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Электронный компонент: TDA7088

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DATA SHEET
Product specification
Supersedes data of January 1991
File under Integrated Circuits, IC01
1996 May 14
INTEGRATED CIRCUITS
TDA7088T
FM receiver circuit for battery
supply
1996 May 14
2
Philips Semiconductors
Product specification
FM receiver circuit for battery supply
TDA7088T
FEATURES
Equipped with all stages of a mono receiver from
antenna to audio output
Mute circuit
Search tuning with a single varicap diode
Mechanical tuning with integrating AFC
AM application supported
Power supply polarity protection
Power supply voltage down to 1.8 V.
APPLICATIONS
Mechanical tuning; this is possible with or without
integrating AFC circuit
Electrical tuning; this is realized by one directional
(band-up) search tuning facility, including RESET to the
lower-band limit.
GENERAL DESCRIPTION
The TDA7088T is a bipolar integrated circuit for use in
mono portable and pocket radios. It is used when a
minimum of peripheral components (of small dimensions
and low costs) is important. The circuit contains a
frequency-locked-loop (FLL) system with an Intermediate
Frequency (IF) of about 70 kHz. Selectivity is achieved by
active RC-filters. De-tuning related to the IF and too weak
input signals is suppressed by the mute circuit.
QUICK REFERENCE DATA
ORDERING INFORMATION
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
V
P
supply voltage
1.8
3
5
V
I
P
supply current
4.2
5.2
6.6
mA
f
iRF
radio input frequency
0.5
-
110
MHz
V
i(rms)
RF sensitivity input voltage
(RMS value)
V
oAF
=
-
3 dB; V
oAF
= 0 dB
at V
i
= 1 mV; mute off
-
3
6
V
signal handling
f =
75 kHz; THD < 10%
100
200
-
mV
V
o(rms)
audio output signal (RMS
value)
R
L
= 22 k
60
85
120
mV
T
amb
operating ambient temperature
-
10
-
+70
C
TYPE
NUMBER
PACKAGE
NAME
DESCRIPTION
VERSION
TDA7088T
SO16
plastic small outline package; 16 leads; body width 3.9 mm
SOT109-1
1996 May 14
3
Philips Semiconductors
Product specification
FM receiver circuit for battery supply
TDA7088T
BLOCK DIAGRAM AND APPLICATION CIRCUIT
handbook, full pagewidth
MEH089
MIXER
TD
A7088T
VCO
14
16
1
2
3
15
r
un
13
10
9
8
7
6
AF
V2
L1
reset
&
+
+
R
MUTE
SEARCH
TUNING
S
ALLP
ASS
FIL
TER
10 k
5.6
k
2.2 k
2.2 k
6 k
5.4 k
6 k
DEMODULATOR
22 nF
LOOP FILTER
AF
V2
V3
-
1
5 k
22 k
1.8 nF
0.1
F
0.1
F
0.1
F
680
pF
10 nF
3 V
BB910
78
nH
70
nH
82
pF
+
1
68
pF
220 pF
3.3 nF
3.9 nF
IF
LIMITER
180 pF
330 pF
470 pF
V1
V2
11
12
5
4
V
P
V
P
V
P
V
oAF
Fig.1 Block diagram and application circuit for search tuning.
V1, V2 and V3 are internal voltages.
1996 May 14
4
Philips Semiconductors
Product specification
FM receiver circuit for battery supply
TDA7088T
PINNING
SYMBOL
PIN
DESCRIPTION
MUTE
1
mute output
V
oAF
2
audio frequency output signal
LOOP
3
AF loop filter
V
P
4
+3 V supply voltage
OSC
5
oscillator resonant circuit
IFFB
6
IF feedback
C
LP1
7
low-pass capacitor of 1 dB amplifier
V
oIF
8
IF output to external coupling
capacitor (high-pass)
V
iIF
9
IF input to limiter amplifier
C
LP2
10
low-pass capacitor of IF limiter
amplifier
V
iRF
11
radio frequency input
V
iRF
12
radio frequency input
C
LIM
13
limiter offset voltage capacitor
GND
14
ground (0 V)
C
AP
15
all-pass filter capacitor/input for
search tuning
TUNE
16
electrical tuning/AFC output
Fig.2 Pin configuration.
handbook, halfpage
TDA7088T
MGE664
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
MUTE
VoAF
LOOP
VP
OSC
IFFB
CLP1
VoIF
TUNE
CAP
GND
CLIM
ViRF
ViRF
CLP2
ViIF
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
Note
1. There is no special ESD protection circuit built-in; ESD data on request.
SYMBOL
PARAMETER
MIN.
MAX.
UNIT
V
P
supply voltage
0
5
V
T
stg
storage temperature
-
55
+150
C
T
amb
operating ambient temperature
-
10
+70
C
V
es
electrostatic handling; note 1
-
-
-
1996 May 14
5
Philips Semiconductors
Product specification
FM receiver circuit for battery supply
TDA7088T
DC CHARACTERISTICS
V
P
= 3 V; T
amb
= 25
C; unless otherwise specified.
AC CHARACTERISTICS
V
P
= 3 V; T
amb
= 25
C; f
iRF
= 96 MHz modulated with f
mod
= 1 kHz and
22.5 kHz deviation; V
i
= 400
V (measured as
EMF; R
S
= 75
) and measurements taken in Fig.4; unless otherwise specified.
SYMBOL
PARAMETER
MIN.
TYP.
MAX.
UNIT
V
P
supply voltage (pin 4)
1.8
3
5
V
I
P
supply current (pin 4)
4.2
5.2
6.6
mA
V
1
DC voltage on pin 1
2.50
2.55
2.60
V
V
3
DC voltage on pin 3
2.64
2.69
2.74
V
V
6, 7
DC voltage on pins 6 and 7
2.38
2.44
2.50
V
V
8
DC voltage on pin 8
1.60
1.67
1.74
V
V
9, 10, 13
DC voltage on pins 9, 10 and 13
2.42
2.47
2.52
V
V
11, 12
DC voltage on pins 11 and 12
0.91
0.94
0.98
V
V
15
DC voltage on pin 15
2.06
2.12
2.18
V
I
2
AF output current on pin 2
45
60
80
A
I
5
oscillator current on pin 5
275
375
500
A
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
V
i(rms)
RF sensitivity input voltage
(RMS value)
V
oAF
=
-
3 dB; V
oAF
= 0 dB
at V
i
= 1 mV; see Fig.3
mute off
-
3
6
V
mute on
3
6
12
V
-
5
10
V
signal handling
f =
75 kHz; THD < 10%
100
200
-
mV
signal plus noise-to-noise ratio
see Fig.3
52
56
-
dB
THD
total harmonic distortion
f =
22.5 kHz
-
1
1.4
%
f =
75 kHz
-
2.4
3.3
%
AM
AM suppression
FM: 1 kHz;
75 kHz;
AM: 1 kHz; m = 0.8
47
52
-
dB
RR
1000
ripple rejection
100 mV RMS ripple on V
P
;
f = 1 kHz
7
10
-
dB
V
o(rms)
audio output signal (RMS value) R
L
= 22 k
60
85
120
mV
Search tuning (with BB910 and C
16
= 0.1
F) see Fig.1
V
16
minimum output voltage on
pin 16
limiting point
-
V
P
-
1.85
-
V
V/
t
tuning steepness
voltage at pin 16
95
210
420
mV/s
f
osc
/
t
oscillator steepness
1.25
2.83
5.6
MHz/s
I
AFC
/
V
3
AFC steepness
voltage at pin 3
4.75
9.5
19
S
S
N
+
N
--------------
26 dB
=
S
N
+
N
--------------
1996 May 14
6
Philips Semiconductors
Product specification
FM receiver circuit for battery supply
TDA7088T
Fig.3 Input sensitivity.
(1) Mute on.
(2) Mute off.
handbook, full pagewidth
-
80
25
VoAF
(dB)
MEH092
10
-
6
10
-
5
10
-
4
10
-
3
10
-
2
-
60
-
40
-
20
0
EMF (V)
(2)
(2)
(1)
(1)
S
+
N
noise
1996 May 14
7
Philips Semiconductors
Product specification
FM receiver circuit for battery supply
TDA7088T
TEST AND APPLICATION INFORMATION
Fig.4 Test circuit and application for mechanical tuning.
C1 = Toko 2A-15BT-R01.
handbook, full pagewidth
MEH090
22 k
1.2
k
1.8 nF
22 nF
10 nF
27 pF
18
pF
180 pF
78
nH
3.3 nF
C1
10 k
75
0.1
F
0.1
F
mute disable
70
nH
TDA7088T
3.9 nF
330 pF
82 pF
220
pF
470 pF
ViRF
VP =
+
3 V
VP
VoAF
68
pF
9
10
11
12
13
14
15
16
8
7
6
5
4
3
2
1
EMF (fRF)
RS
1996 May 14
8
Philips Semiconductors
Product specification
FM receiver circuit for battery supply
TDA7088T
Fig.5 Application circuit with AFC for mechanical tuning.
C1 = Toko 2A-15BT-R01.
handbook, full pagewidth
MEH091
22 k
1.2
k
1.8 nF
AFC
22 nF
10 nF
27 pF
18
pF
180 pF
78
nH
3.3 nF
C2
C1
D1
10 k
0.1
F
0.1
F
0.1
F
BA483
70
nH
TDA7088T
3.9 nF
330 pF
82 pF
220
pF
470 pF
ViRF
VP =
+
3 V
VP
VoAF
68
pF
9
10
11
12
13
14
15
16
8
7
6
5
4
3
2
1
1996 May 14
9
Philips Semiconductors
Product specification
FM receiver circuit for battery supply
TDA7088T
handbook, full pagewidth
MEH157
180
pF
2.7 k
10 k
100 k
BAW62
CC7642
AM-IF
10 nF
(1)
27 k
5.1
12
1
F
0.1
F
1
F
4.7 nF
22
k
0.1
F
TDA7088T
8
7
6
5
4
3
2
1
off
battery
switch
on
9
10
11
12
13
14
AF
(FM antenna)
AF
330
pF
33 pF
RF
470 pF
AF amplifier
AM antenna
15
16
L
H
10
nF
earphone
volume
oscillator
resonant
circuit
FM
33 pF
12 pF
AM
FM
AM
4.7 nF
3.9
nF
4.7 nF
22 nF
V
P
47 nF
+
3 V
+
3 V
22
F
AF
transformer
+
3 V
Fig.6 AM application circuit.
(1)
CC7642: AM-IF amplifier/demodulator type number WU-xi 742 Fty.
1996 May 14
10
Philips Semiconductors
Product specification
FM receiver circuit for battery supply
TDA7088T
PACKAGE OUTLINE
X
w
M
A
A
1
A
2
b
p
D
H
E
L
p
Q
detail X
E
Z
e
c
L
v
M
A
(A )
3
A
8
9
1
16
y
pin 1 index
UNIT
A
max.
A
1
A
2
A
3
b
p
c
D
(1)
E
(1)
(1)
e
H
E
L
L
p
Q
Z
y
w
v
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC
JEDEC
EIAJ
mm
inches
1.75
0.25
0.10
1.45
1.25
0.25
0.49
0.36
0.25
0.19
10.0
9.8
4.0
3.8
1.27
6.2
5.8
0.7
0.6
0.7
0.3
8
0
o
o
0.25
0.1
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
Note
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
1.0
0.4
SOT109-1
91-08-13
95-01-23
076E07S
MS-012AC
0.069
0.0098
0.0039
0.057
0.049
0.01
0.019
0.014
0.0098
0.0075
0.39
0.38
0.16
0.15
0.050
1.05
0.041
0.24
0.23
0.028
0.020
0.028
0.012
0.01
0.25
0.01
0.004
0.039
0.016
0
2.5
5 mm
scale
SO16: plastic small outline package; 16 leads; body width 3.9 mm
SOT109-1
1996 May 14
11
Philips Semiconductors
Product specification
FM receiver circuit for battery supply
TDA7088T
SOLDERING
Introduction
There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our
"IC Package Databook" (order code 9398 652 90011).
Reflow soldering
Reflow soldering techniques are suitable for all SO
packages.
Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.
Several techniques exist for reflowing; for example,
thermal conduction by heated belt. Dwell times vary
between 50 and 300 seconds depending on heating
method. Typical reflow temperatures range from
215 to 250
C.
Preheating is necessary to dry the paste and evaporate
the binding agent. Preheating duration: 45 minutes at
45
C.
Wave soldering
Wave soldering techniques can be used for all SO
packages if the following conditions are observed:
A double-wave (a turbulent wave with high upward
pressure followed by a smooth laminar wave) soldering
technique should be used.
The longitudinal axis of the package footprint must be
parallel to the solder flow.
The package footprint must incorporate solder thieves at
the downstream end.
During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.
Maximum permissible solder temperature is 260
C, and
maximum duration of package immersion in solder is
10 seconds, if cooled to less than 150
C within
6 seconds. Typical dwell time is 4 seconds at 250
C.
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.
Repairing soldered joints
Fix the component by first soldering two diagonally-
opposite end leads. Use only a low voltage soldering iron
(less than 24 V) applied to the flat part of the lead. Contact
time must be limited to 10 seconds at up to 300
C. When
using a dedicated tool, all other leads can be soldered in
one operation within 2 to 5 seconds between
270 and 320
C.
1996 May 14
12
Philips Semiconductors
Product specification
FM receiver circuit for battery supply
TDA7088T
DEFINITIONS
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
Data sheet status
Objective specification
This data sheet contains target or goal specifications for product development.
Preliminary specification
This data sheet contains preliminary data; supplementary data may be published later.
Product specification
This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
1996 May 14
13
Philips Semiconductors
Product specification
FM receiver circuit for battery supply
TDA7088T
NOTES
1996 May 14
14
Philips Semiconductors
Product specification
FM receiver circuit for battery supply
TDA7088T
NOTES
1996 May 14
15
Philips Semiconductors
Product specification
FM receiver circuit for battery supply
TDA7088T
NOTES
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SCDS48
Philips Electronics N.V. 1996
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Printed in The Netherlands
517021/1200/02/pp16
Date of release: 1996 May 14
Document order number:
9397 750 00843