DATA SHEET
Product specification
Supersedes data of 1966 May 28
File under Integrated Circuits, IC01
1997 Aug 15
INTEGRATED CIRCUITS
TDA7052B
Mono BTL audio amplifier with DC
volume control
1997 Aug 15
2
Philips Semiconductors
Product specification
Mono BTL audio amplifier with DC volume
control
TDA7052B
FEATURES
DC volume control
Few external components
Mute mode
Thermal protection
Short-circuit proof
No switch-on and switch-off clicks
Good overall stability
Low power consumption
Low HF radiation
ESD protected on all pins.
GENERAL DESCRIPTION
The TDA7052B and TDA7052BT are 1 W and 0.5 W mono
Bridge-Tied Load (BTL) output amplifiers with DC volume
control.
They have been designed for use in TV and monitors, but
are also suitable for use in battery-fed portable recorders
and radios.
A Missing Current Limiter (MCL) is built in. The MCL circuit
is activated when the difference in current between the
output terminal of each amplifier exceeds 100 mA
(300 mA typ.). This level of 100 mA allows for headphone
applications (single-ended).
QUICK REFERENCE DATA
ORDERING INFORMATION
SYMBOL
PARAMETERS
CONDITIONS
MIN.
TYP.
MAX.
UNIT
V
P
supply voltage
4.5
-
18
V
P
O
output power
V
P
= 6 V
TDA7052B
R
L
= 8
0.9
1.0
-
W
TDA7052BT
R
L
= 16
0.5
0.55
-
W
G
v(max)
maximum total voltage gain
39.5
40.5
41.5
dB
gain control
68
73.5
-
dB
I
q(tot)
total quiescent current
V
P
= 6 V; R
L
=
-
9.2
13
mA
THD
total harmonic distortion
TDA7052B
P
O
= 0.5 W
-
0.3
1
%
TDA7052BT
P
O
= 0.25 W
-
0.3
1
%
TYPE
NUMBER
PACKAGE
NAME
DESCRIPTION
VERSION
TDA7052B
DIP8
plastic dual in-line package; 8 leads (300 mil)
SOT97-1
TDA7052BT
SO8
plastic small outline package; 8 leads; body width 3.9 mm
SOT96-1
1997 Aug 15
3
Philips Semiconductors
Product specification
Mono BTL audio amplifier with DC volume
control
TDA7052B
BLOCK DIAGRAM
Fig.1 Block diagram.
handbook, full pagewidth
input
6
MSA705 - 1
1
2
TDA7052B
TDA7052BT
VP
4
5
I + i
8
I i
TEMPERATURE
PROTECTION
3
signal
ground
DC volume control
7
n.c.
positive output
negative output
power
ground
V
ref
STABILIZER
PINNING
SYMBOL
PIN
DESCRIPTION
V
P
1
supply voltage
IN+
2
input
GND1
3
signal ground
VC
4
DC volume control
OUT+
5
positive output
GND2
6
power ground
n.c.
7
not connected
OUT
-
8
negative output
Fig.2 Pin configuration.
handbook, halfpage
1
2
3
4
8
7
6
5
MSA704 - 1
VP
OUT
GND2
OUT
GND1
IN
VC
n.c.
TDA7052B
TDA7052BT
1997 Aug 15
4
Philips Semiconductors
Product specification
Mono BTL audio amplifier with DC volume
control
TDA7052B
FUNCTIONAL DESCRIPTION
The TDA7052B and TDA7052BT are mono BTL output
amplifiers with DC volume control which have been
designed for use in TV and monitors but are also suitable
for use in battery-fed portable recorders and radios.
In conventional DC volume circuits the control or input
stage is AC coupled to the output stage via external
capacitors to keep the offset voltage low. In the TDA7052B
and TDA7052BT the DC volume control stage is
integrated into the input stage so that no coupling
capacitors are required. With this configuration, a low
offset voltage is maintained and the minimum supply
voltage remains low.
The BTL principle offers the following advantages:
Lower peak value of the supply current
The frequency of the ripple on the supply voltage is twice
the signal frequency.
Consequently, a reduced power supply with smaller
capacitors can be used which results in cost reductions.
For portable applications there is a trend to decrease the
supply voltage, resulting in a reduction of output power at
conventional output stages. Using the BTL principle
increases the output power.
The maximum gain of the amplifier is fixed at 40.5 dB.
The DC volume control stage has a logarithmic control
characteristic. Therefore, the total gain can be controlled
from 40.5 dB to
-
33 dB. If the DC volume control voltage
falls below 0.4 V, the device will switch to the mute mode.
The amplifier is short-circuit proof to ground, V
P
and
across the load. Also a thermal protection circuit is
implemented. If the crystal temperature rises above
+150
C the gain will be reduced, thereby reducing the
output power. Special attention is given to switch-on and
switch-off clicks, low HF radiation and a good overall
stability.
Power dissipation
Assume for the TDA7052B that V
P
= 6 V; R
L
= 8
.
The maximum sine wave dissipation is 0.9 W.
The R
th j-a
of the package is 100 K/W.
Therefore T
amb(max)
= 150
-
100
0.9 = 60
C.
Assume for the TDA7052BT that V
P
= 6 V; R
L
= 16
.
The maximum sine wave dissipation is 0.46 W.
The R
th j-a
of the package is 155 K/W.
Therefore T
amb(max)
= 150
-
155
0.46 = 78
C.
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
THERMAL CHARACTERISTICS
SYMBOL
PARAMETER
CONDITIONS
MIN.
MAX.
UNIT
V
P
supply voltage
-
18
V
V
2, 4
input voltage pins 2 and 4
-
5
V
I
ORM
repetitive peak output current
-
1.25
A
I
OSM
non-repetitive peak output current
-
1.5
A
P
tot
total power dissipation
T
amb
25
C
TDA7052B
-
1.25
W
TDA7052BT
-
0.8
W
T
amb
operating ambient temperature
-
40
+85
C
T
stg
storage temperature
-
55
+150
C
T
vj
virtual junction temperature
-
+150
C
T
sc
short-circuit time
-
1
h
SYMBOL
PARAMETER
VALUE
UNIT
R
th j-a
thermal resistance from junction to ambient in free air
TDA7052B
100
K/W
TDA7052BT
155
K/W
1997 Aug 15
5
Philips Semiconductors
Product specification
Mono BTL audio amplifier with DC volume
control
TDA7052B
CHARACTERISTICS
V
P
= 6 V; V
DC
= 1.4 V; f = 1 kHz; R
L
= 8
; T
amb
= 25
C; unless otherwise specified (see Fig.13).
Notes
1. With a load connected to the outputs the quiescent current will increase, the maximum value of this increase being
equal to the DC output offset voltage divided by R
L
.
2. The noise output voltage (RMS value) at f = 500 kHz is measured with R
S
= 0
and B = 5 kHz.
3. The ripple rejection is measured with R
S
= 0
and f = 100 Hz to 10 kHz. The ripple voltage V
R
of 200 mV
(RMS value) is applied to the positive supply rail.
4. The noise output voltage (RMS value) is measured with R
S
= 5 k
unweighted.
5. The DC volume control can be configured in several ways. Two possible circuits are shown in Figs 14 and 15.
The circuits at the volume control pin will influence the switch-on and switch-off behaviour and the maximum voltage
gain.
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
Supply
V
P
supply voltage
4.5
-
18
V
I
q(tot)
total quiescent current
note 1; R
L
=
-
9.2
13
mA
Maximum gain (V
4
= 1.4 V)
P
O
output power
THD = 10%
TDA7052B
0.9
1.0
-
W
TDA7052BT
0.5
0.55
-
W
THD
total harmonic distortion
TDA7052B
P
O
= 0.5 W
-
0.3
1
%
TDA7052BT
P
O
= 0.25 W
-
0.3
1
%
G
v(max)
maximum total voltage gain
39.5
40.5
41.5
dB
V
I
input signal handling (RMS value) G
v(max)
= 0 dB; THD
<
1%
1.0
-
-
V
V
no
noise output voltage (RMS value)
note 2; f = 500 kHz
-
210
-
V
B
bandwidth
at
-
1 dB
-
0.02 to 300
-
kHz
SVRR
supply voltage ripple rejection
note 3
48
60
-
dB
V
O
DC output offset voltage
V
8
-
V
5
-
0
200
mV
Z
I
input impedance (pin 3)
15
20
25
k
Mute position
V
O
output voltage in mute position
note 4; V
4
0.4 V;
V
I
= 1.0 V
-
-
30
V
DC volume control; note 5
gain control
68
73.5
-
dB
I
4
control current
V
4
= 0 V
-
20
-
25
-
30
A
1997 Aug 15
6
Philips Semiconductors
Product specification
Mono BTL audio amplifier with DC volume
control
TDA7052B
Fig.3
Gain control as a function of DC volume
control.
handbook, halfpage
0
2.0
40
-
80
-
120
0
MBH372
0.4
0.8
1.2
1.6
-
40
Gv
(dB)
V (V)
DC
Fig.4
Noise output voltage as a function of DC
volume control.
Measured with R
S
= 5 k
unweighted.
Frequency range is 22 Hz to 22 kHz.
handbook, halfpage
2.0
VDC (V)
0
MBH373
1
10
-
1
10
-
2
0.4
Vno
(mV)
0.8
1.2
1.6
Fig.5
Control current as a function of DC volume
control.
handbook, halfpage
0
2.0
25
-
15
-
25
15
MBH376
0.4
0.8
1.2
1.6
-
5
VDC (V)
5
IDC
(
A)
Fig.6 Quiescent current versus supply voltage.
Measured with R
L
=
.
handbook, halfpage
0
20
15
5
MBH367
10
20
4
IP
(mA)
8
12
16
VP (V)
1997 Aug 15
7
Philips Semiconductors
Product specification
Mono BTL audio amplifier with DC volume
control
TDA7052B
Fig.7
Total harmonic distortion versus output
power.
(1) V
P
= 5 V; R
L
= 8
.
(2) V
P
= 6 V; R
L
= 8
.
(3) V
P
= 12 V; R
L
= 25
.
handbook, halfpage
10
6
4
2
0
MBH368
10
-
1
1
PO (W)
THD
(%)
10
8
(1)
(2)
(3)
Fig.8 Total harmonic distortion versus frequency.
P
O
= 0.1 W.
(1) G
v(max)
= 40 dB.
(2) G
v(max)
= 30 dB.
handbook, halfpage
0
MBH369
10
2
4
6
8
10
-
2
10
2
10
-
1
1
10
f (kHz)
THD
(%)
(1)
(2)
Fig.9 Output power versus supply voltage.
Measured at a THD of 10%. The maximum output power is limited by
the maximum power dissipation and the maximum available output
current.
(1) R
L
= 8
.
(2) R
L
= 16
.
(3) R
L
= 25
.
handbook, halfpage
0
20
2.5
0
0.5
MBH370
1.0
1.5
2.0
4
PO
(W)
8
12
16
VP (V)
(1)
(2)
(3)
Fig.10 Total worst case power dissipation versus
supply voltage.
(1) R
L
= 8
.
(2) R
L
= 16
.
(3) R
L
= 25
.
handbook, halfpage
0
20
2.5
0
0.5
MBH371
1.0
1.5
2.0
4
Pd
(W)
8
12
16
VP (V)
(1)
(2)
(3)
1997 Aug 15
8
Philips Semiconductors
Product specification
Mono BTL audio amplifier with DC volume
control
TDA7052B
Fig.11 Supply voltage ripple rejection versus
frequency.
Measured with V
R
= 0.2 V.
(1) V
DC
= 1.4 V.
(2) V
DC
= 0.4 V.
handbook, halfpage
-
70
-
60
-
50
-
40
-
30
-
20
MBH374
10
-
2
10
-
1
1
10
10
2
f (kHz)
SVRR
(dB)
(1)
(2)
Fig.12 Input signal handling.
Measured at a THD of 1% and a voltage gain of 0 dB.
handbook, halfpage
0
20
2.0
0
0.4
MBH375
0.8
1.2
1.6
4
VI
(V)
8
12
16
VP (V)
QUALITY SPECIFICATION
In accordance with
"SNW-FQ-611E", if this type is used as an audio amplifier.
1997 Aug 15
9
Philips Semiconductors
Product specification
Mono BTL audio amplifier with DC volume
control
TDA7052B
TEST AND APPLICATION INFORMATION
For single-end application the output peak current may not exceed 100 mA; at higher output currents the short circuit
protection (MCL) will be activated.
Fig.13 Test and application diagram.
To avoid instabilities and too high distortion, the input- and power ground must be separated as long as possible and connected together as close as
possible to the IC.
(1) This capacitor can be omitted if the 220
F electrolytic capacitor is connected close to pin 1.
handbook, full pagewidth
input
0.47
F
6
MSA706 - 2
100 nF
220
F
1
2
TDA7052B
TDA7052BT
VP = 6 V
(1)
4
5 k
RS
5
8
+
-
STABILIZER
TEMPERATURE
PROTECTION
3
ground
DC
volume
control
RL = 8
7
n.c.
I + i
I i
1997 Aug 15
10
Philips Semiconductors
Product specification
Mono BTL audio amplifier with DC volume
control
TDA7052B
Fig.14 Application with potentiometer as volume
control; maximum gain = 34 dB.
handbook, halfpage
MCD387
4
volume
control
1 M
1
F
Fig.15 Application with potentiometer as volume
control; maximum gain = 40 dB.
handbook, halfpage
MBH360
4
volume
control
VP = 6 V
22 k
56 k
1
F
1997 Aug 15
11
Philips Semiconductors
Product specification
Mono BTL audio amplifier with DC volume
control
TDA7052B
PACKAGE OUTLINES
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC
JEDEC
EIAJ
SOT97-1
92-11-17
95-02-04
UNIT
A
max.
1
2
b
1
(1)
(1)
(1)
b
2
c
D
E
e
M
Z
H
L
mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
A
min.
A
max.
b
max.
w
M
E
e
1
1.73
1.14
0.53
0.38
0.36
0.23
9.8
9.2
6.48
6.20
3.60
3.05
0.254
2.54
7.62
8.25
7.80
10.0
8.3
1.15
4.2
0.51
3.2
inches
0.068
0.045
0.021
0.015
0.014
0.009
1.07
0.89
0.042
0.035
0.39
0.36
0.26
0.24
0.14
0.12
0.01
0.10
0.30
0.32
0.31
0.39
0.33
0.045
0.17
0.020
0.13
b
2
050G01
MO-001AN
M
H
c
(e )
1
M
E
A
L
seating plane
A
1
w
M
b
1
e
D
A
2
Z
8
1
5
4
b
E
0
5
10 mm
scale
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
pin 1 index
DIP8: plastic dual in-line package; 8 leads (300 mil)
SOT97-1
1997 Aug 15
12
Philips Semiconductors
Product specification
Mono BTL audio amplifier with DC volume
control
TDA7052B
UNIT
A
max.
A
1
A
2
A
3
b
p
c
D
(1)
E
(2)
(1)
e
H
E
L
L
p
Q
Z
y
w
v
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC
JEDEC
EIAJ
mm
inches
1.75
0.25
0.10
1.45
1.25
0.25
0.49
0.36
0.25
0.19
5.0
4.8
4.0
3.8
1.27
6.2
5.8
1.05
0.7
0.6
0.7
0.3
8
0
o
o
0.25
0.1
0.25
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
1.0
0.4
SOT96-1
X
w
M
A
A
1
A
2
b
p
D
H
E
L
p
Q
detail X
E
Z
e
c
L
v
M
A
(A )
3
A
4
5
pin 1 index
1
8
y
076E03S
MS-012AA
0.069
0.010
0.004
0.057
0.049
0.01
0.019
0.014
0.0100
0.0075
0.20
0.19
0.16
0.15
0.050
0.244
0.228
0.028
0.024
0.028
0.012
0.01
0.01
0.041
0.004
0.039
0.016
0
2.5
5 mm
scale
SO8: plastic small outline package; 8 leads; body width 3.9 mm
SOT96-1
95-02-04
97-05-22
1997 Aug 15
13
Philips Semiconductors
Product specification
Mono BTL audio amplifier with DC volume
control
TDA7052B
SOLDERING
Introduction
There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our
"IC Package Databook" (order code 9398 652 90011).
DIP
S
OLDERING BY DIPPING OR BY WAVE
The maximum permissible temperature of the solder is
260
C; solder at this temperature must not be in contact
with the joint for more than 5 seconds. The total contact
time of successive solder waves must not exceed
5 seconds.
The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified maximum storage temperature (T
stg max
). If the
printed-circuit board has been pre-heated, forced cooling
may be necessary immediately after soldering to keep the
temperature within the permissible limit.
R
EPAIRING SOLDERED JOINTS
Apply a low voltage soldering iron (less than 24 V) to the
lead(s) of the package, below the seating plane or not
more than 2 mm above it. If the temperature of the
soldering iron bit is less than 300
C it may remain in
contact for up to 10 seconds. If the bit temperature is
between 300 and 400
C, contact may be up to 5 seconds.
SO
R
EFLOW SOLDERING
Reflow soldering techniques are suitable for all SO
packages.
Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.
Several techniques exist for reflowing; for example,
thermal conduction by heated belt. Dwell times vary
between 50 and 300 seconds depending on heating
method. Typical reflow temperatures range from
215 to 250
C.
Preheating is necessary to dry the paste and evaporate
the binding agent. Preheating duration: 45 minutes at
45
C.
W
AVE SOLDERING
Wave soldering techniques can be used for all SO
packages if the following conditions are observed:
A double-wave (a turbulent wave with high upward
pressure followed by a smooth laminar wave) soldering
technique should be used.
The longitudinal axis of the package footprint must be
parallel to the solder flow.
The package footprint must incorporate solder thieves at
the downstream end.
During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.
Maximum permissible solder temperature is 260
C, and
maximum duration of package immersion in solder is
10 seconds, if cooled to less than 150
C within
6 seconds. Typical dwell time is 4 seconds at 250
C.
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.
R
EPAIRING SOLDERED JOINTS
Fix the component by first soldering two diagonally-
opposite end leads. Use only a low voltage soldering iron
(less than 24 V) applied to the flat part of the lead. Contact
time must be limited to 10 seconds at up to 300
C. When
using a dedicated tool, all other leads can be soldered in
one operation within 2 to 5 seconds between
270 and 320
C.
1997 Aug 15
14
Philips Semiconductors
Product specification
Mono BTL audio amplifier with DC volume
control
TDA7052B
DEFINITIONS
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
Data sheet status
Objective specification
This data sheet contains target or goal specifications for product development.
Preliminary specification
This data sheet contains preliminary data; supplementary data may be published later.
Product specification
This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
1997 Aug 15
15
Philips Semiconductors
Product specification
Mono BTL audio amplifier with DC volume
control
TDA7052B
NOTES
Internet: http://www.semiconductors.philips.com
Philips Semiconductors a worldwide company
Philips Electronics N.V. 1997
SCA55
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
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Portugal: see Spain
Romania: see Italy
Russia: Philips Russia, Ul. Usatcheva 35A, 119048 MOSCOW,
Tel. +7 095 755 6918, Fax. +7 095 755 6919
Singapore: Lorong 1, Toa Payoh, SINGAPORE 1231,
Tel. +65 350 2538, Fax. +65 251 6500
Slovakia: see Austria
Slovenia: see Italy
South Africa: S.A. PHILIPS Pty Ltd., 195-215 Main Road Martindale,
2092 JOHANNESBURG, P.O. Box 7430 Johannesburg 2000,
Tel. +27 11 470 5911, Fax. +27 11 470 5494
South America: Rua do Rocio 220, 5th floor, Suite 51,
04552-903 So Paulo, SO PAULO - SP, Brazil,
Tel. +55 11 821 2333, Fax. +55 11 829 1849
Spain: Balmes 22, 08007 BARCELONA,
Tel. +34 3 301 6312, Fax. +34 3 301 4107
Sweden: Kottbygatan 7, Akalla, S-16485 STOCKHOLM,
Tel. +46 8 632 2000, Fax. +46 8 632 2745
Switzerland: Allmendstrasse 140, CH-8027 ZRICH,
Tel. +41 1 488 2686, Fax. +41 1 481 7730
Taiwan: Philips Semiconductors, 6F, No. 96, Chien Kuo N. Rd., Sec. 1,
TAIPEI, Taiwan Tel. +886 2 2134 2865, Fax. +886 2 2134 2874
Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd.,
209/2 Sanpavuth-Bangna Road Prakanong, BANGKOK 10260,
Tel. +66 2 745 4090, Fax. +66 2 398 0793
Turkey: Talatpasa Cad. No. 5, 80640 GLTEPE/ISTANBUL,
Tel. +90 212 279 2770, Fax. +90 212 282 6707
Ukraine: PHILIPS UKRAINE, 4 Patrice Lumumba str., Building B, Floor 7,
252042 KIEV, Tel. +380 44 264 2776, Fax. +380 44 268 0461
United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes,
MIDDLESEX UB3 5BX, Tel. +44 181 730 5000, Fax. +44 181 754 8421
United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409,
Tel. +1 800 234 7381
Uruguay: see South America
Vietnam: see Singapore
Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD,
Tel. +381 11 625 344, Fax.+381 11 635 777
For all other countries apply to: Philips Semiconductors, Marketing & Sales Communications,
Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825
Argentina: see South America
Australia: 34 Waterloo Road, NORTH RYDE, NSW 2113,
Tel. +61 2 9805 4455, Fax. +61 2 9805 4466
Austria: Computerstr. 6, A-1101 WIEN, P.O. Box 213, Tel. +43 160 1010,
Fax. +43 160 101 1210
Belarus: Hotel Minsk Business Center, Bld. 3, r. 1211, Volodarski Str. 6,
220050 MINSK, Tel. +375 172 200 733, Fax. +375 172 200 773
Belgium: see The Netherlands
Brazil: see South America
Bulgaria: Philips Bulgaria Ltd., Energoproject, 15th floor,
51 James Bourchier Blvd., 1407 SOFIA,
Tel. +359 2 689 211, Fax. +359 2 689 102
Canada: PHILIPS SEMICONDUCTORS/COMPONENTS,
Tel. +1 800 234 7381
China/Hong Kong: 501 Hong Kong Industrial Technology Centre,
72 Tat Chee Avenue, Kowloon Tong, HONG KONG,
Tel. +852 2319 7888, Fax. +852 2319 7700
Colombia: see South America
Czech Republic: see Austria
Denmark: Prags Boulevard 80, PB 1919, DK-2300 COPENHAGEN S,
Tel. +45 32 88 2636, Fax. +45 31 57 0044
Finland: Sinikalliontie 3, FIN-02630 ESPOO,
Tel. +358 9 615800, Fax. +358 9 61580920
France: 4 Rue du Port-aux-Vins, BP317, 92156 SURESNES Cedex,
Tel. +33 1 40 99 6161, Fax. +33 1 40 99 6427
Germany: Hammerbrookstrae 69, D-20097 HAMBURG,
Tel. +49 40 23 53 60, Fax. +49 40 23 536 300
Greece: No. 15, 25th March Street, GR 17778 TAVROS/ATHENS,
Tel. +30 1 4894 339/239, Fax. +30 1 4814 240
Hungary: see Austria
India: Philips INDIA Ltd, Band Box Building, 2nd floor,
254-D, Dr. Annie Besant Road, Worli, MUMBAI 400 025,
Tel. +91 22 493 8541, Fax. +91 22 493 0966
Indonesia: see Singapore
Ireland: Newstead, Clonskeagh, DUBLIN 14,
Tel. +353 1 7640 000, Fax. +353 1 7640 200
Israel: RAPAC Electronics, 7 Kehilat Saloniki St, PO Box 18053,
TEL AVIV 61180, Tel. +972 3 645 0444, Fax. +972 3 649 1007
Italy: PHILIPS SEMICONDUCTORS, Piazza IV Novembre 3,
20124 MILANO, Tel. +39 2 6752 2531, Fax. +39 2 6752 2557
Japan: Philips Bldg 13-37, Kohnan 2-chome, Minato-ku, TOKYO 108,
Tel. +81 3 3740 5130, Fax. +81 3 3740 5077
Korea: Philips House, 260-199 Itaewon-dong, Yongsan-ku, SEOUL,
Tel. +82 2 709 1412, Fax. +82 2 709 1415
Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA, SELANGOR,
Tel. +60 3 750 5214, Fax. +60 3 757 4880
Mexico: 5900 Gateway East, Suite 200, EL PASO, TEXAS 79905,
Tel. +9-5 800 234 7381
Middle East: see Italy
Printed in The Netherlands
547027/1200/03/pp16
Date of release: 1997 Aug 15
Document order number:
9397 750 02729
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