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Электронный компонент: TDA8350Q/N5

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DATA SHEET
Product specification
Supersedes data of January 1995
File under Integrated Circuits, IC02
1999 Sep 27
INTEGRATED CIRCUITS
TDA8350Q
DC-coupled vertical deflection and
East-West output circuit
1999 Sep 27
2
Philips Semiconductors
Product specification
DC-coupled vertical deflection and
East-West output circuit
TDA8350Q
FEATURES
Few external components
Highly efficient fully DC-coupled vertical output bridge
circuit
Vertical flyback switch
Guard circuit
Protection against:
short-circuit of the output pins
short-circuit of the output pins to V
P
High EMC immunity due to common mode inputs
Temperature protection
East-West output stage with one single conversion
resistor.
GENERAL DESCRIPTION
The TDA8350Q is a power circuit for use in 90
and 110
colour deflection systems for field frequencies of 50
to 120 Hz. The circuit provides a DC driven vertical
deflection output circuit, operating as a highly efficient
class G system and an East-West driver for sinking the
diode modulator current.
QUICK REFERENCE DATA
Note
1. A flyback supply voltage of
>
50 V up to 60 V is allowed in application. A 220 nF capacitor in series with a 22
resistor
(depending on I
O
and the inductance of the coil) has to be connected between pin 9 and ground. The decoupling
capacitor of V
FB
has to be connected between pin 8 and pin 4. This supply voltage line must have a resistance of
33
(see application circuit Fig.5).
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
DC supply
V
P
supply voltage
9
-
25
V
I
P
quiescent current
-
30
-
mA
Vertical circuit
I
O(p-p)
output current (peak-to-peak value)
-
-
3
A
I
diff(p-p)
differential input current (peak-to-peak value)
-
600
-
A
V
diff(p-p)
differential input voltage (peak-to-peak value)
-
1.5
1.8
V
Flyback switch
I
M
peak output current
-
-
1.5
A
V
FB
flyback supply voltage
-
-
50
V
note 1
-
-
60
V
East-West amplifier
I
O(sink)
output current (sink only)
-
-
500
mA
V
O(sink)
peak output voltage
I
O(sink)
= 10
A
-
-
40
V
I
bias
input bias current
-
-
1
A
Thermal data (in accordance with IEC 747-1)
T
stg
storage temperature
-
65
-
150
C
T
amb
operating ambient temperature
-
25
-
+75
C
T
vj
virtual junction temperature
-
-
150
C
1999 Sep 27
3
Philips Semiconductors
Product specification
DC-coupled vertical deflection and
East-West output circuit
TDA8350Q
ORDERING INFORMATION
BLOCK DIAGRAM
TYPE NUMBER
PACKAGE
NAME
DESCRIPTION
VERSION
TDA8350Q
DBS13P
plastic DIL-bent-SIL power package; 13 leads (lead length 12 mm)
SOT141-6
Fig.1 Block diagram.
handbook, full pagewidth
MBC229-1
7
13
V
3
9
5
GND
12
I I(corr)
VO(sink)
4
VP
VFB
8
1
2
Idrive(pos)
Idrive(neg)
TDA8350
I I(set)
I I(set)
I S
I S
VP
I T
I T
VP
11
VO(A)
VO(B)
VO(B)
VO(A)
VI(fb)
VP
VO(guard)
10
CURRENT
SOURCE
1999 Sep 27
4
Philips Semiconductors
Product specification
DC-coupled vertical deflection and
East-West output circuit
TDA8350Q
PINNING
FUNCTIONAL DESCRIPTION
The vertical driver circuit is a bridge configuration. The
deflection coil is connected between the output amplifiers,
which are driven in opposite phase. An external resistor
(R
M
) connected in series with the deflection coil provides
internal feed back information. The differential input
circuit is voltage driven. The input circuit has been
adapted to enable it to be used with the TDA9150,
TDA9151B, TDA9160A, TDA9162, TDA8366 and
TDA8367 which deliver symmetrical current signals. An
external resistor (R
CON
) connected between the
differential input determines the output current through
the deflection coil. The relationship between the
differential input current and the output current is defined
by: I
diff
R
CON
= I
(coil)
R
M
. The output current is
adjustable from 0.5 A (p-p) to 3 A (p-p) by varying R
M
.
The maximum input differential voltage is 1.8 V. In the
application it is recommended that V
diff
= 1.5 V (typ). This
is recommended because of the spread of input current
and the spread in the value of R
CON
.
The flyback voltage is determined by an additional supply
voltage V
FB
. The principle of operating with two supply
voltages (class G) makes it possible to fix the supply
voltage V
P
optimum for the scan voltage and the second
supply voltage V
FB
optimum for the flyback voltage. Using
this method, very high efficiency is achieved.
The supply voltage V
FB
is almost totally available as
flyback voltage across the coil, this being possible due to
the absence of a decoupling capacitor (not necessary,
due to the bridge configuration). Built-in protections are:
thermal protection
short-circuit protection of the output pins (pins 5 and 9)
short-circuit protection of the output pins to V
P.
A guard circuit V
O(guard)
is provided. The guard circuit is
activated at the following conditions:
during flyback
during various short-circuit possibilities at the output
pins
during open loop
when the thermal protection is activated.
This signal can be used for blanking the picture tube
screen.
An East-West amplifier is also provided. This amplifier is
an inverting amplifier which is current driven. The output
is a current sink.
SYMBOL
PIN
DESCRIPTION
I
drive(pos)
1
input power-stage (positive);
includes I
I(sb)
signal bias
I
drive(neg)
2
input power-stage (negative);
includes I
I(sb)
signal bias
V
I(fb)
3
feedback voltage input
V
P
4
supply voltage
V
O(B)
5
output voltage B
n.c.
6
not connected
GND
7
ground
V
FB
8
flyback supply voltage
V
O(A)
9
output voltage A
V
O(guard)
10
guard output voltage
V
O(sink)
11
East-West amplifier driver (sink)
output voltage
I
I(corr)
12
East-West amplifier input
correction current (negative)
I
I(set)
13
East-West amplifier set input
current (positive)
Fig.2 Pin configuration.
handbook, halfpage
TDA8350
I drive(pos)
VI(fb)
VP
V O(B)
n.c.
GND
V FB
VO(A)
VO(guard)
VO(sink)
I I(corr)
I I(set)
I drive(neg)
MBC226-1
1
2
3
4
5
6
7
8
9
10
11
12
13
1999 Sep 27
5
Philips Semiconductors
Product specification
DC-coupled vertical deflection and
East-West output circuit
TDA8350Q
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
Notes
1. A flyback supply voltage of
>
50 V up to 60 V is allowed in application. A 220 nF capacitor in series with a 22
resistor
(depending on I
O
and the inductance of the coil) has to be connected between pin 9 and ground. The decoupling
capacitor of V
FB
has to be connected between pin 8 and pin 4. This supply voltage line must have a resistance of
33
(see application circuit Fig.5).
2. I
O
maximum determined by current protection.
3. The operating area is limited by a straight line between the points V
O(sink)
= 40 V; I
O(sink)
= 10
A and V
O(sink)
= 2 V;
I
O(sink)
= 500 mA.
4. Up to V
p
= 18 V.
SYMBOL
PARAMETER
CONDITIONS
MIN.
MAX.
UNIT
DC supply
V
P
supply voltage
non-operating
-
40
V
-
25
V
V
FB
flyback supply voltage
-
50
V
note 1
60
V
Vertical circuit
I
O
output current (peak-to-peak value)
note 2
-
3
A
V
O(A)
output voltage (pin 9)
-
52
V
note 1
62
V
Flyback switch
I
M
peak output current
-
1.5
A
East-West amplifier
V
O(sink)
output voltage
I
O(sink)
= 10
A; note 3
-
40
V
I
O(sink)
output current
V
O(sink)
= 2 V; note 3
-
500
mA
Thermal data (in accordance with IEC 747-1)
T
stg
storage temperature
-
65
150
C
T
amb
operating ambient temperature
-
25
+75
C
T
vj
virtual junction temperature
-
150
C
R
th vj-c
resistance v
j
-case
-
4
K/W
R
th vj-a
resistance v
j
-ambient in free air
-
40
K/W
t
sc
short-circuiting time
note 4
-
1
hr
1999 Sep 27
6
Philips Semiconductors
Product specification
DC-coupled vertical deflection and
East-West output circuit
TDA8350Q
CHARACTERISTICS
V
P
= 17.5 V; V
FB
= 45 V; V
O(sink)
= 20 V; f
i
= 50 Hz; I
I(sb)
= 400
A; T
amb
= 25
C; measured in test circuit of Fig.3; unless
otherwise specified.
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
DC supply
V
P
operating supply voltage
9
-
25
V
V
FB
flyback supply voltage
V
p
-
50
V
note 1
-
-
60
V
I
P
supply current
no signal; no load
-
30
55
mA
Vertical circuit
V
O
output voltage swing (scan)
I
diff
= 0.6 mA (p-p);
V
diff
= 1.8 V (p-p);
I
O
= 3 A (p-p)
19.8
-
-
V
LE
linearity error
I
O
= 3 A (p-p); note 2
-
1
3
%
I
O
= 50 mA (p-p); note 2
-
1
3
%
V
O
output voltage swing (flyback)
V
O(A)
-
V
O(B)
I
diff
= 0.3 mA;
I
O
= 1.5 A
-
39
-
V
V
DF
forward voltage of the internal
efficiency diode (V
O(A)
-
V
FB
)
I
O
=
-
1.5 A;
I
diff
= 0.3 mA
-
-
1.5
V
|
I
os
|
output offset current
I
diff
= 0;
I
I(sb)
= 50 to 500
A
-
-
30
mA
|
V
os
|
offset voltage at the input of the
feedback amplifier V
I(fb)
-
V
O(B)
I
diff
= 0;
I
I(sb)
= 50 to 500
A
-
-
18
mV
V
os
T
output offset voltage as a function
of temperature
I
diff
= 0;
-
-
72
V/K
V
O(A)
DC output voltage
I
diff
= 0; note 3
-
8
-
V
G
v
open loop voltage gain (V
9-5
/V
1-2
)
notes 4 and 5
-
80
-
dB
open loop voltage gain (V
9-5
/V
3-5
;
V
1-2
= 0)
note 4
-
80
-
dB
V
R
voltage ratio V
1-2
/V
3-5
-
0
-
dB
f
res
frequency response (
-
3 dB)
note 6
-
40
-
Hz
G
I
current gain (I
O
/I
diff
)
-
5000
-
G
I
T
current gain drift as a function of
temperature
-
-
10
-
4
/K
I
I(sb)
signal bias current
50
400
500
A
I
FB
flyback supply current
during scan
-
-
100
A
PSRR
power supply ripple rejection
note 7
-
80
-
dB
V
I(DC)
DC voltage at the input
-
2.7
-
V
V
I(CM)
common mode input voltage
I
I(sb)
= 0
0
-
1.6
V
I
bias
input bias current
I
I(sb)
= 0
-
0.1
0.5
A
I
O(CM)
common mode output current
I
I(sb)
= 300
A (p-p);
f
i
= 50 Hz; I
diff
= 0
-
0.2
-
mA
1999 Sep 27
7
Philips Semiconductors
Product specification
DC-coupled vertical deflection and
East-West output circuit
TDA8350Q
Notes
1. A flyback supply voltage of
>
50 V up to 60 V is allowed in application. A 220 nF capacitor in series with a 22
resistor
(depending on I
O
and the inductance of the coil) has to be connected between pin 9 and ground. The decoupling
capacitor of V
FB
has to be connected between pin 8 and pin 4. This supply voltage line must have a resistance of
33
(see application circuit Fig.5).
2. The linearity error is measured without S-correction and based on the same measurement principle as performed on
the screen. The measuring method is as follows:
Divide the output signal I
5
-
I
9
(V
RM
) into 22 equal parts ranging from 1 to 22 inclusive. Measure the value of two
succeeding parts called one block starting with part 2 and 3 (block 1) and ending with part 20 and 21 (block 10). Thus
part 1 and 22 are unused. The equations for linearity error for adjacent blocks (LEAB) and linearity error for not
adjacent blocks (LENAB) are given below:
;
3. Referenced to V
P
.
4. The V values within formulae relate to voltages at or across the relative pin numbers, i.e. V
9-5
/V
1-2
= voltage value
across pins 9 and 5 divided by voltage value across pins 1 and 2.
5. V
3-5
AC short-circuited.
6. Frequency response V
9-5
/V
3-5
is equal to frequency response V
9-5
/V
1-2
.
7. At V
(ripple)
= 500 mV eff; measured across R
M
; f
i
= 50 Hz.
8. The output pin 11 requires a capacitor of minimum value 68 nF.
East-West amplifier
V
O(sink)
saturation voltage
I
O(sink)
= 500 mA;
I
I(corr)
= 0
A; note 8
-
2.0
2.5
V
G
v
open loop voltage gain (V
11
/V
12
)
-
47
-
dB
f
res
frequency response (
-
3 dB)
-
4000
-
Hz
LE
linearity error
V
O(sink)
= 3 V
-
-
1
%
V
O(sink)
= 10 V; note 2
-
-
0.5
%
I
bias
input bias current (pin 12)
-
-
2
A
V
I(DC)
DC input voltage
-
1
-
V
I
set
offset voltage set current
-
1
-
mA
V
13-7
maximum allowed voltage at
pin 13
-
-
0.3
V
Guard circuit
I
O
output current
not active;
V
O(guard)
= 0 V
-
-
50
A
output current
active; V
O(guard)
= 3.6 V
1
-
2.5
mA
V
O(guard)
output voltage
I
O
= 100
A
4.6
-
5.5
V
allowable voltage on pin 10
maximum leakage
current = 10
A
-
-
40
V
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
LEAB
a
k
a
k
1
+
(
)
a
avg
----------------------------
=
LENAB
a
max
a
min
a
avg
------------------------------
=
1999 Sep 27
8
Philips Semiconductors
Product specification
DC-coupled vertical deflection and
East-West output circuit
TDA8350Q
Fig.3 Test circuit.
handbook, full pagewidth
MBC228
7
13
EAST-WEST AMPLIFIER
V
FEEDBACK
PULSE
3
9
5
68
nF
68 k
GND
ISET
12
11
II(corr)
VO(sink)
RM = 0.6
4
VP
VFB
VO(guard)
10
8
1
2
signal
bias
signal
bias
R = 6.2
36
TDA8350
Idiff
RCON
3 k
Idrive(pos)
Idrive(neg)
II(sb)
II(sb)
1999 Sep 27
9
Philips Semiconductors
Product specification
DC-coupled vertical deflection and
East-West output circuit
TDA8350Q
APPLICATION INFORMATION
Fig.4 Application diagram.
V
P
= 14 V; I
O(p-p)
= 2.14 A; I
I(sb)
= 400
A; I
diff(p-p)
= 500
A; V
FB
= 42 V; t
FB
= 0.6 ms.
handbook, full pagewidth
MBC227
7
13
EAST-WEST AMPLIFIER
V
FEEDBACK
PULSE
3
100
nF
VI(fb)
VO(A)
VO(B)
I(coil)
9
5
11
68
nF
68 k
GND
12
to line
output stage
deflection coil
AT6005/31
L = 8.63 mH
R = 5.0
4
VO(guard)
10
8
1
2
signal
bias
signal
bias
TDA8350
ISET
II(corr)
VO(sink)
RM = 0.7
VP
VFB
Idiff
RCON
3 k
Idrive(pos)
Idrive(neg)
II(sb)
II(sb)
100
nF
10
nF
10
F
100
F
1999 Sep 27
10
Philips Semiconductors
Product specification
DC-coupled vertical deflection and
East-West output circuit
TDA8350Q
Fig.5 Application circuit; 50 V
V
FB
60 V.
V
P
= 14 V; I
O(p-p)
= 2.14 A; I
I(sb)
= 400
A; I
diff(p-p)
= 500
A; V
FB
= 60 V; t
FB
= 0.4 ms.
handbook, full pagewidth
MGC054
7
13
EAST-WEST AMPLIFIER
V
FEEDBACK
PULSE
3
100
nF
9
5
68
nF
68 k
GND
12
11
to line
output stage
deflection coil
AT6005/31
L = 8.63 mH
R = 5.0
4
10
8
1
2
signal
bias
signal
bias
TDA8350
220
nF
20
33
VI(fb)
VO(A)
VFB
VP
VO(B)
I(coil)
VO(guard)
ISET
II(corr)
VO(sink)
RM = 0.7
Idiff
RCON
3 k
Idrive(pos)
Idrive(neg)
II(sb)
II(sb)
100
nF
10
nF
10
F
100
F
1999 Sep 27
11
Philips Semiconductors
Product specification
DC-coupled vertical deflection and
East-West output circuit
TDA8350Q
PACKAGE OUTLINE
UNIT
A
e
1
A
2
b
p
c
D
(1)
E
(1)
Z
(1)
d
e
D
h
L
L
3
m
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC
JEDEC
EIAJ
mm
17.0
15.5
4.6
4.2
0.75
0.60
0.48
0.38
24.0
23.6
20.0
19.6
10
3.4
v
0.8
12.2
11.8
1.7
e
2
5.08
2.4
1.6
E
h
6
2.00
1.45
2.1
1.8
3.4
3.1
4.3
DIMENSIONS (mm are the original dimensions)
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
12.4
11.0
SOT141-6
0
5
10 mm
scale
Q
j
0.25
w
0.03
x
D
L
E
A
c
A
2
m
L
3
Q
w
M
b
p
1
d
D
Z
e
2
e
e
x
h
1
13
j
Eh
non-concave
view B: mounting base side
95-03-11
97-12-16
DBS13P: plastic DIL-bent-SIL power package; 13 leads (lead length 12 mm)
SOT141-6
v
M
B
1999 Sep 27
12
Philips Semiconductors
Product specification
DC-coupled vertical deflection and
East-West output circuit
TDA8350Q
SOLDERING
Introduction to soldering through-hole mount
packages
This text gives a brief insight to wave, dip and manual
soldering. A more in-depth account of soldering ICs can
be found in our
"Data Handbook IC26; Integrated Circuit
Packages" (document order number 9398 652 90011).
Wave soldering is the preferred method for mounting of
through-hole mount IC packages on a printed-circuit
board.
Soldering by dipping or by solder wave
The maximum permissible temperature of the solder is
260
C; solder at this temperature must not be in contact
with the joints for more than 5 seconds.
The total contact time of successive solder waves must
not exceed 5 seconds.
The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified maximum storage temperature (T
stg(max)
). If the
printed-circuit board has been pre-heated, forced cooling
may be necessary immediately after soldering to keep the
temperature within the permissible limit.
Manual soldering
Apply the soldering iron (24 V or less) to the lead(s) of the
package, either below the seating plane or not more than
2 mm above it. If the temperature of the soldering iron bit
is less than 300
C it may remain in contact for up to
10 seconds. If the bit temperature is between
300 and 400
C, contact may be up to 5 seconds.
Suitability of through-hole mount IC packages for dipping and wave soldering methods
Note
1. For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit board.
DEFINITIONS
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
PACKAGE
SOLDERING METHOD
DIPPING
WAVE
DBS, DIP, HDIP, SDIP, SIL
suitable
suitable
(1)
Data sheet status
Objective specification
This data sheet contains target or goal specifications for product development.
Preliminary specification
This data sheet contains preliminary data; supplementary data may be published later.
Product specification
This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
1999 Sep 27
13
Philips Semiconductors
Product specification
DC-coupled vertical deflection and
East-West output circuit
TDA8350Q
NOTES
1999 Sep 27
14
Philips Semiconductors
Product specification
DC-coupled vertical deflection and
East-West output circuit
TDA8350Q
NOTES
1999 Sep 27
15
Philips Semiconductors
Product specification
DC-coupled vertical deflection and
East-West output circuit
TDA8350Q
NOTES
Philips Electronics N.V.
SCA
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.
Internet: http://www.semiconductors.philips.com
1999
68
Philips Semiconductors a worldwide company
For all other countries apply to: Philips Semiconductors,
International Marketing & Sales Communications, Building BE-p, P.O. Box 218,
5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825
Argentina: see South America
Australia: 3 Figtree Drive, HOMEBUSH, NSW 2140,
Tel. +61 2 9704 8141, Fax. +61 2 9704 8139
Austria: Computerstr. 6, A-1101 WIEN, P.O. Box 213,
Tel. +43 1 60 101 1248, Fax. +43 1 60 101 1210
Belarus: Hotel Minsk Business Center, Bld. 3, r. 1211, Volodarski Str. 6,
220050 MINSK, Tel. +375 172 20 0733, Fax. +375 172 20 0773
Belgium: see The Netherlands
Brazil: see South America
Bulgaria: Philips Bulgaria Ltd., Energoproject, 15th floor,
51 James Bourchier Blvd., 1407 SOFIA,
Tel. +359 2 68 9211, Fax. +359 2 68 9102
Canada: PHILIPS SEMICONDUCTORS/COMPONENTS,
Tel. +1 800 234 7381, Fax. +1 800 943 0087
China/Hong Kong: 501 Hong Kong Industrial Technology Centre,
72 Tat Chee Avenue, Kowloon Tong, HONG KONG,
Tel. +852 2319 7888, Fax. +852 2319 7700
Colombia: see South America
Czech Republic: see Austria
Denmark: Sydhavnsgade 23, 1780 COPENHAGEN V,
Tel. +45 33 29 3333, Fax. +45 33 29 3905
Finland: Sinikalliontie 3, FIN-02630 ESPOO,
Tel. +358 9 615 800, Fax. +358 9 6158 0920
France: 51 Rue Carnot, BP317, 92156 SURESNES Cedex,
Tel. +33 1 4099 6161, Fax. +33 1 4099 6427
Germany: Hammerbrookstrae 69, D-20097 HAMBURG,
Tel. +49 40 2353 60, Fax. +49 40 2353 6300
Hungary: see Austria
India: Philips INDIA Ltd, Band Box Building, 2nd floor,
254-D, Dr. Annie Besant Road, Worli, MUMBAI 400 025,
Tel. +91 22 493 8541, Fax. +91 22 493 0966
Indonesia: PT Philips Development Corporation, Semiconductors Division,
Gedung Philips, Jl. Buncit Raya Kav.99-100, JAKARTA 12510,
Tel. +62 21 794 0040 ext. 2501, Fax. +62 21 794 0080
Ireland: Newstead, Clonskeagh, DUBLIN 14,
Tel. +353 1 7640 000, Fax. +353 1 7640 200
Israel: RAPAC Electronics, 7 Kehilat Saloniki St, PO Box 18053,
TEL AVIV 61180, Tel. +972 3 645 0444, Fax. +972 3 649 1007
Italy: PHILIPS SEMICONDUCTORS, Via Casati, 23 - 20052 MONZA (MI),
Tel. +39 039 203 6838, Fax +39 039 203 6800
Japan: Philips Bldg 13-37, Kohnan 2-chome, Minato-ku,
TOKYO 108-8507, Tel. +81 3 3740 5130, Fax. +81 3 3740 5057
Korea: Philips House, 260-199 Itaewon-dong, Yongsan-ku, SEOUL,
Tel. +82 2 709 1412, Fax. +82 2 709 1415
Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA, SELANGOR,
Tel. +60 3 750 5214, Fax. +60 3 757 4880
Mexico: 5900 Gateway East, Suite 200, EL PASO, TEXAS 79905,
Tel. +9-5 800 234 7381, Fax +9-5 800 943 0087
Middle East: see Italy
Netherlands: Postbus 90050, 5600 PB EINDHOVEN, Bldg. VB,
Tel. +31 40 27 82785, Fax. +31 40 27 88399
New Zealand: 2 Wagener Place, C.P.O. Box 1041, AUCKLAND,
Tel. +64 9 849 4160, Fax. +64 9 849 7811
Norway: Box 1, Manglerud 0612, OSLO,
Tel. +47 22 74 8000, Fax. +47 22 74 8341
Pakistan: see Singapore
Philippines: Philips Semiconductors Philippines Inc.,
106 Valero St. Salcedo Village, P.O. Box 2108 MCC, MAKATI,
Metro MANILA, Tel. +63 2 816 6380, Fax. +63 2 817 3474
Poland: Al.Jerozolimskie 195 B, 02-222 WARSAW,
Tel. +48 22 5710 000, Fax. +48 22 5710 001
Portugal: see Spain
Romania: see Italy
Russia: Philips Russia, Ul. Usatcheva 35A, 119048 MOSCOW,
Tel. +7 095 755 6918, Fax. +7 095 755 6919
Singapore: Lorong 1, Toa Payoh, SINGAPORE 319762,
Tel. +65 350 2538, Fax. +65 251 6500
Slovakia: see Austria
Slovenia: see Italy
South Africa: S.A. PHILIPS Pty Ltd., 195-215 Main Road Martindale,
2092 JOHANNESBURG, P.O. Box 58088 Newville 2114,
Tel. +27 11 471 5401, Fax. +27 11 471 5398
South America: Al. Vicente Pinzon, 173, 6th floor,
04547-130 SO PAULO, SP, Brazil,
Tel. +55 11 821 2333, Fax. +55 11 821 2382
Spain: Balmes 22, 08007 BARCELONA,
Tel. +34 93 301 6312, Fax. +34 93 301 4107
Sweden: Kottbygatan 7, Akalla, S-16485 STOCKHOLM,
Tel. +46 8 5985 2000, Fax. +46 8 5985 2745
Switzerland: Allmendstrasse 140, CH-8027 ZRICH,
Tel. +41 1 488 2741 Fax. +41 1 488 3263
Taiwan: Philips Semiconductors, 6F, No. 96, Chien Kuo N. Rd., Sec. 1,
TAIPEI, Taiwan Tel. +886 2 2134 2886, Fax. +886 2 2134 2874
Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd.,
209/2 Sanpavuth-Bangna Road Prakanong, BANGKOK 10260,
Tel. +66 2 745 4090, Fax. +66 2 398 0793
Turkey: Yukari Dudullu, Org. San. Blg., 2.Cad. Nr. 28 81260 Umraniye,
ISTANBUL, Tel. +90 216 522 1500, Fax. +90 216 522 1813
Ukraine: PHILIPS UKRAINE, 4 Patrice Lumumba str., Building B, Floor 7,
252042 KIEV, Tel. +380 44 264 2776, Fax. +380 44 268 0461
United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes,
MIDDLESEX UB3 5BX, Tel. +44 208 730 5000, Fax. +44 208 754 8421
United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409,
Tel. +1 800 234 7381, Fax. +1 800 943 0087
Uruguay: see South America
Vietnam: see Singapore
Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD,
Tel. +381 11 62 5344, Fax.+381 11 63 5777
Printed in The Netherlands
545004/02/pp
16
Date of release:
1999 Sep 27
Document order number:
9397 750 06202