2000 Nov 09
2
Philips Semiconductors
Product specification
Double multiprotocol IC card interface
TDA8007B
FEATURES
Control and communication through an 8-bit parallel
interface, compatible with multiplexed or
non-multiplexed memory access
Specific ISO UART with parallel access on I/O for
automatic convention processing, variable baud rate
through frequency or division ratio programming, error
management at character level for T = 0, extra guard
time register
1 to 8 characters FIFO in reception mode
Parity error counter in reception mode
Dual V
CC
generation (5 V
5%, 65 mA (max.) or 3 V
8%, 50 mA (max.) with controlled rise and fall times)
Dual cards clock generation (up to 10 MHz), with two
times synchronous frequency doubling
Cards clock STOP HIGH, clock STOP LOW or
1.25 MHz (from internal oscillator) for cards
Power-down mode
Automatic activation and deactivation sequence through
an independent sequencer
Supports the asynchronous protocols T = 0 and T = 1 in
accordance with ISO 7816 and EMV
Versatile 24-bit time-out counter for Answer To Reset
(ATR) and waiting times processing
22 Elementary Time Unit (ETU) counter for Block Guard
Time (BGT)
Supports synchronous cards
Current limitations in the event of short-circuit
Special circuitry for killing spikes during power-on/-off
Supply supervisor for power-on/-off reset
Step-up converter (supply voltage from 2.7 to 6 V),
doubler, tripler or follower according to V
CC
and V
DD
Additional I/O pin allowing use of the ISO UART for
another analog interface (pin I/OAUX)
Additional interrupt pin allowing detection of level
toggling on an external signal (pin INTAUX)
Fast and efficient swapping between the 3 cards due to
separate buffering of parameters for each card
Chip select input allowing use of several devices in
parallel and memory space paging
Enhanced ESD protections on card side [6 kV (min.)]
Software library for easy integration within the
application
Power-down mode for reducing current consumption
when no activity.
APPLICATIONS
Multiple smart card readers for multiprotocol
applications (EMV banking, digital pay TV, access
control, etc.).
GENERAL DESCRIPTION
The TDA8007B is a low cost card interface for dual smart
card readers. Controlled through a parallel bus, it takes
care of all ISO 7816, EMV and GSM11-11 requirements.
It may be interfaced to the P0/P2 ports of a 80C51 family
microcontroller, and be addressed as a memory through
MOVX instructions. It may also be addressed on a
non-multiplexed 8-bit data bus, by means of address
registers AD0, AD1, AD2 and AD3. The integrated ISO
UART and the time-out counters allow easy use even at
high baud rates with no real time constraints. Due to its
chip select and external I/O and INT features, it greatly
simplifies the realization of any number of cards readers.
It gives the cards and the reader a very high level of
security, due to its special hardware against ESD,
short-circuiting, power failure, etc. Its integrated step-up
converter allows operation within a supply voltage range of
2.7 to 6 V.
A software library has been developed, taking care of all
actions required for T = 0, T = 1 and synchronous
protocols (see application reports).
ORDERING INFORMATION
TYPE
NUMBER
PACKAGE
NAME
DESCRIPTION
VERSION
TDA8007BHL
LQFP48
plastic low profile quad flat package; 48 leads; body 7
7
1.4 mm
SOT313-2
2000 Nov 09
3
Philips Semiconductors
Product specification
Double multiprotocol IC card interface
TDA8007B
QUICK REFERENCE DATA
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
V
DD
supply voltage
2.7
-
6
V
I
DD(pd)
supply current in power-down
mode
V
DD
= 3.3 V; cards inactive; XTAL
oscillator stopped
-
-
350
A
V
DD
= 3.3 V; cards active at
V
CC
= 5 V; CLK stopped; XTAL
oscillator stopped
-
-
3
mA
I
DD(sm)
supply current in sleep mode
cards powered at 5 V but clock
stopped
-
-
5.5
mA
I
DD(om)
supply current in operating mode
V
DD
= 3.3 V; f
XTAL
= 20 MHz;
V
CC1
= V
CC2
= 5 V;
I
CC1
+ I
CC2
= 80 mA
-
-
315
mA
V
CC
output card supply voltage
including static loads (5 V card)
4.75
5.0
5.25
V
with 40 nC dynamic loads on
200 nF capacitor (5 V card)
4.6
-
5.4
V
including static loads (3 V card)
2.78
-
3.22
V
with 24 nC dynamic loads on
200 nF capacitor (3 V card)
2.75
-
3.25
V
I
CC
output card supply current
operating; 5 V card
-
-
65
mA
operating; 3 V card
-
-
50
mA
overload detection
-
100
-
mA
I
CC1
+ I
CC2
sum of both cards currents
-
-
80
mA
SR
slew rate on V
CC
(rise and fall)
C
L(max)
= 300 nF
0.05
0.16
0.22
V/
s
t
deact
deactivation cycle duration
-
-
150
s
t
act
activation cycle duration
-
-
225
s
f
xtal
crystal frequency
4
-
27
MHz
f
op
operating frequency
external frequency applied to pin
XTAL1
0
-
25
MHz
T
amb
ambient temperature
-
25
-
+85
C
2000 Nov 09
5
Philips Semiconductors
Product specification
Double multiprotocol IC card interface
TDA8007B
PINNING
SYMBOL
PIN
DESCRIPTION
RSTOUT
1
open-drain output for resetting external chips
I/OAUX
2
input or output for an I/O line issued of an auxiliary smart card interface
I/O1
3
data line to/from card 1 (ISO C7 contact)
C81
4
auxiliary I/O for ISO C8 contact (synchronous cards for instance) for card 1
PRES1
5
card 1 presence contact input (active HIGH or LOW by mask option)
C41
6
auxiliary I/O for ISO C4 contact (synchronous cards for instance) for card 1
GNDC1
7
ground for card 1
CLK1
8
clock output to card 1 (ISO C3 contact)
V
CC1
9
card 1 supply output voltage (ISO C1 contact)
RST1
10
card 1 reset output (ISO C2 contact)
I/O2
11
data line to/from card 2 (ISO C7 contact)
C82
12
auxiliary I/O for ISO C8 contact (synchronous cards for instance) for card 2
PRES2
13
card 2 presence contact input (active HIGH or LOW by mask option)
C42
14
auxiliary I/O for ISO C4 contact (synchronous cards for instance) for card 2
GNDC2
15
ground for card 2
CLK2
16
clock output to card 2 (ISO C3 contact)
V
CC2
17
card 2 supply output voltage (ISO C1 contact)
RST2
18
card 2 reset output (ISO C2 contact)
GND
19
ground connection
V
UP
20
output of the step-up converter
SAP
21
contact 1 for the step-up converter (connect a low ESR 220 nF capacitor between pins SAP
and SAM)
SBP
22
contact 3 for the step-up converter (connect a low ESR 220 nF capacitor between pins SBP
and SBM)
V
DDA
23
positive analog supply voltage for the step-up converter
SBM
24
contact 4 for the step-up converter (connect a low ESR 220 nF capacitor between pins SBP
and SBM)
AGND
25
ground connection for the step-up converter
SAM
26
contact 2 for the step-up converter (connect a low ESR 220 nF capacitor between pins SAP
and SAM)
V
DD
27
positive supply voltage
D0
28
data 0 or add 0
D1
29
data 1 or add 1
D2
30
data 2 or add 2
D3
31
data 3 or add 3
D4
32
data 4 or add 4
D5
33
data 5 or add 5
D6
34
data 6 or add 6
D7
35
data 7 or add 7
RD
36
read selection signal (read or write in non-multiplexed configuration)
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