1997 Aug 15
4
Philips Semiconductors
Product specification
5 W mono BTL audio amplifier with DC
volume control
TDA7056B
FUNCTIONAL DESCRIPTION
The TDA7056B is a mono BTL output amplifier with DC
volume control, designed for use in TV and monitor but is
also suitable for battery-fed portable recorders and radios.
In conventional DC volume circuits the control or input
stage is AC coupled to the output stage via external
capacitors to keep the offset voltage low. In the TDA7056B
the DC volume control stage is integrated into the input
stage so that no coupling capacitors are required. With this
configuration, a low offset voltage is still maintained and
the minimum supply voltage remains low.
The BTL principle offers the following advantages:
Lower peak value of the supply current
The frequency of the ripple on the supply voltage is twice
the signal frequency.
Consequently, a reduced power supply with smaller
capacitors can be used which results in cost reductions.
For portable applications there is a trend to decrease the
supply voltage, resulting in a reduction of output power at
conventional output stages. Using the BTL principle
increases the output power.
The maximum gain of the amplifier is fixed at 40.5 dB.
The DC volume control stage has a logarithmic control
characteristic. Therefore, the total gain can be controlled
from 40.5 dB to
-
33 dB. If the DC volume control voltage
falls below 0.4 V, the device will switch to the mute mode.
The amplifier is short-circuit proof to ground, V
P
and
across the load. Also a thermal protection circuit is
implemented. If the crystal temperature rises above
+150
C the gain will be reduced, thereby reducing the
output power. Special attention is given to switch-on and
switch-off clicks, low HF radiation and a good overall
stability.
Power dissipation
Assume V
P
= 12 V; R
L
= 16
.
The maximum sine wave dissipation is = 1.8 W.
The R
th vj-a
of the package is 55 K/W.
Therefore T
amb (max)
= 150
-
55
1.8 = 51
C.
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
THERMAL CHARACTERISTICS
SYMBOL
PARAMETER
CONDITIONS
MIN.
MAX.
UNIT
V
P
supply voltage
-
18
V
V
3, 5
input voltage pins 3 and 5
-
5
V
I
ORM
repetitive peak output current
-
1.25
A
I
OSM
non-repetitive peak output current
-
1.5
A
P
tot
total power dissipation
T
case
<
60
C
-
9
W
T
amb
operating ambient temperature
-
40
+85
C
T
stg
storage temperature
-
55
+150
C
T
vj
virtual junction temperature
-
+150
C
T
sc
short-circuit time
-
1
h
SYMBOL
PARAMETER
VALUE
UNIT
R
th j-a
thermal resistance from junction to ambient in free air
55
K/W
R
th j-c
thermal resistance from junction to case
10
K/W
1997 Aug 15
12
Philips Semiconductors
Product specification
5 W mono BTL audio amplifier with DC
volume control
TDA7056B
SOLDERING
Introduction
There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our
"IC Package Databook" (order code 9398 652 90011).
Soldering by dipping or by wave
The maximum permissible temperature of the solder is
260
C; solder at this temperature must not be in contact
with the joint for more than 5 seconds. The total contact
time of successive solder waves must not exceed
5 seconds.
The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified maximum storage temperature (T
stg max
). If the
printed-circuit board has been pre-heated, forced cooling
may be necessary immediately after soldering to keep the
temperature within the permissible limit.
Repairing soldered joints
Apply a low voltage soldering iron (less than 24 V) to the
lead(s) of the package, below the seating plane or not
more than 2 mm above it. If the temperature of the
soldering iron bit is less than 300
C it may remain in
contact for up to 10 seconds. If the bit temperature is
between 300 and 400
C, contact may be up to 5 seconds.
DEFINITIONS
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
Data sheet status
Objective specification
This data sheet contains target or goal specifications for product development.
Preliminary specification
This data sheet contains preliminary data; supplementary data may be published later.
Product specification
This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
Internet: http://www.semiconductors.philips.com
Philips Semiconductors a worldwide company
Philips Electronics N.V. 1997
SCA55
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Printed in The Netherlands
547027/1200/03/pp16
Date of release: 1997 Aug 15
Document order number:
9397 750 02728