Document Outline
- GENERAL DESCRIPTION
- QUICK REFERENCE DATA
- PACKAGE OUTLINE
- RATINGS
- THERMAL RESISTANCE
- CHARACTERISTICS
- PACKAGE OUTLINES
- SOLDERING
- DEFINITIONS
- LIFE SUPPORT APPLICATIONS
DATA SHEET
Product specification
File under Integrated Circuits, IC02
March 1986
INTEGRATED CIRCUITS
TDA6800
TDA6800T
Video modulator circuit
March 1986
2
Philips Semiconductors
Product specification
Video modulator circuit
TDA6800
TDA6800T
GENERAL DESCRIPTION
The TDA6800 is a modulator circuit for modulation of video signals on a VHF/UHF carrier. The circuit requires a 5 V
power supply and few external components for the negative modulation mode. For positive modulation an external clamp
circuit is required. This circuit can be used as a general purpose modulator without additional external components.
Features
Balanced modulator
Symmetrical oscillator
Video clamp circuit for negative modulation
Frequency range 50 to 800 MHz
QUICK REFERENCE DATA
PACKAGE OUTLINE
TDA6800 : 8-lead dual in-line; plastic (SOT97A); SOT 97-1; 1996 november 29.
TDA6800T: 8-lead mini-pack; plastic (SO8; SOT96A); SOT 96-1; 1996 november 29.
MIN.
TYP.
MAX.
Supply voltage range
V
5
-
4
4,5
-
5,5
V
Supply current consumption
I
5
-
9
-
mA
Video input voltage
V
8(p
-
p)
-
1
-
V
Input impedance
R
8
30
-
-
k
Output voltage (50 MHz)
V
6-7
-
13
-
mV
Output voltage (600 MHz)
V
6-7
-
10
-
mV
Differential gain
G
-
-
10
%
Differential phase
-
-
10
deg.
Intermodulation distortion
d
int
-
-
80
-
dB
March 1986
3
Philips Semiconductors
Product specification
Video modulator circuit
TDA6800
TDA6800T
RATINGS
Limiting values in accordance with the Absolute Maximum System (IEC 134)
THERMAL RESISTANCE
From junction to ambient in free air
Supply voltage
V
5
-
4
max.
7 V
Input voltage
V
8
-
4
max.
4 V
Output voltage
V
6, 7
-
4
max.
9 V
Storage temperature
T
stg
max.
125
C
Junction temperature
T
j
max.
125
C
Operating ambient temperature range
T
amb
-
25 to
+
85
C
TDA6800T
R
th j
-
a
260 K/W
TDA6800
R
th j
-
a
120 K/W
Fig.1 Block diagram TDA6800 and TDA6800T.
March 1986
4
Philips Semiconductors
Product specification
Video modulator circuit
TDA6800
TDA6800T
CHARACTERISTICS
V
P
= 5 V; T
amb
= 25
C; measured in Fig.1; unless otherwise specified
Notes
1. Input signal:
d.c. 0,45 V (V
8-4
= 1,85 V)
4,4 MHz; input voltage (p-p) = 0,6 V
5,5 MHz; input voltage (p-p) = 1,26 V
measured with respect to picture carrier, at f = 600 MHz.
2. Input signal:
d.c. 1 V (V
8-4
= 3,5 V)
5,5 MHz AM modulated, f
m
= 100 kHz
m = 0,8; input voltage (p-p) = 2,27 V (including modulation)
measured with respect to the picture carrier, at f = 600 MHz.
PARAMETER
SYMBOL
MIN.
TYP.
MAX.
UNIT
Supply voltage range
V
5-4
4,5
-
5,5
V
Supply current consumption
I
5
-
9
13
mA
Video input voltage
V
8(p-p)
-
1
-
V
Input impedance
R
8
30
-
-
k
Voltage (d.c.) at video
input (clamp voltage)
V
8
-
1,4
-
V
Voltage (d.c.) at
sound input
V
1
-
2,5
-
V
Output voltage f = 50 MHz; R
L
= 75
V
6-7
-
13
-
mV
Output voltage f = 600 MHz; R
L
= 75
V
6-7
-
10
-
mV
Differential gain
G
-
-
10
%
Differential phase
-
-
10
deg.
Intermodulation
(1,1 MHz) (note 1)
-
-
80
-
60
dB
Frequency shift
V
b
= 5%, f = 600 MHz
f
-
-
100
kHz
Frequency shift
V
b
= 5%, f = 800 MHz
f
-
tbf
-
kHz
Frequency drift
25 to 40
C
f
-
-
100
kHz
Frequency drift
15 to 55
C
f
-
-
300
kHz
Positive modulation
(see Fig.3)
Residual carrier voltage
V
r
-
-
2,5
%
Cross modulation (note 2)
-
0,1
0,25
%
March 1986
5
Philips Semiconductors
Product specification
Video modulator circuit
TDA6800
TDA6800T
Fig.2 Application for negative modulation.
* Close to output transformer.
Fig.3 Application for positive modulation.
* Close to output transformer
March 1986
6
Philips Semiconductors
Product specification
Video modulator circuit
TDA6800
TDA6800T
Fig.4 Application for general purpose modulation.
* Close to output transformer.
March 1986
7
Philips Semiconductors
Product specification
Video modulator circuit
TDA6800
TDA6800T
PACKAGE OUTLINES
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC
JEDEC
EIAJ
SOT97-1
92-11-17
95-02-04
UNIT
A
max.
1
2
b
1
(1)
(1)
(1)
b
2
c
D
E
e
M
Z
H
L
mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
A
min.
A
max.
b
max.
w
M
E
e
1
1.73
1.14
0.53
0.38
0.36
0.23
9.8
9.2
6.48
6.20
3.60
3.05
0.254
2.54
7.62
8.25
7.80
10.0
8.3
1.15
4.2
0.51
3.2
inches
0.068
0.045
0.021
0.015
0.014
0.009
1.07
0.89
0.042
0.035
0.39
0.36
0.26
0.24
0.14
0.12
0.01
0.10
0.30
0.32
0.31
0.39
0.33
0.045
0.17
0.020
0.13
b
2
050G01
MO-001AN
M
H
c
(e )
1
M
E
A
L
seating plane
A
1
w
M
b
1
e
D
A
2
Z
8
1
5
4
b
E
0
5
10 mm
scale
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
pin 1 index
DIP8: plastic dual in-line package; 8 leads (300 mil)
SOT97-1
March 1986
8
Philips Semiconductors
Product specification
Video modulator circuit
TDA6800
TDA6800T
UNIT
A
max.
A
1
A
2
A
3
b
p
c
D
(1)
E
(2)
(1)
e
H
E
L
L
p
Q
Z
y
w
v
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC
JEDEC
EIAJ
mm
inches
1.75
0.25
0.10
1.45
1.25
0.25
0.49
0.36
0.25
0.19
5.0
4.8
4.0
3.8
1.27
6.2
5.8
1.05
0.7
0.6
0.7
0.3
8
0
o
o
0.25
0.1
0.25
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
1.0
0.4
SOT96-1
X
w
M
A
A
1
A
2
b
p
D
H
E
L
p
Q
detail X
E
Z
e
c
L
v
M
A
(A )
3
A
4
5
pin 1 index
1
8
y
076E03S
MS-012AA
0.069
0.010
0.004
0.057
0.049
0.01
0.019
0.014
0.0100
0.0075
0.20
0.19
0.16
0.15
0.050
0.244
0.228
0.028
0.024
0.028
0.012
0.01
0.01
0.041
0.004
0.039
0.016
0
2.5
5 mm
scale
SO8: plastic small outline package; 8 leads; body width 3.9 mm
SOT96-1
95-02-04
97-05-22
March 1986
9
Philips Semiconductors
Product specification
Video modulator circuit
TDA6800
TDA6800T
SOLDERING
Introduction
There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our
"IC Package Databook" (order code 9398 652 90011).
DIP
S
OLDERING BY DIPPING OR BY WAVE
The maximum permissible temperature of the solder is
260
C; solder at this temperature must not be in contact
with the joint for more than 5 seconds. The total contact
time of successive solder waves must not exceed
5 seconds.
The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified maximum storage temperature (T
stg max
). If the
printed-circuit board has been pre-heated, forced cooling
may be necessary immediately after soldering to keep the
temperature within the permissible limit.
R
EPAIRING SOLDERED JOINTS
Apply a low voltage soldering iron (less than 24 V) to the
lead(s) of the package, below the seating plane or not
more than 2 mm above it. If the temperature of the
soldering iron bit is less than 300
C it may remain in
contact for up to 10 seconds. If the bit temperature is
between 300 and 400
C, contact may be up to 5 seconds.
SO
R
EFLOW SOLDERING
Reflow soldering techniques are suitable for all SO
packages.
Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.
Several techniques exist for reflowing; for example,
thermal conduction by heated belt. Dwell times vary
between 50 and 300 seconds depending on heating
method. Typical reflow temperatures range from
215 to 250
C.
Preheating is necessary to dry the paste and evaporate
the binding agent. Preheating duration: 45 minutes at
45
C.
W
AVE SOLDERING
Wave soldering techniques can be used for all SO
packages if the following conditions are observed:
A double-wave (a turbulent wave with high upward
pressure followed by a smooth laminar wave) soldering
technique should be used.
The longitudinal axis of the package footprint must be
parallel to the solder flow.
The package footprint must incorporate solder thieves at
the downstream end.
During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.
Maximum permissible solder temperature is 260
C, and
maximum duration of package immersion in solder is
10 seconds, if cooled to less than 150
C within
6 seconds. Typical dwell time is 4 seconds at 250
C.
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.
R
EPAIRING SOLDERED JOINTS
Fix the component by first soldering two diagonally-
opposite end leads. Use only a low voltage soldering iron
(less than 24 V) applied to the flat part of the lead. Contact
time must be limited to 10 seconds at up to 300
C. When
using a dedicated tool, all other leads can be soldered in
one operation within 2 to 5 seconds between
270 and 320
C.
March 1986
10
Philips Semiconductors
Product specification
Video modulator circuit
TDA6800
TDA6800T
DEFINITIONS
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
Data sheet status
Objective specification
This data sheet contains target or goal specifications for product development.
Preliminary specification
This data sheet contains preliminary data; supplementary data may be published later.
Product specification
This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
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