1996 Aug 26

Philips Semiconductors

Product specification

8-bit high-speed analog-to-digital
converter

TDA8716

FEATURES

8-bit resolution

Sampling rate up to 120 MHz

ECL (10 K family) compatible digital inputs and outputs

Overflow/Underflow output

Low power dissipation

Low input capacitance (13 pF typ.).

APPLICATIONS

High speed analog-to-digital convertion

Video signal digitizing

Radar pulse analysis

Transient signal analysis

High energy physics research

Medical systems

Industrial instrumentation.

GENERAL DESCRIPTION

The TDA8716 is an 8-bit high-speed Analog-to-Digital
Converter (ADC) designed for HDTV and professional
applications. The device converts the analog input signal
into 8-bit binary coded digital words at a sampling rate of
120 MHz. All digital outputs are ECL compatible.

QUICK REFERENCE DATA

Measured over full voltage and temperature ranges, unless otherwise specified.

ORDERING INFORMATION

SYMBOL

PARAMETER

CONDITIONS

MIN.

TYP.

MAX.

UNIT

EEA

analog supply voltage

5.45

5.2

4.95

EED

digital supply voltage

5.45

5.2

4.95

EEA

analog supply current

EED

digital supply current

100

110

EEO

output supply current

= 2.2 k

reference voltage BOTTOM

3.130

reference voltage TOP

1.870

ILE

DC integral linearity error

see Fig.8

0.5

LSB

DLE

DC differential linearity error

see Fig.9

0.25

0.45

LSB

effective bit

= 20 MHz;

CLK

= 100 MHz

bits

CLK

maximum clock frequency

120

MHz

tot

total power dissipation

excluding load

780

900

TYPE NUMBER

PACKAGE

NAME

DESCRIPTION

VERSION

TDA8716

DIP24

plastic dual in-line package; 24 leads (600 mil)

SOT101-1

TDA8716T

SO32L

plastic small outline package; 32 leads; body width 7.5 mm

SOT287-1

1996 Aug 26

Philips Semiconductors

Product specification

8-bit high-speed analog-to-digital converter

TDA8716

BLOCK DIAGRAM

Fig.1 Block diagram; TDA8716.

handbook, full pagewidth

TDA8716

OUTPUT LATCHES

DIGITAL PROCESSING

LATCHES

CLOCK

BUFFER

MSB ANALOG

PROCESSING

LSB ANALOG

PROCESSING

folding and interpolation

SAMPLE LATCHES

LSB BINARY

ENCODER

MSB BINARY

ENCODER

ECL BUFFERS

digital outputs

D0 to D7

IN range

MCD265 - 2

CLK input

analog input

analog ground

digital ground

analog negative
supply voltage
( 5.2 V)

output ground
supply voltage
(0 V)

digital negative
supply voltage
( 5.2 V)

two's complement
output select

voltage

reference top

voltage

reference middle

voltage

reference bottom

1996 Aug 26

Philips Semiconductors

Product specification

8-bit high-speed analog-to-digital converter

TDA8716

PINNING TDA8716

SYMBOL

PIN

DESCRIPTION

CLK

complementary clock input

CLK

clock input

EED1

digital negative supply voltage
(

5.2 V)

PLT2

two's complement output select
(active HIGH)

EEA

analog negative supply voltage
(

5.2 V)

reference voltage BOTTOM

AGND1

analog ground 1

analog input

reference voltage MIDDLE
decoupling

reference voltage TOP

AGND2

analog ground 2

EED2

digital negative supply voltage
(

5.2 V)

DGND1

digital ground 1

digital output (LSB)

digital output

OGND

output ground supply voltage (0 V)

digital output

digital output (MSB)

IN range

DGND2

digital ground 2

Fig.2 Pin configuration; TDA8716.

handbook, halfpage

MCD259

CLK

EED1

C PLT2

AGND1

EEA

AGND2

CLK

DGND2

DGND1

TDA8716

EED2

OGND

1996 Aug 26

Philips Semiconductors

Product specification

8-bit high-speed analog-to-digital converter

TDA8716

PINNING TDA8716T

SYMBOL

PIN

DESCRIPTION

CLK

complementary clock input

CLK

clock input

EED1

digital negative supply voltage
(

5.2 V)

n.c.

not connected

n.c.

not connected

PLT2

two's complement output select
(active HIGH)

EEA

analog negative supply voltage
(

5.2 V)

reference voltage BOTTOM

AGND1

analog ground 1

analog input

reference voltage MIDDLE
decoupling

n.c.

not connected

n.c.

not connected

reference voltage TOP

AGND2

analog ground 2

EED2

digital negative supply voltage
(

5.2 V)

DGND1

digital ground 1

digital output (LSB)

digital output

n.c.

not connected

n.c.

not connected

digital output

OGND

output ground supply voltage (0 V)

digital output

n.c.

not connected

n.c.

not connected

digital output (MSB)

IN range

DGND2

digital ground 2

Fig.3 Pin configuration; TDA8716T.

handbook, halfpage

TDA8716T

MBC742 - 2

V EED2

AGND2

VRT

n.c.

V I

AGND1

V RB

VEEA

C PLT2

n.c.

EED1

CLK

DGND1

n.c.

OGND

n.c.

DGND2

n.c.

1996 Aug 26

Philips Semiconductors

Product specification

8-bit high-speed analog-to-digital converter

TDA8716

LIMITING VALUES

In accordance with the Absolute Maximum Rating System (IEC 134).

Note

1. The circuit has two clock inputs: CLK and CLK. Sampling takes place on the rising edge of the clock input signal:

CLK and CLK are two's complementary ECL signals.

THERMAL CHARACTERISTICS

HANDLING

Inputs and outputs are protected against electrostatic discharge in normal handling. However, to be totally safe, it is
desirable to take normal precautions appropriate to handling integrated circuits.

SYMBOL

PARAMETER

CONDITIONS

MIN.

MAX.

UNIT

EEA

analog supply voltage

7.0

+0.3

EED1

EED2

digital supply voltage

7.0

+0.3

EEA

EED1

;

EEA

EED2

supply voltage differences

input voltage

referenced to
AGND

EEA

CLK; CLK(p-p)

input voltage for differential clock drive
(peak-to-peak value)

note 1

2.0

output current (each output stage)

stg

storage temperature

+150

amb

operating ambient temperature

+70

junction temperature

+150

SYMBOL

PARAMETER

CONDITIONS

VALUE

UNIT

th j-a

from junction to ambient

in free air

SOT101

K/W

SOT287 (see Fig.4)

K/W

1996 Aug 26

Philips Semiconductors

Product specification

8-bit high-speed analog-to-digital converter

TDA8716

CHARACTERISTICS

EEA

4.95 to

5.45 V; V

EED1

, V

EED2

4.95 to

5.45 V; AGND, DGND and OGND shorted together;

amb

= 0 to +70

C; unless otherwise specified. (Typical values taken at V

EEA

5.2 V; V

EED1

, V

EED2

5.2 V;

amb

= 25

C).

SYMBOL

PARAMETER

CONDITIONS

MIN.

TYP.

MAX.

UNIT

Supply

EEA

analog supply voltage

5.45

5.2

4.95

EED1

EED2

digital supply voltage

5.45

5.2

4.95

EEA

analog supply current

EED1

EED2

digital supply current

100

110

output supply current

= 2.2 k

diff

supply voltage differential

EEA

EED1

; V

EEA

EED2

0.5

+0.5

Reference voltages for the resistor ladder

reference voltage BOTTOM

3.5

3.13

reference voltage TOP

1.87

1.5

ref

reference voltage differential

1.26

voltage offset BOTTOM

note 1

130

voltage offset TOP

note 1

130

I(p-p)

input voltage amplitude
(peak-to-peak value)

0.95

1.0

1.5

ref

reference current

LAD

resistor ladder

temperature coefficient of the
resistor ladder

0.18

Inputs

CLK and CLK input

LOW level input voltage

1850

1770

1650

HIGH level input voltage

960

880

810

LOW level input current

CLK

1.77 V

HIGH level input current

CLK

0.88 V

input resistance

input capacitance

CLK(p-p)

differential clock input
V

CLK

(peak-to-peak value)

900

Analog input; note 2

input current BOTTOM

3.13 V

input current TOP

1.87 V

170

input resistance

input capacitance

1996 Aug 26

Philips Semiconductors

Product specification

8-bit high-speed analog-to-digital converter

TDA8716

Outputs (R

= 2.2 k

)

Digital 10K ECL outputs (D0 to D7; IR)

LOW level output voltage

1850

1770

1600

HIGH level output voltage

960

880

810

LOW level output current

1.8

4.0

HIGH level output current

2.0

4.0

Timing (f

CLK

= 100 MHz; R

= 2.2 k

; see Fig.5)

sampling delay

output hold time

output delay time

note 3

= 3.3 pF

7.5

= 7.5 pF

aperture jitter

Switching characteristics

CLK

; f

CLK

maximum clock frequency

120

MHz

Analog signal processing (f

CLK

= 100 MHz)

diff

differential gain

note 4

0.3

diff

differential phase

note 4

0.4

Harmonics (full scale); f

= 10 MHz; f

CLK

= 100 MHz

fundamental

even harmonics

odd harmonics

Transfer function

ILE

DC integral linearity error

0.5

LSB

DLE

DC differential linearity error

0.25

0.45

LSB

AILE

AC integral linearity error

note 4

1.5

LSB

effective bits

Figs 13 and 14; note 5;
f

CLK

= 100 MHz

= 4.43 MHz

see Fig.10

7.7

bits

= 10 MHz

see Fig.11

7.5

bits

= 20 MHz

see Fig.12

7.0

bits

= 30 MHz

6.5

bits

BER

bit error rate

CLK

= 100 MHz;

= 10 MHz; V

8 LSB at

code 128; 50% clock duty
factor

times/
samples

SYMBOL

PARAMETER

CONDITIONS

MIN.

TYP.

MAX.

UNIT

1996 Aug 26

Philips Semiconductors

Product specification

8-bit high-speed analog-to-digital converter

TDA8716

Notes

1. Voltage offset BOTTOM (V

) is the difference between the analog input which produces data outputs equal to 00

and the reference voltage BOTTOM (V

), at T

amb

= 25

C. Voltage offset TOP (V

) is the difference between

reference voltage TOP (V

) and the analog input which produces data outputs equal to FF, at T

amb

= 25

2. The analog input is not internally biased. It should be externally biased between V

and V

levels.

3. The TDA8716 can only withstand one or two 10K or 100K ECL loads in order to work-out timings at the maximum

sampling frequency. It is therefore recommended to minimize the printed-circuit board load by implementing the load
device as close as possible to the TDA8716.

4. Full-scale sinewave; f

= 4.43 MHz; f

CLK

, f

CLK

= 100 MHz.

5. Effective bits are obtained via a Fast Fourier Transformer (FFT) treatment taking 4 K acquisition points per period.

The calculation takes into account all harmonics and noise up to half of the clock frequency (NYQUIST frequency).
Conversion to SNR: SNR = EB (dB)

6.02 + 1.76.

Fig.4 Average effect of air flow on thermal resistance.

handbook, full pagewidth

1000

200

400

600

800

MEA540

percent
change

(R th ja)

air flow (LFPM)

SOL

1996 Aug 26

Philips Semiconductors

Product specification

8-bit high-speed analog-to-digital converter

TDA8716

Table 1

Output coding (CPLT2 HIGH)

STEP

(TYP.)

BINARY

OUTPUTS

D7 to D0

Underflow

< -

3 V

00000000

3 V

00000000

00000001

......

254

11111110

255

2 V

11111111

Overflow

> -

2 V

11111111

Table 2

Two's complement coding

PLT2

D7 (MSB)

1 (V

)

non inverted

0 (V

)

inverted

Fig.5 Timing diagram.

handbook, full pagewidth

sample N + 1

sample N

CLK

MSA654

sample N + 2

50 %

ANALOG
INPUT
V

DATA
OUTPUT
D0 - D7

50 %

DATA

N + 1

DATA

N - 1

1996 Aug 26

Philips Semiconductors

Product specification

8-bit high-speed analog-to-digital converter

TDA8716

APPLICATION INFORMATION

Additional application information will be supplied upon request, please quote reference number FTV/AN 9109.

Fig.6 Application diagram; TDA8716.

handbook, full pagewidth

MCD260 - 2

CLK

PLT2

AGND1

AGND2

CLK

DGND2

DGND1

TDA8716

EED

OGND (0 V)

EED1

( 5.2 V)

EEA

( 5.2 V)

( 3.13 V)

( 1.87 V)

EED2

( 5.2 V)

analog input

100 nF

Typical value for resistors = 2.2 k

Lower resistor values can be used down to 500

to obtain higher sampling frequencies in the 150 MSPS range (limited by t

and t

timings). In this

configuration a DC shift of the ECL output levels V

and V

will occur.

, V

and V

are decoupled to AGND.

Analog, digital and output supplies should be separated and decoupled.

The external voltage regulator must be constructed in such a way that a good supply voltage ripple rejection is achieved with respect to the LSB value.

1996 Aug 26

Philips Semiconductors

Product specification

8-bit high-speed analog-to-digital converter

TDA8716

PACKAGE OUTLINES

UNIT

max.

REFERENCES

OUTLINE

VERSION

EUROPEAN

PROJECTION

ISSUE DATE

IEC

JEDEC

EIAJ

inches

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

SOT101-1

92-11-17
95-01-23

min.

max.

1.7
1.3

0.53
0.38

0.32
0.23

32.0
31.4

14.1
13.7

3.9
3.4

0.25

2.54

15.24

15.80
15.24

17.15
15.90

2.2

5.1

0.51

4.0

0.066
0.051

0.021
0.015

0.013
0.009

1.26
1.24

0.56
0.54

0.15
0.13

0.01

0.10

0.60

0.62
0.60

0.68
0.63

0.087

0.20

0.020

0.16

051G02

MO-015AD

(e )

seating plane

pin 1 index

10 mm

scale

Note

1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.

max.

(1)

DIP24: plastic dual in-line package; 24 leads (600 mil)

SOT101-1

1996 Aug 26

Philips Semiconductors

Product specification

8-bit high-speed analog-to-digital converter

TDA8716

UNIT

max.

(1)

REFERENCES

OUTLINE

VERSION

EUROPEAN

PROJECTION

ISSUE DATE

IEC

JEDEC

EIAJ

inches

2.65

0.10

0.25

0.01

1.4

0.055

0.3
0.1

2.45
2.25

0.49
0.36

0.27
0.18

20.7
20.3

7.6
7.4

1.27

10.65
10.00

1.2
1.0

0.95
0.55

8
0

0.25

0.1

0.004

0.25

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

Note

1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.

1.1
0.4

SOT287-1

92-11-17
95-01-25

(1)

0.012
0.004

0.096
0.086

0.02
0.01

0.050

0.047
0.039

0.42
0.39

0.30
0.29

0.81
0.80

0.011
0.007

0.037
0.022

0.01

0.043
0.016

detail X

(A )

pin 1 index

10 mm

scale

SO32: plastic small outline package; 32 leads; body width 7.5 mm

SOT287-1

1996 Aug 26

Philips Semiconductors

Product specification

8-bit high-speed analog-to-digital converter

TDA8716

SOLDERING

Introduction

There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.

This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our

"IC Package Databook" (order code 9398 652 90011).

DIP

OLDERING BY DIPPING OR BY WAVE

The maximum permissible temperature of the solder is
260

C; solder at this temperature must not be in contact

with the joint for more than 5 seconds. The total contact
time of successive solder waves must not exceed
5 seconds.

The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified maximum storage temperature (T

stg max

). If the

printed-circuit board has been pre-heated, forced cooling
may be necessary immediately after soldering to keep the
temperature within the permissible limit.

EPAIRING SOLDERED JOINTS

Apply a low voltage soldering iron (less than 24 V) to the
lead(s) of the package, below the seating plane or not
more than 2 mm above it. If the temperature of the
soldering iron bit is less than 300

C it may remain in

contact for up to 10 seconds. If the bit temperature is
between 300 and 400

C, contact may be up to 5 seconds.

EFLOW SOLDERING

Reflow soldering techniques are suitable for all SO
packages.

Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.

Several techniques exist for reflowing; for example,
thermal conduction by heated belt. Dwell times vary
between 50 and 300 seconds depending on heating
method. Typical reflow temperatures range from
215 to 250

Preheating is necessary to dry the paste and evaporate
the binding agent. Preheating duration: 45 minutes at
45

AVE SOLDERING

Wave soldering techniques can be used for all SO
packages if the following conditions are observed:

A double-wave (a turbulent wave with high upward
pressure followed by a smooth laminar wave) soldering
technique should be used.

The longitudinal axis of the package footprint must be
parallel to the solder flow.

The package footprint must incorporate solder thieves at
the downstream end.

During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.

Maximum permissible solder temperature is 260

C, and

maximum duration of package immersion in solder is
10 seconds, if cooled to less than 150

C within

6 seconds. Typical dwell time is 4 seconds at 250

A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.

EPAIRING SOLDERED JOINTS

Fix the component by first soldering two diagonally-
opposite end leads. Use only a low voltage soldering iron
(less than 24 V) applied to the flat part of the lead. Contact
time must be limited to 10 seconds at up to 300

C. When

using a dedicated tool, all other leads can be soldered in
one operation within 2 to 5 seconds between
270 and 320

1996 Aug 26

Philips Semiconductors

Product specification

8-bit high-speed analog-to-digital converter

TDA8716

DEFINITIONS

LIFE SUPPORT APPLICATIONS

These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.

Data sheet status

Objective specification

This data sheet contains target or goal specifications for product development.

Preliminary specification

This data sheet contains preliminary data; supplementary data may be published later.

Product specification

This data sheet contains final product specifications.

Limiting values

Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.

Application information

Where application information is given, it is advisory and does not form part of the specification.

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