_5
20050613
Product data
-
9397 750 15047
TDA3663_4
Modifications:
The format of this data sheet has been redesigned to comply with the new presentation and
information standard of Philips Semiconductors.
Section 1 "General description"
: Removed automotive reference
Section 2 "Features"
: Removed stability capacitor values and pin compatible products
Section 3 "Quick reference data"
: Added V
P
= 3.1 V to the V
REG(drop)
conditions
Section 7 "Functional description"
: Removed automotive reference and details on stability
capacitors
Section 11.2 "Stability"
: Removed two figures and examples; added a new stability description
Section 11.4 "Additional application information"
: Changed
Figure 13
and removed former
Figure 14
TDA3663_4
20001214
Product specification
-
9397 750 07864
TDA3663_3
TDA3663_3
20001208
Preliminary specification -
9397 750 07555
TDA3663_2
TDA3663_2
20000201
Preliminary specification -
9397 750 06798
TDA3663_1
TDA3663_1
19990929
Preliminary specification -
9397 750 06068
-
Philips Semiconductors
TDA3663
Very low dropout voltage/quiescent current 3.3 V voltage regulator
9397 750 15047
Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet
Rev. 05 -- 13 June 2005
16 of 17
16. Data sheet status
[1]
Please consult the most recently issued data sheet before initiating or completing a design.
[2]
The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at
URL http://www.semiconductors.philips.com.
[3]
For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status.
17. Definitions
Short-form specification -- The data in a short-form specification is
extracted from a full data sheet with the same type number and title. For
detailed information see the relevant data sheet or data handbook.
Limiting values definition -- Limiting values given are in accordance with
the Absolute Maximum Rating System (IEC 60134). Stress above one or
more of the limiting values may cause permanent damage to the device.
These are stress ratings only and operation of the device at these or at any
other conditions above those given in the Characteristics sections of the
specification is not implied. Exposure to limiting values for extended periods
may affect device reliability.
Application information -- Applications that are described herein for any
of these products are for illustrative purposes only. Philips Semiconductors
make no representation or warranty that such applications will be suitable for
the specified use without further testing or modification.
18. Disclaimers
Life support -- These products are not designed for use in life support
appliances, devices, or systems where malfunction of these products can
reasonably be expected to result in personal injury. Philips Semiconductors
customers using or selling these products for use in such applications do so
at their own risk and agree to fully indemnify Philips Semiconductors for any
damages resulting from such application.
Right to make changes -- Philips Semiconductors reserves the right to
make changes in the products - including circuits, standard cells, and/or
software - described or contained herein in order to improve design and/or
performance. When the product is in full production (status `Production'),
relevant changes will be communicated via a Customer Product/Process
Change Notification (CPCN). Philips Semiconductors assumes no
responsibility or liability for the use of any of these products, conveys no
license or title under any patent, copyright, or mask work right to these
products, and makes no representations or warranties that these products are
free from patent, copyright, or mask work right infringement, unless otherwise
specified.
19. Trademarks
Notice -- All referenced brands, product names, service names and
trademarks are the property of their respective owners.
20. Contact information
For additional information, please visit: http://www.semiconductors.philips.com
For sales office addresses, send an email to: sales.addresses@www.semiconductors.philips.com
Level
Data sheet status
[1]
Product status
[2] [3]
Definition
I
Objective data
Development
This data sheet contains data from the objective specification for product development. Philips
Semiconductors reserves the right to change the specification in any manner without notice.
II
Preliminary data
Qualification
This data sheet contains data from the preliminary specification. Supplementary data will be published
at a later date. Philips Semiconductors reserves the right to change the specification without notice, in
order to improve the design and supply the best possible product.
III
Product data
Production
This data sheet contains data from the product specification. Philips Semiconductors reserves the
right to make changes at any time in order to improve the design, manufacturing and supply. Relevant
changes will be communicated via a Customer Product/Process Change Notification (CPCN).
Koninklijke Philips Electronics N.V. 2005
All rights are reserved. Reproduction in whole or in part is prohibited without the prior
written consent of the copyright owner. The information presented in this document does
not form part of any quotation or contract, is believed to be accurate and reliable and may
be changed without notice. No liability will be accepted by the publisher for any
consequence of its use. Publication thereof does not convey nor imply any license under
patent- or other industrial or intellectual property rights.
Date of release: 13 June 2005
Document number: 9397 750 15047
Published in The Netherlands
Philips Semiconductors
TDA3663
Very low dropout voltage/quiescent current 3.3 V voltage regulator
21. Contents
1
General description . . . . . . . . . . . . . . . . . . . . . . 1
2
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
3
Quick reference data . . . . . . . . . . . . . . . . . . . . . 1
4
Ordering information . . . . . . . . . . . . . . . . . . . . . 2
5
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 2
6
Pinning information . . . . . . . . . . . . . . . . . . . . . . 2
6.1
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
6.2
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3
7
Functional description . . . . . . . . . . . . . . . . . . . 3
8
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3
9
Thermal characteristics. . . . . . . . . . . . . . . . . . . 4
10
Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 4
11
Application information. . . . . . . . . . . . . . . . . . . 5
11.1
Noise. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
11.2
Stability . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
11.3
Application circuits . . . . . . . . . . . . . . . . . . . . . . 5
11.3.1
Application circuit with backup function . . . . . . 6
11.4
Additional application information . . . . . . . . . . . 7
12
Test information . . . . . . . . . . . . . . . . . . . . . . . . . 9
12.1
Quality information . . . . . . . . . . . . . . . . . . . . . . 9
12.2
Test circuit. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
13
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 10
14
Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
14.1
Introduction to soldering surface mount
packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
14.2
Reflow soldering . . . . . . . . . . . . . . . . . . . . . . . 12
14.3
Wave soldering . . . . . . . . . . . . . . . . . . . . . . . . 12
14.4
Manual soldering . . . . . . . . . . . . . . . . . . . . . . 13
14.5
Package related soldering information . . . . . . 13
15
Revision history . . . . . . . . . . . . . . . . . . . . . . . . 15
16
Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 16
17
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
18
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
19
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
20
Contact information . . . . . . . . . . . . . . . . . . . . 16
PDF 
ZIP