2003 Oct 31

Philips Semiconductors

Product specification

Vertical deflection booster

TDA4864J; TDA4864AJ

FEATURES

Power amplifier with differential inputs

Output current up to 2.5 A (p-p)

High vertical deflection frequency up to 200 Hz

High linear sawtooth signal amplification

Flyback generator:

TDA4864J: separate adjustable flyback supply

voltage up to 60 V

TDA4864AJ: internally doubled supply voltage

(two supply voltages only for DC-coupled outputs).

GENERAL DESCRIPTION

The TDA4864J and TDA4864AJ are deflection boosters
for use in vertical deflection systems for frame frequencies
up to 200 Hz.

The TDA4864J needs a separate flyback supply voltage,
so the supply voltages are independently adjustable to
optimize power consumption and flyback time.

For the TDA4864AJ the flyback supply voltage will be
generated internally by doubling the supply voltage and
therefore a separate flyback supply voltage is not needed.

Both circuits provide differential input stages.

QUICK REFERENCE DATA
Measurements referenced to pin GND.

ORDERING INFORMATION

SYMBOL

PARAMETER

CONDITIONS

MIN.

TYP.

MAX.

UNIT

supply voltage 1

supply voltage 2 for vertical output

flyback supply voltage of TDA4864J

flyback generator output voltage of
TDA4864AJ

V-OUT

1.25 A

+ 2.2 V

input voltage on

pin INN

1.6

0.5 V

pin INP

1.6

0.5 V

supply current 1

during scan

quiescent supply current 2

V-OUT

= 0

V-OUT(p-p)

vertical deflection output current
(peak-to-peak value)

2.5

amb

ambient temperature

+75

TYPE NUMBER

PACKAGE

NAME

DESCRIPTION

VERSION

TDA4864J

DBS7P

plastic DIL-bent-SIL power package; 7 leads
(lead length 12/11 mm); exposed die pad

SOT524-1

TDA4864AJ

2003 Oct 31

Philips Semiconductors

Product specification

Vertical deflection booster

TDA4864J; TDA4864AJ

PINNING

SYMBOL

PIN

DESCRIPTION

TDA4864J

TDA4864AJ

positive supply voltage 1

flyback supply voltage

flyback generator output

supply voltage 2 for vertical output

GND

ground or negative supply voltage

V-OUT

vertical output

INN

inverted input of differential input stage

INP

non-inverted input of differential input stage

handbook, halfpage

VP1

VFB

VP2

GND

V-OUT

INN

INP

TDA4864J

XXXxxx

Fig.3 Pin configuration of TDA4864J.

handbook, halfpage

VP1

VP3

VP2

GND

V-OUT

INN

INP

TDA4864AJ

XXXxxx

Fig.4 Pin configuration of TDA4864AJ.

2003 Oct 31

Philips Semiconductors

Product specification

Vertical deflection booster

TDA4864J; TDA4864AJ

FUNCTIONAL DESCRIPTION

Both the TDA4864J and TDA4864AJ consist of a
differential input stage, a vertical output stage, a flyback
generator, a reference circuit and a thermal protection
circuit.

The TDA4864J operates with a separate flyback supply
voltage (see Fig.1) while the TDA4864AJ generates the
flyback voltage internally by doubling the supply voltage
(see Fig.2).

Differential input stage

The differential sawtooth input current signal (coming from
the deflection controller) is connected to the inputs
(inverted signal to pin INN and non-inverted signal to
pin INP). The vertical feedback signal is superimposed on
the inverted signal on pin INN.

Vertical output and thermal protection

The vertical output stage is a quasi-complementary
class-B amplifier with a high linearity.

The output stage is protected against thermal overshoots.
For a junction temperature T

> 150

C this protection will

be activated and will reduce then the deflection current
(I

V-OUT

Flyback generator

The flyback generator supplies the vertical output stage
during flyback.

The TDA4864J is used with separate flyback supply
voltage to achieve a short flyback time with minimized
power dissipation.

The TDA4864AJ needs a capacitor C

between

pins V

and V

(see Fig.2). Capacitor C

is charged

during scan, using the external diode D1 and resistor R5.
During flyback the cathode of capacitor C

is connected to

the positive supply voltage and the flyback voltage is then
twice the supply voltage. For the TDA4864AJ the
resistor R6 in the positive supply line can be used to
reduce the power consumption.

In parallel with the deflection coil a damping resistor R

and an RC combination (R

= 5.6

and C

= 100 nF)

are needed. Furthermore, another additional
RC combination (R

= 5.6

and C

= 47 to 150 nF)

can be used to minimize the noise effect and the flyback
time (see Figs 9 and 10).

2003 Oct 31

Philips Semiconductors

Product specification

Vertical deflection booster

TDA4864J; TDA4864AJ

LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 60134); voltages referenced to pin GND; unless
otherwise specified.

Notes

1. Internally limited by thermal protection; will be activated for T

150

2. Equivalent to discharging a 200 pF capacitor through a 0

series resistor.

THERMAL CHARACTERISTICS

Note

1. To minimize the thermal resistance from mounting base to heatsink [R

th(mb-h)

] follow the recommended mounting

instruction: screw mounting preferred; torque = 40 Ncm; use heatsink compound; isolation plate increases R

th(mb-h)

SYMBOL

PARAMETER

CONDITIONS

MIN.

MAX.

UNIT

supply voltage 1

supply voltage 2

flyback supply voltage of TDA4864J

flyback generator output voltage of TDA4864AJ

+ 3

input voltage on

pin INN

pin INP

o(V-OUT)

output voltage on pin V-OUT

supply current 2

1.5

o(V-OUT)

output current on pin V-OUT

note 1

1.5

VFB

current during flyback of TDA4864J

1.5

VP3

current during flyback of TDA4864AJ

1.5

stg

storage temperature

+150

amb

ambient temperature

+75

junction temperature

note 1

150

electrostatic discharge voltage on all pins

note 2

300

SYMBOL

PARAMETER

CONDITIONS

VALUE

UNIT

th(j-mb)

thermal resistance from junction to mounting base

note 1

K/W

2003 Oct 31

Philips Semiconductors

Product specification

Vertical deflection booster

TDA4864J; TDA4864AJ

CHARACTERISTICS
V

= 25 V; T

amb

= 25

C; voltages referenced to pin GND; unless otherwise specified.

Note

1. Deviation of the output slope at a constant input slope.

SYMBOL

PARAMETER

CONDITIONS

MIN.

TYP.

MAX.

UNIT

Supplies

supply voltage 1

supply voltage 2

flyback supply voltage of TDA4864J

flyback generator output voltage of TDA4864AJ

V-OUT

1.25 A

+ 2.2 V

supply current 1

during scan

quiescent supply current 2

V-OUT

= 0

Differential input stage

input voltage on

pin INN

1.6

0.5 V

pin INP

1.6

0.5 V

input quiescent current on

pin INN

100

500

pin INP

100

500

Flyback generator

VFB

current during flyback of TDA4864J

1.5

VP3

current during flyback of TDA4864AJ

1.5

VP2-VFB

voltage drop during flyback of TDA4864J

reverse

V-OUT

1 A

1.5

V-OUT

1.25 A

forward

V-OUT

= 1 A

2.2

V-OUT

= 1.25 A

2.5

VP3-VP1

voltage drop during flyback of TDA4864AJ

reverse

V-OUT

1 A

1.5

V-OUT

1.25 A

forward

V-OUT

= 1 A

2.2

V-OUT

= 1.25 A

2.5

Vertical output stage; see Fig.5

V-OUT

vertical deflection output current

1.25

V-OUT(p-p)

vertical deflection output current
(peak-to-peak value)

2.5

o(sat)n

output saturation voltage to ground

V-OUT

= 1 A

1.4

1.7

V-OUT

= 1.25 A

1.8

2.3

o(sat)p

output saturation voltage to V

V-OUT

= 1 A

2.3

V-OUT

= 1.25 A

2.8

2.3

LIN

non-linearity of output signal

note 1

2003 Oct 31

Philips Semiconductors

Product specification

Vertical deflection booster

TDA4864J; TDA4864AJ

APPLICATION INFORMATION

handbook, full pagewidth

TDA4864J

1 k

220 k

BC548

BC556

3.3 k

1N4448

2.2

guard output
HIGH = error

vertical

output

signal

Fig.8 Application circuit with TDA4864J for external guard signal generation.

handbook, full pagewidth

TDA4864J

470

DIFFERENTIAL

INPUT

STAGE

VERTICAL

OUTPUT

REFERENCE

CIRCUIT

FLYBACK

GENERATOR

VP1

8 V

GND

1.8 k

(1 W)

deflection
coil

4.3

5.6

100

BYV27

from

deflection controller

50 V

THERMAL

PROTECTION

VFB

V-OUT

1.8 k

470

270

VP2

RS1

470

9 V

CS1

INN

INP

5.6

RS2

CS2

(1)

Fig.9 Application circuit with TDA4864J.

Attention: the heatsink of the IC must be isolated against ground of the application (it is connected to pin GND).

(1) With C

(typical value between 47 and 150 nF) the flyback time and the noise behaviour can be optimized.

2003 Oct 31

Philips Semiconductors

Product specification

Vertical deflection booster

TDA4864J; TDA4864AJ

handbook, full pagewidth

TDA4864AJ

470

DIFFERENTIAL

INPUT

STAGE

VERTICAL

OUTPUT

REFERENCE

CIRCUIT

FLYBACK

GENERATOR

VP1

12.5 V

GND

1.8 k

(1 W)

deflection
coil

3.9

(2 W)

5.6

100

BYV27

from

deflection controller

THERMAL

PROTECTION

VP3

V-OUT

1.8 k

100

270

VP2

RS1

470

12.5 V

CS1

INN

INP

5.6

RS2

CS2

(1)

(3)

(2)

240

(2 W)

Fig.10 Application circuit with TDA4864AJ.

Attention: the heatsink of the IC must be isolated against ground of the application (it is connected to pin GND).

(1) With C

(typical value between 47 and 150 nF) the flyback time and the noise behaviour can be optimized.

(2) With R5 capacitor C

will be charged during scan and the value (typical value between 150 and 270

) depends on I

defl

, t

flb

and C

(3) R6 reduces the power dissipation of the IC. The maximum possible value depends on the application.

2003 Oct 31

Philips Semiconductors

Product specification

Vertical deflection booster

TDA4864J; TDA4864AJ

Example for both TDA4864J and TDA4864AJ

Table 1

Values given from application

Note

1. For TDA4864J only.

Table 2

Calculated values

, V

and V

are referenced to ground of application;

voltages are calculated with +10% tolerances.

Calculation formulae for supply voltages:

o(sat)p

+ (R1 + R

deflcoil

)

defl(max)

+ U

= V

o(sat)n

+ (R1 + R

deflcoil

)

defl(max)

+ U'

where

= L

deflcoil

defl(max)

= vertical deflection frequency

= forward voltage drop across D1.

Calculation formulae for power consumption:

where

= power dissipation of the IC

tot

= total power dissipation

defl

= power dissipation of the deflection coil.

Calculation formulae for maximum required thermal
resistance for the heatsink at T

j(max)

= 110

Table 3

flb

as a function of V

for TDA4864J

Table 4

flb

as a function of V

and V

for TDA4864AJ

SYMBOL

VALUE

UNIT

defl(max)

0.71

deflcoil

270

1.8

(1)

amb

deflcoil

th(j-mb)

K/W

th(mb-amb)

K/W

SYMBOL

VALUE

UNIT

TDA4864J

TDA4864AJ

12.5

tot

3.2

4.4

defl

1.2

3.2

th(tot)

K/W

j(max)

105

flb

(

(V)

350

250

210

flb

(

(V)

(W)

R6 (

)

360

2.5

290

12.5

3.2

3.9

240

3.9

6.8

tot

defl

tot

(

)

defl(max)

--------------------

defl(max)

--------------------

(

)

0.01 A

0.2 W

defl

deflcoil

--------------------------------

defl(max)

th(mb-amb)

j(max)

amb

-----------------------------------

th(j-mb)

19 K/W (max.)

2003 Oct 31

Philips Semiconductors

Product specification

Vertical deflection booster

TDA4864J; TDA4864AJ

PACKAGE OUTLINE

REFERENCES

OUTLINE

VERSION

EUROPEAN

PROJECTION

ISSUE DATE

IEC

JEDEC

JEITA

DIMENSIONS (mm are the original dimensions)

Notes

1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.

2. Plastic surface within circle area D1 may protrude 0.04 mm maximum.

SOT524-1

10 mm

scale

non-concave

00-07-03
03-03-12

DBS7P: plastic DIL-bent-SIL power package; 7 leads (lead length 12/11 mm); exposed die pad

SOT524-1

view B: mounting base side

UNIT

(1)

2.7
2.3

(2)

0.80
0.65

0.58
0.48

13.2
12.8

(2)

6.2
5.8

3.5

2.54

1.27

5.08

4.85

(1)

14.7
14.3

(1)

2.92
2.37

11.4
10.0

6.7
5.5

4.5
3.7

3.4
3.1

1.15
0.85

17.5
16.3

2.8

0.8

3.8
3.6

3
2

12.4
11.0

0.02

0.3

2003 Oct 31

Philips Semiconductors

Product specification

Vertical deflection booster

TDA4864J; TDA4864AJ

SOLDERING

Introduction to soldering through-hole mount
packages

This text gives a brief insight to wave, dip and manual
soldering. A more in-depth account of soldering ICs can be
found in our

"Data Handbook IC26; Integrated Circuit

Packages" (document order number 9398 652 90011).

Wave soldering is the preferred method for mounting of
through-hole mount IC packages on a printed-circuit
board.

Soldering by dipping or by solder wave

Driven by legislation and environmental forces the
worldwide use of lead-free solder pastes is increasing.
Typical dwell time of the leads in the wave ranges from
3 to 4 seconds at 250

C or 265

C, depending on solder

material applied, SnPb or Pb-free respectively.

The total contact time of successive solder waves must not
exceed 5 seconds.

The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified maximum storage temperature (T

stg(max)

). If the

printed-circuit board has been pre-heated, forced cooling
may be necessary immediately after soldering to keep the
temperature within the permissible limit.

Manual soldering

Apply the soldering iron (24 V or less) to the lead(s) of the
package, either below the seating plane or not more than
2 mm above it. If the temperature of the soldering iron bit
is less than 300

C it may remain in contact for up to

10 seconds. If the bit temperature is between
300 and 400

C, contact may be up to 5 seconds.

Suitability of through-hole mount IC packages for dipping and wave soldering methods

Notes

1. For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit board.

2. For PMFP packages hot bar soldering or manual soldering is suitable.

PACKAGE

SOLDERING METHOD

DIPPING

WAVE

DBS, DIP, HDIP, RDBS, SDIP, SIL

suitable

(1)

PMFP

(2)

not suitable

2003 Oct 31

Philips Semiconductors

Product specification

Vertical deflection booster

TDA4864J; TDA4864AJ

DATA SHEET STATUS

Notes

1. Please consult the most recently issued data sheet before initiating or completing a design.

2. The product status of the device(s) described in this data sheet may have changed since this data sheet was

published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com.

3. For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status.

LEVEL

DATA SHEET

STATUS

(1)

PRODUCT

STATUS

(2)(3)

DEFINITION

Objective data

Development

This data sheet contains data from the objective specification for product
development. Philips Semiconductors reserves the right to change the
specification in any manner without notice.

Preliminary data Qualification

This data sheet contains data from the preliminary specification.
Supplementary data will be published at a later date. Philips
Semiconductors reserves the right to change the specification without
notice, in order to improve the design and supply the best possible
product.

III

Product data

Production

This data sheet contains data from the product specification. Philips
Semiconductors reserves the right to make changes at any time in order
to improve the design, manufacturing and supply. Relevant changes will
be communicated via a Customer Product/Process Change Notification
(CPCN).

DEFINITIONS

Short-form specification

The data in a short-form

specification is extracted from a full data sheet with the
same type number and title. For detailed information see
the relevant data sheet or data handbook.

Limiting values definition

Limiting values given are in

accordance with the Absolute Maximum Rating System
(IEC 60134). Stress above one or more of the limiting
values may cause permanent damage to the device.
These are stress ratings only and operation of the device
at these or at any other conditions above those given in the
Characteristics sections of the specification is not implied.
Exposure to limiting values for extended periods may
affect device reliability.

Application information

Applications that are

described herein for any of these products are for
illustrative purposes only. Philips Semiconductors make
no representation or warranty that such applications will be
suitable for the specified use without further testing or
modification.

DISCLAIMERS

Life support applications

These products are not

designed for use in life support appliances, devices, or
systems where malfunction of these products can
reasonably be expected to result in personal injury. Philips
Semiconductors customers using or selling these products
for use in such applications do so at their own risk and
agree to fully indemnify Philips Semiconductors for any
damages resulting from such application.

Right to make changes

Philips Semiconductors

reserves the right to make changes in the products -
including circuits, standard cells, and/or software -
described or contained herein in order to improve design
and/or performance. When the product is in full production
(status `Production'), relevant changes will be
communicated via a Customer Product/Process Change
Notification (CPCN). Philips Semiconductors assumes no
responsibility or liability for the use of any of these
products, conveys no licence or title under any patent,
copyright, or mask work right to these products, and
makes no representations or warranties that these
products are free from patent, copyright, or mask work
right infringement, unless otherwise specified.

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