1996 Sep 25

Philips Semiconductors

Product specification

Low-power smart card coupler

TDA8005

FEATURES

generation (5 V

5%, 20 mA maximum with

controlled rise and fall times)

Clock generation (up to 8 MHz), with two times
synchronous frequency doubling

Clock STOP HIGH, clock STOP LOW or 1.25 MHz (from
internal oscillator) for cards power-down mode

Specific UART on I/O for automatic direct/inverse
convention settings and error management at
character level

Automatic activation and deactivation sequences
through an independent sequencer

Supports the protocol T = 0 in accordance with
ISO 7816, GSM11.11 requirements (Global System for
Mobile communication); and EMV banking specification
approved for Final GSM11.11 Test Approval (FTA)

Several analog options are available for different
applications (doubler or tripler DC/DC converter, card
presence, active HIGH or LOW, threshold voltage
supervisor, etc.

Overloads and take-off protections

Current limitations in the event of short-circuit

Special circuitry for killing spikes during power-on or off

Supply supervisor

Step-up converter (supply voltage from 2.5 to 6 V)

Power-down and sleep mode for low-power
consumption

Enhanced ESD protections on card side
(6 kV minimum)

Control and communication through a standard RS232
full duplex interface

Optional additional I/O ports for:

keyboard

LEDs

display

etc.

80CL51 microcontroller core with 4 kbytes ROM and
256-byte RAM.

APPLICATIONS

Portable smart card readers for protocol T = 0

GSM mobile phones.

GENERAL DESCRIPTION

The TDA8005 is a low cost card interface for portable
smart card readers. Controlled through a standard serial
interface, it takes care of all ISO 7816 and GSM11-11
requirements. It gives the card and the set a very high level
of security, due to its special hardware against ESD,
short-circuiting, power failure, etc. Its integrated step-up
converter allows operation within a supply voltage range of
2.5 to 6 V.

The very low-power consumption in Power-down and
sleep modes saves battery power. A special version where
the internal connections to the controller are fed outside
through pins allows easy development and evaluation,
together with a standard 80CL51 microcontroller.

Development tools, application report and support
(hardware and software) are available.

The device can be supplied either as a masked chip with
standard software handling all communication between
smart card and a master controller in order to make the
application easier, or as a maskable device.

1996 Sep 25

Philips Semiconductors

Product specification

Low-power smart card coupler

TDA8005

QUICK REFERENCE DATA

ORDERING INFORMATION

SYMBOL

PARAMETER

CONDITIONS

MIN.

TYP.

MAX.

UNIT

supply voltage

doubler and tripler option

2.5

6.0

DD(pd)

supply current in power-down mode

= 5 V; card inactive

100

DD(sm)

supply current in sleep mode doubler card powered but clock

stopped

500

DD(sm)

supply current in sleep mode tripler

card powered but clock
stopped

500

DD(om)

supply current in operating mode

unloaded; f

xtal

= 13 MHz;

= 6.5 MHz;

card

= 3.25 MHz

5.5

card supply voltage

including static and
dynamic loads on 100 nF
capacitor

4.75

5.0

5.25

card supply current

operating

limitation

slew rate on V

(rise and fall)

maximum load capacitor
150 nF (including typical
100 nF decoupling)

0.05

0.1

0.15

deactivation cycle duration

100

act

activation cycle duration

100

xtal

crystal frequency

MHz

amb

operating ambient temperature

+85

TYPE

NUMBER

PACKAGE

NAME

DESCRIPTION

VERSION

TDA8005G

LQFP64

plastic low profile quad flat package; 64 leads; body 10

1.4 mm

SOT314-2

TDA8005H

QFP44

plastic quad flat package; 44 leads (lead length 1.3 mm);
body 10

1.75 mm

SOT307-2

1996 Sep 25

Philips Semiconductors

Product specification

Low-power smart card coupler

TDA8005

PINNING

SYMBOL

PIN

DESCRIPTION

LQFP64

SOT314-2

QFP44

SOT307-2

n.c.

not connected

AGND

analog ground

contact 3 for the step-up converter

output port from port extension

P03

general purpose I/O port (connected to P03)

P02

general purpose I/O port (connected to P02)

P01

general purpose I/O port (connected to P01)

n.c.

not connected

P00

general purpose I/O port (connected to P00)

DDD

digital supply voltage

n.c.

not connected

TEST1

test pin 1 (connected to P10; must be left open-circuit in the application)

P11

general purpose I/O port or interrupt (connected to P11)

P12

general purpose I/O port or interrupt (connected to P12)

P13

general purpose I/O port or interrupt (connected to P13)

P14

general purpose I/O port or interrupt (connected to P14)

n.c.

not connected

P15

general purpose I/O port or interrupt (connected to P15)

P16

general purpose I/O port or interrupt (connected to P16)

TEST2

test pin 2 (connected to PSEN; must be left open-circuit in the application)

P17

general purpose I/O port or interrupt (connected to P17)

RESET

input for resetting the microcontroller (active HIGH)

n.c.

not connected

n.c.

not connected

n.c.

not connected

n.c.

not connected

n.c.

not connected

RxD

serial interface receive line

TxD

serial interface transmit line

INT1

general purpose I/O port or interrupt (connected to P33)

general purpose I/O port (connected to P34)

AUX1

push-pull auxiliary output (

5 mA; connected to timer T1 e.g. P35)

AUX2

push-pull auxiliary output (

5 mA; connected to timer P36)

P37

general purpose I/O port (connected to P37)

XTAL2

crystal connection

XTAL1

crystal connection or external clock input

DGND

digital ground

n.c.

not connected

1996 Sep 25

Philips Semiconductors

Product specification

Low-power smart card coupler

TDA8005

n.c.

not connected

P20

general purpose I/O port (connected to P20)

P21

general purpose I/O port (connected to P21)

P22

general purpose I/O port (connected to P22)

P23

general purpose I/O port (connected to P23)

ALARM

open-drain output for Power-On Reset (active HIGH or LOW by mask option)

n.c.

not connected

DELAY

external capacitor connection for delayed reset signal

PRES

card presence contact input (active HIGH or LOW by mask option)

TEST3

test pin 3 (must be left open-circuit in the application)

output port from port extension

TEST4

test pin 4 (must be left open-circuit in the application)

I/O

data line to/from the card (ISO C7 contact)

RST

card reset output (ISO C2 contact)

CLK

clock output to the card (ISO C3 contact)

card supply output voltage (ISO C1 contact)

LIS

supply for low-impedance on cards contacts

contact 5 for the step-up converter

contact 2 for the step-up converter

contact 4 for the step-up converter

DDA

analog supply voltage

contact 1 for the step-up converter

SYMBOL

PIN

DESCRIPTION

LQFP64

SOT314-2

QFP44

SOT307-2

1996 Sep 25

Philips Semiconductors

Product specification

Low-power smart card coupler

TDA8005

FUNCTIONAL DESCRIPTION

Microcontroller

The microcontroller is an 80CL51 with 256 bytes of RAM
instead of 128. The baud rate of the UART has been
multiplied by four in modes 1, 2 and 3 (which means that
the division factor of 32 in the formula is replaced by 8 in
both reception and transmission, and that in the reception
modes, only four samples per bit are taken with decision
on the majority of samples 2, 3 and 4) and the delay
counter has been reduced from 1536 to 24.

Remark: this has an impact when getting out of
PDOWN mode. It is recommended to switch to internal
clock before entering PDOWN mode
(see

"application report").

All the other functions remain unchanged. Please, refer to
the published specification of the 80CL51 for any further
information. Pins INT0, P10, P04 to P07 and P24 to P27
are used internally for controlling the smart card interface.

Mode 0 is unchanged. The baud rate for modes 1 and 3 is:

The baud rate for mode 2 is:

Table 1

Mode 3 timing

BAUD

RATE

clk

= 6.5 MHz;

= 5 V

clk

= 3.25 MHz;

= 5 or 3 V

SMOD

TH1

SMOD

TH1

135416

255

67708

255

45139

253

33854

254

255

27083

251

22569

253

16927

254

13542

251

11285

250

253

SMOD

------------------

clk

256

TH1

)

(

--------------------------------------------------

SMOD

------------------

clk

Supply

The circuit operates within a supply voltage range of
2.5 to 6 V. The supply pins are V

DDD

, DGND and AGND.

Pins V

DDA

and AGND supply the analog drivers to the card

and have to be externally decoupled because of the large
current spikes that the card and the step-up converter can
create. An integrated spike killer ensures the contacts to
the card remain inactive during power-up or power-down.
An internal voltage reference is generated which is used
within the step-up converter, the voltage supervisor, and
the V

generator.

The voltage supervisor generates an alarm pulse, whose
length is defined by an external capacitor tied to the
DELAY pin, when V

DDD

is too low to ensure proper

operation (1 ms per 1 nF typical). This pulse is used as a
RESET pulse by the controller, in parallel with an external
RESET input, which can be tied to the system controller.

It is also used in order to either block any spurious card
contacts during controllers reset, or to force an automatic
deactivation of the contacts in the event of supply drop-out
[see Sections "Activation sequence" and "Deactivation
sequence (see Fig.10)"].

In the 64 pin version, this reset pulse is output to the open
drain ALARM pin, which may be selected active HIGH or
active LOW by mask option and may be used as a reset
pulse for other devices within the application.

1996 Sep 25

Philips Semiconductors

Product specification

Low-power smart card coupler

TDA8005

Fig.4 Supply supervisor.

handbook, full pagewidth

MBH634

Vth1

Vhys1

Vth1

Vth2

VDEL

ALARM

Low impedance supply (pin LIS)

For some applications, it is mandatory that the contacts to
the card (V

, RST, CLK and I/O) are low impedance while

the card is inactive and also when the coupler is not
powered. An auxiliary supply voltage on pin LIS ensures
this condition where I

LIS

= <5

A for V

LIS

= 5 V. This low

impedance situation is disabled when V

starts rising

during activation, and re-enabled when the step-up
converter is stopped during deactivation. If this feature is
not required, the LIS pin must be tied to V

Step-up converter

Except for the V

generator, and the other cards contacts

buffers, the whole circuit is powered by V

DDD

and V

DDA

If the supply voltage is 3 V or 5 V, then a higher voltage is
needed for the ISO contacts supply. When a card session
is requested by the controller, the sequencer first starts the
step-up converter, which is a switched capacitors type,
clocked by an internal oscillator at a frequency
approximately 2.5 MHz. The output voltage, V

, is

regulated at approximately 6,5 V and then fed to the V

generator. V

and GND are used as a reference for all

other cards contacts. The step-up converter may be

chosen as a doubler or a tripler by mask option, depending
on the voltage and the current needed on the card.

ISO 7816 security

The correct sequence during activation and deactivation of
the card is ensured through a specific sequencer, clocked
by a division ratio of the internal oscillator.

Activation (START signal P05) is only possible if the card
is present (PRES HIGH or LOW according to mask
option), and if the supply voltage is correct (ALARM signal
inactive), CLK and RST are controlled by RSTIN (P04),
allowing the correct count of CLK pulses during
Answer-to-Reset from the card.

The presence of the card is signalled to the controller by
the OFF signal (P10).

During a session, the sequencer performs an automatic
emergency deactivation in the event of card take-off,
supply voltage drop, or hardware problems. The OFF
signal falls thereby warning the controller.

1996 Sep 25

Philips Semiconductors

Product specification

Low-power smart card coupler

TDA8005

Clock circuitry

The clock to the microcontroller and the clock to the card
are derived from the main clock signal (XTAL from
2 to 16 MHz, or an external clock signal).

Microcontroller clock (f

clk

) after reset, and during power

reduction modes, the microcontroller is clocked with f

INT

/8,

which is always present because it is derived from the
internal oscillator and gives the lowest power
consumption. When required, (for card session, serial
communication or anything else) the microcontroller may
choose to clock itself with

xtal

INT

All frequency changes are synchronous, thereby ensuring
no hang-up due to short spikes etc.

Cards clock: the microcontroller may select to send the
card

xtal

INT

(

1.25 MHz), or to stop

the clock HIGH or LOW. All transition are synchronous,
ensuring correct pulse length during start or change in
accordance with ISO 7816.

After power on, CLK is set at STOP LOW, and f

clk

is set at

INT.

Power-down and sleep modes

The TDA8005 offers a large flexibility for defining power
reduction modes by software. Some configurations are
described below.

In the power-down mode, the microcontroller is in
power-down and the supply and the internal oscillator are

active. The card is not active; this is the smallest power
consumption mode. Any change on P1 ports or on PRES
will wake-up the circuit (for example, a key pressed on the
keyboard, the card inserted or taken off).

In the sleep mode, the card is powered, but configured in
the Idle or sleep mode. The step-up converter will only be
active when it is necessary to reactivate V

. When the

microcontroller is in Power-down mode any change on P1
ports or on PRES will wake up the circuit.

In both power reduction modes the sequencer is active,
allowing automatic emergency deactivation in the event of
card take-off, hardware problems, or supply drop-out.

The TDA8005 is set into Power-down or sleep mode by
software. There are several ways to return to normal
mode, Introduction or extraction of the card, detection of a
change on P1 (which can be a key pressed) or a command
from the system microcontroller. For example, if the
system monitors the clock on XTAL1, it may stop this clock
after setting the device into power-down mode and then
wake it up when sending the clock again. In this situation,
the internal clock should have been chosen before the f

clk

Peripheral interface

This block allows synchronous serial communication with
the three peripherals (ISO UART, CLOCK CIRCUITRY
and OUTPUT PORTS EXTENSION).

Fig.5 Peripheral interface diagram.

handbook, full pagewidth

MBH635

CC0 CC1 CC2 CC3 CC4 CC5 CC6 CC7

clock configuration

RESET

UC0 UC1 UC2 UC3 UC4 UC5 UC6 UC7

Uart configuration

UT0 UT1 UT2 UT3 UT4 UT5 UT6 UT7

Uart transmit

UR0 UR1 UR2 UR3 UR4 UR5 UR6 UR7

Uart receive

PERIPHERAL CONTROL

US0 US1 US2 US3 US4 US5 US6 US7

Uart status register

PE0 PE1 PE2 PE3 PE4 PE5 PE6 PE7

ports extension

P07

ENABLE

P06

STROBE

P24

DATA

P27

REG0

P26

REG1

P25

R/W

P32

INT

1996 Sep 25

Philips Semiconductors

Product specification

Low-power smart card coupler

TDA8005

Table 2

Description of Fig.5

BIT NAME

DESCRIPTION

REG0 = 0, REG1 = 0, R/W = 0; CLOCK CONFIGURATION

(Configuration after reset is cards clock STOP LOW, f

clk

INT

)

CC0

cards clock =

xtal

CC1

cards clock =

xtal

CC2

cards clock =

xtal

CC3

cards clock =

INT

CC4

cards clock = STOP HIGH

CC5

clk

xtal

CC6

clk

xtal

CC7

clk

INT

REG0 = 1, REG1 = 0, R/W = 0; UART CONFIGURATION (after reset all bits are cleared)

UC0

ISO UART RESET

UC1

START SESSION

UC2

LCT (Last Character to Transmit)

UC3

TRANSMIT/RECEIVE

UC4 to UC7

not used

REG0 = 0, REG1 = 1, R/W = 0; UART TRANSMIT

UT0 to UT7

LSB to MSB of the character to be transmitted to the card

REG0 = 1, REG1 = 1, R/W = 0; PORTS EXTENSION (after reset all bits are cleared)

PE0 to PE5

PE0 to PE5 is the inverse of the value to be written on K0 to K5

PE6, PE7

not used

REG0 = 0, REG1 = 0, R/W = 1; UART RECEIVE

UR0 to UR7

LSB to MSB of the character received from the card

REG0 = 1, REG1 = 0, R/W = 1; UART STATUS REGISTER (after reset all bits are cleared)

US0

UART TRANSMIT buffer empty

US1

UART RECEIVE buffer full

US2

first start bit detected

US3

parity error detected during reception of a character (the UART has asked the card to repeat the
character)

US4

parity error detected during transmission of a character. The controller must write the previous
character in UART TRANSMIT, or abort the session.

US5 to US7

not used

1996 Sep 25

Philips Semiconductors

Product specification

Low-power smart card coupler

TDA8005

SE OF PERIPHERAL INTERFACE

Write operation:

Select the correct register with R/W, REG0, REG1.

Write the word in the peripheral shift register (PSR) with
DATA and STROBE. DATA is shifted on the rising edge
of STROBE. 8 shifts are necessary.

Give a negative pulse on ENABLE. The data is parallel
loaded in the register on the falling edge of ENABLE.

Read operation:

Select the correct register with R/W, REG0 and REG1.

Give a first negative pulse on ENABLE. The word is
parallel loaded in the peripheral shift register on the
rising edge of ENABLE.

Give a second negative pulse on ENABLE for
configuring the PSR in shift right mode.

Read the word from PSR with DATA and STROBE.
DATA is shifted on the rising edge of STROBE. 7 shifts
are necessary.

Table 3

Example of peripheral interface

Notes

1. The new configuration is supposed to be in the accumulator.

2. The character will be in the accumulator.

CHANGE OF CLOCK CONFIGURATION

(1)

READ CHARACTER ARRIVED IN UART RECEIVE

(2)

CLR REG0

CLR REG1

CLR R/W

SET R/W

MOV R2, #8

CLR ENABLE

LOOP

RRC A

SET ENABLE

MOV DATA C

CLR ENABLE

CLR STROBE

SET ENABLE

SET STROBE

MOV R2, #8

DJNZ R2, LOOP

LOOP

MOV C, DATA

CLR ENABLE

RRC A

SET ENABLE

CLR STROBE

SET DATA

SET STROBE

RET

DJNZ R2, LOOP

SET DATA

RET

1996 Sep 25

Philips Semiconductors

Product specification

Low-power smart card coupler

TDA8005

ISO UART

The ISO UART handles all the specific requirements
defined in ISO T = 0 protocol type. It is clocked with the
cards clock, which gives the f

clk

/31 sampling rate for start

bit detection (the start bit is detected at the first LOW level
on I/O) and the f

clk

/372 frequency for ETU timing (in the

reception mode the bit is sampled at

ETU). It also allows

the cards clock frequency changes without interfering with
the baud rate.

This hardware UART allows operating of the
microcontroller at low frequency, thus lowering EM
radiations and power consumption. It also frees the
microcontroller of fastidious conversions and real time jobs
thereby allowing the control of higher level tasks.

The following occurs in the reception mode (see Fig.6):

Detection of the inverse or direct convention at the begin
of ATR.

Automatic convention setting, so the microcontroller
only receives characters in direct convention.

Parity checking and automatic request for character
repetition in case of error (reception is possible at
12 ETU).

In the transmission mode (see Fig.7):

Transmission according to the convention detected
during ATR, consequently the microcontroller only has
to send characters in direct convention. Transmission of
the next character may start at 12 ETU in the event of no
error or 13 ETU in case of error.

Parity calculation and detection of repetition request
from the card in the event of error.

The bit LCT (Last Character to Transmit) allows fast
reconfiguration for receiving the answer 12 ETU after
the start bit of the last transmitted character.

The ISO UART status register can inform which event has
caused an interrupt. (Buffer full, buffer empty, parity error
detected etc.) cf Peripheral Interface.

This register is reset when the microcontroller reads the
status out of it.

The ISO UART configuration register enables the
microcontroller to configure the ISO UART. cf Peripheral
Interface.

After power-on, all ISO UART registers are reset.

The ISO UART is configured in the reception mode. When
the microcontroller wants to start a session, it sets the bits
START SESSION and RESET ISO UART in UART
CONFIGURATION and then sets START LOW. When the
first start bit on I/O is detected (sampling rate f

clk

/31), the

UART sets the bit US2 (First Start Detect) in the status
register which gives an interrupt on INT0 one CLK pulse
later.

The convention is recognized on the first character of the
ATR and the UART configures itself in order to exchange
direct data without parity processing with the
microcontroller whatever the convention of the card is.
The bit START SESSION must be reset by software. At
the end of every character, the UART tests the parity and
resets what is necessary for receiving another character.

If no parity error is detected, the UART sets the bit US1
(BUFFER FULL) in the STATUS REGISTER which warns
the microcontroller it has to read the character before the
reception of the next one has been completed. The
STATUS REGISTER is reset when read from the
controller.

If a parity error has been detected, the UART pulls the I/O
line LOW between 10.5 and 12 ETU. It also sets the bits
BUFFER FULL and US3 (parity error during reception) in
the STATUS REGISTER which warns the microcontroller
that an error has occurred. The card is supposed to repeat
the previous character.

1996 Sep 25

Philips Semiconductors

Product specification

Low-power smart card coupler

TDA8005

Fig.6 ISO UART reception flow chart.

(1) The start session is reset by software.

(2) The software may load the received character in the peripheral

control at any time without any action on the ISO UART.

handbook, full pagewidth

MBH636

CONVERT AND LOAD CHARACTER

IN RECEPTION BUFFER AT 10 ETU

CHECK PARITY

(2)

(1)

parity error

DISABLE I/O BUFFER BETWEEN

10 AND 12 ETU

SET BIT BUFFER FULL AT 10 ETU

RESET RECEPTION PART AT 12 ETU

SET BIT RECEPTION PARITY

ERROR AT 10 ETU

PULL I/O LINE LOW FROM

10.5 TILL 11.75 ETU

5th bit

SET CONVENTION

IF START SESSION = 1

SET FSD STATUS REGISTER

IN FSD IS ENABLED

RESET EN FSD

T/R =1

SAMPLE I/O AT 186

AND EVERY 372 CLK

SAMPLE I/O EVERY 31 CLK

INHIBIT I/O DURING 200 CLK

SET ENABLE FSD

start session

and T/R = 0

10th bit

I/O = 0

clock starts

T/R = 0

LCT = 1

When the controller needs to transmit data to the card, it
first sets the bit UC3 in the UART CONFIGURATION
which configures the UART in the transmission mode.
As soon as a character has been written in the UART
TRANSMIT register, the UART makes the conversion,

calculates the parity and starts the transmission on the
rising edge of ENABLE. When the character has been
transmitted, it surveys the I/O line at 11 ETU in order to
know if an error has been detected by the card.

1996 Sep 25

Philips Semiconductors

Product specification

Low-power smart card coupler

TDA8005

If no error has occurred, the UART sets the bit US0
(BUFFER EMPTY) in the STATUS REGISTER and waits
for the next character. If the next character has been
written before 12 ETU, the transmission will start at
12 ETU. If it was written after 12 ETU it will start on the
rising edge of ENABLE.

If an error has occurred, it sets the bits BUFFER EMPTY
and US4 (parity error during transmission) which warns
the microcontroller to rewrite the previous character in the
UART TRANSMIT register. If the character has been
rewritten before 13 ETU, the transmission will start at

13 ETU. If it has been written after 13 ETU it will start on
the rising edge of ENABLE.

When the transmission is completed, the microcontroller
may set the bit LCT (Last Character to Transmit) so that
the UART will force the reception mode into ready to get
the reply from the card at 12 ETU. This bit must be reset
before the end of the first reception. The bit T/R must be
reset to enable the reception of the following characters.

When the session is completed, the microcontroller
re-initializes the whole UART by resetting the bit RESET
ISO UART.

Fig.7 ISO UART transmission flow chart.

(1) The transmit register may be loaded just after reading from the status register.

(2) The software must reset the last character but before completion of the first received character.

handbook, full pagewidth

MBH637

SET TRANSMIT ENABLE

CONVERT, CALCULATE PARITY

AND LOAD IN TRANSMIT

SHIFT REGISTER

SAMPLE I/O AT 11 ETU

SET BIT TRANSMISSION PARITY

ERROR AND BUFFER EMPTY

AT 11 ETU

RESET TRANSMIT PART AND

ENABLE TRANSMIT AT 13 ETU

SHIFT EVERY ETU IF TRANSMIT

ENABLE IS SET

transmit register selected

T/R

T/R = 0

LCT = 1

10th bit shifted

(1)

(2)

SET I/O BUFFER IN

RECEPTION AT 10 ETU

SET BIT BUFFER EMPTY

AT 11 ETU

RESET TRANSMIT PART AND

ENABLE TRANSMIT AT 12 ETU

RESET TRANSMIT PART AT 11 ETU

FORCE RECEPTION MODE

parity error

1996 Sep 25

Philips Semiconductors

Product specification

Low-power smart card coupler

TDA8005

I/O buffer modes (see Fig.8)

The following are the I/O buffer modes:

1. I/O buffer disabled by ENIO.

2. I/O buffer in input, 20 k

pull-up resister connected

between I/O and V

, I/O masked till 200 clock pulses.

3. I/O buffer in input, 20 k

pull-up resister connected

between I/O and V

, I/O is sampled every 31 clock

pulses.

4. I/O buffer in output, 20 k

pull-up resister connected

between I/O and V

5. I/O buffer in output, I/O is pulled LOW by the N

transistor of the buffer.

6. I/O buffer in output, I/O is strongly HIGH or LOW by the

P or N transistor.

Output ports extension

In the LQFP64 version, 6 auxiliary output ports may be
used for low frequency tasks (for example, keyboard
scanning). These ports are push-pull output types (cf use
in software document).

Activation sequence

When the card is inactive, V

, CLK, RST and I/O are

LOW, with low impedance with respect to GND. The
step-up converter is stopped. The I/O is configured in the
reception mode with a high impedance path to the ISO
UART, subsequently no spurious pulse from the card
during power-up will be taken into account until I/O is
enabled. When everything is satisfactory (voltage supply,
card present, no hardware problems), the microcontroller
may initiate an activation sequence by setting START
LOW (t

The step-up converter is started (t

)

LIS signal is disabled by ENLI, and V

starts rising from

0 to 5 V with a controlled rise time of 0.1 V/

s typically

)

I/O buffer is enabled (t

)

Clock is sent to the card (t

)

RST buffer is enabled (t

In order to allow a precise count of clock pulses during
ATR, a defined time window (t

; t

) is opened where the

clock may be sent to the card by means of RSTIN. Beyond
this window, RSTIN has no more action on clock, and only
monitors the cards RST contact (RST is the inverse of
RSTIN).

The sequencer is clocked by f

INT

/64 which leads to a time

interval T of 25

s typical. Thus t

= 0 to

= t

3T, t

= t

+ 4T, t

= t

to t

and t

= t

+ 7T

(see Fig.9).

Deactivation sequence (see Fig.10)

When the session is completed, the microcontroller sets
START HIGH. The circuit then executes an automatic
deactivation sequence:

Card reset (RST falls LOW) at t

Clock is stopped at t

I/O becomes high impedance to the ISO UART (t

)

falls to 0 V with typical 0.1 V/

s slew rate (t

)

The step-up converter is stopped and CLK, RST, V

and I/O become low impedance to GND (t

T; t

= t

T; t

= t

+ T; t

= t

3T;

= t

+ 5T.

Protections

Main hardware fault conditions are monitored by the circuit

Overcurrent on V

Short circuits between V

and other contacts

Card take-off during transaction.

When one of these problems is detected, the security logic
block pulls the interrupt line OFF LOW, in order to warn the
microcontroller, and initiates an automatic deactivation of
the contacts. When the deactivation has been completed,
the OFF line returns HIGH, except if the problem was due
to a card extraction in which case it remains LOW till a card
is inserted.

1996 Sep 25

Philips Semiconductors

Product specification

Low-power smart card coupler

TDA8005

LIMITING VALUES

In accordance with the Absolute Maximum Rating System (IEC 134).

HANDLING

Inputs and outputs are protected against electrostatic discharge in normal handling. However, to be totally safe, it is
desirable to take normal precautions appropriate to handling MOS devices.

THERMAL CHARACTERISTICS

SYMBOL

PARAMETER

CONDITIONS

MIN.

MAX.

UNIT

DDA

analog supply voltage

6.5

DDD

digital supply voltage

6.5

all input voltages

+ 0.5

DC current into XTAL1, XTAL2, RX, TX,
RESET, INT1, P34, P37, P00 to P03,
P11 to P17, P20 to P23 and
TEST1 to TEST4

DC current from or to AUX1, AUX2

+10

DC current from or to S1 to S5

+30

DC current into DELAY

+10

DC current from or to PRES

DC current from and to K0 to K5

DC current from or into ALARM
(according to option choice)

tot

continuous total power dissipation

amb

20 to +85

500

stg

IC storage temperature

+150

electrostatic discharge

on pins I/O, V

RST, CLK and PRES

on other pins

Operating Junction Temp.

125

SYMBOL

PARAMETER

VALUE

UNIT

th j-a

from junction to ambient in free air

LQFP64

K/W

QFP44

K/W

1996 Sep 25

Philips Semiconductors

Product specification

Low-power smart card coupler

TDA8005

CHARACTERISTICS

= 5 V; V

= 0 V; T

amb

= 25

C; for general purpose I/O ports see 80CL51 data sheet; unless otherwise specified.

SYMBOL

PARAMETER

CONDITIONS

MIN.

TYP.

MAX.

UNIT

Supply

supply voltage

Option dependant

2.5

6.0

DD(pd)

supply current power-down
mode

= 5 V; card inactive

= 3V;

DD(sm)

supply current sleep mode

card powered, but with clock
stopped

500

DD(om)

supply current operating mode unloaded; f

xtal

= 13 MHz;

clk

= 6.5 MHz; f

card

= 3.25 MHz

5.5

= 3 V; f

xtal

= 13 MHz;

clk

= 3.25 MHz; f

card

= 3.25 MHz

th1

threshold voltage on V

(falling)

supervisor option

2.3

2.45

3.8

4.5

hys1

hysteresis on V

th1

350

th2

threshold voltage on DELAY

1.38

DEL

voltage on pin DELAY

4.6

DEL

output current at DELAY

pin grounded (charge)

1.5

0.4

DEL

= V

(discharge)

6.8

ALARM pulse width

DEL

= 10 nF

ALARM (open drain active HIGH or LOW output)

HIGH level output current

active LOW option; V

= 5 V

LOW level output voltage

active LOW option; I

= 2 mA

0.4

LOW level output current

active HIGH option, V

= 0 V

HIGH level output voltage

active HIGH option, I

2 mA

Crystal oscillator (note 1)

xtal

crystal frequency

MHz

EXT

external frequency applied on
XTAL1

MHz

Step-up converter

INT

oscillation frequency

MHz

voltage on S5

6.5

Low impedance supply (LIS)

LIS

voltage on LIS

LIS

current at LIS

1996 Sep 25

Philips Semiconductors

Product specification

Low-power smart card coupler

TDA8005

Reset output to the card (RST)

inactive

output voltage

when inactive

0.3

0.4

when LIS is used; I

inactive

= 1 mA

0.3

0.4

inactive

current from RST when
inactive and pin grounded

LOW level output voltage

= 200

0.25

0.4

HIGH level output voltage

200

+ 0.3 V

rise time

= 30 pF

fall time

= 30 pF

Clock output to the card (CLK)

inactive

output voltage

when inactive

0.3

0.4

when LIS is used; I

inactive

= 1 mA

0.3

0.4

inactive

current from CLK when
inactive and pin grounded

LOW level output voltage

= 200

0.25

0.4

HIGH level output voltage

200

0.5

+0.25 V

rise time

= 30 pF

fall time

= 30 pF

clk

clock frequency

1 MHz Idle configuration

1.5

MHz

low operating speed

MHz

middle operating speed

MHz

high operating speed

MHz

duty cycle

= 30 pF

Card supply voltage (V

)

inactive

output voltage

when inactive

0.3

0.4

when LIS is used; I

inactive

= 1 mA

0.3

0.4

inactive

current from VCC when
inactive and pin grounded

output voltage in active mode
with 100 nF capacitor;

static load (up to 20 mA)
dynamic current of 40 nA

max

= 200 mA, f

max

= 5 MHz, and

duration <400 ns

4.75
4.5

5.25
5.5

output current

= 5V

shorted to GND

slew rate

up or down
(max capacitance is 150 nF)

0.04

0.1

0.16

SYMBOL

PARAMETER

CONDITIONS

MIN.

TYP.

MAX.

UNIT

1996 Sep 25

Philips Semiconductors

Product specification

Low-power smart card coupler

TDA8005

Note

1. The crystal oscillator is the same as OPTION 3 of the 80CL51.

Data line (I/O)

inactive

output voltage

when inactive

0.3

0.4

when LIS is used; I

inactive

= 1 mA

0.3

0.4

inactive

current from I/O when inactive
and pin grounded

LOW level output voltage (I/O
configured as an output)

= 1 mA

0.25

0.3

HIGH level output voltage (I/O
configured as an output)

100

+0.8

+0.25 V

input voltage LOW (I/O
configured as an input)

= 1 mA

0.5

input voltage HIGH (I/O
configured as an input)

= 100

+0.6

rise time

= 30 pF

fall time

= 30 pF

pull-up resistor connected to
V

when I/O is input

see Table 4 for options

Protections

CC(sd)

shutdown current at V

Timing

act

activation sequence duration

225

deactivation sequence
duration

150

3(start)

start of the window for sending
clock to the card

130

5(end)

end of the window for sending
clock to the card

140

Auxiliary outputs (AUX1, AUX2)

LOW level output voltage

= 5 mA

0.4

HIGH level output voltage

5 mA

Output ports from extension (K0 to Kn)

LOW level output voltage

= 2 mA

0.4

HIGH level output voltage

2 mA

Card presence input (PRES)

LOW level input voltage

1 mA

0.6

HIGH level input voltage

= 100

0.7V

HIGH level input current

=+5V

0.2

SYMBOL

PARAMETER

CONDITIONS

MIN.

TYP.

MAX.

UNIT

1996 Sep 25

Philips Semiconductors

Product specification

Low-power smart card coupler

TDA8005

SOLDERING

Introduction

There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.

This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our

"IC Package Databook" (order code 9398 652 90011).

Reflow soldering

Reflow soldering techniques are suitable for all LQFP and
QFP packages.

The choice of heating method may be influenced by larger
plastic QFP packages (44 leads, or more). If infrared or
vapour phase heating is used and the large packages are
not absolutely dry (less than 0.1% moisture content by
weight), vaporization of the small amount of moisture in
them can cause cracking of the plastic body. For more
information, refer to the Drypack chapter in our

"Quality

Reference Handbook" (order code 9397 750 00192).

Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.

Several techniques exist for reflowing; for example,
thermal conduction by heated belt. Dwell times vary
between 50 and 300 seconds depending on heating
method. Typical reflow temperatures range from
215 to 250

Preheating is necessary to dry the paste and evaporate
the binding agent. Preheating duration: 45 minutes at
45

Wave soldering

Wave soldering is not recommended for LQFP or QFP
packages. This is because of the likelihood of solder
bridging due to closely-spaced leads and the possibility of
incomplete solder penetration in multi-lead devices.

If wave soldering cannot be avoided, the following
conditions must be observed:

A double-wave (a turbulent wave with high upward
pressure followed by a smooth laminar wave)
soldering technique should be used.

The footprint must be at an angle of 45

to the board

direction and must incorporate solder thieves
downstream and at the side corners.

Even with these conditions:

Do not consider wave soldering LQFP packages
LQFP48 (SOT313-2), LQFP64 (SOT314-2) or
LQFP80 (SOT315-1).

Do not consider wave soldering QFP packages
QFP52 (SOT379-1), QFP100 (SOT317-1),
QFP100 (SOT317-2), QFP100 (SOT382-1) or
QFP160 (SOT322-1).

During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.

Maximum permissible solder temperature is 260

C, and

maximum duration of package immersion in solder is
10 seconds, if cooled to less than 150

C within

6 seconds. Typical dwell time is 4 seconds at 250

A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.

Repairing soldered joints

Fix the component by first soldering two diagonally-
opposite end leads. Use only a low voltage soldering iron
(less than 24 V) applied to the flat part of the lead. Contact
time must be limited to 10 seconds at up to 300

C. When

using a dedicated tool, all other leads can be soldered in
one operation within 2 to 5 seconds between
270 and 320

1996 Sep 25

Philips Semiconductors

Product specification

Low-power smart card coupler

TDA8005

DEFINITIONS

LIFE SUPPORT APPLICATIONS

These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.

Data sheet status

Objective specification

This data sheet contains target or goal specifications for product development.

Preliminary specification

This data sheet contains preliminary data; supplementary data may be published later.

Product specification

This data sheet contains final product specifications.

Limiting values

Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.

Application information

Where application information is given, it is advisory and does not form part of the specification.

Internet: http://www.semiconductors.philips.com

Philips Semiconductors a worldwide company

SCA51

All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.

The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.

Netherlands: Postbus 90050, 5600 PB EINDHOVEN, Bldg. VB,
Tel. +31 40 27 82785, Fax. +31 40 27 88399

New Zealand: 2 Wagener Place, C.P.O. Box 1041, AUCKLAND,
Tel. +64 9 849 4160, Fax. +64 9 849 7811

Norway: Box 1, Manglerud 0612, OSLO,
Tel. +47 22 74 8000, Fax. +47 22 74 8341

Philippines: Philips Semiconductors Philippines Inc.,
106 Valero St. Salcedo Village, P.O. Box 2108 MCC, MAKATI,
Metro MANILA, Tel. +63 2 816 6380, Fax. +63 2 817 3474

Poland: Ul. Lukiska 10, PL 04-123 WARSZAWA,
Tel. +48 22 612 2831, Fax. +48 22 612 2327

Portugal: see Spain

Romania: see Italy

Russia: Philips Russia, Ul. Usatcheva 35A, 119048 MOSCOW,
Tel. +7 095 926 5361, Fax. +7 095 564 8323

Singapore: Lorong 1, Toa Payoh, SINGAPORE 1231,
Tel. +65 350 2538, Fax. +65 251 6500

Slovakia: see Austria

Slovenia: see Italy

South Africa: S.A. PHILIPS Pty Ltd., 195-215 Main Road Martindale,
2092 JOHANNESBURG, P.O. Box 7430 Johannesburg 2000,
Tel. +27 11 470 5911, Fax. +27 11 470 5494

South America: Rua do Rocio 220, 5th floor, Suite 51,
04552-903 São Paulo, SÃO PAULO - SP, Brazil,
Tel. +55 11 821 2333, Fax. +55 11 829 1849

Spain: Balmes 22, 08007 BARCELONA,
Tel. +34 3 301 6312, Fax. +34 3 301 4107

Sweden: Kottbygatan 7, Akalla, S-16485 STOCKHOLM,
Tel. +46 8 632 2000, Fax. +46 8 632 2745

Switzerland: Allmendstrasse 140, CH-8027 ZÜRICH,
Tel. +41 1 488 2686, Fax. +41 1 481 7730

Taiwan: PHILIPS TAIWAN Ltd., 23-30F, 66,
Chung Hsiao West Road, Sec. 1, P.O. Box 22978,
TAIPEI 100, Tel. +886 2 382 4443, Fax. +886 2 382 4444

Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd.,
209/2 Sanpavuth-Bangna Road Prakanong, BANGKOK 10260,
Tel. +66 2 745 4090, Fax. +66 2 398 0793

Turkey: Talatpasa Cad. No. 5, 80640 GÜLTEPE/ISTANBUL,
Tel. +90 212 279 2770, Fax. +90 212 282 6707

Ukraine: PHILIPS UKRAINE, 4 Patrice Lumumba str., Building B, Floor 7,
252042 KIEV, Tel. +380 44 264 2776, Fax. +380 44 268 0461

United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes,
MIDDLESEX UB3 5BX, Tel. +44 181 730 5000, Fax. +44 181 754 8421

United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409,
Tel. +1 800 234 7381

Uruguay: see South America

Vietnam: see Singapore

Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD,
Tel. +381 11 825 344, Fax.+381 11 635 777

For all other countries apply to: Philips Semiconductors, Marketing & Sales Communications,
Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825

Argentina: see South America

Australia: 34 Waterloo Road, NORTH RYDE, NSW 2113,
Tel. +61 2 9805 4455, Fax. +61 2 9805 4466

Austria: Computerstr. 6, A-1101 WIEN, P.O. Box 213,
Tel. +43 1 60 101, Fax. +43 1 60 101 1210

Belarus: Hotel Minsk Business Center, Bld. 3, r. 1211, Volodarski Str. 6,
220050 MINSK, Tel. +375 172 200 733, Fax. +375 172 200 773

Belgium: see The Netherlands

Brazil: see South America

Bulgaria: Philips Bulgaria Ltd., Energoproject, 15th floor,
51 James Bourchier Blvd., 1407 SOFIA,
Tel. +359 2 689 211, Fax. +359 2 689 102

Canada: PHILIPS SEMICONDUCTORS/COMPONENTS,
Tel. +1 800 234 7381

China/Hong Kong: 501 Hong Kong Industrial Technology Centre,
72 Tat Chee Avenue, Kowloon Tong, HONG KONG,
Tel. +852 2319 7888, Fax. +852 2319 7700

Colombia: see South America

Czech Republic: see Austria

Denmark: Prags Boulevard 80, PB 1919, DK-2300 COPENHAGEN S,
Tel. +45 32 88 2636, Fax. +45 31 57 1949

Finland: Sinikalliontie 3, FIN-02630 ESPOO,
Tel. +358 615 800, Fax. +358 615 80920

France: 4 Rue du Port-aux-Vins, BP317, 92156 SURESNES Cedex,
Tel. +33 1 40 99 6161, Fax. +33 1 40 99 6427

Germany: Hammerbrookstraße 69, D-20097 HAMBURG,
Tel. +49 40 23 53 60, Fax. +49 40 23 536 300

Greece: No. 15, 25th March Street, GR 17778 TAVROS,
Tel. +30 1 4894 339/911, Fax. +30 1 4814 240

Hungary: see Austria

India: Philips INDIA Ltd, Shivsagar Estate, A Block, Dr. Annie Besant Rd.
Worli, MUMBAI 400 018, Tel. +91 22 4938 541, Fax. +91 22 4938 722

Indonesia: see Singapore

Ireland: Newstead, Clonskeagh, DUBLIN 14,
Tel. +353 1 7640 000, Fax. +353 1 7640 200

Israel: RAPAC Electronics, 7 Kehilat Saloniki St, TEL AVIV 61180,
Tel. +972 3 645 0444, Fax. +972 3 649 1007

Italy: PHILIPS SEMICONDUCTORS, Piazza IV Novembre 3,
20124 MILANO, Tel. +39 2 6752 2531, Fax. +39 2 6752 2557

Japan: Philips Bldg 13-37, Kohnan 2-chome, Minato-ku, TOKYO 108,
Tel. +81 3 3740 5130, Fax. +81 3 3740 5077

Korea: Philips House, 260-199 Itaewon-dong, Yongsan-ku, SEOUL,
Tel. +82 2 709 1412, Fax. +82 2 709 1415

Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA, SELANGOR,
Tel. +60 3 750 5214, Fax. +60 3 757 4880

Mexico: 5900 Gateway East, Suite 200, EL PASO, TEXAS 79905,
Tel. +9-5 800 234 7381

Middle East: see Italy

Printed in The Netherlands

647021/1200/02/pp32

Date of release: 1996 Sep 25

Document order number:

9397 750 01154

Document Outline

Ð­Ð»ÐµÐºÑ‚Ñ€Ð¾Ð½Ð½Ñ‹Ð¹ ÐºÐ¾Ð¼Ð¿Ð¾Ð½ÐµÐ½Ñ‚: TDA8005AH/C129/S1

Document Outline

ÐÐ»ÐµÐºÑ‚Ñ€Ð¾Ð½Ð½Ñ‹Ð¹ ÐºÐ¾Ð¼Ð¿Ð¾Ð½ÐµÐ½Ñ‚: TDA8005AH/C129/S1