DATA SHEET
Product specification
Supersedes data of 1997 Feb 26
File under Integrated Circuits, IC01
1998 Oct 16
INTEGRATED CIRCUITS
TDA8574
Class-H high-output voltage level
line driver
1998 Oct 16
2
Philips Semiconductors
Product specification
Class-H high-output voltage level line
driver
TDA8574
FEATURES
Output voltage swing larger than supply voltage
High supply voltage ripple rejection
Low distortion
Low noise
ESD protected on all pins.
GENERAL DESCRIPTION
The TDA8574(T) is a two channel class-H high-output
voltage line driver for use in car audio applications.
The line driver behaves as a non-inverting amplifier with a
gain of 8 dB and a single-ended output. Due to the class-H
voltage lifting principle the voltage swing over the load is
more than the supply voltage. With a supply voltage of 9 V
the output voltage swing over the load will be
14 V (peak-to-peak).
The TDA8574 is available in a DIP16 package and the
TDA8574T in a SO16 package.
Line drivers are necessary in car audio systems in which
the power amplifiers are driven by long cables.
The signal-to-noise ratio of these car audio systems is
improved by using the TDA8574(T) class-H high-output
level line driver. The high-output level of TDA8574(T)
enables a reduction of the gain of the power amplifier
resulting in an improvement of the power amplifier
performance.
QUICK REFERENCE DATA
ORDERING INFORMATION
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
V
CC
supply voltage
6
9
12
V
I
CC
supply current
V
CC
= 9 V
-
8
13
mA
G
v
voltage gain
7.5
8
8.5
dB
V
o(rms)
maximal output voltage (RMS value)
THD = 0.1%
5.0
5.2
-
V
SVRR
supply voltage ripple rejection
50
65
-
dB
THD
total harmonic distortion
V
o(rms)
= 3 V; f = 1 kHz
-
0.003
-
%
V
no
noise output voltage
-
5
-
V
Z
o
output impedance
-
-
10
TYPE
NUMBER
PACKAGE
NAME
DESCRIPTION
VERSION
TDA8574T
SO16
plastic small outline package; 16 leads; body width 7.5 mm
SOT162-1
TDA8574
DIP16
plastic dual in-line package; 16 leads (300 mil)
SOT38-4
1998 Oct 16
3
Philips Semiconductors
Product specification
Class-H high-output voltage level line
driver
TDA8574
BLOCK DIAGRAM
Fig.1 Block diagram.
handbook, full pagewidth
MGE668
24 k
30 k
5
36 k
36 k
30 k
24 k
REFERENCE
REFERENCE
LIFT
AMP.
LIFT
AMP.
SIGNAL
AMP.
SIGNAL
AMP.
TDA8574(T)
VCCL
VCCL
VCCR
VCCR
VCCL
VCCR
3
1
BUFFER
BUFFER
BUFFER
BUFFER
CL
+
CL
-
CR
+
CR
-
OUTL
13
14
11
12
10
9
6
INR
INMR
INML
INL
SVRL
8
15
16
LGND
RGND
OUTR
2
4
5
7
SVRR
+
+
-
+
-
-
+
-
1998 Oct 16
4
Philips Semiconductors
Product specification
Class-H high-output voltage level line
driver
TDA8574
PINNING
SYMBOL
PIN
DESCRIPTION
V
CCL
1
supply voltage left channel
INL
2
input voltage left channel
SVRL
3
SVRR left channel
INML
4
inverting input left channel
INMR
5
inverting input right channel
SVRR
6
SVRR right channel
INR
7
input voltage right channel
V
CCR
8
supply voltage right channel
CR+
9
lift capacitor (+) right channel
CR
-
10
lift capacitor (
-
) right channel
RGND
11
ground right channel
OUTR
12
output voltage right channel
OUTL
13
output voltage left channel
LGND
14
ground left channel
CL
-
15
lift capacitor (
-
) left channel
CL+
16
lift capacitor (
+
) left channel
Fig.2 Pin configuration.
handbook, halfpage
TDA8574
TDA8574T
MGE667
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
VCCL
INL
SVRL
INML
INMR
SVRR
INR
VCCR
CR
+
CR
-
RGND
OUTR
OUTL
LGND
CL
-
CL
+
FUNCTIONAL DESCRIPTION
Lift amplifier
The lift amplifier, referred to as LIFT AMP. in Fig.1, is used
as a non-inverting amplifier with a voltage gain of 8 dB set
by an internal feedback network. If the output voltage of
the signal amplifier is low, the external lift capacitor is
recharged by the lift amplifier. As soon as the output
voltage of the signal amplifier increases above 0.87
V
CC
the lift amplifier switches the voltage of the lift capacitor in
series with the supply voltage V
CC
. The voltage at the
positive side of the lift capacitor is referred to as lifted
supply voltage.
Signal amplifier
The signal amplifier, referred to as SIGNAL AMP. in Fig.1,
is used as a non-inverting amplifier. The voltage gain G
v
is
set by the feedback resistors according to the formula:
and should be set to 8 dB. The LIFT AMP. and SIG AMP.
must have equal voltage gain G
v
. The rail-to-rail output
stage of the signal amplifier uses the lifted supply voltage
to increase the output voltage swing.
G
v
1
R
2
R
1
-------
+
=
The DC output level is set to
0.87
V
CC.
The maximum
peak-to-peak output voltage of the signal amplifier is
calculated with the formula:
Buffers
The buffers prevent loading of the internal voltage divider
network made by a series connection of resistors. For a
good supply voltage ripple rejection this internal voltage
divider network has to be decoupled by an external
capacitor.
Reference
This circuit supplies all currents needed in the device.
V
o p
p
(
)
max
2
0.87V
CC
0.4
(
)
1998 Oct 16
5
Philips Semiconductors
Product specification
Class-H high-output voltage level line
driver
TDA8574
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
THERMAL CHARACTERISTICS
SYMBOL
PARAMETER
CONDITIONS
MIN.
MAX.
UNIT
V
CC
supply voltage
operating
-
12
V
I
ORM
repetitive peak output current
-
20
mA
T
stg
storage temperature
-
55
+150
C
T
amb
operating ambient temperature
-
40
+85
C
T
j
junction temperature
-
+150
C
SYMBOL
PARAMETER
VALUE
UNIT
R
th j-a
thermal resistance from junction to ambient in free air
TDA8574 (DIP16)
75
K/W
TDA8574T (SO16)
110
K/W
1998 Oct 16
6
Philips Semiconductors
Product specification
Class-H high-output voltage level line
driver
TDA8574
DC CHARACTERISTICS
V
CC
= 9 V; T
amb
= 25
C; R
L
= 10 k
; in accordance with application diagram (see Fig.3).
Note
1. The DC output voltage with respect to ground is
0.87
V
CC.
AC CHARACTERISTICS
V
CC
= 9 V; f = 1 kHz; R
L
= 10 k
;
T
amb
= 25
C; in accordance with test circuit (see Fig.3); note 1.
Notes
1. The channel separation is determined by the parasitic capacitance between the inverting input left channel (pin 4)
and the inverting input right channel (pin 5). The PCB layout has a major contribution to the parasitic capacitance.
To obtain best results, the PCB tracks to pin 4 and pin 5 should be separated as much as possible.
2. The frequency response is externally fixed by the input coupling capacitors.
3. Noise output voltage is measured in a bandwidth of 20 Hz to 20 kHz with a source resistor R
s
= 600
.
4. Noise output voltage is measured in a bandwidth of 20 Hz to 20 kHz with an A-weighted filter with a source resistor
R
s
= 600
.
5. Distortion is measured at a frequency of 1 kHz using an A-weighted filter.
6. Distortion is measured at an output voltage of 3.0 V (RMS) at frequencies between 17 Hz and 20 kHz.
7. Ripple rejection is measured at the output, using a source resistor R
s
= 600
and a ripple amplitude of
100 mV (RMS) at a frequency of 1 kHz.
8. Ripple rejection is measured at the output, using a source resistor R
s
= 600
and a ripple amplitude of
100 mV (RMS) at frequencies between 20 Hz and 20 kHz.
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
V
CC
supply voltage
V
in
= 0 V
6
9
12
V
I
CC
supply current
-
8
13
mA
V
O
DC output voltage
note 1
-
7.8
-
V
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
G
v
voltage gain
7.5
8
8.5
dB
G
v
channel unbalance
-
-
0.5
dB
cs
channel separation
R
s
= 600
; V
o(rms)
= 1 V; note 1
80
90
-
dB
f
lr
low frequency roll-off
-
1 dB; note 2
-
-
5
Hz
f
hr
high frequency roll-off
-
1 dB
20
-
-
kHz
Z
i
input impedance
22
30
38
k
Z
o
output impedance
-
-
10
V
o(max)(rms)
maximum output voltage
(RMS value)
THD + N = 0.1%
5.0
5.2
-
V
V
no
noise output voltage
unweighted; note 3
-
7
9
V
A-weighted; note 4
-
5
-
V
THD + N
total harmonic distortion plus
noise
f = 1 kHz; V
o
= 3 V (RMS); note 5
-
0.003
0.01
%
f = 17 Hz to 20 kHz; note 6
-
0.01
-
%
SVRR
supply voltage ripple rejection
note 7
50
65
-
dB
f = 20 Hz to 20 kHz; note 8
-
55
-
dB
1998 Oct 16
7
Philips Semiconductors
Product specification
Class-H high-output voltage level line
driver
TDA8574
APPLICATION INFORMATION
Fig.3 Application diagram.
handbook, full pagewidth
MGE669
24 k
24 k
36 k
30 k
10 k
5
36 k
36 k
30 k
24 k
REFERENCE
REFERENCE
LIFT
AMP.
LIFT
AMP.
SIGNAL
AMP.
SIGNAL
AMP.
TDA8574(T)
VCCL
VCC
C6
VCCL
VCCR
RL
VCCR
VCCL
VCC
C5
1.5 nF
22
F
C4
C3
VCCR
3
1
R1
(1)
R2
(1)
R1
(1)
R2
(1)
BUFFER
BUFFER
BUFFER
BUFFER
CL
+
CL
-
CR
+
CR
-
OUTL
13
14
11
12
10
9
6
INR
INMR
INML
INL
SVRL
100
nF
8
15
16
LGND
RGND
OUTR
1.5 nF
2
4
5
7
Vi(R)
C2
C1
Vi(L)
SVRR
+
+
-
+
-
-
+
-
24 k
36 k
47
F
22
F
C1
Rs
Rs
22
F
22
F
100
F
100
F
10 k
RL
C3
C5
C4
VCC
(1) R1 and R2 should have a tolerance of
1%.
1998 Oct 16
8
Philips Semiconductors
Product specification
Class-H high-output voltage level line
driver
TDA8574
Printed-Circuit Board (PCB) layout
Fig.4 Recommended PCB-layout.
handbook, full pagewidth
MBH883
64
46.08
47
F
22
F
22
F
10 k
OUTR
INR
SGND
OUTL
INL
VCC
GND
RL
SGND
10 k
36 k
24 k
22
F
22
F
36 k
24 k
SO16
Dimensions in mm.
IC mounted on track side, additional components mounted on component side.
Tracks viewed from component side.
1998 Oct 16
9
Philips Semiconductors
Product specification
Class-H high-output voltage level line
driver
TDA8574
Application characteristics
V
CC
= 9 V; R
I
= 10 k
; T
amb
= 25
C; 80 kHz filter.
Fig.5
Total harmonic distortion plus noise as a
function of V
o
.
handbook, halfpage
6
0
V
o
(V)
THD
+
N
(%)
2
4
1
10
-
1
10
-
2
10
-
3
MGD906
1 kHz
f = 10 kHz
100 Hz
Fig.6
Total harmonic distortion plus noise as a
function of frequency.
handbook, halfpage
1
10
-
1
10
-
2
10
-
3
MGD907
10
f (Hz)
THD
+
N
(%)
10
2
10
3
10
4
10
5
Vo = 5 V
4 V
3 V
2 V
Fig.7 Total circuit gain as a function of frequency.
handbook, halfpage
2
4
6
8
10
MGD908
10
f (Hz)
G
(dB)
10
2
10
3
10
4
10
5
10
6
Fig.8
Supply voltage ripple rejection as a function
of frequency.
handbook, halfpage
-
80
-
70
-
60
-
50
-
40
MGD909
10
f (Hz)
SVRR
(dB)
10
2
10
3
10
4
10
5
Rs =
600
0
1998 Oct 16
10
Philips Semiconductors
Product specification
Class-H high-output voltage level line
driver
TDA8574
Fig.9 Channel separation as a function of V
o
.
handbook, halfpage
0
Vo (V)
cs
(dB)
-
60
-
80
-
100
-
120
1
5
2
3
4
MGD910
f = 10 kHz
1 kHz
100 Hz
Fig.10 Channel separation as a function of
frequency.
handbook, halfpage
-
120
-
100
-
80
-
60
MGD911
10
1 V
3 V
5 V
f (Hz)
cs
(dB)
10
2
10
3
10
4
10
5
1998 Oct 16
11
Philips Semiconductors
Product specification
Class-H high-output voltage level line
driver
TDA8574
PACKAGE OUTLINES
UNIT
A
max.
A
1
A
2
A
3
b
p
c
D
(1)
E
(1)
(1)
e
H
E
L
L
p
Q
Z
y
w
v
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC
JEDEC
EIAJ
mm
inches
2.65
0.30
0.10
2.45
2.25
0.49
0.36
0.32
0.23
10.5
10.1
7.6
7.4
1.27
10.65
10.00
1.1
1.0
0.9
0.4
8
0
o
o
0.25
0.1
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
Note
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
1.1
0.4
SOT162-1
8
16
w
M
b
p
D
detail X
Z
e
9
1
y
0.25
075E03
MS-013AA
pin 1 index
0.10
0.012
0.004
0.096
0.089
0.019
0.014
0.013
0.009
0.41
0.40
0.30
0.29
0.050
1.4
0.055
0.419
0.394
0.043
0.039
0.035
0.016
0.01
0.25
0.01
0.004
0.043
0.016
0.01
X
A
A
1
A
2
H
E
L
p
Q
E
c
L
v
M
A
(A )
3
A
0
5
10 mm
scale
SO16: plastic small outline package; 16 leads; body width 7.5 mm
SOT162-1
95-01-24
97-05-22
1998 Oct 16
12
Philips Semiconductors
Product specification
Class-H high-output voltage level line
driver
TDA8574
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC
JEDEC
EIAJ
SOT38-4
92-11-17
95-01-14
M
H
c
(e )
1
M
E
A
L
seating plane
A
1
w
M
b
1
b
2
e
D
A
2
Z
16
1
9
8
E
pin 1 index
b
0
5
10 mm
scale
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
UNIT
A
max.
1
2
b
1
(1)
(1)
(1)
b
2
c
D
E
e
M
Z
H
L
mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
A
min.
A
max.
b
max.
w
M
E
e
1
1.73
1.30
0.53
0.38
0.36
0.23
19.50
18.55
6.48
6.20
3.60
3.05
0.254
2.54
7.62
8.25
7.80
10.0
8.3
0.76
4.2
0.51
3.2
inches
0.068
0.051
0.021
0.015
0.014
0.009
1.25
0.85
0.049
0.033
0.77
0.73
0.26
0.24
0.14
0.12
0.01
0.10
0.30
0.32
0.31
0.39
0.33
0.030
0.17
0.020
0.13
DIP16: plastic dual in-line package; 16 leads (300 mil)
SOT38-4
1998 Oct 16
13
Philips Semiconductors
Product specification
Class-H high-output voltage level line
driver
TDA8574
SOLDERING
Introduction
There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our
"Data Handbook IC26; Integrated Circuit Packages"
(order code 9398 652 90011).
DIP
S
OLDERING BY DIPPING OR BY WAVE
The maximum permissible temperature of the solder is
260
C; solder at this temperature must not be in contact
with the joint for more than 5 seconds. The total contact
time of successive solder waves must not exceed
5 seconds.
The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified maximum storage temperature (T
stg max
). If the
printed-circuit board has been pre-heated, forced cooling
may be necessary immediately after soldering to keep the
temperature within the permissible limit.
R
EPAIRING SOLDERED JOINTS
Apply a low voltage soldering iron (less than 24 V) to the
lead(s) of the package, below the seating plane or not
more than 2 mm above it. If the temperature of the
soldering iron bit is less than 300
C it may remain in
contact for up to 10 seconds. If the bit temperature is
between 300 and 400
C, contact may be up to 5 seconds.
SO
R
EFLOW SOLDERING
Reflow soldering techniques are suitable for all SO
packages.
Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.
Several techniques exist for reflowing; for example,
thermal conduction by heated belt. Dwell times vary
between 50 and 300 seconds depending on heating
method. Typical reflow temperatures range from
215 to 250
C.
Preheating is necessary to dry the paste and evaporate
the binding agent. Preheating duration: 45 minutes at
45
C.
W
AVE SOLDERING
Wave soldering techniques can be used for all SO
packages if the following conditions are observed:
A double-wave (a turbulent wave with high upward
pressure followed by a smooth laminar wave) soldering
technique should be used.
The longitudinal axis of the package footprint must be
parallel to the solder flow.
The package footprint must incorporate solder thieves at
the downstream end.
During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.
Maximum permissible solder temperature is 260
C, and
maximum duration of package immersion in solder is
10 seconds, if cooled to less than 150
C within
6 seconds. Typical dwell time is 4 seconds at 250
C.
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.
R
EPAIRING SOLDERED JOINTS
Fix the component by first soldering two diagonally-
opposite end leads. Use only a low voltage soldering iron
(less than 24 V) applied to the flat part of the lead. Contact
time must be limited to 10 seconds at up to 300
C. When
using a dedicated tool, all other leads can be soldered in
one operation within 2 to 5 seconds between
270 and 320
C.
1998 Oct 16
14
Philips Semiconductors
Product specification
Class-H high-output voltage level line
driver
TDA8574
DEFINITIONS
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
Data sheet status
Objective specification
This data sheet contains target or goal specifications for product development.
Preliminary specification
This data sheet contains preliminary data; supplementary data may be published later.
Product specification
This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
1998 Oct 16
15
Philips Semiconductors
Product specification
Class-H high-output voltage level line
driver
TDA8574
NOTES
Internet: http://www.semiconductors.philips.com
Philips Semiconductors a worldwide company
Philips Electronics N.V. 1998
SCA60
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.
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South America: Al. Vicente Pinzon, 173, 6th floor,
04547-130 SO PAULO, SP, Brazil,
Tel. +55 11 821 2333, Fax. +55 11 821 2382
Spain: Balmes 22, 08007 BARCELONA,
Tel. +34 93 301 6312, Fax. +34 93 301 4107
Sweden: Kottbygatan 7, Akalla, S-16485 STOCKHOLM,
Tel. +46 8 5985 2000, Fax. +46 8 5985 2745
Switzerland: Allmendstrasse 140, CH-8027 ZRICH,
Tel. +41 1 488 2741 Fax. +41 1 488 3263
Taiwan: Philips Semiconductors, 6F, No. 96, Chien Kuo N. Rd., Sec. 1,
TAIPEI, Taiwan Tel. +886 2 2134 2865, Fax. +886 2 2134 2874
Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd.,
209/2 Sanpavuth-Bangna Road Prakanong, BANGKOK 10260,
Tel. +66 2 745 4090, Fax. +66 2 398 0793
Turkey: Talatpasa Cad. No. 5, 80640 GLTEPE/ISTANBUL,
Tel. +90 212 279 2770, Fax. +90 212 282 6707
Ukraine: PHILIPS UKRAINE, 4 Patrice Lumumba str., Building B, Floor 7,
252042 KIEV, Tel. +380 44 264 2776, Fax. +380 44 268 0461
United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes,
MIDDLESEX UB3 5BX, Tel. +44 181 730 5000, Fax. +44 181 754 8421
United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409,
Tel. +1 800 234 7381
Uruguay: see South America
Vietnam: see Singapore
Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD,
Tel. +381 11 625 344, Fax.+381 11 635 777
For all other countries apply to: Philips Semiconductors,
International Marketing & Sales Communications, Building BE-p, P.O. Box 218,
5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825
Argentina: see South America
Australia: 34 Waterloo Road, NORTH RYDE, NSW 2113,
Tel. +61 2 9805 4455, Fax. +61 2 9805 4466
Austria: Computerstr. 6, A-1101 WIEN, P.O. Box 213, Tel. +43 160 1010,
Fax. +43 160 101 1210
Belarus: Hotel Minsk Business Center, Bld. 3, r. 1211, Volodarski Str. 6,
220050 MINSK, Tel. +375 172 200 733, Fax. +375 172 200 773
Belgium: see The Netherlands
Brazil: see South America
Bulgaria: Philips Bulgaria Ltd., Energoproject, 15th floor,
51 James Bourchier Blvd., 1407 SOFIA,
Tel. +359 2 689 211, Fax. +359 2 689 102
Canada: PHILIPS SEMICONDUCTORS/COMPONENTS,
Tel. +1 800 234 7381
China/Hong Kong: 501 Hong Kong Industrial Technology Centre,
72 Tat Chee Avenue, Kowloon Tong, HONG KONG,
Tel. +852 2319 7888, Fax. +852 2319 7700
Colombia: see South America
Czech Republic: see Austria
Denmark: Prags Boulevard 80, PB 1919, DK-2300 COPENHAGEN S,
Tel. +45 32 88 2636, Fax. +45 31 57 0044
Finland: Sinikalliontie 3, FIN-02630 ESPOO,
Tel. +358 9 615800, Fax. +358 9 61580920
France: 51 Rue Carnot, BP317, 92156 SURESNES Cedex,
Tel. +33 1 40 99 6161, Fax. +33 1 40 99 6427
Germany: Hammerbrookstrae 69, D-20097 HAMBURG,
Tel. +49 40 23 53 60, Fax. +49 40 23 536 300
Greece: No. 15, 25th March Street, GR 17778 TAVROS/ATHENS,
Tel. +30 1 4894 339/239, Fax. +30 1 4814 240
Hungary: see Austria
India: Philips INDIA Ltd, Band Box Building, 2nd floor,
254-D, Dr. Annie Besant Road, Worli, MUMBAI 400 025,
Tel. +91 22 493 8541, Fax. +91 22 493 0966
Indonesia: PT Philips Development Corporation, Semiconductors Division,
Gedung Philips, Jl. Buncit Raya Kav.99-100, JAKARTA 12510,
Tel. +62 21 794 0040 ext. 2501, Fax. +62 21 794 0080
Ireland: Newstead, Clonskeagh, DUBLIN 14,
Tel. +353 1 7640 000, Fax. +353 1 7640 200
Israel: RAPAC Electronics, 7 Kehilat Saloniki St, PO Box 18053,
TEL AVIV 61180, Tel. +972 3 645 0444, Fax. +972 3 649 1007
Italy: PHILIPS SEMICONDUCTORS, Piazza IV Novembre 3,
20124 MILANO, Tel. +39 2 6752 2531, Fax. +39 2 6752 2557
Japan: Philips Bldg 13-37, Kohnan 2-chome, Minato-ku,
TOKYO 108-8507, Tel. +81 3 3740 5130, Fax. +81 3 3740 5077
Korea: Philips House, 260-199 Itaewon-dong, Yongsan-ku, SEOUL,
Tel. +82 2 709 1412, Fax. +82 2 709 1415
Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA, SELANGOR,
Tel. +60 3 750 5214, Fax. +60 3 757 4880
Mexico: 5900 Gateway East, Suite 200, EL PASO, TEXAS 79905,
Tel. +9-5 800 234 7381
Printed in The Netherlands
545102/25/03/pp16
Date of release: 1998 Oct 16
Document order number:
9397 750 04393
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