DATA SHEET
Objective specification
File under Integrated circuits, IC01
July 1994
INTEGRATED CIRCUITS
TDA7072A/AT
Single BTL power driver
July 1994
2
Philips Semiconductors
Objective specification
Single BTL power driver
TDA7072A/AT
FEATURES
No external components
Very high slew rate
Single power supply
Short-circuit proof
High output current (0.6 A)
Wide supply voltage range
Low output offset voltage
Suited for handling PWM signals up to 176 kHz
ESD protected on all pins
GENERAL DESCRIPTION
The TDA7072A/AT are single power driver circuits in a
BTL configuration, intended for use as a power driver for
servo systems with a single supply. They are specially
designed for compact disc players and are capable of
driving focus, tracking, sled functions and spindle motors.
Missing Current Limiter (MCL)
A MCL protection circuit is built-in. The MCL circuit is
activated when the difference in current between the
output terminal of each amplifier exceeds 100 mA (typical
300 mA). This level of 100 mA allows for headphone
applications (single-ended).
QUICK REFERENCE DATA
ORDERING INFORMATION
Notes
1. SOT97-1; 1996 September 10.
2. SOT96-1; 1996 September 10.
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
V
P
positive supply voltage range
3.0
5.0
18
V
G
v
internal voltage gain
32.5
33.5
34.5
dB
I
P
total quiescent current
V
P
= 5 V; R
L
=
-
4
8
mA
SR
slew rate
-
12
-
V/
s
I
O
output current
-
-
0.6
A
I
bias
input bias current
-
100
300
nA
f
co
cut-off frequency
-
3 dB
-
1.5
-
MHz
EXTENDED TYPE
NUMBER
PACKAGE
PINS
PIN POSITION
MATERIAL
CODE
TDA7072A
8
DIL
plastic
SOT97
(1)
TDA7072AT
8
mini-pack
plastic
SOT96A
(2)
July 1994
3
Philips Semiconductors
Objective specification
Single BTL power driver
TDA7072A/AT
handbook, full pagewidth
ground
MCD377 - 1
1
2
TDA7072A
TDA7072AT
3
5
8
4
n.c.
6
7
n.c.
I + i
I i
positive input
negative input
positive output
negative output
VP
SHORT - CIRCUIT AND
THERMAL PROTECTION
Fig.1 Block diagram.
PINNING
SYMBOL
PIN
DESCRIPTION
V
P
1
positive supply voltage
IN+
2
positive input
IN
-
3
negative input
n.c.
4
not connected
OUT+
5
positive output
GND
6
ground
n.c.
7
not connected
OUT
-
8
negative output
handbook, halfpage
1
2
3
4
8
7
6
5
MCD378
VP
OUT
GND
OUT +
IN
IN +
n.c.
n.c.
TDA7072A
TDA7072AT
Fig.2 Pin configuration.
July 1994
4
Philips Semiconductors
Objective specification
Single BTL power driver
TDA7072A/AT
FUNCTIONAL DESCRIPTION
The TDA7072A/AT are single power driver circuits in a
BTL configuration, intended for use as a power driver for
servo systems with a single supply. They are particular
designed for compact disc players and are capable of
driving focus, tracking, sled functions and spindle motors.
Because of the BTL configuration, the devices can supply
a bi-directional DC current in the load, with only a single
supply voltage. The voltage gain is fixed by internal
feedback at 33.5 dB and the devices operate in a wide
supply voltage range (3 to 18 V). The devices can supply
a maximum output current of 0.6 A. The outputs can be
short-circuited over the load, to the supply and to ground
at all input conditions. The differential inputs can handle
common mode input voltages from ground level up to
(V
P
-
2.2 V). The devices have a very high slew rate. Due
to the large bandwidth, they can handle PWM signals up
to 176 kHz.
LIMITING VALUES
In accordance with the Absolute Maximum System (IEC 134.
Note to the limiting values
The outputs can be short-circuited over the load, to the supply and to ground at all input conditions.
THERMAL RESISTANCE
Note to the thermal resistance
TDA7072A: V
P
= 5 V; R
L
= 8
; The typical voltage swing = 5.8 V and V
loss
is 2.1 V therefore I
O
= 0.36 A and
P
tot
= 0.76 W; T
amb (max)
= 150
-
0.76
100 = 74
C
TDA7072AT: V
P
= 5 V; R
L
= 16 typical voltage swing = 5.8 V and V
loss
is 2.1 V therefore I
O
= 0.18 A and P
tot
= 0.38 W;
T
amb (max)
= 150
-
0.38
155 = 91
C
SYMBOL
PARAMETER
CONDITIONS
MIN.
MAX.
UNIT
V
P
positive supply voltage range
-
18
V
I
ORM
repetitive peak output current
-
1
A
I
OSM
non repetitive peak output current
-
1.5
A
P
tot
total power dissipation
T
amb
<
25
C
TDA7072A
-
1.25
W
TDA7072AT
-
0.54
W
T
stg
storage temperature range
-
55
+150
C
T
vj
virtual junction temperature
-
+150
C
T
sc
short-circuit time
see note
-
1
hr
SYMBOL
PARAMETER
THERMAL RESISTANCE
R
th j-a
from junction to ambient in free air
TDA7072A
100 K/W
TDA7072AT
155 K/W
July 1994
5
Philips Semiconductors
Objective specification
Single BTL power driver
TDA7072A/AT
CHARACTERISTICS
V
P
= 5 V; f = 1 kHz; T
amb
= 25
C; unless otherwise specified (see Fig.3>). TDA7072A: R
L
= 8
;
TDA7072AT: R
L
= 16
.
Notes to the characteristics
1. With a load connected to the outputs the quiescent current will increase, the maximum value of this increase being
equal to the DC output offset voltage divided by R
L
.
2. The output voltage swing is typically limited to 2 x (V
P
-
2.1 V) (see Fig.4).
3. The noise output voltage (RMS value), unweighted (20 Hz to 20 kHz) is measured with R
S
= 500
.
4. The ripple rejection is measured with R
S
= 0
and f = 100 Hz to 10 kHz. The ripple voltage of 200 mV (RMS value)
is applied to the positive supply rail.
5. The DC common mode voltage range is limited to (V
P
-
2.2 V).
6. The common mode rejection ratio is measured at V
ref
= 1.4 V, V
I(CM)
= 200 mV and f = 1 kHz.
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
V
P
positive supply voltage range
3.0
5.0
18
V
I
ORM
repetitive peak output current
-
-
0.6
A
I
P
total quiescent current
R
L
=
; note 1
-
4
8
mA
V
OUT
output voltage swing
note 2
5.2
5.8
-
V
THD
total harmonic distortion
V
OUT
= 1 V (RMS)
TDA7072A
-
0.3
-
%
TDA7072AT
-
0.1
-
%
G
v
voltage gain
32.5
33.5
34.5
dB
V
no(rms)
noise output voltage (RMS value)
note 3
-
75
150
V
B
bandwidth
-
-
1.5
MHz
SVRR
supply voltage ripple rejection
note 4
40
55
-
dB
|
V
5-8
|
DC output offset voltage
R
S
= 500
-
-
100
mV
V
I(CM)
DC common mode voltage range
note 5
0
-
2.8
V
CMRR
DC common mode rejection ratio
note 6
-
100
-
dB
Z
I
input impedance
-
100
-
k
I
bias
input bias current
-
100
300
nA
SR
slew rate
-
12
-
V/
s
July 1994
6
Philips Semiconductors
Objective specification
Single BTL power driver
TDA7072A/AT
APPLICATION INFORMATION
handbook, full pagewidth
500
R
s
100 nF
220
F
V = 5 V
P
(1)
Vref
ground
MCD379
1
2
TDA7072A
TDA7072AT
3
5
8
4
n.c.
6
7
n.c.
R L
(2)
driver signal
SERVO SYSTEM
I + i
I i
Fig.3 Test and application diagram.
(1) This capacitor can be omitted if the 220
F electrolytic capacitor is connected close to pin 1.
(1) R
L
can be: focus, tracking, sled function or spindle motor.
Fig.4 Typical output voltage swing over R
L
.
+ (V 2.1) V
P
(V 2.1) V
P
0 V
MCD380
July 1994
7
Philips Semiconductors
Objective specification
Single BTL power driver
TDA7072A/AT
PACKAGE OUTLINES
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC
JEDEC
EIAJ
SOT97-1
92-11-17
95-02-04
UNIT
A
max.
1
2
b
1
(1)
(1)
(1)
b
2
c
D
E
e
M
Z
H
L
mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
A
min.
A
max.
b
max.
w
M
E
e
1
1.73
1.14
0.53
0.38
0.36
0.23
9.8
9.2
6.48
6.20
3.60
3.05
0.254
2.54
7.62
8.25
7.80
10.0
8.3
1.15
4.2
0.51
3.2
inches
0.068
0.045
0.021
0.015
0.014
0.009
1.07
0.89
0.042
0.035
0.39
0.36
0.26
0.24
0.14
0.12
0.01
0.10
0.30
0.32
0.31
0.39
0.33
0.045
0.17
0.020
0.13
b
2
050G01
MO-001AN
M
H
c
(e )
1
M
E
A
L
seating plane
A
1
w
M
b
1
e
D
A
2
Z
8
1
5
4
b
E
0
5
10 mm
scale
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
pin 1 index
DIP8: plastic dual in-line package; 8 leads (300 mil)
SOT97-1
July 1994
8
Philips Semiconductors
Objective specification
Single BTL power driver
TDA7072A/AT
UNIT
A
max.
A
1
A
2
A
3
b
p
c
D
(1)
E
(2)
(1)
e
H
E
L
L
p
Q
Z
y
w
v
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC
JEDEC
EIAJ
mm
inches
1.75
0.25
0.10
1.45
1.25
0.25
0.49
0.36
0.25
0.19
5.0
4.8
4.0
3.8
1.27
6.2
5.8
1.05
0.7
0.6
0.7
0.3
8
0
o
o
0.25
0.1
0.25
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
1.0
0.4
SOT96-1
92-11-17
95-02-04
X
w
M
A
A
1
A
2
b
p
D
H
E
L
p
Q
detail X
E
Z
e
c
L
v
M
A
(A )
3
A
4
5
pin 1 index
1
8
y
076E03S
MS-012AA
0.069
0.0098
0.0039
0.057
0.049
0.01
0.019
0.014
0.0098
0.0075
0.20
0.19
0.16
0.15
0.050
0.24
0.23
0.028
0.024
0.028
0.012
0.01
0.01
0.041
0.004
0.039
0.016
0
2.5
5 mm
scale
SO8: plastic small outline package; 8 leads; body width 3.9 mm
SOT96-1
July 1994
9
Philips Semiconductors
Objective specification
Single BTL power driver
TDA7072A/AT
SOLDERING
Introduction
There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our
"IC Package Databook" (order code 9398 652 90011).
DIP
S
OLDERING BY DIPPING OR BY WAVE
The maximum permissible temperature of the solder is
260
C; solder at this temperature must not be in contact
with the joint for more than 5 seconds. The total contact
time of successive solder waves must not exceed
5 seconds.
The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified maximum storage temperature (T
stg max
). If the
printed-circuit board has been pre-heated, forced cooling
may be necessary immediately after soldering to keep the
temperature within the permissible limit.
R
EPAIRING SOLDERED JOINTS
Apply a low voltage soldering iron (less than 24 V) to the
lead(s) of the package, below the seating plane or not
more than 2 mm above it. If the temperature of the
soldering iron bit is less than 300
C it may remain in
contact for up to 10 seconds. If the bit temperature is
between 300 and 400
C, contact may be up to 5 seconds.
SO
R
EFLOW SOLDERING
Reflow soldering techniques are suitable for all SO
packages.
Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.
Several techniques exist for reflowing; for example,
thermal conduction by heated belt. Dwell times vary
between 50 and 300 seconds depending on heating
method. Typical reflow temperatures range from
215 to 250
C.
Preheating is necessary to dry the paste and evaporate
the binding agent. Preheating duration: 45 minutes at
45
C.
W
AVE SOLDERING
Wave soldering techniques can be used for all SO
packages if the following conditions are observed:
A double-wave (a turbulent wave with high upward
pressure followed by a smooth laminar wave) soldering
technique should be used.
The longitudinal axis of the package footprint must be
parallel to the solder flow.
The package footprint must incorporate solder thieves at
the downstream end.
During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.
Maximum permissible solder temperature is 260
C, and
maximum duration of package immersion in solder is
10 seconds, if cooled to less than 150
C within
6 seconds. Typical dwell time is 4 seconds at 250
C.
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.
R
EPAIRING SOLDERED JOINTS
Fix the component by first soldering two diagonally-
opposite end leads. Use only a low voltage soldering iron
(less than 24 V) applied to the flat part of the lead. Contact
time must be limited to 10 seconds at up to 300
C. When
using a dedicated tool, all other leads can be soldered in
one operation within 2 to 5 seconds between
270 and 320
C.
July 1994
10
Philips Semiconductors
Objective specification
Single BTL power driver
TDA7072A/AT
DEFINITIONS
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
Data sheet status
Objective specification
This data sheet contains target or goal specifications for product development.
Preliminary specification
This data sheet contains preliminary data; supplementary data may be published later.
Product specification
This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
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