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Электронный компонент: TDA8718X

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DATA SHEET
Product specification
Supersedes data of April 1993
File under Integrated Circuits, IC02
June 1994
INTEGRATED CIRCUITS
Philips Semiconductors
TDA8718
8-bit high-speed analog-to-digital
converter
June 1994
2
Philips Semiconductors
Product specification
8-bit high-speed analog-to-digital converter
TDA8718
FEATURES
8-bit resolution
Sampling rate up to 600 MHz
ECL (100K family) compatible for digital inputs and
outputs
Overflow/Underflow output
50
load drive capability
Low input capacitance (5 pF typ.).
APPLICATIONS
High speed analog-to-digital conversion
Industrial instrumentation
Data communication
RF communication.
GENERAL DESCRIPTION
The TDA8718 is an 8-bit analog-to-digital converter (ADC)
designed for professional applications. The device
converts the analog input signal into 8-bit binary coded
digital words at a sampling rate of 600 MHz. It has an
effective bandwidth capability up to 150 MHz full-scale
sine wave. All digital outputs are ECL compatible.
QUICK REFERENCE DATA
Measured over full voltage and temperature ranges, unless otherwise specified.
ORDERING INFORMATION
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
V
EEA
analog supply voltage
-
4.2
-
4.5
-
4.8
V
V
EED
digital supply voltage
-
4.2
-
4.5
-
4.8
V
I
ref
resistive ladder current
R = 48
30
45
60
mA
I
EEA
analog supply current
30
42
54
mA
I
EED
digital supply current
100
120
150
mA
I
EEO(L)
LOW level output supply current
R
L
= 50
40
70
90
mA
I
EEO(H)
HIGH level output supply current
R
L
= 50
155
170
185
mA
ILE
DC integral linearity error
-
0.7
1.0
LSB
DLE
DC differential linearity error
-
0.3
0.5
LSB
EB
effective bits
f
i
= 4.43 MHz; I
ref
= 45 mA;
f
clk
= 100 MHz
-
7.5
-
bits
f
i
= 4.43 MHz; I
ref
= 45 mA;
f
clk
= 100 MHz
-
6.5
-
bits
f
clk(max)
maximum clock frequency
600
-
-
MHz
P
tot
total power dissipation
-
990
1250
mW
TYPE NUMBER
PACKAGE
PINS
PIN POSITION
MATERIAL
CODE
TDA8718K
28
PLCC28
plastic
SOT261-2
June 1994
3
Philips Semiconductors
Product specification
8-bit high-speed analog-to-digital converter
TDA8718
BLOCK DIAGRAM
Fig.1 Block diagram.
handbook, full pagewidth
1
3
5
VRB
V I
21
23
8
9
CLK
CLK
VEED
28
V EEA
16
15
13
17 D2
D3
D4
D5
D6
19
20
10
D1
D0
D7
ECL OUTPUTS
CLOCK DRIVER
TDA8718
analog
voltage input
clock inputs
underflow
output
data outputs
LSB
MSB
14
ANALOG SIGNAL
PROCESSING
RESISTOR
LADDER
&
INPUT
AND
OUTPUT
LATCHES
&
DIGITAL
DECODING
MBB854 - 2
24
DGND
27
AGND
analog ground
digital ground
VBB
UF
OGND2
OF
overflow
output
output
ground
analog negative
supply voltage
digital negative
supply voltage
32
8
8
VRT
VRM 2
reference
voltage middle
reference
voltage TOP
reference
voltage BOTTOM
11
6
18
12
OGND1
June 1994
4
Philips Semiconductors
Product specification
8-bit high-speed analog-to-digital converter
TDA8718
PINNING
SYMB
OL
PIN
DESCRIPTION
V
RB
1
reference voltage BOTTOM
V
RM
2
reference voltage MIDDLE decoupling
V
I
3
analog input voltage
n.c.
4
not connected
V
RT
5
reference voltage TOP
OF
6
overflow digital output
n.c.
7
not connected
CLK
8
clock input
CLK
9
complementary clock input
D7
10
digital output; bit 7 (MSB)
V
BB
11
ECL reference voltage
OGND1
12
output ground 1 (0 V)
D6
13
digital output; bit 6
D5
14
digital output; bit 5
D4
15
digital output; bit 4
D3
16
digital output; bit 3
D2
17
digital output; bit 2
OGND2
18
output ground 2 (0 V)
D1
19
digital output; bit 1
D0
20
digital output; bit 0 (LSB)
UF
21
underflow digital output
n.c.
22
not connected
V
EED
23
digital supply voltage (
-
4.5 V)
DGND
24
digital ground
n.c.
25
not connected
n.c.
26
not connected
AGND
27
analog ground
V
EEA
28
analog supply voltage (
-
4.5 V)
Fig.2 Pin configuration.
handbook, halfpage
5
6
7
8
9
10
11
25
24
23
22
21
20
19
12
13
14
15
16
17
18
4
3
2
1
28
27
26
TDA8718
VRT
OF
n.c.
CLK
D7
VBB
OGND1
D6
D5
D4
D3
D2
OGND2
D1
D0
UF
n.c.
VEED
DGND
n.c.
n.c.
AGND
V
EEA
V
RB
RM
V
n.c.
CLK
MBB850 - 2
V
I
June 1994
5
Philips Semiconductors
Product specification
8-bit high-speed analog-to-digital converter
TDA8718
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
Note
1. The circuit has two clock inputs CLK and CLK. Sampling takes place on the falling edge of the clock input signal;
CLK and CLK are two complementary signals.
THERMAL CHARACTERISTICS
SYMBOL
PARAMETER
CONDITIONS
MIN.
MAX.
UNIT
V
EEA
analog supply voltage (pin 28)
-
7.0
+0.3
V
V
EED
digital supply voltage (pin 23)
-
7.0
+0.3
V
V
EE
supply voltage difference between V
EEA
and V
EED
-
1.00
+1.0
V
V
I
input voltage (pin 3)
referenced to AGND
V
EEA
0
V
V
clk(p-p)
clock input voltage difference between
CLK and CLK pin 8 to pin 9
(peak-to-peak value)
referenced to V
EED
;
note 1
-
2.0
V
I
O
output current for each digital output
-
30
mA
T
stg
storage temperature
-
55
+150
C
T
amb
operating ambient temperature
0
+70
C
T
j
junction temperature
-
+150
C
SYMBOL
PARAMETER
VALUE
UNIT
R
th j-a
thermal resistance from junction to ambient in free air
55
K/W
Fig.3 Average effect of air flow on R
th j-a
.
Test conditions: PCB (2.24
2.24
0.062 inches).
LFPM = Linear Foot Per Minute.
handbook, halfpage
0
1000
0
50
40
MBB851
30
20
10
200
400
600
800
airflow (LFPM)
R th j-a
(%)
June 1994
6
Philips Semiconductors
Product specification
8-bit high-speed analog-to-digital converter
TDA8718
CHARACTERISTICS
V
EEA
=
-
4.2 to
-
4.8 V; V
EED
=
-
4.2 to
-
4.8 V; V
EEA
to V
EED
=
-
0.1 to +0.1 V; AGND and DGND shorted together;
T
amb
= 0 to +70
C; typical values measured at V
EEA
=
-
4.5 V, V
EED
=
-
4.5 V and T
amb
= 25
C;
unless otherwise specified.
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
Supply
V
EEA
analog supply voltage (pin 28)
-
4.2
-
4.5
-
4.8
V
V
EED
digital supply voltage (pin 23)
-
4.2
-
4.5
-
4.8
V
I
EEA
analog supply current (pin 28)
30
42
54
mA
I
EED
digital supply current (pin 23)
100
120
150
mA
I
EEO(L)
LOW level output supply current
R
L
= 50
40
70
90
mA
I
EEO(H)
HIGH level output supply current
R
L
= 50
155
170
185
mA
Reference voltages for the resistor ladder (see Table 1)
I
RT
reference current (pin 5)
R = 48
30
45
60
mA
V
RB
reference voltage BOTTOM (pin 1)
-
48
I
RT
-
V
V
RT
reference voltage TOP (pin 5)
-
0
-
V
R
LAD
resistor ladder
-
48
-
TC
RLAD
temperature coefficient of the
resistor ladder
-
175
-
M
/K
V
osB
voltage offset BOTTOM
note 1
-
8
I
RT
-
mV
V
osT
voltage offset TOP
note 1
-
8
I
RT
-
mV
Inputs
CLK
INPUT
(
PIN
8); CLK
INPUT
(
PIN
9)
V
IL
LOW level input voltage
-
-
1.8
-
V
V
IH
HIGH level input voltage
-
-
0.8
-
V
I
IL
LOW level input current
V
clk
=
-
1.8 V
-
0
-
A
I
IH
HIGH level input current
V
clk
=
-
0.8 V
-
120
-
A
R
I
input resistance
f
clk
= 100 MHz
-
1.5
-
k
C
I
input capacitance
f
clk
= 100 MHz
-
3.5
-
pF
V
clk(p-p)
clock input voltage difference
between CLK and CLK pin 8 to
pin 9 (peak-to-peak value)
-
900
-
mV
A
NALOG INPUT
(
PIN
3);
NOTE
2
I
IL
LOW level input current
data output = 00
20
40
80
A
I
IH
HIGH level input current
data output = FF
100
200
400
A
R
I
input resistance
-
10
-
k
C
I
input capacitance
-
5
-
pF
June 1994
7
Philips Semiconductors
Product specification
8-bit high-speed analog-to-digital converter
TDA8718
Outputs (R
L
= 50
)
D
IGITAL
100K ECL
OUTPUTS
(D0
TO
D7; OF; UF)
V
OL
LOW level output voltage
Tamb = 25
C
-
-
1770
-
1650
mV
V
OH
HIGH level output voltage
Tamb = 25
C
-
1300
-
1150
-
mV
V
ECL
ECL reference voltage
-
1550
-
1450
-
1350
mV
I
OL
LOW level output current
4
6
8
mA
I
OH
HIGH level output current
10
20
25
mA
Switching characteristics
f
clk(max)
maximum clock frequency
(pins 8 and 9)
600
-
-
MHz
t
r
; t
f
rise and fall times
f
i
= 100 MHz
-
-
750
ps
Analog signal processing (f
clk
= 500 MHz)
H
ARMONICS
(
FULL SCALE
)
h
1
fundamental harmonics
f
i
= 100 MHz
-
0
-
dB
h
2
second harmonics
f
i
= 100 MHz
-
-
54
-
dB
h
3
third harmonics
f
i
= 100 MHz
-
-
50
-
dB
Transfer function
ILE
DC integral linearity error
-
0.7
1.0
LSB
DLE
DC differential linearity error
-
0.3
0.5
LSB
AILE
AC integral linearity error
note 3
-
0.9
1.5
LSB
EB
effective bits
f
i
= 4.43 MHz, full scale;
I
ref
= 45 mA; note 4;
f
clk
= 100 MHz; Fig.5
-
7.5
-
bits
f
i
= 100 MHz, full scale;
I
ref
= 45 mA; note 4;
f
clk
= 500 MHz; Fig.6
-
6.5
-
bits
BER
bit error rate
f
clk
= 500 MHz;
f
i
= 100 MHz;
V
i
=
8 LSB at code
128; 50% clock duty
cycle
-
10
-
11
-
times/
samples
Timing (f
clk
= 500 MHz; R
L
= 50
; C
L
= 5 pF) note 5
t
ds
sampling delay
-
-
300
ps
t
h
output hold time
400
700
-
ps
t
d
output delay time
-
1300
1500
ps
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
June 1994
8
Philips Semiconductors
Product specification
8-bit high-speed analog-to-digital converter
TDA8718
Notes to the "Characteristics"
1. Voltage offset BOTTOM (V
osB
) is the difference between the analog input which produces data outputs equal to 00
and the reference voltage BOTTOM (V
RB
) at T
amb
= 25
C. Voltage offset TOP (V
osT
) is the difference between
reference voltage TOP (V
RT
) and the analog input which produces data outputs equal to FF, at T
amb
= 25
C.
2. The analog input is not internally biased. It should be externally biased between V
RT
and V
RB
levels.
3. Full-scale sine wave; f
i
= 4.43 MHz; f
clk
= 100 MHz.
4. Effective bits are obtained via a Fast Fourier Transform (FFT) treatment taking 4K acquisition points per period.
The calculation takes into account all harmonics and noise up to half of the clock frequency (NYQUIST frequency).
Conversion to signal-to-noise ratio: S/N = EB
6.02 + 1.76 dB.
5. TDA8718 can only withstand one or two 100K ECL loads in order to work out timings at the maximum sampling
frequency. It is recommended to minimize the printed circuit-board load by implementing the load device as close as
possible to the TDA8718.
Table 1 Output coding and input voltage (typical values; referenced to AGND.
STEP
V
I
O/UF
BINARY OUTPUT BITS
D5
D4
D3
D2
D1
D0
Underflow
< -
40
I
RT
1
0
0
0
0
0
0
0
-
40
I
RT
0
0
0
0
0
0
0
1
.
0
0
0
0
0
0
1
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
254
.
0
1
1
1
1
1
0
255
-
8
I
RT
0
1
1
1
1
1
1
Overflow
> -
8
I
RT
1
1
1
1
1
1
1
Fig.4 Timing diagram.
handbook, full pagewidth
sample N + 1
sample N
CLK
MSA666
sample N + 2
50 %
DATA
OF/UF
t ds
t h
50 %
DATA
N + 1
DATA
N
DATA
N - 1
DATA
N - 2
V I
June 1994
9
Philips Semiconductors
Product specification
8-bit high-speed analog-to-digital converter
TDA8718
Fig.5 Fast Fourier Transform (f
clk
= 100 MHz; f
i
= 4.43 MHz).
Effective bits: 7.53; THD =
-
54.56 dB.
Harmonic levels (dB): 2nd =
-
77.28; 3rd =
-
54.76; 4th =
-
71.43; 5th =
-
71.85; 6th =
-
105.50.
handbook, full pagewidth
18.8
0
120
0
6.27
12.5
MBD879
40
80
43.9
25.1
31.3
37.6
50.2
f (MHz)
100
20
60
amplitude
(dB)
Fig.6 Fast Fourier Transform (f
clk
= 500 MHz; f
i
= 100 MHz).
Effective bits: 6.60; THD =
-
48.60 dB.
Harmonic levels (dB): 2nd =
-
64.81; 3rd =
-
51.10; 4th =
-
65.05; 5th =
-
58.33; 6th =
-
54.07.
handbook, full pagewidth
93.5
0
120
0
31.2
62.4
MBD880
40
80
218.0
125.0
156.0
187.0
249.0
f (MHz)
100
20
60
amplitude
(dB)
June 1994
10
Philips Semiconductors
Product specification
8-bit high-speed analog-to-digital converter
TDA8718
APPLICATION INFORMATION
Fig.7 Application diagram.
handbook, full pagewidth
MBB852 - 2
TDA8718
VRT
OF
n.c.
CLK
D7
VBB
OGND1 D6
D5
D4
D3
D2
OGND2
D1
D0
UF
n.c.
VEED
DGND
n.c.
AGND
VEEA
VRB
RM
V
n.c.
CLK
22
nF
22
nF
22
nF
22
nF
4
3
2
1
28
27
26
11
10
9
8
7
6
5
19
20
21
22
23
24
25
12
13
14
15
16
17
18
2 V
n.c.
22 nF
22 nF
V I
June 1994
11
Philips Semiconductors
Product specification
8-bit high-speed analog-to-digital converter
TDA8718
PACKAGE OUTLINE
Fig.8 Plastic leaded chip carrier, 28-leads; SOT261-2.
Dimensions in mm.
handbook, full pagewidth
0.81
max
19
25
28
1
A
4
5
11
18
26
12
1.22
1.07
0.51
max
(3x)
MBC654
detail A
0.32
max
0.51 min
3.04
max
4.57
max
11.58
11.43
12.57
12.32
seating plane
0.10 S
0.53
max
0.18 M
1.27
(24 x)
S
12.57
12.32
11.58
11.43
2.16
max
1.14
0.64
R
10.92
9.91
45
o
June 1994
12
Philips Semiconductors
Product specification
8-bit high-speed analog-to-digital converter
TDA8718
SOLDERING
Plastic leaded chip carriers
B
Y WAVE
During placement and before soldering, the component
must be fixed with a droplet of adhesive. After curing the
adhesive, the component can be soldered. The adhesive
can be applied by screen printing, pin transfer or syringe
dispensing.
Maximum permissible solder temperature is 260
C, and
maximum duration of package immersion in solder bath is
10 s, if allowed to cool to less than 150
C within 6 s.
Typical dwell time is 4 s at 250
C.
A modified wave soldering technique is recommended
using two solder waves (dual-wave), in which a turbulent
wave with high upward pressure is followed by a smooth
laminar wave. Using a mildly-activated flux eliminates the
need for removal of corrosive residues in most
applications.
B
Y SOLDER PASTE REFLOW
Reflow soldering requires the solder paste (a suspension
of fine solder particles, flux and binding agent) to be
applied to the substrate by screen printing, stencilling or
pressure-syringe dispensing before device placement.
Several techniques exist for reflowing; for example,
thermal conduction by heated belt, infrared, and
vapour-phase reflow. Dwell times vary between 50 and
300 s according to method. Typical reflow temperatures
range from 215 to 250
C.
Preheating is necessary to dry the paste and evaporate
the binding agent. Preheating duration: 45 min at 45
C.
R
EPAIRING SOLDERED JOINTS
(
BY HAND
-
HELD SOLDERING
IRON OR PULSE
-
HEATED SOLDER TOOL
)
Fix the component by first soldering two, diagonally
opposite, end pins. Apply the heating tool to the flat part of
the pin only. Contact time must be limited to 10 s at up to
300
C. When using proper tools, all other pins can be
soldered in one operation within 2 to 5 s at between
270 and 320
C. (Pulse-heated soldering is not
recommended for SO packages.)
For pulse-heated solder tool (resistance) soldering of VSO
packages, solder is applied to the substrate by dipping or
by an extra thick tin/lead plating before package
placement.
DEFINITIONS
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
Data sheet status
Objective specification
This data sheet contains target or goal specifications for product development.
Preliminary specification
This data sheet contains preliminary data; supplementary data may be published later.
Product specification
This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
June 1994
13
Philips Semiconductors
Product specification
8-bit high-speed analog-to-digital converter
TDA8718
NOTES
June 1994
14
Philips Semiconductors
Product specification
8-bit high-speed analog-to-digital converter
TDA8718
NOTES
June 1994
15
Philips Semiconductors
Product specification
8-bit high-speed analog-to-digital converter
TDA8718
NOTES
Philips Semiconductors
Philips Semiconductors a worldwide company
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Tel. (9)0-50261, Fax. (9)0-520971
France: 4 Rue du Port-aux-Vins, BP317,
92156 SURESNES Cedex,
Tel. (01)4099 6161, Fax. (01)4099 6427
Germany: PHILIPS COMPONENTS UB der Philips G.m.b.H.,
P.O. Box 10 63 23, 20043 HAMBURG,
Tel. (040)3296-0, Fax. (040)3296 213.
Greece: No. 15, 25th March Street, GR 17778 TAVROS,
Tel. (01)4894 339/4894 911, Fax. (01)4814 240
Hong Kong: PHILIPS HONG KONG Ltd., Components Div.,
6/F Philips Ind. Bldg., 24-28 Kung Yip St., KWAI CHUNG, N.T.,
Tel. (852)424 5121, Fax. (852)428 6729
India: Philips INDIA Ltd, Components Dept,
Shivsagar Estate, A Block ,
Dr. Annie Besant Rd. Worli, Bombay 400 018
Tel. (022)4938 541, Fax. (022)4938 722
Indonesia: Philips House, Jalan H.R. Rasuna Said Kav. 3-4,
P.O. Box 4252, JAKARTA 12950,
Tel. (021)5201 122, Fax. (021)5205 189
Ireland: Newstead, Clonskeagh, DUBLIN 14,
Tel. (01)640 000, Fax. (01)640 200
Italy: PHILIPS COMPONENTS S.r.l.,
Viale F. Testi, 327, 20162 MILANO,
Tel. (02)6752.3302, Fax. (02)6752 3300.
Japan: Philips Bldg 13-37, Kohnan 2 -chome, Minato-ku, TOKYO 108,
Tel. (03)3740 5028, Fax. (03)3740 0580
Korea: (Republic of) Philips House, 260-199 Itaewon-dong,
Yongsan-ku, SEOUL, Tel. (02)794-5011, Fax. (02)798-8022
Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA,
SELANGOR, Tel. (03)750 5214, Fax. (03)757 4880
Mexico: Philips Components, 5900 Gateway East, Suite 200,
EL PASO, TX 79905, Tel. 9-5(800)234-7381, Fax. (708)296-8556
Netherlands: Postbus 90050, 5600 PB EINDHOVEN, Bldg. VB
Tel. (040)783749, Fax. (040)788399
New Zealand: 2 Wagener Place, C.P.O. Box 1041, AUCKLAND,
Tel. (09)849-4160, Fax. (09)849-7811
Norway: Box 1, Manglerud 0612, OSLO,
Tel. (022)74 8000, Fax. (022)74 8341
Pakistan: Philips Electrical Industries of Pakistan Ltd.,
Exchange Bldg. ST-2/A, Block 9, KDA Scheme 5, Clifton,
KARACHI 75600, Tel. (021)587 4641-49,
Fax. (021)577035/5874546.
Philippines: PHILIPS SEMICONDUCTORS PHILIPPINES Inc,
106 Valero St. Salcedo Village, P.O. Box 2108 MCC, MAKATI,
Metro MANILA, Tel. (02)810 0161, Fax. (02)817 3474
Portugal: PHILIPS PORTUGUESA, S.A.,
Rua dr. Antnio Loureiro Borges 5, Arquiparque - Miraflores,
Apartado 300, 2795 LINDA-A-VELHA,
Tel. (01)14163160/4163333, Fax. (01)14163174/4163366.
Singapore: Lorong 1, Toa Payoh, SINGAPORE 1231,
Tel. (65)350 2000, Fax. (65)251 6500
South Africa: S.A. PHILIPS Pty Ltd., Components Division,
195-215 Main Road Martindale, 2092 JOHANNESBURG,
P.O. Box 7430 Johannesburg 2000,
Tel. (011)470-5911, Fax. (011)470-5494.
Spain: Balmes 22, 08007 BARCELONA,
Tel. (03)301 6312, Fax. (03)301 42 43
Sweden: Kottbygatan 7, Akalla. S-164 85 STOCKHOLM,
Tel. (0)8-632 2000, Fax. (0)8-632 2745
Switzerland: Allmendstrasse 140, CH-8027 ZRICH,
Tel. (01)488 2211, Fax. (01)481 77 30
Taiwan: PHILIPS TAIWAN Ltd., 23-30F, 66, Chung Hsiao West
Road, Sec. 1. Taipeh, Taiwan ROC, P.O. Box 22978,
TAIPEI 100, Tel. (02)388 7666, Fax. (02)382 4382.
Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd.,
209/2 Sanpavuth-Bangna Road Prakanong,
Bangkok 10260, THAILAND,
Tel. (662)398-0141, Fax. (662)398-3319.
Turkey: Talatpasa Cad. No. 5, 80640 GLTEPE/ISTANBUL,
Tel. (0 212)279 2770, Fax. (0212)269 3094
United Kingdom: Philips Semiconductors Limited, P.O. Box 65,
Philips House, Torrington Place, LONDON, WC1E 7HD,
Tel. (071)436 41 44, Fax. (071)323 03 42
United States: INTEGRATED CIRCUITS:
811 East Arques Avenue, SUNNYVALE, CA 94088-3409,
Tel. (800)234-7381, Fax. (708)296-8556
DISCRETE SEMICONDUCTORS: 2001 West Blue Heron Blvd.,
P.O. Box 10330, RIVIERA BEACH, FLORIDA 33404,
Tel. (800)447-3762 and (407)881-3200, Fax. (407)881-3300
Uruguay: Coronel Mora 433, MONTEVIDEO,
Tel. (02)70-4044, Fax. (02)92 0601
For all other countries apply to: Philips Semiconductors,
International Marketing and Sales, Building BAF-1,
P.O. Box 218, 5600 MD, EINDHOVEN, The Netherlands,
Telex 35000 phtcnl, Fax. +31-40-724825
SCD31
Philips Electronics N.V. 1994
All rights are reserved. Reproduction in whole or in part is prohibited without the
prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation
or contract, is believed to be accurate and reliable and may be changed without
notice. No liability will be accepted by the publisher for any consequence of its
use. Publication thereof does not convey nor imply any license under patent- or
other industrial or intellectual property rights.
Printed in The Netherlands
533061/1500/04/pp16
Date of release: June 1994
Document order number:
9397 734 40011