1999 Oct 12

Philips Semiconductors

Product specification

IC card interface

TDA8002C

FEATURES

Single supply voltage interface (3.3 or 5 V environment)

Low-power sleep mode

Three specific protected half-duplex bidirectional
buffered I/O lines

regulation 5 V

5% or 3 V

5%, I

< 55 mA for

= 3.0 to 6.5 V, with controlled rise and fall times

Thermal and short-circuit protections with current
limitations

Automatic ISO 7816 activation and deactivation
sequences

Enhanced ESD protections on card side (>6 kV)

Clock generation for the card up to 12 MHz with
synchronous frequency changes

Clock generation up to 20 MHz (external clock)

Synchronous and asynchronous cards (memory and
smart cards)

ISO 7816, GSM11.11 compatibility and EMV
(Europay, MasterCard

and Visa) compliant

Step-up converter for V

generation

Supply supervisor for spikes elimination and emergency
deactivation

Chip select input for easy use of several TDA8002Cs in
parallel.

APPLICATIONS

IC card readers for:

GSM applications

Banking

Electronic payment

Identification

Pay TV

Road tolling.

GENERAL DESCRIPTION

The TDA8002C is a complete low-power analog interface
for asynchronous and synchronous cards. It can be placed
between the card and the microcontroller. It performs all
supply, protection and control functions. It is directly
compatible with ISO 7816, GSM11.11 and EMV
specifications.

ORDERING INFORMATION

TYPE NUMBER

PACKAGE

MARKING

NAME

DESCRIPTION

VERSION

TDA8002CT/A/C1

TDA8002CT/A

SO28

plastic small outline package; 28 leads; body width
7.5 mm

SOT136-1

TDA8002CT/B/C1

TDA8002CT/B

TDA8002CT/C/C1

TDA8002CT/C

TDA8002CG/C1

TDA8002C

LQFP32

plastic low profile quad flat package; 32 leads;
body 5

1.4 mm

SOT401-1

1999 Oct 12

Philips Semiconductors

Product specification

IC card interface

TDA8002C

QUICK REFERENCE DATA

SYMBOL

PARAMETER

CONDITIONS

MIN.

TYP.

MAX.

UNIT

Supplies

supply voltage

3.0

6.5

DD(lp)

supply current

low-power

150

DD(idle)

supply current

Idle mode; f

CLKOUT

= 10 MHz

DD(active)

supply current

active mode; V

CC(O)

= 5 V;

CLKOUT

= 10 MHz

CLK

= LOW; I

= 100

CLK

= 5 MHz; I

= 10 mA

CLK

= 5 MHz; I

= 55 mA

140

active mode; V

CC(O)

= 3 V;

CLKOUT

= 10 MHz

CLK

= LOW; I

= 100

CLK

= 5 MHz; I

= 10 mA

CLK

= 5 MHz; I

= 55 mA

140

Card supply

CC(O)

output voltage

active mode for V

= 5 V

< 55 mA; DC load

4.6

5.4

= 40 nAs; AC load

4.6

5.4

active mode for V

= 3 V

< 55 mA; DC load

2.76

3.24

= 40 nAs; AC load

2.76

3.24

General

CLK

card clock frequency

MHz

deactivation sequence duration

100

tot

continuous total power dissipation

TDA8002CT/x

amb

25 to +85

0.56

TDA8002CG

amb

25 to +85

0.46

amb

ambient temperature

+85

1999 Oct 12

Philips Semiconductors

Product specification

IC card interface

TDA8002C

PINNING

SYMBOL

PIN

I/O

DESCRIPTION

TYPE

CT/A

TYPE

CT/B

TYPE

CT/C

TYPE

XTAL1

crystal connection or input for external clock

XTAL2

crystal connection

I/OUC

I/O

data I/O line to and from microcontroller

AUX1UC

I/O

auxiliary line 1 to and from microcontroller for synchronous
applications

AUX2UC

I/O

auxiliary line 2 to and from microcontroller for synchronous
applications

chip select control input for enabling pins I/OUC, AUX1UC,
AUX2UC, CLKSEL, CLKDIV1, CLKDIV2, STROBE, CV/TV,
CMDVCC, RSTIN, OFF and MODE; note 1

ALARM

open drain PMOS reset output for microcontroller (active
HIGH)

CLKSEL

control input signal for CLK (LOW = XTAL oscillator;
HIGH = STROBE input)

CLKDIV1

control input with CLKDIV2 for choosing CLK frequency

CLKDIV2

control input with CLKDIV1 for choosing CLK frequency

STROBE

external clock input for synchronous applications

CLKOUT

clock output (see Table 1)

DGND1

supply digital ground 1

AGND

supply analog ground

I/O

capacitance connection for voltage doubler

DDA

supply analog supply voltage

I/O

capacitance connection for voltage doubler

VUP

I/O

output of voltage doubler

I/O

data I/O line to and from card

AUX2

I/O

auxiliary I/O line to and from card

PRES

card input presence contact (active LOW)

PRES

active HIGH card input presence contact

CV/TV

card voltage selection input line (high = 5 V, low = 3 V); note 1

AUX1

I/O

auxiliary I/O line to and from card

CLK

clock to card output (C3I) (see Table 1)

RST

card reset output (C2I)

supply for card (C1I)

CMDVCC

start activation sequence input from microcontroller (active
LOW)

RSTIN

card reset input from microcontroller

OFF

open-drain NMOS interrupt output to microcontroller (active
LOW)

1999 Oct 12

Philips Semiconductors

Product specification

IC card interface

TDA8002C

Note

1. A pull-up resistor of 100 k

connected to V

is integrated.

MODE

operating mode selection input (HIGH = normal; LOW = sleep)

DDD

supply digital supply voltage

DGND2

supply digital ground 2

SYMBOL

PIN

I/O

DESCRIPTION

TYPE

CT/A

TYPE

CT/B

TYPE

CT/C

TYPE

Fig.2 Pin configuration (TDA8002CT/A).

handbook, halfpage

XTAL1

XTAL2

I/OUC

AUX1UC

AUX2UC

ALARM

CLKSEL

CLKDIV1

CLKDIV2

STROBE

CLKOUT

DGND1

AGND

MODE

RSTIN

RST

CLK

VCC

AUX1

AUX2

I/O

VUP

VDDA

TDA8002CT/A

FCE247

OFF

CMDVCC

PRES

Fig.3 Pin configuration (TDA8002CT/B).

handbook, halfpage

XTAL1

XTAL2

I/OUC

AUX1UC

ALARM

CLKSEL

CLKDIV1

CLKDIV2

STROBE

CLKOUT

DGND1

AGND

MODE

RSTIN

RST

CLK

VCC

AUX1

I/O

VUP

VDDA

TDA8002CT/B

FCE248

OFF

CMDVCC

PRES

1999 Oct 12

Philips Semiconductors

Product specification

IC card interface

TDA8002C

FUNCTIONAL DESCRIPTION

Power supply

The supply pins for the chip are V

DDA

, V

DDD

, AGND,

DGND1 and DGND2. V

DDA

and V

DDD

(i.e. V

) should be

in the range of 3.0 to 6.5 V. All card contacts remain
inactive during power-up or power-down.

On power-up, the logic is reset by an internal signal.
The sequencer is not activated until V

reaches

th2

+ V

hys2

(see Fig.6). When V

falls below V

th2

, an

automatic deactivation sequence of the contacts is
performed.

Chip selection

The chip select pin (CS) allows the use of several
TDA8002Cs in parallel.

When CS is HIGH, the pins RSTN, CMDVCC, MODE,
CV/TV, CLKDIV1, CLKDIV2, CLKSEL and STROBE
control the chip, pins I/OUC, AUX1UC and AUX2UC are
the copy of I/O, AUX1 and AUX2 when enabled (with
integrated 20 k

pull-up resistors connected to V

) and

OFF is enabled.

When CS goes LOW, the levels on pins RSTIN,
CMDVCC, MODE, CV/TV, CLKDIV1, CLKDIV2 and
STROBE are internally latched, I/OUC, AUX1UC and
AUX2UC go to high-impedance with respect to I/O, AUX1
and AUX2 (with integrated 100 k

pull-up resistors

connected to V

) and OFF is high-impedance.

Supply voltage supervisor (V

)

This block surveys the V

supply. A defined retriggerable

pulse of 10 ms minimum (t

) is delivered on the ALARM

output during power-up or power-down of V

(see Fig.6).

This signal is also used for eliminating the spikes on card
contacts during power-up or power-down.

When V

reaches V

th2

+ V

hys2

, an internal delay (t

) is

started. The ALARM output is active until this delay has
expired. When V

falls below V

th2

, ALARM is activated

and a deactivation sequence of the contacts is performed.

Clock circuitry

The TDA8002C supports both synchronous and
asynchronous cards. There are three methods to clock the
circuitry:

Apply a clock signal to pin STROBE

Use of an internal RC oscillator

Use of a quartz oscillator which should be connected
between pins XTAL1 and XTAL2 or an external clock
applied on XTAL1.

When CLKSEL is HIGH, the clock should be applied to the
STROBE pin. When CLKSEL is LOW, the internal
oscillators is used.

When an internal clock is used, the clock output is
available on pin CLKOUT. The RC oscillator is selected by
making CLKDIV1 HIGH and CLKDIV2 LOW. The clock
output to the card is available on pin CLK. The frequency
of the card clock can be the input frequency divided by
2 or 4, STOP low or 1.25 MHz, depending on the states of
CLKDIV1 or CLKDIV2 (see Table 1).

When STROBE is used for entering the clock to a
synchronous card, STROBE should remain stable during
activation sequence otherwise the first pulse may be
omitted.

Do not change CLKSEL during activation. When in
low-power (sleep) mode, the internal oscillator frequency
which is available on pin CLKOUT is lowered to
approximately 16 kHz for power economy purposes.

1999 Oct 12

Philips Semiconductors

Product specification

IC card interface

TDA8002C

Table 1

Clock circuitry definition

Notes

1. X = don't care.

2. In low-power mode.

3. f

int

= 32 kHz in low-power mode.

MODE

CLKSEL

CLKDIV1

CLKDIV2

FREQUENCY OF

CLK

FREQUENCY OF

CLKOUT

HIGH

LOW

HIGH

LOW

int

HIGH

LOW

xtal

HIGH

LOW

HIGH

xtal

HIGH

LOW

HIGH

STOP low

xtal

HIGH

(1)

STROBE

xtal

LOW

(2)

(1)

STOP low

int

(3)

I/O circuitry

The three I/O transceivers are identical. The state is HIGH
for all I/O pins (i.e. I/O, I/OUC, AUX1, AUX1UC, AUX2 and
AUX2UC). Pin I/O is referenced to V

and pin I/OUC to

, thus ensuring proper operation in the event that

The first side on which a falling edge is detected becomes
a master (input). An anti-latch circuitry first disables the
detection of the falling edge on the other side, which
becomes slave (output), see Fig.8.

After a delay time t

(between 50 and 400 ns), the logic 0

present on the master side is transferred on the slave side.

When the input is back to HIGH level, a current booster is
turned on during the delay t

on the output side and then

both sides are back to their idle state, ready to detect the
next logic 0 on any side.

In the event of a conflict, both lines may remain LOW until
the software enables the lines to be HIGH. The anti-latch
circuitry ensures that the lines do not remain LOW if both
sides return HIGH, regardless of the prior conditions.
The maximum frequency on the lines is approximately
200 kHz.

When CS is HIGH, I/OUC, AUX1UC and AUX2UC are
internally pulled-up to V

with 20 k

resistors. When

CS is LOW, I/OUC, AUX1UC and AUX2UC are
permanently HIGH (with integrated 100 k

pull-up

resistors connected to V

Fig.8 Master and slave signals.

handbook, full pagewidth

MGD703

I/O

I/OUC

conflict

idle

1999 Oct 12

Philips Semiconductors

Product specification

IC card interface

TDA8002C

Logic circuitry

After power-up, the circuit has six possible states of
operation. Figure 9 shows the state diagram.

DLE MODE

After reset, the circuit enters the idle mode. A minimum
number of functions in the circuit are active while waiting
for the microcontroller to start a session:

All card contacts are inactive

I/OUC, AUX1UC and AUX2UC are high-impedance

Oscillator (XTAL) runs, delivering CLKOUT

Voltage supervisor is active.

POWER MODE

When pin MODE goes LOW, the circuit enters the
low-power (sleep) mode. As long as pin MODE is LOW no
activation is possible.

If pin MODE goes LOW in the active mode, a normal
deactivation sequence is performed before entering the
low-power mode. When pin MODE goes HIGH, the circuit
enters the normal operating mode after a delay of at least
6 ms (96 cycles of CLKOUT). During this time the
CLKOUT remains at 16 kHz.

All card contacts are inactive

Oscillator (XTAL) does not operate

The V

supervisor, ALARM output, card presence

detection and OFF output remain functional

Internal oscillator is slowed to 32 kHz, providing 16 kHz
on CLKOUT.

CTIVE MODE

When the activation sequence is completed, the
TDA8002C will be in the active mode. Data is exchanged
between the card and the microcontroller via the I/O lines.

Fig.9 State diagram.

handbook, full pagewidth

MGE735

POWER

OFF

ACTIVE

MODE

LOW-POWER

MODE

IDLE

MODE

FAULT

ACTIVATION

DEACTIVATION

1999 Oct 12

Philips Semiconductors

Product specification

IC card interface

TDA8002C

CTIVATION SEQUENCE

From Idle mode, the circuit enters the activation mode
when the microcontroller sets the CMDVCC line LOW or
sets the MODE line HIGH when the CMDVCC line is
already LOW. The internal circuitry is then activated, the
internal clock is activated and an activation sequence is
executed. When RST is enabled it becomes the inverse of
RSTIN.

Figures 10 to 12 illustrate the activation sequence as
follows:

1. Step-up converter is started (t

)

2. V

rises from 0 to 3 or 5 V (t

= t

+ 1

T) (according

to the state on pin CV/TV)

3. I/O, AUX1 and AUX2 are enabled and CLK is enabled

= t

+ 4T); I/O, AUX1 and AUX2 were forced LOW

until this time

4. CLK is set by setting RSTIN to HIGH (t

)

5. RST is enabled (t

= t

+ 7T); after t

, RSTIN has no

further action on CLK, but is only controlling RST.

The value of V

(5 or 3 V) must be selected by the level

on pin CV/TV before the activation sequence.

Fig.10 Activation sequence using RSTIN and CMDVCC.

handbook, full pagewidth

FCE273

OSC_INT/64

CMDVCC

VUP

VCC

I/O

CLK

RSTIN

RST

LOW

tact

T = 25

1999 Oct 12

Philips Semiconductors

Product specification

IC card interface

TDA8002C

LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134); note 1.

Note

1. Stress beyond these levels may cause permanent damage to the device. This is a stress rating only and functional

operation of the device under this condition is not implied.

HANDLING

Every pin withstands the ESD test according to MIL-STD-883C class 3 for card contacts, class 2 for the remaining.
Method 3015 (HBM 1500

, 100 pF) 3 positive pulses and 3 negative pulses on each pin with respect to ground.

THERMAL CHARACTERISTICS

SYMBOL

PARAMETER

CONDITIONS

MIN.

MAX.

UNIT

DDD

digital supply voltage

0.3

+6.5

DDA

analog supply voltage

0.3

+6.5

card supply voltage pins;
XTAL1, XTAL2, ALARM, CS, MODE,
RSTIN, CLKSEL, AUX2UC, AUX1UC,
CLKDIV1, CLKDIV2, CLKOUT,
STROBE, CMDVCC, CV/TV and OFF

0.3

+6.5

i(card)

input voltage on card contact pins;
I/O, AUX2, PRES, PRES, AUX1, CLK,
RST and V

0.3

+6.5

electrostatic handling voltage

on pins I/O, AUX2, PRES, PRES,
AUX1, CLK, RST and V

on all other pins

stg

storage temperature

+125

tot

continuous total power dissipation

TDA8002CT/x

amb

25 to +85

0.56

TDA8002CG

amb

25 to +85

0.46

amb

ambient temperature

+85

junction temperature

150

SYMBOL

PARAMETER

CONDITIONS

VALUE

UNIT

th(j-a)

thermal resistance from junction to ambient

in free air

SOT136-1

K/W

SOT401-1

K/W

1999 Oct 12

Philips Semiconductors

Product specification

IC card interface

TDA8002C

CHARACTERISTICS
V

= 3.3 V; T

amb

= 25

C; f

xtal

= 10 MHz; unless otherwise specified.

SYMBOL

PARAMETER

CONDITIONS

MIN.

TYP.

MAX.

UNIT

Supplies

supply voltage

6.5

DD(lp)

supply current

low-power mode

150

DD(idle)

supply current

Idle mode; f

CLKOUT

= 10 MHz

DD(active)

supply current

active mode; V

CC(O)

= 5 V;

CLKOUT

= 10 MHz

CLK

= LOW; I

= 100

CLK

= 5 MHz; I

= 10 mA

CLK

= 5 MHz; I

= 55 mA

140

active mode; V

CC(O)

= 3 V;

CLKOUT

= 10 MHz

CLK

= LOW; I

= 100

CLK

= 5 MHz; I

= 10 mA

CLK

= 5 MHz; I

= 55 mA

140

th2

threshold voltage on V

for

voltage supervisor

falling

2.2

2.4

hys2

hysteresis on V

th2

100

150

Card supply

CC(O)

output voltage

Idle mode

0.3

active mode

= 5 V; I

< 55 mA;

DC load

4.6

5.4

= 40 nAs; AC load

4.6

5.4

= 3 V; I

< 55 mA;

DC load

2.76

3.24

= 24 nAs; AC load

2.76

3.24

CC(O)

output current

CC(O)

= from 0 to 5 or 3 V

short-circuited to ground

200

slew rate

rising or falling slope

0.10

0.15

0.20

Crystal connections (XTAL1 and XTAL2)

ext

external capacitors

note 1

xtal

resonance frequency

note 2

MHz

1999 Oct 12

Philips Semiconductors

Product specification

IC card interface

TDA8002C

Data lines

ENERAL

d(edge)

delay between falling edge
of I/O, AUX1, AUX2, I/OUC,
AUX1UC and AUX2UC

, t

rise and fall times

= C

= 30 pF

0.5

I/O(max)

maximum frequency on
data lines

200

kHz

ATA LINES

I/O, AUX1

AND

AUX2 (

WITH

PULL

UP RESISTOR CONNECTED TO

)

output voltage

Idle and low-power modes

0.3

HIGH-level output voltage
on data lines

0.8V

LOW-level output voltage on
data lines

I/O

= 1 mA

0.4

HIGH-level input voltage on
data lines

0.6V

LOW-level input voltage on
data lines

0.5

idle

voltage on data lines
outside a session

0.4

internal pull-up resistance
between data lines and V

edge

current from data lines
when active pull-up is active

LOW-level input current on
data lines

= 0.4 V

600

HIGH-level input current on
data lines

= V

ATA LINES

I/OUC, AUX1UC

AND

AUX2UC (

WITH

PULL

UP RESISTOR CONNECTED TO

WHEN

HIGH

AND

100

WHEN

LOW)

HIGH-level output voltage
on data lines

+ 0.2

LOW-level output voltage on
data lines

I/OUC

= 1 mA

0.4

HIGH-level input voltage on
data lines

0.7V

LOW-level input voltage on
data lines

0.3V

idle

impedance on data lines
outside a session

ALARM and OFF when connected (open-drain outputs)

OH(OFF)

HIGH-level output current
on pin OFF

OH(OFF)

= 5 V

SYMBOL

PARAMETER

CONDITIONS

MIN.

TYP.

MAX.

UNIT

1999 Oct 12

Philips Semiconductors

Product specification

IC card interface

TDA8002C

OL(OFF)

LOW-level output voltage on
pin OFF

OL(OFF)

= 2 mA

0.4

OL(ALARM)

LOW-level output current on
pin ALARM

OL(ALARM)

= 0 V

OH(ALARM)

HIGH-level output voltage
on pin ALARM

OH(ALARM)

2 mA

ALARM pulse width

Clock output (CLKOUT; powered from V

)

CLKOUT

frequency on CLKOUT

MHz

low power

kHz

LOW-level output voltage

= 1 mA

0.5

HIGH-level output voltage

1 mA

0.5

, t

rise and fall times

= 15 pF; notes 3 and 4

duty factor

= 15 pF; notes 3 and 4

Internal oscillator

int

frequency of internal
oscillator

active mode

2.5

MHz

sleep mode

kHz

Card reset output (RST)

O(inact)

output voltage

inactive modes

0.3

d(RST)

delay between RSTIN and
RST

RST enabled

100

LOW-level output voltage

= 200

0.3

HIGH-level output voltage

200

0.5

, t

rise and fall times

= 30 pF

0.5

Card clock output (CLK)

O(inact)

output voltage

inactive modes

0.3

LOW-level output voltage

= 200

0.3

HIGH-level output voltage

0.5

, t

rise and fall times

= 30 pF; note 3

duty factor

= 30 pF; note 3

slew rate (rise and fall)

0.2

V/ns

Strobe input (STROBE)

STROBE

frequency on STROBE

MHz

LOW-level input voltage

0.3V

HIGH-level input voltage

0.7V

Logic inputs (CLKSEL, CLKDIV1, CLKDIV2, MODE, CMDVCC and RSTIN); note 5

LOW-level input voltage

0.3V

HIGH-level input voltage

0.7V

SYMBOL

PARAMETER

CONDITIONS

MIN.

TYP.

MAX.

UNIT

1999 Oct 12

Philips Semiconductors

Product specification

IC card interface

TDA8002C

OGIC INPUTS

(CV/TV

AND

CS) (I

NTEGRATED

PULL

UP RESISTOR CONNECTED TO

); note 5

LOW-level input voltage

0.3V

HIGH-level input voltage

0.7V

Logic inputs PRES and PRES; note 5

LOW-level input voltage

0.3V

HIGH-level input voltage

0.7V

IL(PRES)

LOW-level input current on
pin PRES

= 0 V

IH(PRES)

HIGH-level input current on
pin PRES

Protections

shut-down local
temperature

135

CC(sd)

shut-down current at V

Timing

act

activation sequence
duration

guaranteed by design;
see Fig.12

180

220

deactivation sequence
duration

guaranteed by design;
see Fig.14

100

start of the window for
sending CLK to the card

see Figs 10 and 11

130

end of the window for
sending CLK to the card

see Fig.11

150

time from input to select

100

time from select to input

1000

time from input to deselect

1000

time from deselect to input

100

time from select to low
impedance

time from deselect to high
impedance

pull-up resistor at pin
OFF = 10 k

; 1 device

2 devices in parallel

r(max)

maximum rise time on pin
CS

100

f(max)

maximum fall time on pin
CS

100

SYMBOL

PARAMETER

CONDITIONS

MIN.

TYP.

MAX.

UNIT

1999

Oct

Philips Semiconductors

Product specification

IC card interf

ace

TD
A8002C

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APPLICA

TION INFORMA

TION

ll pagewidth

FCE195

C8
10

(3)

100 nF

(2)

100

(4)

470 nF

100 nF

(5)

470 nF

80C51

P1-0

P1-1

P1-2

P1-3

P1-4

P1-5

P1-6

P1-7

RST

P3-0

P3-1

P3-2

P3-3

P3-4

P3-5

P3-6

P3-7

XTAL2

XTAL1

VSS

VCC

P0-0

P0-1

P0-2

P0-3

P0-4

P0-5

P0-6

P0-7

ALE

PSEN

P2-7

P2-6

P2-5

P2-4

P2-3

P2-2

P2-1

P2-0

XTAL1

XTAL2

I/OUC

AUX1UC

ALARM

CLKSEL

CLKDIV1

CLKDIV2

STROBE

CLKOUT

DGND1

AGND

IC2

IC1

MODE

OFF

RSTIN

CMDVCC

RST

CLK

VCC

AUX1

PRES

I/O

VUP

VDDA

VDD

TDA8002CT/C

CV/TV

C5I

C6I

C7I

C8I

C1I

C2I

C3I

C4I

(1)

33 pF

14.745

MHz

VDD

C2
10

100 nF

VDD

J1 1

3.3 V or 5 V

J1 2

ground

CARD READ

Fig.16 Application diagram.

TDA8002C should be placed as close as possible to the card reader.

(1) Contact normally open.

(2) C3 close to pin V

of TDA8002C.

(3) C4 close to C1 contact of card reader.

(4) C5 close to VUP pin of TDA8002C.

(5) C6 as close as possible to pins S1 and S2.

CLK line may be shielded with respect to other lines.

Decoupling capacitors C7 and C8 may be placed as close as possible to pin V

DDA

A good ground plane is recommended.

1999

Oct

Philips Semiconductors

Product specification

IC card interf

ace

TD
A8002C

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ook, full pagewidth

FCE196

C8
10

(2)

100 nF

(5)

470 nF

80C51

P1-0

P1-1

P1-2

P1-3

P1-4

P1-5

P1-6

P1-7

RST

P3-0

P3-1

P3-2

P3-3

P3-4

P3-5

P3-6

P3-7

XTAL2

XTAL1

VSS

VCC

P0-0

P0-1

P0-2

P0-3

P0-4

P0-5

P0-6

P0-7

ALE

PSEN

P2-7

P2-6

P2-5

P2-4

P2-3

P2-2

P2-1

P2-0

IC2

IC1

VDD

TDA8002CG

C5I

C6I

C7I

C8I

C1I

C2I

C3I

C4I

(1)

33 pF

14.745 MHz

VDD

C2
10

100 nF

VDD

J1 1

3.3 V or 5 V

J1 2

ground

AUX1UC

STROBE

AUX2UC

ALARM

CLKSEL

CLKDIV1

CLKDIV2

(3)

100 nF

(4)

470 nF

AUX2

RST

CLK

VCC

AUX1

CMDVCC

CV/TV

PRES

CLKOUT

I/O

DGND1

AGND

VUP

DDA

DDD

I/OUC

DGND2

XTAL2

XTAL1

MODE

RSTIN

OFF

CARD READ

Fig.17 Application diagram (for more details, see

"Application note AN98054").

TDA8002C should be placed as close as possible to the card reader.

(1) Contact normally open.

(2) C3 close to pin V

of TDA8002C.

(3) C4 close to C1 contact of card reader.

(4) C5 close to VUP pin of TDA8002C.

(5) C6 as close as possible to pins S1 and S2.

CLK line may be shielded with respect to other lines.

Decoupling capacitors C7, C8 and C9 may be placed as close as possible to pin V

DDA

and V

DDD

A good ground plane is recommended.

1999 Oct 12

Philips Semiconductors

Product specification

IC card interface

TDA8002C

SOLDERING

Introduction to soldering surface mount packages

This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our

"Data Handbook IC26; Integrated Circuit Packages"

(document order number 9398 652 90011).

There is no soldering method that is ideal for all surface
mount IC packages. Wave soldering is not always suitable
for surface mount ICs, or for printed-circuit boards with
high population densities. In these situations reflow
soldering is often used.

Reflow soldering

Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.

Several methods exist for reflowing; for example,
infrared/convection heating in a conveyor type oven.
Throughput times (preheating, soldering and cooling) vary
between 100 and 200 seconds depending on heating
method.

Typical reflow peak temperatures range from
215 to 250

C. The top-surface temperature of the

packages should preferable be kept below 230

Wave soldering

Conventional single wave soldering is not recommended
for surface mount devices (SMDs) or printed-circuit boards
with a high component density, as solder bridging and
non-wetting can present major problems.

To overcome these problems the double-wave soldering
method was specifically developed.

If wave soldering is used the following conditions must be
observed for optimal results:

Use a double-wave soldering method comprising a
turbulent wave with high upward pressure followed by a
smooth laminar wave.

For packages with leads on two sides and a pitch (e):

larger than or equal to 1.27 mm, the footprint

longitudinal axis is preferred to be parallel to the
transport direction of the printed-circuit board;

smaller than 1.27 mm, the footprint longitudinal axis

must be parallel to the transport direction of the
printed-circuit board.

The footprint must incorporate solder thieves at the
downstream end.

For packages with leads on four sides, the footprint must
be placed at a 45

angle to the transport direction of the

printed-circuit board. The footprint must incorporate
solder thieves downstream and at the side corners.

During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.

Typical dwell time is 4 seconds at 250

A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.

Manual soldering

Fix the component by first soldering two
diagonally-opposite end leads. Use a low voltage (24 V or
less) soldering iron applied to the flat part of the lead.
Contact time must be limited to 10 seconds at up to
300

When using a dedicated tool, all other leads can be
soldered in one operation within 2 to 5 seconds between
270 and 320

1999 Oct 12

Philips Semiconductors

Product specification

IC card interface

TDA8002C

Suitability of surface mount IC packages for wave and reflow soldering methods

Notes

1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum

temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the

"Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods".

2. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink

(at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version).

3. If wave soldering is considered, then the package must be placed at a 45

angle to the solder wave direction.

The package footprint must incorporate solder thieves downstream and at the side corners.

4. Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8 mm;

it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.

5. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is

definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.

DEFINITIONS

LIFE SUPPORT APPLICATIONS

These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.

PACKAGE

SOLDERING METHOD

WAVE

REFLOW

(1)

BGA, SQFP

not suitable

suitable

HLQFP, HSQFP, HSOP, HTQFP, HTSSOP, SMS

not suitable

(2)

suitable

PLCC

(3)

, SO, SOJ

suitable

LQFP, QFP, TQFP

not recommended

(3)(4)

suitable

SSOP, TSSOP, VSO

not recommended

(5)

suitable

Data sheet status

Objective specification

This data sheet contains target or goal specifications for product development.

Preliminary specification

This data sheet contains preliminary data; supplementary data may be published later.

Product specification

This data sheet contains final product specifications.

Limiting values

Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.

Application information

Where application information is given, it is advisory and does not form part of the specification.

SCA

All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.

The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.

Internet: http://www.semiconductors.philips.com

1999

Philips Semiconductors a worldwide company

For all other countries apply to: Philips Semiconductors,
International Marketing & Sales Communications, Building BE-p, P.O. Box 218,
5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825

Argentina: see South America

Australia: 3 Figtree Drive, HOMEBUSH, NSW 2140,
Tel. +61 2 9704 8141, Fax. +61 2 9704 8139

Austria: Computerstr. 6, A-1101 WIEN, P.O. Box 213,
Tel. +43 1 60 101 1248, Fax. +43 1 60 101 1210

Belarus: Hotel Minsk Business Center, Bld. 3, r. 1211, Volodarski Str. 6,
220050 MINSK, Tel. +375 172 20 0733, Fax. +375 172 20 0773

Belgium: see The Netherlands

Brazil: see South America

Bulgaria: Philips Bulgaria Ltd., Energoproject, 15th floor,
51 James Bourchier Blvd., 1407 SOFIA,
Tel. +359 2 68 9211, Fax. +359 2 68 9102

Canada: PHILIPS SEMICONDUCTORS/COMPONENTS,
Tel. +1 800 234 7381, Fax. +1 800 943 0087

China/Hong Kong: 501 Hong Kong Industrial Technology Centre,
72 Tat Chee Avenue, Kowloon Tong, HONG KONG,
Tel. +852 2319 7888, Fax. +852 2319 7700

Colombia: see South America

Czech Republic: see Austria

Denmark: Sydhavnsgade 23, 1780 COPENHAGEN V,
Tel. +45 33 29 3333, Fax. +45 33 29 3905

Finland: Sinikalliontie 3, FIN-02630 ESPOO,
Tel. +358 9 615 800, Fax. +358 9 6158 0920

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Tel. +33 1 4099 6161, Fax. +33 1 4099 6427

Germany: Hammerbrookstraße 69, D-20097 HAMBURG,
Tel. +49 40 2353 60, Fax. +49 40 2353 6300

Hungary: see Austria

India: Philips INDIA Ltd, Band Box Building, 2nd floor,
254-D, Dr. Annie Besant Road, Worli, MUMBAI 400 025,
Tel. +91 22 493 8541, Fax. +91 22 493 0966

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Gedung Philips, Jl. Buncit Raya Kav.99-100, JAKARTA 12510,
Tel. +62 21 794 0040 ext. 2501, Fax. +62 21 794 0080

Ireland: Newstead, Clonskeagh, DUBLIN 14,
Tel. +353 1 7640 000, Fax. +353 1 7640 200

Israel: RAPAC Electronics, 7 Kehilat Saloniki St, PO Box 18053,
TEL AVIV 61180, Tel. +972 3 645 0444, Fax. +972 3 649 1007

Italy: PHILIPS SEMICONDUCTORS, Via Casati, 23 - 20052 MONZA (MI),
Tel. +39 039 203 6838, Fax +39 039 203 6800

Japan: Philips Bldg 13-37, Kohnan 2-chome, Minato-ku,
TOKYO 108-8507, Tel. +81 3 3740 5130, Fax. +81 3 3740 5057

Korea: Philips House, 260-199 Itaewon-dong, Yongsan-ku, SEOUL,
Tel. +82 2 709 1412, Fax. +82 2 709 1415

Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA, SELANGOR,
Tel. +60 3 750 5214, Fax. +60 3 757 4880

Mexico: 5900 Gateway East, Suite 200, EL PASO, TEXAS 79905,
Tel. +9-5 800 234 7381, Fax +9-5 800 943 0087

Middle East: see Italy

Netherlands: Postbus 90050, 5600 PB EINDHOVEN, Bldg. VB,
Tel. +31 40 27 82785, Fax. +31 40 27 88399

New Zealand: 2 Wagener Place, C.P.O. Box 1041, AUCKLAND,
Tel. +64 9 849 4160, Fax. +64 9 849 7811

Norway: Box 1, Manglerud 0612, OSLO,
Tel. +47 22 74 8000, Fax. +47 22 74 8341

Pakistan: see Singapore

Philippines: Philips Semiconductors Philippines Inc.,
106 Valero St. Salcedo Village, P.O. Box 2108 MCC, MAKATI,
Metro MANILA, Tel. +63 2 816 6380, Fax. +63 2 817 3474

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Tel. +48 22 5710 000, Fax. +48 22 5710 001

Portugal: see Spain

Romania: see Italy

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Tel. +7 095 755 6918, Fax. +7 095 755 6919

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Tel. +65 350 2538, Fax. +65 251 6500

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Slovenia: see Italy

South Africa: S.A. PHILIPS Pty Ltd., 195-215 Main Road Martindale,
2092 JOHANNESBURG, P.O. Box 58088 Newville 2114,
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04547-130 SÃO PAULO, SP, Brazil,
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Spain: Balmes 22, 08007 BARCELONA,
Tel. +34 93 301 6312, Fax. +34 93 301 4107

Sweden: Kottbygatan 7, Akalla, S-16485 STOCKHOLM,
Tel. +46 8 5985 2000, Fax. +46 8 5985 2745

Switzerland: Allmendstrasse 140, CH-8027 ZÜRICH,
Tel. +41 1 488 2741 Fax. +41 1 488 3263

Taiwan: Philips Semiconductors, 6F, No. 96, Chien Kuo N. Rd., Sec. 1,
TAIPEI, Taiwan Tel. +886 2 2134 2886, Fax. +886 2 2134 2874

Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd.,
209/2 Sanpavuth-Bangna Road Prakanong, BANGKOK 10260,
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Turkey: Yukari Dudullu, Org. San. Blg., 2.Cad. Nr. 28 81260 Umraniye,
ISTANBUL, Tel. +90 216 522 1500, Fax. +90 216 522 1813

Ukraine: PHILIPS UKRAINE, 4 Patrice Lumumba str., Building B, Floor 7,
252042 KIEV, Tel. +380 44 264 2776, Fax. +380 44 268 0461

United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes,
MIDDLESEX UB3 5BX, Tel. +44 208 730 5000, Fax. +44 208 754 8421

United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409,
Tel. +1 800 234 7381, Fax. +1 800 943 0087

Uruguay: see South America

Vietnam: see Singapore

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Tel. +381 11 62 5344, Fax.+381 11 63 5777

Printed in The Netherlands

545004/25/03/pp

Date of release:

1999 Oct 12

Document order number:

9397 750 06149

Document Outline

Ð­Ð»ÐµÐºÑ‚Ñ€Ð¾Ð½Ð½Ñ‹Ð¹ ÐºÐ¾Ð¼Ð¿Ð¾Ð½ÐµÐ½Ñ‚: TDA8002CT/A/C1

Document Outline

ÐÐ»ÐµÐºÑ‚Ñ€Ð¾Ð½Ð½Ñ‹Ð¹ ÐºÐ¾Ð¼Ð¿Ð¾Ð½ÐµÐ½Ñ‚: TDA8002CT/A/C1