Preliminary specification
Supersedes data of 1999 Sep 29
File under Integrated Circuits, IC01
2000 Feb 01
INTEGRATED CIRCUITS
TDA3673
Very low dropout voltage/quiescent
current 3.3 V voltage regulator with
enable
DATA SHEET
2000 Feb 01
2
Philips Semiconductors
Preliminary specification
Very low dropout voltage/quiescent current
3.3 V voltage regulator with enable
TDA3673
FEATURES
Fixed 3.3 V, 100 mA regulator with enable function
Supply voltage range up to 33 V (45 V)
Very low quiescent current of 15
A (typical value)
Very low dropout voltage
High ripple rejection
Very high stability:
Electrolytic capacitors: Equivalent Series Resistance
(ESR) < 38
at I
REG
25 mA
Other capacitors: 100 nF at 200
A
I
REG
100 mA.
Pin compatible family TDA3672 to TDA3676
Protections:
Reverse polarity safe (down to
-
25 V without high
reverse current)
Negative transient of 50 V (R
S
= 10
, t < 100 ms)
Able to withstand voltages up to 18 V at the output
(supply line may be short-circuited)
ESD protection on all pins
DC short-circuit safe to ground and V
P
of the
regulator output
Temperature protection (at T
j
> 150
C).
GENERAL DESCRIPTION
The TDA3673 is a fixed 3.3 V voltage regulator with very
low dropout voltage and quiescent current, which operates
over a wide supply voltage range.
The IC is available as:
TDA3673T: V
P
33 V,
-
40
C
T
amb
+85
C and
SO8 package (non-automotive)
TDA3673AT: V
P
45 V,
-
40
C
T
amb
+125
C and
SO8 package (automotive).
QUICK REFERENCE DATA
ORDERING INFORMATION
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
Supply
V
P
supply voltage
regulator on
TDA3673T
3
14.4
33
V
TDA3673AT
3
14.4
45
V
I
q
quiescent supply current
V
P
= 14.4 V; I
REG
= 0 mA;
V
I(EN)
= 5 V
-
15
30
A
Voltage regulator
V
REG
output voltage
8 V
V
P
22 V; I
REG
= 0.5 mA
3.16
3.3
3.44
V
6 V
V
P
45 V; I
REG
= 0.5 mA
3.13
3.3
3.47
V
0.5 mA
I
REG
100 mA;
V
P
= 14.4 V
3.13
3.3
3.47
V
V
REG(drop)
dropout voltage
V
P
= 3.1 V; I
REG
= 50 mA;
T
amb
85
C
-
0.18
0.3
V
TYPE
NUMBER
PACKAGE
NAME
DESCRIPTION
VERSION
TDA3673T
SO8
plastic small outline package; 8 leads; body width 3.9 mm
SOT96-1
TDA3673AT
SO8
plastic small outline package; 8 leads; body width 3.9 mm
SOT96-1
2000 Feb 01
3
Philips Semiconductors
Preliminary specification
Very low dropout voltage/quiescent current
3.3 V voltage regulator with enable
TDA3673
BLOCK DIAGRAM
handbook, halfpage
MGS593
REGULATOR
2, 3, 6, 7
1
GND
8
REG
VP
5
EN
BAND GAP
TDA3673
THERMAL
PROTECTION
Fig.1 Block diagram.
PINNING
Note
1. All GND pins are connected to the lead frame and can
also be used to reduce the total thermal resistance
R
th(j-a)
by soldering these pins to a ground plane.
The ground plane on the top side of the PCB acts like
a heat spreader.
SYMBOL
PIN
DESCRIPTION
REG
1
regulator output
GND
2, 3, 6 and 7
ground; note 1
n.c.
4
not connected
EN
5
enable input
V
P
8
supply voltage
handbook, halfpage
1
2
3
4
8
7
6
5
MGS594
TDA3673
VP
GND
GND
GND
EN
n.c.
GND
REG
Fig.2 Pin configuration.
2000 Feb 01
4
Philips Semiconductors
Preliminary specification
Very low dropout voltage/quiescent current
3.3 V voltage regulator with enable
TDA3673
FUNCTIONAL DESCRIPTION
The TDA3673 is a fixed 3.3 V regulator which can deliver
output currents up to 100 mA. The regulator is available in
an SO8 package with fused centre pins connected to the
lead frame. The regulator is intended for portable, mains,
telephone and automotive applications. To increase the
lifetime of batteries, a specially built-in clamp circuit keeps
the quiescent current of this regulator very low, also in
dropout and full load conditions.
The regulator remains operating down to very low supply
voltages and below it switches off.
A temperature protection circuit is included, which
switches off the regulator output at a junction temperature
above 150
C.
A new output circuit guarantees the stability of the
regulator for a capacitor output circuit with an ESR up to
20
. If only a 100 nF capacitor is used, the regulator is
fully stable when I
REG
> 200
A. This is very attractive as
the ESR of an electrolytic capacitor increases strongly at
low temperatures (no expensive tantalum capacitor is
required).
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
THERMAL CHARACTERISTICS
QUALITY SPECIFICATION
In accordance with
"SNW-FQ-611E".
SYMBOL
PARAMETER
CONDITIONS
MIN.
MAX.
UNIT
V
P
supply voltage
TDA3673T
-
33
V
TDA3673AT
-
45
V
V
P(rp)
reverse polarity supply voltage
non-operating
-
-
25
V
P
tot
total power dissipation
temperature of copper area
is 25
C
-
4.1
W
T
stg
storage temperature
non-operating
-
55
+150
C
T
amb
ambient temperature
operating
TDA3673T
-
40
+85
C
TDA3673AT
-
40
+125
C
T
j
junction temperature
operating
-
40
+150
C
SYMBOL
PARAMETER
CONDITIONS
VALUE
UNIT
R
th(j-a)
thermal resistance from junction to ambient
in free air; soldered
125
K/W
R
th(j-c)
thermal resistance from junction to case
to centre pins; soldered
30
K/W
2000 Feb 01
5
Philips Semiconductors
Preliminary specification
Very low dropout voltage/quiescent current
3.3 V voltage regulator with enable
TDA3673
CHARACTERISTICS
V
P
= 14.4 V; T
amb
= 25
C; measured in test circuit of Fig.3; unless otherwise specified.
Notes
1. The regulator output will follow V
P
if V
P
< V
REG
+ V
REG(drop)
.
2. Limiting values as applicable for device type:
a) TDA3673T: V
P
33 V and
-
40
C
T
amb
+85
C.
b) TDA3673AT: V
P
45 V and
-
40
C
T
amb
+125
C.
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
Supply voltage: pin V
P
V
P
supply voltage
regulator operating; note 1
TDA3673T
3
14.4
33
V
TDA3673AT
3
14.4
45
V
I
q
quiescent current
V
P
= 14.4 V; I
REG
= 0 mA;
V
I(EN)
= 0 V
-
4
15
A
V
P
= 14.4 V; I
REG
= 0 mA;
V
I(EN)
= 5 V
-
15
30
A
6 V
V
P
22 V; I
REG
= 10 mA
-
0.2
0.5
mA
6 V
V
P
22 V; I
REG
= 50 mA
-
1.4
2.5
mA
Enable input: pin EN
V
I(EN)
enable input voltage
enable off; V
REG
0.8 V
-
1
-
+1.0
V
enable on; V
REG
3 V
3.0
-
18
V
I
I(EN)
enable input current
V
I(EN)
= 5 V
-
0.3
-
A
Regulator output: pin REG; note 2
V
REG
output voltage
8 V
V
P
22 V; I
REG
= 0.5 mA
3.16
3.3
3.44
V
0.5 mA
I
REG
100 mA
3.13
3.3
3.47
V
6 V
V
P
45 V; I
REG
= 0.5 mA
3.13
3.3
3.47
V
V
REG(drop)
dropout voltage
V
P
= 3.1 V; T
amb
85
C;
I
REG
= 50 mA
-
0.18
0.3
V
V
REG(stab)
long-term output voltage
stability
-
20
-
mV/1000 h
V
REG(line)
line input regulation voltage
7 V
V
P
22 V; I
REG
= 0.5 mA
-
1
30
mV
7 V
V
P
45 V; I
REG
= 0.5 mA
-
1
50
mV
V
REG(load)
load output regulation voltage
0.5 mA
I
REG
50 mA
-
10
50
mV
SVRR
supply voltage ripple rejection
f
i
= 120 Hz; V
i(ripple)
= 1 V (RMS);
I
REG
= 0.5 mA
50
60
-
dB
I
REG(crl)
current limit
V
REG
> 2.8 V
0.17
0.25
-
A
I
LO(rp)
output leakage current at
reverse polarity input
V
P
=
-
15 V; V
REG
0.3 V
-
1
500
A
2000 Feb 01
6
Philips Semiconductors
Preliminary specification
Very low dropout voltage/quiescent current
3.3 V voltage regulator with enable
TDA3673
TEST AND APPLICATION INFORMATION
andbook, halfpage
MGS595
VP
8
1
2, 3, 6, 7
C2
VI(EN)
5
TDA3673
10
F
C1
(1)
1
F
VREG = 3.3 V
Fig.3 Test circuit.
V
I(EN)
= 5 V.
(1) C1 is optional (to minimize supply noise only).
handbook, halfpage
MDA961
ESR
(
)
C2 (
F)
10
2
10
1
10
-
1
10
-
1
1
10
10
2
stable region
(2)
(1)
Fig.4
Graph for selecting the value of the output
capacitor.
(1) Maximum ESR at 200
A
I
REG
100 mA.
(2) Minimum ESR only when I
REG
200
A.
Noise
The output noise is determined by the value of the output
capacitor. The noise figure is measured at a bandwidth of
10 Hz to 100 kHz (see Table 1).
Table 1
Noise figures
Stability
The regulator is stabilized with an external capacitor
connected to the output. The value of this capacitor can be
selected using the diagrams shown in Figs 4 and 5.
The following four examples show the effects of the
stabilization circuit using different values for the output
capacitor.
OUTPUT
CURRENT
I
REG
(mA)
NOISE FIGURE (
V)
C2 = 10
F
C2 = 47
F
C2 = 100
F
0.5
550
320
300
50
650
400
400
handbook, halfpage
MDA962
ESR
(
)
IREG (mA)
10
3
10
2
10
22
1
10
-
1
1
10
10
3
10
2
stable region
Fig.5
ESR as a function of I
REG
for selecting the
value of the output capacitor.
2000 Feb 01
7
Philips Semiconductors
Preliminary specification
Very low dropout voltage/quiescent current
3.3 V voltage regulator with enable
TDA3673
E
XAMPLE
1
The regulator is stabilized with an electrolytic capacitor of
68
F (ESR = 0.5
). At T
amb
=
-
40
C, the capacitor
value is decreased to 22
F and the ESR is increased
to 3.5
. The regulator will remain stable at a temperature
of T
amb
=
-
40
C.
E
XAMPLE
2
The regulator is stabilized with an electrolytic capacitor of
10
F (ESR = 3.3
). At T
amb
=
-
40
C, the capacitor
value is decreased to 3
F and the ESR is increased to
20
. The regulator will remain stable at a temperature of
T
amb
=
-
40
C.
E
XAMPLE
3
The regulator is stabilized with a 100 nF MKT capacitor
connected to the output. Full stability is guaranteed when
the output current is larger then 200
A. Because the
thermal influence on this capacitor value is almost zero,
the regulator will remain stable at a temperature of
T
amb
=
-
40
C.
E
XAMPLE
4
The regulator is stabilized with a 100 nF capacitor in
parallel with a electrolytic capacitor of 10
F connected to
the output.
The regulator is now stable under all conditions and
independent of:
The ESR of the electrolytic capacitor
The value of the electrolytic capacitor
The output current.
Application circuits
The maximum output current of the regulator equals:
When T
amb
= 21
C and V
P
= 14 V, the maximum output
current equals 116 mA.
For successful operation of the IC (maximum output
current capability) special attention has to be given to the
copper area required as heatsink (connected to all
GND pins), the thermal capacity of the heatsink and its
ability to transfer heat to the external environment. It is
possible to reduce the total thermal resistance from
120 to 50 K/W.
A
PPLICATION CIRCUIT WITH BACKUP FUNCTION
Sometimes a backup function is needed to supply, for
example, a microcontroller for a short period of time when
the supply voltage spikes to 0 V (or even
-
1 V).
This function can be easily built with the TDA3673 by using
a large output capacitor. When the supply voltage is 0 V
(or
-
1 V), only a small current will flow into pin REG from
this large output capacitor (a few
A).
The application circuit is given in Fig.6.
I
REG max
(
)
150
T
amb
R
th(j-a)
V
P
V
REG
(
)
------------------------------------------------------
=
150
T
amb
100
V
P
3.3
(
)
------------------------------------------
=
(mA)
ndbook, halfpage
MGS596
VP
8
1
2, 3, 6, 7
C2
(2)
VI(EN)
5
TDA3673
C1
(1)
1
F
VREG = 3.3 V
Fig.6 Application circuit with backup function.
V
I(EN)
= 5 V.
(1) C1 is optional (to minimize supply noise only).
(2) C2
4700
F.
2000 Feb 01
8
Philips Semiconductors
Preliminary specification
Very low dropout voltage/quiescent current
3.3 V voltage regulator with enable
TDA3673
Additional application information
This section gives typical curves for various parameters measured on the TDA3673AT. Standard test conditions are:
V
P
= 14.4 V; T
amb
= 25
C.
handbook, halfpage
0
10
VP (V)
Iq
(
A)
20
30
25
0
20
15
10
5
MDA947
Fig.7
Quiescent current as a function of the
supply voltage.
I
REG
= 0 mA.
handbook, halfpage
0
10
50
4
3
1
0
2
20
30
VP (V)
Iq
(mA)
40
MDA949
Fig.8
Quiescent current as a function of high
supply voltage.
handbook, halfpage
-
40
0
(1)
(2)
160
2
1.5
0.5
0
1
40
80
Tj (
C)
Iq
(mA)
120
MDA951
Fig.9
Quiescent current as a function of the
junction temperature.
(1) I
q
at 50 mA load.
(2) I
q
at 10 mA load.
handbook, halfpage
5
0.36
0.40
0.44
0.48
10
15
VP (V)
Iq
(mA)
25
20
MDA948
Fig.10 Quiescent current as a function of the
supply voltage.
I
REG
= 10 mA.
2000 Feb 01
9
Philips Semiconductors
Preliminary specification
Very low dropout voltage/quiescent current
3.3 V voltage regulator with enable
TDA3673
handbook, halfpage
5
1.4
1.6
1.8
2
10
15
VP (V)
Iq
(mA)
25
20
MDA950
Fig.11 Quiescent current as a function of the
supply voltage.
I
REG
= 50 mA.
handbook, halfpage
0
20
100
4
3
1
0
2
40
60
IREG (mA)
Iq
(mA)
80
MDA952
Fig.12 Quiescent current as a function of the
output current.
Fig.13 Output voltage as a function of the junction
temperature.
handbook, halfpage
-
50
200
3.40
3.25
3.30
3.35
0
50
Tj (
C)
VREG
(V)
100
150
MGS694
I
REG
= 0 mA.
Fig.14 Output voltage thermal protection as a
function of the junction temperature.
handbook, halfpage
-
50
200
4
0
1
3
2
0
50
Tj (
C)
VREG
(V)
100
150
MGS695
I
REG
= 0 mA.
2000 Feb 01
10
Philips Semiconductors
Preliminary specification
Very low dropout voltage/quiescent current
3.3 V voltage regulator with enable
TDA3673
handbook, halfpage
0
40
IREG (mA)
VREG(drop)
(mV)
80
120
500
400
200
100
300
MDA957
Fig.15 Dropout voltage as a function of the output
current.
handbook, halfpage
0
4
3
2
1
0
100
VREG
(V)
IREG (mA)
200
300
MGS696
Fig.16 Fold back protection mode.
V
P
= 8 V with pulsed load.
handbook, halfpage
-
70
-
60
-
50
-
40
-
30
MDA956
10
SVRR
(dB)
f (Hz)
10
2
10
3
10
4
10
5
(1)
(1)
(2)
(2)
(3)
(3)
Fig.17 SVRR as a function of the ripple frequency.
I
REG
= 10 mA; C2 = 10
F.
(1) SVRR at R
L
= 100
.
(2) SVRR at R
L
= 500
.
(3) SVRR at R
L
= 10 k
.
2000 Feb 01
11
Philips Semiconductors
Preliminary specification
Very low dropout voltage/quiescent current
3.3 V voltage regulator with enable
TDA3673
PACKAGE OUTLINE
UNIT
A
max.
A
1
A
2
A
3
b
p
c
D
(1)
E
(2)
(1)
e
H
E
L
L
p
Q
Z
y
w
v
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC
JEDEC
EIAJ
mm
inches
1.75
0.25
0.10
1.45
1.25
0.25
0.49
0.36
0.25
0.19
5.0
4.8
4.0
3.8
1.27
6.2
5.8
1.05
0.7
0.6
0.7
0.3
8
0
o
o
0.25
0.1
0.25
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
1.0
0.4
SOT96-1
X
w
M
A
A
1
A
2
b
p
D
H
E
L
p
Q
detail X
E
Z
e
c
L
v
M
A
(A )
3
A
4
5
pin 1 index
1
8
y
076E03
MS-012
0.069
0.010
0.004
0.057
0.049
0.01
0.019
0.014
0.0100
0.0075
0.20
0.19
0.16
0.15
0.050
0.244
0.228
0.028
0.024
0.028
0.012
0.01
0.01
0.041
0.004
0.039
0.016
0
2.5
5 mm
scale
SO8: plastic small outline package; 8 leads; body width 3.9 mm
SOT96-1
97-05-22
99-12-27
2000 Feb 01
12
Philips Semiconductors
Preliminary specification
Very low dropout voltage/quiescent current
3.3 V voltage regulator with enable
TDA3673
SOLDERING
Introduction to soldering surface mount packages
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our
"Data Handbook IC26; Integrated Circuit Packages"
(document order number 9398 652 90011).
There is no soldering method that is ideal for all surface
mount IC packages. Wave soldering is not always suitable
for surface mount ICs, or for printed-circuit boards with
high population densities. In these situations reflow
soldering is often used.
Reflow soldering
Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.
Several methods exist for reflowing; for example,
infrared/convection heating in a conveyor type oven.
Throughput times (preheating, soldering and cooling) vary
between 100 and 200 seconds depending on heating
method.
Typical reflow peak temperatures range from
215 to 250
C. The top-surface temperature of the
packages should preferable be kept below 230
C.
Wave soldering
Conventional single wave soldering is not recommended
for surface mount devices (SMDs) or printed-circuit boards
with a high component density, as solder bridging and
non-wetting can present major problems.
To overcome these problems the double-wave soldering
method was specifically developed.
If wave soldering is used the following conditions must be
observed for optimal results:
Use a double-wave soldering method comprising a
turbulent wave with high upward pressure followed by a
smooth laminar wave.
For packages with leads on two sides and a pitch (e):
larger than or equal to 1.27 mm, the footprint
longitudinal axis is preferred to be parallel to the
transport direction of the printed-circuit board;
smaller than 1.27 mm, the footprint longitudinal axis
must be parallel to the transport direction of the
printed-circuit board.
The footprint must incorporate solder thieves at the
downstream end.
For packages with leads on four sides, the footprint must
be placed at a 45
angle to the transport direction of the
printed-circuit board. The footprint must incorporate
solder thieves downstream and at the side corners.
During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.
Typical dwell time is 4 seconds at 250
C.
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.
Manual soldering
Fix the component by first soldering two
diagonally-opposite end leads. Use a low voltage (24 V or
less) soldering iron applied to the flat part of the lead.
Contact time must be limited to 10 seconds at up to
300
C.
When using a dedicated tool, all other leads can be
soldered in one operation within 2 to 5 seconds between
270 and 320
C.
2000 Feb 01
13
Philips Semiconductors
Preliminary specification
Very low dropout voltage/quiescent current
3.3 V voltage regulator with enable
TDA3673
Suitability of surface mount IC packages for wave and reflow soldering methods
Notes
1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum
temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the
"Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods".
2. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink
(at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version).
3. If wave soldering is considered, then the package must be placed at a 45
angle to the solder wave direction.
The package footprint must incorporate solder thieves downstream and at the side corners.
4. Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8 mm;
it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
5. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
DEFINITIONS
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
PACKAGE
SOLDERING METHOD
WAVE
REFLOW
(1)
BGA, SQFP
not suitable
suitable
HLQFP, HSQFP, HSOP, HTSSOP, SMS
not suitable
(2)
suitable
PLCC
(3)
, SO, SOJ
suitable
suitable
LQFP, QFP, TQFP
not recommended
(3)(4)
suitable
SSOP, TSSOP, VSO
not recommended
(5)
suitable
Data sheet status
Objective specification
This data sheet contains target or goal specifications for product development.
Preliminary specification
This data sheet contains preliminary data; supplementary data may be published later.
Product specification
This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
2000 Feb 01
14
Philips Semiconductors
Preliminary specification
Very low dropout voltage/quiescent current
3.3 V voltage regulator with enable
TDA3673
NOTES
2000 Feb 01
15
Philips Semiconductors
Preliminary specification
Very low dropout voltage/quiescent current
3.3 V voltage regulator with enable
TDA3673
NOTES
Philips Electronics N.V.
SCA
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.
Internet: http://www.semiconductors.philips.com
2000
69
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Printed in The Netherlands
753503/02/pp
16
Date of release:
2000 Feb 01
Document order number:
9397 750 06801
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