Document Outline
- FEATURES
- GENERAL DESCRIPTION
- QUICK REFERENCE DATA
- ORDERING AND PACKAGE INFORMATION
- PINNING
- PIN CONFIGURATION
- FUNCTIONAL DESCRIPTION
- LIMITING VALUES
- CHARACTERISTICS
- PACKAGE OUTLINE
- SOLDERING
- DEFINITIONS
- LIFE SUPPORT APPLICATIONS
DATA SHEET
Preliminary specification
File under Integrated Circuits, IC02
January 1992
INTEGRATED CIRCUITS
TDA3867T
Quasi-split sound processor with
two FM demodulators
January 1992
2
Philips Semiconductors
Preliminary specification
Quasi-split sound processor with two FM demodulators
TDA3867T
FEATURES
Quasi-split sound processor for all FM standards e.g. B/G
Reduction of spurious video signals by tracking function and AFC for the vision carrier reference circuit; (indispensable
for NICAM)
AF2 signal automatically muted (at B/G) by the input signal level
GENERAL DESCRIPTION
Symmetrical IF input and gain controlled wideband IF amplifier.
AGC generation due to peak sync Reference amplifier for the regeneration of the vision carrier.
Optimized limiting amplifier for AM suppression in the regenerated vision carrier signal and 90
phase shifter.
Intercarrier mixer for FM sound, output with low-pass filter.
Separate signal processing for 5.5 and 5.74 MHz intercarriers.
Wide supply voltage range, only 300 mW power dissipation at 5 V.
QUICK REFERENCE DATA
ORDERING AND PACKAGE INFORMATION
Note
1. SOT136-1; 1997 January 8.
SYMBOL
PARAMETER
MIN.
TYP.
MAX.
UNIT
V
P
supply voltage (pin 24)
4.5
5
8.8
V
I
P
supply current (pin 24)
-
60
72
mA
V
i IF
IF input sensitivity (
-
3 dB)
-
70
100
V
V
o
audio output signal (RMS value)
-
1
-
V
THD
total harmonic distortion
-
0.5
-
%
S/N (W)
weighted signal-to-noise ratio
for FM
-
68
-
dB
for FM with 6 kHz sinus vision modulation
-
56
-
dB
EXTENDED
TYPE NUMBER
PACKAGE
PINS
PIN POSITION
MATERIAL
CODE
TDA3867T
28
mini-pack
plastic
SOT136A
(1)
January 1992
3
Philips Semiconductors
Preliminary specification
Quasi-split sound processor with two FM demodulators
TDA3867T
Fig.1 Block diagram.
January 1992
4
Philips Semiconductors
Preliminary specification
Quasi-split sound processor with two FM demodulators
TDA3867T
PINNING
SYMBOL
PIN
DESCRIPTION
n.c.
1
not connected
n.c.
2
not connected
C
AGC
3
charge capacitor for AGC
n.c.
4
not connected
n.c.
5
not connected
MATR
6
input for stereo matrix correction
FM2R1
7
reference circuit for FM2 (5.74 MHz)
FM2R2
8
reference circuit for FM2 (5,74 MHz)
AF2
9
AF2 output (AF out of 5.74 MHz)
AF1
10
AF1 output (AF out of 5.5 MHz)
FM1R1
11
reference circuit for FM1 (5.5 MHz)
FM1R2
12
reference circuit for FM1 (5.5 MHz)
n.c.
13
not connected
VC-R1
14
reference circuit for the vision carrier (38.9 MHz)
VC-R2
15
reference circuit for the vision carrier (38.9 MHz)
TRACK
16
DC output level for tracking
n.c.
17
not connected
FM1I
18
intercarrier input for FM1 (5.5 MHz)
C
AF1
19
DC-decoupling capacitor for FM1 demodulator (AF1)
ICO
20
intercarrier output signal (5.5/5.74 MHz)
C
AF2
21
DC-decoupling capacitor for FM2 demodulator (AF2)
FM2I
22
intercarrier input for FM2 (5.74 MHz)
GND
23
ground (0 V)
V
P
24
+
5 to
+
8 V supply voltage
n.c.
25
not connected
n.c.
26
not connected
FMIF1
27
IF difference input 1 (B/G standard, 38.9 MHz)
FMIF2
28
IF difference input 2 (B/G standard, 38.9 MHz)
PIN CONFIGURATION
Fig.2 Pin configuration.
January 1992
5
Philips Semiconductors
Preliminary specification
Quasi-split sound processor with two FM demodulators
TDA3867T
FUNCTIONAL DESCRIPTION
The quasi-split sound processor is
suitable for all FM standards
(e. g. B/G).
The AGC detector uses peak sync
level. Sound carrier SC1 (5.5 MHz)
provides AF1, sound carrier SC2
(5.74 MHz) provides AF2. With no
sound carrier SC2 on pin 22, AF2
output is muted. The mute circuit
prevents false signal recognition in
the stereo decoder at high IF signal
levels when no second sound carrier
exists (mono) and an AF signal is
present in the identification signal
frequency range.
With 1 mV on pin 22, under
measurement conditions, AF2 is
switched on (see limiting amplifier).
Weak input signals at pins 27 and 28
generate noise on pin 22, which is
present in the intercarrier signal and
passes through the 5.74 MHz filter.
Noise on pin 22 inhibits muting. No
misinterpretation due to white noise
occurs in the stereo decoder; when
non-correlated noise masks the
identification signal frequencies,
which may be present in sustained
tone signals. The stereo decoder
remains switched to mono.
The series capacitor C
s
in the
38.9 MHz resonant circuit provides a
notch at the sound carrier frequency
in order to provide more attenuation
for the sound carrier in the vision
carrier reference channel. The ratio of
parallel/series capacitor depends on
the ratio of VC/SC frequency and has
to be adapted to other TV
transmission standards if necessary,
according to
The result is an improved "intercarrier
buzz" (up to 10 dB improvement in
sound channel 2 with 250 kHz video
modulation for B/G stereo) or
suppression of 350 kHz video
modulated beat frequency in the
digitally-modulated NICAM
subcarrier. The picture carrier for
quadrature demodulation in the
intercarrier mixer is not exactly
90 degrees due to the shift variation
in the integrated phase shift network.
The tuning of the LC reference circuit
to provide optimal video suppression
at the intercarrier output is not the
same as that to provide optimal
intercarrier buzz suppression. In
order to optimize the AF signal
performance, a fine tuning for the
optimal S/N at the sound channel 2
(from 5.74 MHz) may be performed
with a 250 kHz square wave video
modulation.
C
S
C
P
f
VC
f
SC
/
(
)
2
- C
P
.
=
Measurements at the demodulators:
For all signal-to-noise measurements
the generator must meet the following
specifications;
phase modulation errors
<
0.5 degree
for B/W-jumps intercarrier
signal-to-noise ratio as measured
with "TV demodulator AMF2"
(weighted S/N)
must be
>
60 dB at 6 kHz sine wave
modulation of the B/W-signal.
Signal-to-noise ratios are measured
with
f =
50 kHz deviation and
f
m
= 1 kHz; with a deviation of
27 kHz the S/N ratio is deteriorated
by 5.3 dB.
January 1992
6
Philips Semiconductors
Preliminary specification
Quasi-split sound processor with two FM demodulators
TDA3867T
LIMITING VALUES
In accordance with the Absolute Maximum System (IEC 134).
Note
1. Equivalent to discharging a 200 pF capacitor through a 0
series resistor.
SYMBOL
PARAMETER
MIN.
MAX.
UNIT
V
P
supply voltages (pin 24)
-
8.8
V
V
n
input and output voltage (pins 9, 10, 18, 20, 22, 27 and 28)
0
V
P
V
P
tot
total power dissipation
0
635
mW
T
stg
storage temperature range
-
25
150
C
T
amb
operating ambient temperature range
0
70
C
V
ESD
electrostatic handling
(1)
all pins except 27 and 28
500
-
V
pins 27 and 28
+
400
-
V
-
500
-
V
January 1992
7
Philips Semiconductors
Preliminary specification
Quasi-split sound processor with two FM demodulators
TDA3867T
CHARACTERISTICS
V
P1
= 5 V and T
amb
= 25
C, measurements taken in Fig.3 with f
VC
= 38.9 MHz, f
SC1
= 33.4 MHz and
f
SC2
= 33.158 MHz.
Vision carrier (VC) modulated with different video signals, modulation depth 100 % (proportional to 10 % residual
carrier).
Vision carrier amplitude (RMS value) V
i VC
= 10 mV; vision to sound carrier ratios are VC/SC1 = 13 dB and
VC/SC2 = 20 dB. Sound carriers (SC1, SC2) modulated with f = 1 kHz and deviation
f =
50 kHz and deviation
f =
50 kHz unless otherwise specified.
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
V
P
supply voltage.range (pin 24)
4.5
5
8.8
V
I
P
supply current (pin 24)
V
P
= 5 V
48
60
72
mA
IF amplifier (pins 27-28)
R
I
input resistance
1.75
2.2
2.65
k
C
I
input capacitance
1.0
1.5
2.2
pF
V
I
DC potential, voltage (pins 27 and 28)
-
1.75
-
V
V
i IF
maximum input signal (RMS value)
V
o
=
+
1 dB
70
100
-
mV
input signal sensitivity (RMS value)
-
3 dB intercarrier signal
reduction on pin 20
-
70
100
V
G
v
IF gain control range
60
63
-
dB
B
IF bandwidth
-
3 dB
50
70
-
MHz
V
3
voltage range for gain control (pin 3)
G
min
-
G
max
1.7
-
2.6
V
Resonance amplifier (pins 14-15)
V
o
vision carrier amplitude
(peak-to-peak value)
f
o
= 38.9 MHz
-
270
-
mV
R
14-15
operating resistance
-
4
-
k
L
inductance
Fig.3 and 4
-
0.247
-
H
C
capacitance
C
S
= 27 pF
-
68
-
pF
Q
L
Q-factor of resonant circuit
Q
o
= 90
-
40
-
V
14, 15
DC voltage (pins 14 and 15)
-
V
P
-
1
-
V
Intercarrier mixer output (pin 20)
V
o
output signal for 5.5 MHz (RMS value)
71
95
125
mV
output signal for 5.74 MHz (RMS value)
32
43
56
mV
B
IF bandwidth
-
1 dB
-
8.5
-
MHz
-
3 dB
-
10
-
MHz
V
VID
/V
20
residual video AM on intercarrier
note 1
-
3
10
%
V
VC
residual vision carrier (RMS value)
1st/2nd harmonic;
(38.9/77.8 MHz)
-
0.5
1
mV
R
20
output resistance (emitter follower)
1 mA emitter current
-
30
-
I
o
allowable AC output current (pin 20)
-
-
0.7
mA
I
20
allowable DC output current
-
-
-
2
mA
V
20
DC voltage
-
1.75
-
V
January 1992
8
Philips Semiconductors
Preliminary specification
Quasi-split sound processor with two FM demodulators
TDA3867T
Limiting amplifiers (pins 18 and 22)
V
i
minimum input signal (RMS value)
-
3 dB AF signal
-
300
450
V
maximum input signal (RMS value)
200
-
-
mV
R
18, 22
input resistance
-
560
-
V
18, 22
DC voltage
-
0
-
V
V
i
level detector threshold for no muting
(RMS value, pin 22)
only 5.74 MHz channel
-
1
-
mV
V
i
hysteresis of level detector
-
5
-
dB
Tracking automatic frequency control (AFC) of the vision carrier reference circuit.
V
o
tracking output voltage range (pin 16)
note 5
V
P1
-
3.3
-
V
P1
-
1
V
F
TR
tracking reducing factor for
black picture
-
9
-
white test picture
-
4
-
50 % grey picture
-
6
-
S
AFC steepness (open loop) for
black picture
-
-
8
-
mV/kHz
white test picture
-
-
3
-
mV/kHz
50 % grey picture
-
-
5.5
-
mV/kHz
FM1 and FM2 demodulators
Measurements with FM IF input signals of 5.5 MHz and 5.74 MHz with V
i IF (rms)
= 10 mV (f
mod
= 1 kHz, deviation
f =
50 kHz) on pins 18 and 22 without ceramic filters, R
S
= 50
.
De-emphasis of 50
s and V
5
= V
P
(B/G standard). Q
L
-
factor = 11 for resonant circuits at pins 7-8 and 11-12.
V
IC
intercarrier signals
(RMS values, pins 7-8 and 11-12)
-
100
-
mV
V
DC
DC voltage (pins 7, 8, 11 and 12)
-
1.8
-
V
V
o
AF output signals
(RMS values, pins 9 and 10)
0.75
0.95
1.20
V
V
o
difference of AF signals
between channels (pins 9 and 10)
pin 6 open-circuit;
note 2
-
-
1
dB
R
9, 10
output resistance
-
100
-
V
9, 10
DC voltage
-
2.1
-
V
I
9, 10
allowed AC current of emitter output
(peak value)
note 3
-
-
1.5
mA
maximum allowed DC output current
-
-
-
2
mA
THD
total harmonic distortion
-
0.5
1.0
%
V
o
AF output signal (RMS value)
THD = 1.5 %
1.25
-
-
V
AM
AM suppression
1 kHz, m = 0.3
48
54
-
dB
S/N(W)
weighted signal-to-noise ratio
CCIR 468-3
64
68
-
dB
B
AF bandwidth
-
3 dB
0.02
-
100
kHz
CR
crosstalk attenuation (pins 9-10)
60
70
-
dB
V
6
adjusting voltage for AF2 signal (pin 6)
note 4
0
-
5
V
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
January 1992
9
Philips Semiconductors
Preliminary specification
Quasi-split sound processor with two FM demodulators
TDA3867T
Notes to the characteristics
1. Spurious intercarrier AM: m = (A
-
B)/A (wherein A = signal at sync; B = signal with 100 % picture modulation.)
2. AF2 signal can be adjusted by V
6
3. For larger current: R
L
>
2.2 k
(pin 9 or 10 to GND) in order to increase the bias current of the output emitter follower.
4. If not used, pin 6 should not be connected.
5. Automatic frequency control (AFC) of the vision carrier reference circuit (pins 14 and 15) for reducing spurious video
signals in the stereo/dual sound modes. The factor of reducing F
TR
at a deviation
f
VC
specifies the ratio of spurious
signals with/without tracking function.
G
AF2
minimum gain range due to V
6
due to V
6
-
1.5
-
1.0
dB
typical gain range
due to V
6
-
2.5
-
1.5
dB
V
19, 21
DC voltage (pins 19 and 21)
-
1.7
-
V
Audio frequency performance in B/G standard unless otherwise specified.
Measurements on AF outputs (pins 9 and 10)
V
o
AF signal attenuation
V
i
= 400
V;
mute: AF2 on pin 9
5.74 MHz on pin 22
70
-
-
dB
dV
9
DC level deviation
after mute switching
-
5
25
mV
S/N(W)
weighted signal-to-noise ratio
CCIR 468-3
on output pin 10
de-emphasis 50
s
black picture
f
i
= 5.5 MHz
59
63
-
dB
2T/20T pulses with white bar
f
i
= 5.5 MHz
57
61
-
dB
6 kHz sine wave, B/W-modulated
f
i
= 5.5 MHz
52
56
-
dB
250 kHz square wave B/W-modulated
f
i
= 5.5 MHz
50
56
-
dB
on output pin 9
black picture
f
i
= 5.742 MHz
57
61
-
dB
2T/20T pulses with white bar
f
i
= 5.742 MHz
55
59
-
dB
6 kHz sine wave, B/W-modulated
f
i
= 5.742 MHz
50
54
-
dB
250 kHz square wave B/W-modulated
f
i
= 5.742 MHz
50
56
-
dB
RR
ripple rejection
all standards; f
R
= 70 Hz
V
R
= 200 mV (p-p)
30
40
-
dB
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
January 1992
10
Philips Semiconductors
Preliminary specification
Quasi-split sound processor with two FM demodulators
TDA3867T
Fig.3 Test and application circuit (for application SAW-filters must be used).
(1) C
P
= 47 pF with the optional use of
tracking (because of C
o
of the varicaps).
Fig.4 Frequency response of the 38.9 MHz reference circuit.
(1) simple resonance circuit (without C
s
)
(2) resonance circuit with C
s
= 27 pF
C
S
= 27 pF (Fig.3)
C
S
C
P
f
VC
f
SC
--------
2
C
P
=
January 1992
11
Philips Semiconductors
Preliminary specification
Quasi-split sound processor with two FM demodulators
TDA3867T
Fig.5 Internal circuits.
January 1992
12
Philips Semiconductors
Preliminary specification
Quasi-split sound processor with two FM demodulators
TDA3867T
PACKAGE OUTLINE
UNIT
A
max.
A
1
A
2
A
3
b
p
c
D
(1)
E
(1)
(1)
e
H
E
L
L
p
Q
Z
y
w
v
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC
JEDEC
EIAJ
mm
inches
2.65
0.30
0.10
2.45
2.25
0.49
0.36
0.32
0.23
18.1
17.7
7.6
7.4
1.27
10.65
10.00
1.1
1.0
0.9
0.4
8
0
o
o
0.25
0.1
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
Note
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
1.1
0.4
SOT136-1
X
14
28
w
M
A
A
1
A
2
b
p
D
H
E
L
p
Q
detail X
E
Z
c
L
v
M
A
e
15
1
(A )
3
A
y
0.25
075E06
MS-013AE
pin 1 index
0.10
0.012
0.004
0.096
0.089
0.019
0.014
0.013
0.009
0.71
0.69
0.30
0.29
0.050
1.4
0.055
0.419
0.394
0.043
0.039
0.035
0.016
0.01
0.25
0.01
0.004
0.043
0.016
0.01
0
5
10 mm
scale
SO28: plastic small outline package; 28 leads; body width 7.5 mm
SOT136-1
95-01-24
97-05-22
January 1992
13
Philips Semiconductors
Preliminary specification
Quasi-split sound processor with two FM demodulators
TDA3867T
SOLDERING
Introduction
There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our
"IC Package Databook" (order code 9398 652 90011).
Reflow soldering
Reflow soldering techniques are suitable for all SO
packages.
Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.
Several techniques exist for reflowing; for example,
thermal conduction by heated belt. Dwell times vary
between 50 and 300 seconds depending on heating
method. Typical reflow temperatures range from
215 to 250
C.
Preheating is necessary to dry the paste and evaporate
the binding agent. Preheating duration: 45 minutes at
45
C.
Wave soldering
Wave soldering techniques can be used for all SO
packages if the following conditions are observed:
A double-wave (a turbulent wave with high upward
pressure followed by a smooth laminar wave) soldering
technique should be used.
The longitudinal axis of the package footprint must be
parallel to the solder flow.
The package footprint must incorporate solder thieves at
the downstream end.
During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.
Maximum permissible solder temperature is 260
C, and
maximum duration of package immersion in solder is
10 seconds, if cooled to less than 150
C within
6 seconds. Typical dwell time is 4 seconds at 250
C.
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.
Repairing soldered joints
Fix the component by first soldering two diagonally-
opposite end leads. Use only a low voltage soldering iron
(less than 24 V) applied to the flat part of the lead. Contact
time must be limited to 10 seconds at up to 300
C. When
using a dedicated tool, all other leads can be soldered in
one operation within 2 to 5 seconds between
270 and 320
C.
January 1992
14
Philips Semiconductors
Preliminary specification
Quasi-split sound processor with two FM demodulators
TDA3867T
DEFINITIONS
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
Data sheet status
Objective specification
This data sheet contains target or goal specifications for product development.
Preliminary specification
This data sheet contains preliminary data; supplementary data may be published later.
Product specification
This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
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