January 1992

Philips Semiconductors

Preliminary specification

Quasi-split sound processor for all standards

TDA3866

FEATURES

Quasi-split sound processor for all standards e. g. B/G
(FM sound) and L (AM sound)

AF2 signal automatically muted (at B/G) by the input
signal level

AM signal processing for L standard and switching over
the audio signal

Stereo-matrix correction

Layout-compatible with TDA3858 (32 pins) and
TDA3857 (20 pins)

AM output level typically 500 mV at m = 0.54 (

2.5 dB in

comparison to TDA3856)

GENERAL DESCRIPTION

Separate symmetrical IF inputs for FM or AM sound.

Gain controlled wideband IF amplifier, input select switch.
AGC generation due to peak sync for FM or mean signal
level for AM. Reference amplifier for the regeneration of
the vision carrier. Optimized limiting amplifier for AM
suppression in the regenerated vision carrier signal and
90

phase shifter.

Intercarrier mixer for FM sound, output with low-pass filter.

Separate signal processing for 5.5 and 5.74 MHz
intercarriers.

Wide supply voltage range, only 300 mW power
dissipation at 5 V.

QUICK REFERENCE DATA

ORDERING AND PACKAGE INFORMATION

Note

1. SOT234-1; 1997 January 8.

SYMBOL

PARAMETER

MIN.

TYP.

MAX.

UNIT

supply voltage (pin 21)

4.5

8.8

supply current

i IF

IF input sensitivity (

3 dB)

100

audio output signal for FM standard B/G (RMS value)

audio output signal for AM standard L (RMS value)

0.5

THD

total harmonic distortion

for FM

0.5

for AM

S/N (W)

weighted signal-to-noise ratio

for FM

for AM

EXTENDED TYPE

NUMBER

PACKAGE

PINS

PIN POSITION

MATERIAL

CODE

TDA3866

shrink DIL

plastic

SOT234

(1)

January 1992

Philips Semiconductors

Preliminary specification

Quasi-split sound processor for all standards

TDA3866

PINNING

SYMBOL

PIN

DESCRIPTION

AMIF1

AM IF difference input 1 for L standard (32.4 MHz)

AMIF2

AM IF difference input 2 for L standard

AGC

charge capacitor for AGC (FM and AM)

charge capacitor for AM AGC

MODE

3-state input for standard select

FM2R1

reference circuit for FM2 (5.74 MHz)

FM2R2

reference circuit for FM2 (5,74 MHz)

AF2

AF2 output (AF out of 5.74 MHz)

AF1

AF1 output (AF out of 5.5 MHz or AM)

FM1R1

reference circuit for FM1 (5.5 MHz)

FM1R2

reference circuit for FM1 (5.5 MHz)

VC-R1

reference circuit for the vision carrier (38.9 MHz)

VC-R2

reference circuit for the vision carrier (38.9 MHz)

AFAM

DC-decoupling capacitor for AM demodulator (AF-AM)

FM1I

intercarrier input for FM1 (5.5 MHz)

AF1

DC-decoupling capacitor for FM1 demodulator (AF1)

ICO

intercarrier output signal (5.5/5.74 MHz)

AF2

DC-decoupling capacitor for FM2 demodulator (AF2)

FM2I

intercarrier input for FM2 (5.74 MHz)

GND

ground (0 V)

5 ...

8 V supply voltage

ref

charge capacitor for reference voltage

FMIF1

IF difference input 1 for B/G standard (38.9 MHz)

FMIF2

IF difference input 2 for B/G standard (38.9 MHz)

PIN CONFIGURATION

Fig.2 Pin configuration.

January 1992

Philips Semiconductors

Preliminary specification

Quasi-split sound processor for all standards

TDA3866

FUNCTIONAL DESCRIPTION

The quasi-split sound processor is for
all standards. Dependent on the
voltage on pin 5 either FM mode
(B/G) or AM mode (L) is selected.

B/G standard (FM mode):
Pins 23 and 24 are active, AGC
detector uses peak sync level. Sound
carrier SC1 (5.5 MHz) provides AF1,
sound carrier SC2 (5.74 MHz)
provides AF2. With no sound carrier
SC2 on pin 19, AF2 output is muted
(in mid-position of the standard select
switch FM mode without muting of
AF2 is selected).

The mute circuit prevents false signal
recognition in the stereo decoder at
high IF signal levels when no second
sound carrier exists (mono) and an
AF signal is present in the
identification signal frequency range.

With 1 mV on pin 19, under
measurement conditions, AF2 is
switched on (see limiting amplifier).
Weak input signals at pins 23 and 24
generate noise on pin 19, which is
present in the intercarrier signal and
passes through the 5.74 MHz filter.
Noise on pin 19 inhibits muting. No
misinterpretation due to white noise
occurs in the stereo decoder; when
non-correlated noise masks the
identification signal frequencies,
which may be present in sustained

tone signals. The stereo decoder
remains switched to mono.

The series capacitor C

in 38.9 MHz

resonant circuit provides a notch at
the sound carrier frequency in order
to provide more attenuation for the
sound carrier in the vision carrier
reference channel. The ratio of
parallel/series capacitor depends on
the ratio of VC/SC frequency and has
to be adapted to other TV
transmission standards if necessary,
according to the formula
C

= C

)

The result is an improved "intercarrier
buzz" (up to 10 dB improvement in
sound channel 2 with 250 kHz video
modulation for B/G stereo) or
suppression of 350 kHz video
modulated beat frequency in the
digitally-modulated NICAM
subcarrier.
The picture carrier for quadrature
demodulation in the intercarrier mixer
is not exactly 90 degrees due to the
shift variation in the integrated phase
shift network. The tuning of the LC
reference circuit to provide optimal
video suppression at the intercarrier
output is not the same as that to
provide optimal intercarrier buzz
suppression. In order to optimize the
AF signal performance, a fine tuning
for the optimal S/N at the sound
channel 2 (from 5.74 MHz) may be
performed with a 250 kHz square
wave video modulation.

Measurements at the demodulators:
For all signal-to-noise measurements
the generator must meet the following
specifications;
phase modulation errors

0.5 degree

for B/W-jumps intercarrier
signal-to-noise ratio as measured
with "TV-demodulator AMF2"
(weighted S/N) must be

60 dB at

6 kHz sine wave modulation of the
B/W-signal.
Signal-to-noise ratios are measured
with

f =

50 kHz deviation and

mod

= 1 kHz; with a deviation

27 kHz the S/N ratio is

deteriorated by 5.3 dB.

L standard (AM mode): Pins 1 and 2
are active, AGC detector uses mean
signal level. The audio signal from the
AM demodulator is output on AF1,
with AF2 output muted.

January 1992

Philips Semiconductors

Preliminary specification

Quasi-split sound processor for all standards

TDA3866

LIMITING VALUES

In accordance with the Absolute Maximum System (IEC 134).

Note

1. Equivalent to discharging a 200 pF capacitor through a 0

series resistor.

SYMBOL

PARAMETER

MIN.

MAX.

UNIT

supply voltages (pin 21)

8.8

input and output voltage (pins 1, 2, 5, 8, 9, 15, 17, 19, 23
and 24)

tot

total power dissipation

635

stg

storage temperature range

150

amb

operating ambient temperature range

ESD

electrostatic handling

(1)

500

all pins except 1, 2, 23 and 24

pins 1, 2, 23 and 24

400

pins 1, 2, 23 and 24

500

January 1992

Philips Semiconductors

Preliminary specification

Quasi-split sound processor for all standards

TDA3866

CHARACTERISTICS

= 5 V and T

amb

= 25

C, measurements taken in Fig.3 with f

= 38.9 MHz, f

SC1

= 33.4 MHz and f

SC2

= 33.158 MHz.

Vision carrier (VC) modulated with different video signals, modulation depth 100 % (proportional to 10 % residual
carrier).
Vision carrier amplitude (RMS value) V

i VC

= 10 mV; vision to sound carrier ratios are VC/SC1 = 13 dB and

VC/SC2 = 20 dB. Sound carriers (SC1, SC2) modulated with f = 1 kHz and deviation

f = 50 kHz unless otherwise

specified.

SYMBOL

PARAMETER

CONDITIONS

MIN.

TYP.

MAX.

UNIT

supply voltage range (pin 21)

4.5

8.8

supply current (pin 21)

IF source control (pin 5)

input voltage in order to obtain standards

B/G (FM) with automatic muting

pin 5 connected

2.8

pin 5 open-circuit

2.8

B/G (FM) without muting

pin 5 connected

1.3

2.3

22 k

to GND

(alternative measure)

1.8

L (AM sound)

pin 5 connected

0.8

input current

= V

100

= 0

300

IF input not activated (pins 1-2 or 23-24)

input resistance

100

DC input voltage (pins 1, 2, 23 and 24)

internally set LOW

0.1

1,2-23,24

crosstalk attenuation of IF input switch

note 1

IF amplifier (pins 1-2 or 23-24)

input resistance

1.75

2.2

2.65

input capacitance

1.0

1.5

2.2

DC potential, voltage (pins 1, 2, 23, 24)

1.75

i IF

maximum input signal (RMS value)

1 dB

100

input signal sensitivity B/G standard
(RMS value, pins 23-24)

3 dB intercarrier signal

reduction on pin 17

100

input signal sensitivity L standard
(RMS value, pins 1-2)

3 dB intercarrier signal

reduction on pin 9

100

IF gain control range

IF bandwidth

3 dB

MHz

voltage range for gain control (pin 3)

min

max

1.7

2.6

January 1992

Philips Semiconductors

Preliminary specification

Quasi-split sound processor for all standards

TDA3866

Resonance amplifier (pins 12-13)

vision carrier amplitude
(peak-to-peak value)

= 38.9 MHz

270

12-13

operating resistance

inductance

Fig.3 and 5

0.247

capacitance

= 27 pF

Q-factor of resonant circuit

= 90

12, 13

DC voltage (pins 12 and 13)

Intercarrier mixer output (pin 17)

output signal for 5.5 MHz (RMS value)

125

output signal for 5.74 MHz (RMS value)

IF bandwidth

1 dB

8.5

MHz

3 dB

MHz

VID

residual video AM on intercarrier

note 2

residual vision carrier (RMS value)

1st/2nd harmonic;
(38.9/77.8 MHz)

0.5

output resistance (emitter follower)

1 mA emitter current

allowable AC output current (pin 17)

0.7

allowable DC output current

DC voltage

1.75

Limiting amplifiers (pins 15 and 19)

minimum input signal (RMS value)

3 dB AF signal

300

450

maximum input signal (RMS value)

200

15, 19

input resistance

560

15, 19

DC voltage

level detector threshold for no muting
(RMS value, pin 19)

only 5.74 MHz channel

hysteresis of level detector

SYMBOL

PARAMETER

CONDITIONS

MIN.

TYP.

MAX.

UNIT

January 1992

Philips Semiconductors

Preliminary specification

Quasi-split sound processor for all standards

TDA3866

FM1 and FM2 demodulators

Measurements with FM IF input signals of 5.5 MHz and 5.74 MHz with V

i IF (rms)

= 10 mV (f

mod

= 1 kHz, deviation

f =

50 kHz) at pins 15 and 19 without ceramic filters, R

= 50

De-emphasis 50

s and V

= V

(B/G standard). Q

-factor = 11 for resonant circuits at pins 6-7 and 10-11.

intercarrier signals
(RMS values, pins 6-7 and 10-11)

100

DC voltage (pins 6-7 and 10-11)

1.8

AF output signals
(RMS values, pins 8 and 9)

0.75

0.95

1.20

difference of AF signals
between channels (pins 8 and 9)

8, 9

output resistance

100

8, 9

DC voltage

2.1

8, 9

allowed AC current of emitter output
(peak value)

note 3

1.5

8, 9

maximum allowed DC output current

THD

total harmonic distortion

0.5

1.0

AF output signal (RMS value)

THD = 1.5 %

1.25

AM suppression

1 kHz, m = 0.3

S/N(W)

weighted signal-to-noise ratio

CCIR 468-3

AF bandwidth

3 dB

0.02

100

kHz

crosstalk attenuation (pins 9-8)

16, 18

DC voltage (pins 16 and 18)

1.7

AM mode, input signal at pins 1-2

SC = 32.4 MHz;
f

mod

= 1 kHz, m = 0.54;

i AM

= 10 mV rms

AF output signal on pin 9 (RMS value)

400

500

600

output resistance (pin 9)

100

maximum AC output current (peak value)

note 3

1.5

maximum DC output current

DC voltage

2.1

THD

total harmonic distortion

Fig.4

S/N(W)

weighted signal-to-noise ratio

CCIR 468-3

AF bandwidth

3 dB

0.02

100

kHz

DC voltage (pin 14)

SYMBOL

PARAMETER

CONDITIONS

MIN.

TYP.

MAX.

UNIT

January 1992

Philips Semiconductors

Preliminary specification

Quasi-split sound processor for all standards

TDA3866

Notes to the characteristics

1. Crosstalk attenuation of IF input switch, measured at R

12-13

= 470

(instead of LC circuit);

input signal V

i (rms)

= 20 mV (pins 23-24). AGC voltage V

set to a value to achieve V

o (rms)

= 20 mV (pins 12-13).

After switching (V

= 0 V) measure attenuation.

IF coupling with OFWG3203 and OFWL9350 (Siemens).

2. Spurious intercarrier AM: m = (A-B)/A (wherein A = signal at sync; B = signal with 100% picture modulation.)

3. For larger current: R

2.2 k

(pin 8 or 9 to GND) in order to increase the bias current of the output emitter follower.

Audio frequency performance for FM operation in B/G standard (V

= V

) unless otherwise specified.

Measurements on AF outputs (pins 8 and 9)

signals attenuation of AF signal switches

mute: AF2 on pin 8

= 0

AM mode: not required signal
AF1 on pin 9 (from FM)

5.5 MHz on pin 18;
V

= 0; V

= 10 mV

FM mode: not required signal
AF1 on pin 9 (from AM)

signal for L standard
(pins 1-2); V

= V

8, 9

DC level deviation (pins 8 and 9)

when switching to FM
or AM sound or Mute

S/N(W)

weighted signal-to-noise ratio
on output pin 9

CCIR 468-3
de-emphasis 50

black picture

= 5.5 MHz

2T/20T pulses with white bar

= 5.5 MHz

6 kHz sine wave, B/W-modulated

= 5.5 MHz

250 kHz square wave B/W-modulated

= 5.5 MHz

on output pin 8

black picture

= 5.742 MHz

2T/20T pulses with white bar

= 5.742 MHz

6 kHz sine wave, B/W-modulated

= 5.742 MHz

250 kHz square wave B/W-modulated

= 5.742 MHz

ripple rejection

all standards; f

= 70 Hz

= 200 mV (p-p)

SYMBOL

PARAMETER

CONDITIONS

MIN.

TYP.

MAX.

UNIT

January 1992

Philips Semiconductors

Preliminary specification

Quasi-split sound processor for all standards

TDA3866

PACKAGE OUTLINE

UNIT

REFERENCES

OUTLINE

VERSION

EUROPEAN

PROJECTION

ISSUE DATE

IEC

JEDEC

EIAJ

DIMENSIONS (mm are the original dimensions)

SOT234-1

92-11-17
95-02-04

max.

1.3
0.8

0.53
0.40

0.32
0.23

22.3
21.4

9.1
8.7

3.2
2.8

0.18

1.778

10.16

10.7
10.2

12.2
10.5

1.6

4.7

0.51

3.8

(e )

seating plane

pin 1 index

10 mm

scale

Note

1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.

(1)

max.

min.

max.

SDIP24: plastic shrink dual in-line package; 24 leads (400 mil)

SOT234-1

January 1992

Philips Semiconductors

Preliminary specification

Quasi-split sound processor for all standards

TDA3866

SOLDERING

Introduction

There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.

This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our

"IC Package Databook" (order code 9398 652 90011).

Soldering by dipping or by wave

The maximum permissible temperature of the solder is
260

C; solder at this temperature must not be in contact

with the joint for more than 5 seconds. The total contact
time of successive solder waves must not exceed
5 seconds.

The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified maximum storage temperature (T

stg max

). If the

printed-circuit board has been pre-heated, forced cooling
may be necessary immediately after soldering to keep the
temperature within the permissible limit.

Repairing soldered joints

Apply a low voltage soldering iron (less than 24 V) to the
lead(s) of the package, below the seating plane or not
more than 2 mm above it. If the temperature of the
soldering iron bit is less than 300

C it may remain in

contact for up to 10 seconds. If the bit temperature is
between 300 and 400

C, contact may be up to 5 seconds.

DEFINITIONS

LIFE SUPPORT APPLICATIONS

These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.

Data sheet status

Objective specification

This data sheet contains target or goal specifications for product development.

Preliminary specification

This data sheet contains preliminary data; supplementary data may be published later.

Product specification

This data sheet contains final product specifications.

Limiting values

Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.

Application information

Where application information is given, it is advisory and does not form part of the specification.

Ð­Ð»ÐµÐºÑ‚Ñ€Ð¾Ð½Ð½Ñ‹Ð¹ ÐºÐ¾Ð¼Ð¿Ð¾Ð½ÐµÐ½Ñ‚: TDA3866

ÐÐ»ÐµÐºÑ‚Ñ€Ð¾Ð½Ð½Ñ‹Ð¹ ÐºÐ¾Ð¼Ð¿Ð¾Ð½ÐµÐ½Ñ‚: TDA3866