DATA SHEET
Product specification
File under Integrated Circuits, IC01
September 1986
INTEGRATED CIRCUITS
TDA7040T
Low voltage PLL stereo decoder
September 1986
2
Philips Semiconductors
Product specification
Low voltage PLL stereo decoder
TDA7040T
GENERAL DESCRIPTION
The TDA7040T is a monolithic integrated circuit for low cost FM stereo radios with an absolute minimum of peripheral
components and a simple lay-out.
Features
Built-in four pole low pass filter with a 70 kHz corner frequency suppressing unwanted out-of-band input signals
Fully integrated 228 kHz oscillator
Pilot presence detector and soft mono/stereo blend
Built-in interference suppression
External stereo lamp driver applicable
Adjustable gain.
QUICK REFERENCE DATA
PACKAGE OUTLINE
8-lead mini-pack; plastic (S08; SOT96A); SOT96-1; 1996 July 24.
PARAMETER
SYMBOL
MIN.
TYP.
MAX.
UNIT
Supply voltage (pin 4)
V
P
1,8
-
6
V
Supply current V
P
= 3 V
I
P
-
3
-
mA
Total harmonic distortion
THD
-
0,3
-
%
Signal to noise ratio
S/(S
+
N)
-
70
-
dB
Channel separation
-
40
-
dB
September 1986
3
Philips Semiconductors
Product specification
Low voltage PLL stereo decoder
TDA7040T
RATINGS
Limiting values in accordance with the Absolute Maximum System (IEC 134)
PARAMETER
SYMBOL
MIN.
TYP.
MAX.
UNIT
Supply voltage range
V
P
-
-
7
V
Operating ambient temperature
T
amb
-
10
-
+
70
C
Storage temperature range
T
stg
-
55
-
+
150
C
Fig.1 Block diagram.
September 1986
4
Philips Semiconductors
Product specification
Low voltage PLL stereo decoder
TDA7040T
CHARACTERISTICS
V
P
= 3 V; T
amb
= 25
C; test circuit Fig.2; unless otherwise specified
PARAMETER
SYMBOL
MIN.
TYP.
MAX.
UNIT
Supply voltage (pin 4)
V
P
1,8
3,0
6,0
V
Supply current
I
P
-
3
4
mA
Output voltage (r.m.s. value)
V
i(rms)
L and R 120 mV;
f = 1 kHz
V
5, 6-1
-
240
-
mV
Channel balance
V
i(rms)
L and R 40mV;
f = 1 kHz
G
v
-
0
1
dB
Output resistance
R
O
-
5
-
k
Total harmonic distortion
V
i(rms)
L and R 40 mV;
f = 1 kHz
THD
-
0,1
-
%
Total harmonic distortion
V
i(rms)
L and R 40 mV;
f = 1 kHz; V
p(rms)
= 12 mV
THD
-
0,3
-
%
Signal-to-noise ratio
V
i(rms)
= 120 mV; f = 1 kHz
S/(S
+
N)
-
70
-
dB
Signal-to-noise ratio
V
i(rms)
= 120 mV; f = 1 kHz
V
p(rms)
= 12 mV
S/(S
+
N)
-
70
-
dB
Channel separation
V
i(rms)
L and R 40 mV;
f = 1 kHz; V
p(rms)
= 12 mV
-
40
-
dB
Capture range
V
p(rms)
= 12 mV; deviation from
centre frequency
f
-
3
-
%
Carrier leak
V
i(rms)
L and R 120 mV;
V
p(rms)
= 12 mV; f = 1 kHz;
f = 19 kHz
-
30
-
dB
f = 38 kHz
-
50
-
dB
SCA (Subsidiary Communications
Authorization) rejection
V
i(rms)
L and R 120 mV;
V
p(rms)
= 12 mV; f = 1 kHz;
V
SCA(RMS)
= 12 mV; f = 67 kHz
67
-
70
-
dB
September 1986
5
Philips Semiconductors
Product specification
Low voltage PLL stereo decoder
TDA7040T
ACI (Adjacent channel interference)
V
i(rms)
L and R 120 mV;
V
p(rms)
= 12 mV; f = 1 kHz;
V
ACI(RMS)
= 1,3 mV; f = 114 kHz
114
-
90
-
dB
V
ACI(RMS)
= 1,3 mV; f = 190 kHz
119
-
85
-
dB
Traffic radio (V.W.F.) suppression
57(VWF)
-
75
-
dB
measured with: 91% stereo signal; f
m
= 1 kHz;
9% pilot signal; 5% traffic subcarrier
(f = 57 kHz, f
m
= 23 Hz AM, m = 60%)
PARAMETER
SYMBOL
MIN.
TYP.
MAX.
UNIT
57 VWF
(
)
V
o signal
(
)
at 1 kHz
(
)
V
o spurious
(
)
at 1 kHz
(
23 Hz
)
-------------------------------------------------------------------------------------
=
Fig.2 Test circuit.
September 1986
6
Philips Semiconductors
Product specification
Low voltage PLL stereo decoder
TDA7040T
Fig.3 Application diagram in combination with TDA7021T and TDA7050T.
September 1986
7
Philips Semiconductors
Product specification
Low voltage PLL stereo decoder
TDA7040T
CHARACTERISTICS
Of the combination TDA7021T, TDA7040T and TDA7050T (Fig.3).
Conditions unless otherwise specified: V
vhf(rms)
= 1 mV; f
hf
= 97 MHz; f
dev
= 22,5 kHz; f
dev pilot
= 6,75 kHz; noise
measured unweighted in a range from 400 Hz to 15 kHz.
PARAMETER
SYMBOL
MIN.
TYP.
MAX.
UNIT
Total harmonic distortion (pilot on)
V
i
= (L
+
R) signal; f
mod
= 1 kHz
THD
-
0,5
-
%
V
i
= L signal; f
mod
= 1 kHz
THD
-
1,0
-
%
Signal to noise ratio
V
i
= (L
+
R) signal; f
mod
= 1 kHz
pilot off
S/(S
+
N)
-
56
-
dB
pilot on
S/(S
+
N)
-
50
-
dB
Channel separation
V
i
= L-signal, f
mod
= 1 kHz; pilot on;
-
26
-
dB
f
RF
= 97 MHz
V
i
= L-signal, f
mod
= 1 kHz; pilot on;
f
RF
= 87,5 MHz and 108 MHz
-
14
-
dB
Output voltage (pilot off)
V
i
= (L
+
R) signal, f
mod
= 1 kHz
V
o(rms)
-
80
-
mV
Fig.4 Channel separation as a function of audio frequency.
a = measured in test circuit (Fig.2)
b = measured in application diagram (Fig.3)
September 1986
8
Philips Semiconductors
Product specification
Low voltage PLL stereo decoder
TDA7040T
Fig.5
Signal/noise and channel separation behaviour in Fig.3. at R1 = 270 k
and R2 = 13 k
;
without diode BAW62.
Fig.6
Signal/noise and channel separation behaviour in Fig.3.
at R1 = 200 k
, R2 = 30 k
; with diode BAW62.
September 1986
9
Philips Semiconductors
Product specification
Low voltage PLL stereo decoder
TDA7040T
PACKAGE OUTLINE
UNIT
A
max.
A
1
A
2
A
3
b
p
c
D
(1)
E
(2)
(1)
e
H
E
L
L
p
Q
Z
y
w
v
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC
JEDEC
EIAJ
mm
inches
1.75
0.25
0.10
1.45
1.25
0.25
0.49
0.36
0.25
0.19
5.0
4.8
4.0
3.8
1.27
6.2
5.8
1.05
0.7
0.6
0.7
0.3
8
0
o
o
0.25
0.1
0.25
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
1.0
0.4
SOT96-1
X
w
M
A
A
1
A
2
b
p
D
H
E
L
p
Q
detail X
E
Z
e
c
L
v
M
A
(A )
3
A
4
5
pin 1 index
1
8
y
076E03S
MS-012AA
0.069
0.010
0.004
0.057
0.049
0.01
0.019
0.014
0.0100
0.0075
0.20
0.19
0.16
0.15
0.050
0.244
0.228
0.028
0.024
0.028
0.012
0.01
0.01
0.041
0.004
0.039
0.016
0
2.5
5 mm
scale
SO8: plastic small outline package; 8 leads; body width 3.9 mm
SOT96-1
95-02-04
97-05-22
September 1986
10
Philips Semiconductors
Product specification
Low voltage PLL stereo decoder
TDA7040T
SOLDERING
Introduction
There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our
"IC Package Databook" (order code 9398 652 90011).
Reflow soldering
Reflow soldering techniques are suitable for all SO
packages.
Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.
Several techniques exist for reflowing; for example,
thermal conduction by heated belt. Dwell times vary
between 50 and 300 seconds depending on heating
method. Typical reflow temperatures range from
215 to 250
C.
Preheating is necessary to dry the paste and evaporate
the binding agent. Preheating duration: 45 minutes at
45
C.
Wave soldering
Wave soldering techniques can be used for all SO
packages if the following conditions are observed:
A double-wave (a turbulent wave with high upward
pressure followed by a smooth laminar wave) soldering
technique should be used.
The longitudinal axis of the package footprint must be
parallel to the solder flow.
The package footprint must incorporate solder thieves at
the downstream end.
During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.
Maximum permissible solder temperature is 260
C, and
maximum duration of package immersion in solder is
10 seconds, if cooled to less than 150
C within
6 seconds. Typical dwell time is 4 seconds at 250
C.
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.
Repairing soldered joints
Fix the component by first soldering two diagonally-
opposite end leads. Use only a low voltage soldering iron
(less than 24 V) applied to the flat part of the lead. Contact
time must be limited to 10 seconds at up to 300
C. When
using a dedicated tool, all other leads can be soldered in
one operation within 2 to 5 seconds between
270 and 320
C.
September 1986
11
Philips Semiconductors
Product specification
Low voltage PLL stereo decoder
TDA7040T
DEFINITIONS
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
Data sheet status
Objective specification
This data sheet contains target or goal specifications for product development.
Preliminary specification
This data sheet contains preliminary data; supplementary data may be published later.
Product specification
This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
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