1999 Sep 01

Philips Semiconductors

Preliminary specification

Very low dropout voltage/quiescent
current 5 V voltage regulator

TDA3664

FEATURES

General

Fixed 5 V, 100 mA regulator

Supply voltage range up to +33 V (45 V)

Very low quiescent current (typically 15

Very low dropout voltage

High ripple rejection

Very high stability

Electrolytic capacitors: ESR (Equivalent Series

resistance) < 38

at I

REG

25 mA

Other capacitors: 100 nF at 200

REG

100 mA

see Fig.5 and Fig.6

Pin compatible family TDA3662 up to TDA3666.

Protections

Reverse polarity safe (down to

25 V without high

reverse current)

Negative transient of 50 V (R

= 10

, t < 100 ms)

Able to withstand voltages up to 18 V at the output
(supply line may be short-circuited)

ESD protection on all pins

DC short-circuit safe to ground and V

of regulator

output

Temperature protection (T

> 150

C).

GENERAL DESCRIPTION

The TDA3664 is a fixed 5 V voltage regulator with very low
dropout voltage/quiescent current, which operates over a
wide supply voltage range.

The regulator is available as:

TDA3664T: SO8 package (non-automotive)

TDA3664AT: SO8 package (automotive)

TDA3664: SOT223 package (automotive).

Automotive: V

50P V,

amb

+125

Non-automotive: V

22V,

amb

+85

QUICK REFERENCE DATA

ORDERING INFORMATION

SYMBOL

PARAMETER

CONDITIONS

MIN.

TYP.

MAX.

UNIT

Supply

supply voltage

TDA3664

regulator on

14.4

TDA3664AT

regulator on

14.4

TDA3664T

regulator on

14.4

q(tot)

total quiescent supply current
(all versions)

= 14.4 V; no load

Voltage regulator

REG

regulator output voltage

TDA3664T

8 V

22 V

4.8

5.0

5.2

TDA3664 and TDA3664AT

6 V

45 V

4.75

5.0

5.25

REG

regulator output current

0.5 mA

REG

100 mA

4.75

5.0

5.25

REG(drop)

dropout voltage

REG

= 50 mA

0.18

0.3

TYPE

NUMBER

PACKAGE

NAME

DESCRIPTION

VERSION

TDA3664

plastic surface mounted package; collector pad for good heat transfer; 4 leads

SOT223

TDA3664T

SO8

plastic small outline package; 8 leads; body width 3.9 mm

SOT96-1

TDA3664AT

SO8

plastic small outline package; 8 leads; body width 3.9 mm

SOT96-1

1999 Sep 01

Philips Semiconductors

Preliminary specification

Very low dropout voltage/quiescent
current 5 V voltage regulator

TDA3664

FUNCTIONAL DESCRIPTION

The TDA3664 is a fixed 5 V regulator which can deliver
output currents up to 100 mA. The regulator is available in
SO8 and SOT223 packages. The regulator is intended for
portable, mains, telephone and automotive applications.
To increase the lifetime of batteries, a specially built-in
clamp circuit keeps the quiescent current of this regulator
very low, also in dropout and full load conditions.

The regulator remains operational down to very low supply
voltages, below which it switches off.

A temperature protection is included, which switches the
regulator output off at IC temperatures above 150

A new output structure guarantees the stability of the
regulator with an ESR up to 38

. This is very attractive as

the ESR of an electrolytic capacitor increases strongly at
low temperatures (no expensive tantalum capacitor
required).

LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).

THERMAL CHARACTERISTICS

QUALITY SPECIFICATION

In accordance with

"SNW-FQ-611E". The number of the quality specification can be found in the "Quality Reference

Handbook".

SYMBOL

PARAMETER

CONDITIONS

MIN.

MAX.

UNIT

supply voltage

TDA3664T

TDA3664

TDA3664AT

P(rp)

reverse polarity supply voltage

non-operating

tot

total power dissipation

amb

= 25

SO8

0.8

SOT223

stg

storage temperature

non-operating

+150

amb

ambient temperature range

operating

TDA3664T

+85

TDA3664

+125

TDA3664AT

+125

junction temperature

operating

+150

SYMBOL

PARAMETER

CONDITIONS

VALUE

UNIT

th(j-a)

thermal resistance from junction to ambient

in free air, soldered in

SO8

155

K/W

SOT223

100

K/W

th(j-c)

thermal resistance from junction to case (SOT223)

in free air

K/W

1999 Sep 01

Philips Semiconductors

Preliminary specification

Very low dropout voltage/quiescent
current 5 V voltage regulator

TDA3664

CHARACTERISTICS
V

= 14.4 V; T

amb

= 25

C; see Fig.4; unless otherwise specified.

Notes

1. The regulator output will follow V

if V

< V

REG

+ V

REG(drop)

2. TDA3664T: V

22 V;

amb

SYMBOL

PARAMETER

CONDITIONS

MIN.

TYP.

MAX.

UNIT

Supply voltage

supply voltage

TDA3664

regulator operating; note 1

14.4

TDA3664AT

regulator operating; note 1

14.4

TDA3664T

regulator operating; note 1

14.4

quiescent current

= 4.5 V; I

REG

= 0

= 14.4 V; I

REG

= 0

6 V

22 V; I

REG

= 10 mA

0.2

0.5

6 V

22 V; I

REG

= 50 mA

1.4

2.5

Regulator output: on pin REG (I

REG

= 0.5 mA),

amb

125

C; note 2

REG

regulated output voltage

REG

= 0.5 mA,

4.8

5.0

5.2

8 V

22 V, T

amb

= 25

REG

= 0.5 mA, 8 V

22 V 4.75

5.0

5.25

0.5 mA

REG

100 mA

4.75

5.0

5.25

6 V

45 V; note 2

4.75

5.0

5.25

REG(line)

line regulation voltage

8 V

16 V, T

amb

= 25

7 V

22 V, T

amb

= 25

7 V

45 V; note 2

REG(load)

load regulation voltage

0.5 mA

REG

50 mA

SVRR

supply voltage ripple rejection

= 120 Hz; V

ripple

= 1 V

rms

REG(drop)

dropout voltage

REG

= 50 mA; V

= 4.5 V;

amb

0.18

0.3

REG(crl)

current limit

REG

> 4.5 V

0.17

0.25

REG(stab)

long-term stability

mV/1000 h

LO(rp)

output leakage current

with reverse polarity input
V

15 V, V

REG

0.3 V

500

1999 Sep 01

Philips Semiconductors

Preliminary specification

Very low dropout voltage/quiescent
current 5 V voltage regulator

TDA3664

TEST AND APPLICATION INFORMATION

Test information

Application information

OISE

The output noise is determined by the value of the output
capacitor, see Table 1.

Table 1

Noise figures

Note

1. Measured at a bandwidth of 10 Hz to 100 kHz.

TABILITY

The regulator is stabilized with an external capacitor on the
output. The value of this capacitor can be selected using
the diagrams shown in Fig.5 and Fig.6. The four examples
on the next page show the effects of the stabilization circuit
using different values for the output capacitor.

Fig.4 Test circuit (SOT223).

handbook, halfpage

MDA960

2, 4

REG

(3)

(1)

(2)

TDA3664

(1) C1 is optional (to minimize supply noise only).

(2) C2 = 10

(3) V

REG

= 5 V.

OUTPUT

CURRENT

(mA)

NOISE FIGURE (

(1)

= 10

= 47

= 100

0.5

550

320

300

650

400

Fig.5

Curve for selecting the value of the output
capacitor.

(1) Maximum ESR (Equivalent Series resistance)

at 200

REG

100 mA.

(2) Minimum ESR only when I

REG

200

handbook, halfpage

MDA961

ESR

(

)

C2 (

stable region

(2)

(1)

Fig.6

ESR dependency due to I

REG

for selecting

the right type of output capacitor.

handbook, halfpage

MDA962

ESR

(

)

IREG (mA)

stable region

1999 Sep 01

Philips Semiconductors

Preliminary specification

Very low dropout voltage/quiescent
current 5 V voltage regulator

TDA3664

Example 1

The regulator is stabilized with an electrolytic output
capacitor of 68

F (ESR = 0.5

). At

C, the capacitor

value is decreased to 22

F and the ESR is increased to

3.5

. The regulator will remain stable at a temperature of

Example 2

The regulator is stabilized with an electrolytic output
capacitor of 10

F (ESR = 3.3

). At

C, the capacitor

value is decreased to 3

F and the ESR is increased to

. The regulator will remain stable at a temperature of

Example 3

The regulator is stabilized with a 100 nF MKT capacitor on
the output. Full stability is guaranteed when the output
current is over 200

Because the thermal influence on this capacitor value is
almost zero, the regulator will remain stable at a
temperature of

Example 4

The regulator is stabilized with a 100 nF capacitor in
parallel with a electrolytic capacitor of 10

F on the output.

The regulator is now stable under all conditions and
independent of:

The ESR of the electrolytic capacitor

The value of the electrolytic capacitor

The output current.

PPLICATION CIRCUITS

The maximum output current of the regulator equals:

When T

amb

= 21

C, the maximum output current equals

140 mA at V

=14 V.

o max

(

)

150

amb

th(j-a)

REG

(

)

------------------------------------------------------

150

amb

100

(

)

------------------------------------- (mA)

The total thermal resistance of the TDA3664 (SOT223
package) can be decreased to lower values when pin 4
and body of the package are soldered to the printed-circuit
board.

Application circuit with backup function

Sometimes, a backup function is needed to supply, for
example, a microprocessor for a short period of time when
the supply voltage spikes to 0 V (or even

1 V).

This function can be easily built with the TDA3664 by using
a large output capacitor. When the supply voltage is 0 V
(or

1 V), no large current will flow into the output pin out

of this large output capacitor (only a few

A).

The application circuit is given in Fig.7.

Fig.7

Application circuit with backup functionality
(SOT223 version).

handbook, halfpage

MDA960

2, 4

REG

(3)

(1)

(2)

TDA3664

(1) C1 is optional (to minimize supply noise only).

(2) C2

4700

(3) V

REG

= 5 V.

1999 Sep 01

Philips Semiconductors

Preliminary specification

Very low dropout voltage/quiescent
current 5 V voltage regulator

TDA3664

UNIT

max.

(1)

(2)

(1)

REFERENCES

OUTLINE

VERSION

EUROPEAN

PROJECTION

ISSUE DATE

IEC

JEDEC

EIAJ

inches

1.75

0.25
0.10

1.45
1.25

0.25

0.49
0.36

0.25
0.19

5.0
4.8

4.0
3.8

1.27

6.2
5.8

1.05

0.7
0.6

0.7
0.3

8
0

0.25

0.1

0.25

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

Notes

1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.

2. Plastic or metal protrusions of 0.25 mm maximum per side are not included.

1.0
0.4

SOT96-1

detail X

(A )

pin 1 index

076E03S

MS-012AA

0.069

0.010
0.004

0.057
0.049

0.01

0.019
0.014

0.0100
0.0075

0.20
0.19

0.16
0.15

0.050

0.244
0.228

0.028
0.024

0.028
0.012

0.01

0.041

0.004

0.039
0.016

2.5

5 mm

scale

SO8: plastic small outline package; 8 leads; body width 3.9 mm

SOT96-1

95-02-04
97-05-22

1999 Sep 01

Philips Semiconductors

Preliminary specification

Very low dropout voltage/quiescent
current 5 V voltage regulator

TDA3664

SOLDERING

Introduction to soldering surface mount packages

This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our

"Data Handbook IC26; Integrated Circuit Packages"

(document order number 9398 652 90011).

There is no soldering method that is ideal for all surface
mount IC packages. Wave soldering is not always suitable
for surface mount ICs, or for printed-circuit boards with
high population densities. In these situations reflow
soldering is often used.

Reflow soldering

Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.

Several methods exist for reflowing; for example,
infrared/convection heating in a conveyor type oven.
Throughput times (preheating, soldering and cooling) vary
between 100 and 200 seconds depending on heating
method.

Typical reflow peak temperatures range from
215 to 250

C. The top-surface temperature of the

packages should preferable be kept below 230

Wave soldering

Conventional single wave soldering is not recommended
for surface mount devices (SMDs) or printed-circuit boards
with a high component density, as solder bridging and
non-wetting can present major problems.

To overcome these problems the double-wave soldering
method was specifically developed.

If wave soldering is used the following conditions must be
observed for optimal results:

Use a double-wave soldering method comprising a
turbulent wave with high upward pressure followed by a
smooth laminar wave.

For packages with leads on two sides and a pitch (e):

larger than or equal to 1.27 mm, the footprint

longitudinal axis is preferred to be parallel to the
transport direction of the printed-circuit board;

smaller than 1.27 mm, the footprint longitudinal axis

must be parallel to the transport direction of the
printed-circuit board.

The footprint must incorporate solder thieves at the
downstream end.

For packages with leads on four sides, the footprint must
be placed at a 45

angle to the transport direction of the

printed-circuit board. The footprint must incorporate
solder thieves downstream and at the side corners.

During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.

Typical dwell time is 4 seconds at 250

A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.

Manual soldering

Fix the component by first soldering two
diagonally-opposite end leads. Use a low voltage (24 V or
less) soldering iron applied to the flat part of the lead.
Contact time must be limited to 10 seconds at up to
300

When using a dedicated tool, all other leads can be
soldered in one operation within 2 to 5 seconds between
270 and 320

1999 Sep 01

Philips Semiconductors

Preliminary specification

Very low dropout voltage/quiescent
current 5 V voltage regulator

TDA3664

Suitability of surface mount IC packages for wave and reflow soldering methods

Notes

1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum

temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the

"Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods".

2. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink

(at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version).

3. If wave soldering is considered, then the package must be placed at a 45

angle to the solder wave direction.

The package footprint must incorporate solder thieves downstream and at the side corners.

4. Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8 mm;

it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.

5. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is

definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.

DEFINITIONS

LIFE SUPPORT APPLICATIONS

These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.

PACKAGE

SOLDERING METHOD

WAVE

REFLOW

(1)

BGA, SQFP

not suitable

suitable

HLQFP, HSQFP, HSOP, HTSSOP, SMS

not suitable

(2)

suitable

PLCC

(3)

, SO, SOJ

suitable

LQFP, QFP, TQFP

not recommended

(3)(4)

suitable

SSOP, TSSOP, VSO

not recommended

(5)

suitable

Data sheet status

Objective specification

This data sheet contains target or goal specifications for product development.

Preliminary specification

This data sheet contains preliminary data; supplementary data may be published later.

Product specification

This data sheet contains final product specifications.

Limiting values

Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.

Application information

Where application information is given, it is advisory and does not form part of the specification.

SCA

All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.

The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.

Internet: http://www.semiconductors.philips.com

1999

Philips Semiconductors a worldwide company

For all other countries apply to: Philips Semiconductors,
International Marketing & Sales Communications, Building BE-p, P.O. Box 218,
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Printed in The Netherlands

545002/02/pp

Date of release:

1999 Sep 01

Document order number:

9397 750 06347

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