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Электронный компонент: TDA8566TH

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DATA SHEET
Objective specification
File under Integrated Circuits, IC01
2001 Apr 24
INTEGRATED CIRCUITS
TDA8566TH
2
40 W/2
stereo BTL car radio
power amplifier with differential
inputs and diagnostic outputs
2001 Apr 24
2
Philips Semiconductors
Objective specification
2
40 W/2
stereo BTL car radio power amplifier
with differential inputs and diagnostic outputs
TDA8566TH
FEATURES
Differential inputs
Very high Common Mode Rejection Ratio (CMRR)
High common mode input signal handling
Requires very few external components
High output power
4 and 2
load driving capability
Low offset voltage at output
Fixed gain
Diagnostic facility (distortion, short-circuit and
temperature pre-warning)
Good ripple rejection
Mode select switch (operating, mute and standby)
Load dump protection
Short-circuit proof to ground, to V
P
and across the load
Low power dissipation in any short-circuit condition
Thermally protected
Reverse polarity safe
Protected against electrostatic discharge
No switch-on/switch-off plops
Low thermal resistance.
GENERAL DESCRIPTION
The TDA8566TH is an integrated class-B output amplifier
contained in a 20-lead small outline plastic package. The
device contains 2 amplifiers in a Bridge-Tied Load (BTL)
configuration. The output power is 2
25 W in a 4
load
or 2
40 W in a 2
load. It has a differential input stage
and 2 diagnostic outputs. The device is primarily
developed for car radio applications.
QUICK REFERENCE DATA
ORDERING INFORMATION
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
V
P
operating supply voltage
6
14.4
18
V
I
ORM
repetitive peak output current
-
-
7.5
A
I
q(tot)
total quiescent current
-
115
-
mA
I
stb
standby current
-
0.1
10
A
I
sw
switch-on current
-
-
40
A
Z
i
input impedance
100
120
-
k
P
out
output power
R
L
= 4
; THD = 10%
-
25
-
W
R
L
= 2
; THD = 10%
-
40
-
W
SVRR
supply voltage ripple rejection
R
s
= 0
-
60
-
dB
cs
channel separation
R
s
= 10 k
-
50
-
dB
CMRR
common mode rejection ratio
-
75
-
dB
G
v
closed loop voltage gain
25
26
27
dB
V
n(o)
noise output voltage
R
s
= 0
-
-
120
V
TYPE
NUMBER
PACKAGE
NAME
DESCRIPTION
VERSION
TDA8566TH
HSOP20
plastic, heatsink small outline package; 20 leads; low stand-off height
SOT418-2
2001 Apr 24
3
Philips Semiconductors
Objective specification
2
40 W/2
stereo BTL car radio power amplifier
with differential inputs and diagnostic outputs
TDA8566TH
BLOCK DIAGRAM
handbook, full pagewidth
+
-
+
-
CM
VA
(9
)
2.3 k
2.3
k
mute
switch
+
-
+
-
CM
VA
VA
1
standby
reference
voltage
standby
switch
mute
reference
voltage
Vref
mute
switch
CLIP
(9
)
2.3 k
2.3
k
60
k
60
k
60
k
60
k
mute
switch
+
-
+
-
CM
VA
(9
)
2.3 k
2.3
k
mute
switch
+
-
+
-
CM
VA
17
14
18
16
1
11
TDA8566TH
20
15
13
19
12
8
9
10
2
3
VP2
VP1
PGND2
PGND1
OUT2
-
OUT2
+
OUT1
-
OUT1
+
IN1
-
IN1
+
IN2
-
IN2
+
SGND
n.c.
DIAG
MODE
CLIP
MGU358
(9
)
2.3 k
2.3
k
mute
switch
4, 5,
6, 7
DIAG
Fig.1 Block diagram.
2001 Apr 24
4
Philips Semiconductors
Objective specification
2
40 W/2
stereo BTL car radio power amplifier
with differential inputs and diagnostic outputs
TDA8566TH
PINNING
SYMBOL
PIN
DESCRIPTION
DIAG
1
short-circuit and temperature
pre-warning diagnostic output
IN2+
2
channel 2 input positive
IN2
-
3
channel 2 input negative
n.c.
4
not connected
n.c.
5
not connected
n.c.
6
not connected
n.c.
7
not connected
IN1+
8
channel 1 input positive
IN1
-
9
channel 1 input negative
SGND
10
signal ground
CLIP
11
clip detection output
V
P1
12
supply voltage 1
OUT1+
13
channel 1 output positive
PGND1
14
power ground 1
OUT1
-
15
channel 1 output negative
OUT2+
16
channel 2 output positive
PGND2
17
power ground 2
OUT2
-
18
channel 2 output negative
V
P2
19
supply voltage 2
MODE
20
mode select switch input
(standby/mute/operating)
handbook, halfpage
DIAG
IN2
+
IN2
-
n.c.
n.c.
n.c.
n.c.
IN1
+
IN1
-
SGND
MODE
VP2
OUT2
-
PGND2
OUT1
-
PGND1
OUT2
+
OUT1
+
VP1
CLIP
1
2
3
4
5
6
7
8
9
10
11
12
20
19
18
17
16
15
14
13
TDA8566TH
MGU356
Fig.2 Pin configuration.
2001 Apr 24
5
Philips Semiconductors
Objective specification
2
40 W/2
stereo BTL car radio power amplifier
with differential inputs and diagnostic outputs
TDA8566TH
FUNCTIONAL DESCRIPTION
The TDA8566TH contains 2 identical amplifiers and can
be used for BTL applications. The gain of each amplifier is
fixed at 26 dB. Special features of this device are:
1. Mode select switch
2. Clip detection
3. Short-circuit diagnostic
4. Temperature pre-warning
5. Open-collector diagnostic outputs
6. Differential inputs.
Mode select switch (pin MODE)
Standby: low supply current
Mute: input signal suppressed
Operating: normal on condition.
Since this pin has a very low input current (<40
A), a low
cost supply switch can be applied. To avoid switch-on
plops, it is advisable to keep the amplifier in the mute mode
for a period of
150 ms (charging the input capacitors at
pins IN1+, IN1
-
, IN2+ and IN2
-
). This can be realized by
using a microcontroller or by using an external timing
circuit as illustrated in Fig.7.
Clip detection (pin CLIP)
When clipping occurs at one or more output stages, the
dynamic distortion detector becomes active and pin CLIP
goes LOW. This information can be used to drive a sound
processor or a DC volume control to attenuate the input
signal and so limit the level of distortion. The output level
of pin CLIP is independent of the number of channels that
are being clipped. The clip detection circuit is disabled in a
short-circuit condition, so if a fault condition occurs at the
outputs, pin CLIP will remain at a HIGH level. The clip
detection waveforms are illustrated in Fig.3.
Short-circuit diagnostic (pin DIAG)
When a short-circuit occurs at one or more outputs to
ground or to the supply voltage, the output stages are
switched off until the short-circuit is removed and the
device is switched on again (with a delay of approximately
20 ms after the removal of the short-circuit). During this
short-circuit condition, pin DIAG is continuously LOW.
When a short-circuit occurs across the load of one or both
channels, the output stages are switched off for
approximately 20 ms. After that time the load condition is
checked during approximately 50
s to see whether the
short-circuit is still present. Due to this duty cycle of
50
s/20 ms the average current consumption during the
short-circuit condition is very low (approximately 40 mA).
During this condition, pin DIAG is LOW for 20 ms and
HIGH for 50
s; see Fig.4. The power dissipation in any
short-circuit condition is very low.
Temperature pre-warning (pin DIAG)
When the junction temperature (T
vj
) reaches 145
C,
pin DIAG will become continuously LOW.
Open-collector diagnostic outputs
Pins DIAG and CLIP are open-collector outputs, therefore
more devices can be tied together. Pins DIAG and CLIP
can also be tied together. An external pull-up resistor is
required.
Differential inputs
The input stage is a high-impedance fully differential
balanced input stage that is also capable of operating in
a single-ended mode with one of the inputs capacitively
coupled to an audio ground. It should be noted that if a
source resistance is added (input voltage dividers) the
CMRR degrades to lower values.
handbook, halfpage
0
VO
(V)
VCLIP
(V)
0
t (s)
MGU357
Fig.3 Clip detection waveforms.
2001 Apr 24
6
Philips Semiconductors
Objective specification
2
40 W/2
stereo BTL car radio power amplifier
with differential inputs and diagnostic outputs
TDA8566TH
handbook, full pagewidth
MGU360
short-circuit over the load
20 ms
50
s
t (s)
t (s)
VDIAG
(V)
current
in
output
stage
Fig.4 Short-circuit diagnostic timing diagram.
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 60134).
QUALITY SPECIFICATION
Quality specification in accordance with
"SNW-FQ-611D", if this type is used as an audio amplifier.
THERMAL CHARACTERISTICS
Thermal characteristics in accordance with IEC 60747-1.
SYMBOL
PARAMETER
CONDITIONS
MIN.
MAX.
UNIT
V
P
supply voltage
operating
-
18
V
non-operating
-
30
V
load dump protection;
during 50 ms; t
r
2.5 ms
-
45
V
I
OSM
non-repetitive peak output current
-
10
A
I
ORM
repetitive peak output current
-
7.5
A
T
stg
storage temperature
-
55
+150
C
T
vj
virtual junction temperature
-
150
C
T
amb
ambient temperature
-
40
+85
C
V
psc
short-circuit safe voltage
-
18
V
V
rp
reverse polarity voltage
-
6.0
V
P
tot
total power dissipation
-
60
W
SYMBOL
PARAMETER
CONDITIONS
VALUE
UNIT
R
th(j-c)
thermal resistance from junction to case
see Fig.5
1.9
K/W
R
th(j-a)
thermal resistance from junction to ambient
in free air
40
K/W
2001 Apr 24
7
Philips Semiconductors
Objective specification
2
40 W/2
stereo BTL car radio power amplifier
with differential inputs and diagnostic outputs
TDA8566TH
handbook, halfpage
3.2 K/W
0.3 K/W
3.2 K/W
virtual junction
output 1
output 2
case
MGU361
Fig.5 Equivalent thermal resistance network.
DC CHARACTERISTICS
V
P
= 14.4 V; T
amb
= 25
C; measured in test circuit of Fig.6; unless otherwise specified.
Notes
1. The circuit is DC adjusted at V
P
= 6 to 18 V and AC operating at V
P
= 8.5 to 18 V.
2. At V
P
= 18 to 30 V the DC output voltage is
0.5V
P
.
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
Supply
V
P
supply voltage
note 1
6
14.4
18
V
I
q
quiescent current
R
L
=
-
115
180
mA
Operating condition
V
MODE
mode select switch level
8.5
-
V
P
V
I
MODE
mode select switch current
V
MODE
= 14.4 V
-
15
40
A
V
O
output voltage
note 2
-
7.0
-
V
V
OO
output offset voltage
-
-
100
mV
Mute condition
V
MODE
mode select switch level
3.3
-
6.4
V
V
O
output voltage
note 2
-
7.0
-
V
V
OO
output offset voltage
-
-
60
mV
V
OO
output offset voltage difference
with respect to operating
condition
-
-
60
mV
Standby condition
V
MODE
mode select switch level
0
-
2
V
I
stb
standby current
-
0.1
10
A
Diagnostic
V
DIAG
diagnostic output voltage
during any fault condition
-
-
0.6
V
2001 Apr 24
8
Philips Semiconductors
Objective specification
2
40 W/2
stereo BTL car radio power amplifier
with differential inputs and diagnostic outputs
TDA8566TH
AC CHARACTERISTICS
V
P
= 14.4 V; T
amb
= 25
C; R
L
= 2
; f
i
= 1 kHz; measured in test circuit of Fig.6; unless otherwise specified.
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
P
o
output power
THD = 0.5%
25
30
-
W
THD = 10%
33
40
-
W
THD = 30%
45
55
-
W
V
P
= 13.5 V; THD = 0.5%
-
25
-
W
V
P
= 13.5 V; THD = 10%
-
35
-
W
THD = 0.5%; R
L
= 4
16
19
-
W
THD = 10%; R
L
= 4
21
25
-
W
THD = 30%; R
L
= 4
28
35
-
W
V
P
= 13.5 V; THD = 0.5%;
R
L
= 4
-
14
-
W
V
P
= 13.5 V; THD = 10%;
R
L
= 4
-
22
-
W
THD
total harmonic distortion
P
o
= 1 W
-
0.1
-
%
V
CLIP
= 0.6 V; note 1
-
8
-
%
P
o
= 1 W; R
L
= 4
-
0.05
-
%
B
power bandwidth
THD = 0.5%; P
o
=
-
1 dB
with respect to 25 W
-
20 to 20000
-
Hz
f
ro(l)
low frequency roll off
-
1 dB; note 2
-
25
-
Hz
f
ro(h)
high frequency roll off
-
1 dB
20
-
-
kHz
G
v
closed loop voltage gain
25
26
27
dB
SVRR
supply voltage ripple
rejection
operating; note 3
50
-
-
dB
mute; note 3
50
-
-
dB
standby; note 3
80
-
-
dB
Z
i
input impedance
differential
100
120
150
k
single-ended
50
60
75
k
Z
i
input impedance mismatch
-
2
-
%
V
n(o)
noise output voltage
operating; R
s
= 0
; note 4
-
85
120
V
operating; R
s
= 10 k
;
note 4
-
100
-
V
mute; independent of R
s
;
note 4
-
60
-
V
cs
channel separation
P
o
= 25 W; R
s
= 10 k
45
-
-
dB
G
v
channel unbalance
-
-
1
dB
2001 Apr 24
9
Philips Semiconductors
Objective specification
2
40 W/2
stereo BTL car radio power amplifier
with differential inputs and diagnostic outputs
TDA8566TH
Notes
1. Dynamic distortion detector active; pin CLIP is LOW.
2. Frequency response externally fixed.
3. V
ripple
= V
ripple(max)
= 2 V (p-p); R
s
= 0
.
4. Noise measured in a bandwidth of 20 Hz to 20 kHz.
5. Common mode rejection ratio measured at the output (over R
L
) with both inputs tied together;
V
common
3.5 V (RMS); f
i
= 100 Hz to 10 kHz; R
s
= 0
.
6. Common mode rejection ratio measured at the output (over R
L
) with both inputs tied together;
V
common
3.5 V (RMS); f
i
= 1 kHz; R
s
= 45 k
. The mismatch of the input coupling capacitors is excluded.
V
o(mute)
output signal voltage in mute V
in
= V
in(max)
= 1 V (RMS)
-
-
2
mV
CMRR
common mode rejection
ratio
R
s
= 0
; note 5
60
75
-
dB
R
s
= 45 k
; note 6
40
-
-
dB
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
2001 Apr 24
10
Philips Semiconductors
Objective specification
2
40 W/2
stereo BTL car radio power amplifier
with differential inputs and diagnostic outputs
TDA8566TH
TEST AND APPLICATION INFORMATION
handbook, full pagewidth
+
-
+
-
Rs/2
Vmode
Rs/2
Rs/2
Rs/2
Vin2
Vin1
10
k
10
k
RL2
RL1
220 nF
220 nF
60
k
60
k
+
+
-
-
+
-
220 nF
220 nF
60
k
60
k
CLIP
DETECTOR
DIAGNOSTIC
INTERFACE
VP
TDA8566TH
Vref
VP
100
nF
VP =
14.4 V
2200
F/16V
CLIP
DIAG
MGU359
8
+
+
_
+
_
+
_
+
_
_
+
_
13
15
11
1
16
18
14
17
20
19
12
9
10
2
3
Fig.6 Stereo BTL test diagram.
Application information
D
IAGNOSTIC OUTPUT
Special care must be taken in the PCB layout to separate
pin CLIP from pins IN1+, IN1
-
, IN2+ and IN2
-
to minimize
the crosstalk between the CLIP output and the inputs.
M
ODE SELECT SWITCH
To avoid switch-on plops, it is advisable to keep the
amplifier in the mute mode during
150 ms (charging of
the input capacitors at pins IN1+, IN1
-
, IN2+ and IN2
-
).
The circuit in Fig.7 slowly ramps-up the voltage at the
mode select switch pin when switching on and results in
fast muting when switching off.
handbook, halfpage
100 k
MGD102
47
F
10 k
S
100
mode
select
switch
+
Vsupply
Fig.7 Mode select switch circuit.
2001 Apr 24
11
Philips Semiconductors
Objective specification
2
40 W/2
stereo BTL car radio power amplifier
with differential inputs and diagnostic outputs
TDA8566TH
PACKAGE OUTLINE
UNIT
A4
(1)
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
98-02-25
99-11-12
IEC
JEDEC
EIAJ
mm
+
0.12
-
0.02
3.5
0.35
DIMENSIONS (mm are the original dimensions)
Notes
1. Limits per individual lead.
2. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
SOT418-2
0
5
10 mm
scale
HSOP20: plastic, heatsink small outline package; 20 leads; low stand-off height
SOT418-2
A
max.
detail X
A2
3.5
3.2
D2
1.1
0.9
HE
14.5
13.9
Lp
1.1
0.8
Q
1.7
1.5
2.5
2.0
v
0.25
w
0.25
y
Z
8
0
0.07
x
0.03
D1
13.0
12.6
E1
6.2
5.8
E2
2.9
2.5
bp
c
0.32
0.23
e
1.27
D
(2)
16.0
15.8
E
(2)
11.1
10.9
0.53
0.40
A3
A4
A2
(A3)
Lp
A
Q
D
y
x
HE
E
c
v
M
A
X
A
bp
w
M
Z
D1
D2
E2
E1
e
20
11
1
10
pin 1 index
2001 Apr 24
12
Philips Semiconductors
Objective specification
2
40 W/2
stereo BTL car radio power amplifier
with differential inputs and diagnostic outputs
TDA8566TH
SOLDERING
Introduction to soldering surface mount packages
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our
"Data Handbook IC26; Integrated Circuit Packages"
(document order number 9398 652 90011).
There is no soldering method that is ideal for all surface
mount IC packages. Wave soldering can still be used for
certain surface mount ICs, but it is not suitable for fine pitch
SMDs. In these situations reflow soldering is
recommended.
Reflow soldering
Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.
Several methods exist for reflowing; for example,
convection or convection/infrared heating in a conveyor
type oven. Throughput times (preheating, soldering and
cooling) vary between 100 and 200 seconds depending
on heating method.
Typical reflow peak temperatures range from
215 to 250
C. The top-surface temperature of the
packages should preferable be kept below 220
C for
thick/large packages, and below 235
C for small/thin
packages.
Wave soldering
Conventional single wave soldering is not recommended
for surface mount devices (SMDs) or printed-circuit boards
with a high component density, as solder bridging and
non-wetting can present major problems.
To overcome these problems the double-wave soldering
method was specifically developed.
If wave soldering is used the following conditions must be
observed for optimal results:
Use a double-wave soldering method comprising a
turbulent wave with high upward pressure followed by a
smooth laminar wave.
For packages with leads on two sides and a pitch (e):
larger than or equal to 1.27 mm, the footprint
longitudinal axis is preferred to be parallel to the
transport direction of the printed-circuit board;
smaller than 1.27 mm, the footprint longitudinal axis
must be parallel to the transport direction of the
printed-circuit board.
The footprint must incorporate solder thieves at the
downstream end.
For packages with leads on four sides, the footprint must
be placed at a 45
angle to the transport direction of the
printed-circuit board. The footprint must incorporate
solder thieves downstream and at the side corners.
During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.
Typical dwell time is 4 seconds at 250
C.
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.
Manual soldering
Fix the component by first soldering two
diagonally-opposite end leads. Use a low voltage (24 V or
less) soldering iron applied to the flat part of the lead.
Contact time must be limited to 10 seconds at up to
300
C.
When using a dedicated tool, all other leads can be
soldered in one operation within 2 to 5 seconds between
270 and 320
C.
2001 Apr 24
13
Philips Semiconductors
Objective specification
2
40 W/2
stereo BTL car radio power amplifier
with differential inputs and diagnostic outputs
TDA8566TH
Suitability of surface mount IC packages for wave and reflow soldering methods
Notes
1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum
temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the
"Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods".
2. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink
(at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version).
3. If wave soldering is considered, then the package must be placed at a 45
angle to the solder wave direction.
The package footprint must incorporate solder thieves downstream and at the side corners.
4. Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8 mm;
it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
5. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
PACKAGE
SOLDERING METHOD
WAVE
REFLOW
(1)
BGA, HBGA, LFBGA, SQFP, TFBGA
not suitable
suitable
HBCC, HLQFP, HSQFP, HSOP, HTQFP, HTSSOP, HVQFN, SMS
not suitable
(2)
suitable
PLCC
(3)
, SO, SOJ
suitable
suitable
LQFP, QFP, TQFP
not recommended
(3)(4)
suitable
SSOP, TSSOP, VSO
not recommended
(5)
suitable
2001 Apr 24
14
Philips Semiconductors
Objective specification
2
40 W/2
stereo BTL car radio power amplifier
with differential inputs and diagnostic outputs
TDA8566TH
DATA SHEET STATUS
Notes
1. Please consult the most recently issued data sheet before initiating or completing a design.
2. The product status of the device(s) described in this data sheet may have changed since this data sheet was
published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com.
DATA SHEET STATUS
(1)
PRODUCT
STATUS
(2)
DEFINITIONS
Objective data
Development
This data sheet contains data from the objective specification for product
development. Philips Semiconductors reserves the right to change the
specification in any manner without notice.
Preliminary data
Qualification
This data sheet contains data from the preliminary specification.
Supplementary data will be published at a later date. Philips
Semiconductors reserves the right to change the specification without
notice, in order to improve the design and supply the best possible
product.
Product data
Production
This data sheet contains data from the product specification. Philips
Semiconductors reserves the right to make changes at any time in order
to improve the design, manufacturing and supply. Changes will be
communicated according to the Customer Product/Process Change
Notification (CPCN) procedure SNW-SQ-650A.
DEFINITIONS
Short-form specification
The data in a short-form
specification is extracted from a full data sheet with the
same type number and title. For detailed information see
the relevant data sheet or data handbook.
Limiting values definition
Limiting values given are in
accordance with the Absolute Maximum Rating System
(IEC 60134). Stress above one or more of the limiting
values may cause permanent damage to the device.
These are stress ratings only and operation of the device
at these or at any other conditions above those given in the
Characteristics sections of the specification is not implied.
Exposure to limiting values for extended periods may
affect device reliability.
Application information
Applications that are
described herein for any of these products are for
illustrative purposes only. Philips Semiconductors make
no representation or warranty that such applications will be
suitable for the specified use without further testing or
modification.
DISCLAIMERS
Life support applications
These products are not
designed for use in life support appliances, devices, or
systems where malfunction of these products can
reasonably be expected to result in personal injury. Philips
Semiconductors customers using or selling these products
for use in such applications do so at their own risk and
agree to fully indemnify Philips Semiconductors for any
damages resulting from such application.
Right to make changes
Philips Semiconductors
reserves the right to make changes, without notice, in the
products, including circuits, standard cells, and/or
software, described or contained herein in order to
improve design and/or performance. Philips
Semiconductors assumes no responsibility or liability for
the use of any of these products, conveys no licence or title
under any patent, copyright, or mask work right to these
products, and makes no representations or warranties that
these products are free from patent, copyright, or mask
work right infringement, unless otherwise specified.
2001 Apr 24
15
Philips Semiconductors
Objective specification
2
40 W/2
stereo BTL car radio power amplifier
with differential inputs and diagnostic outputs
TDA8566TH
NOTES
Philips Electronics N.V.
SCA
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.
Internet: http://www.semiconductors.philips.com
2001
72
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Printed in The Netherlands
753503/01/pp
16
Date of release:
2001 Apr 24
Document order number:
9397 750 08125