1999 Sep 17

Philips Semiconductors

Preliminary specification

Analog current buffer for CD-R and CD-RW
systems

TZA1027

FEATURES

Eight amplifiers for servo and power calibration
functions

Gain selector for CD-R and CD-RW discs

Separate data amplifier for read speed up to thirty times
nominal data speed.

GENERAL DESCRIPTION

The TZA1027 is an analog current buffer IC for CD-R and
CD-RW systems with a 3-spot push-pull tracking system.
The IC interfaces directly to the photo diodes and
TZA1020. A HF current amplifier is implemented to detect
the actual HF data signal.

QUICK REFERENCE DATA

ORDERING INFORMATION

SYMBOL

PARAMETER

CONDITIONS

MIN.

TYP.

MAX.

UNIT

supply voltage

4.5

5.0

5.5

i(cd)

central diode input current

WRON = 1

3400

i(sd)

satellite diode input current

WRON = 1

520

CAHF

bandwidth

= 5 pF

MHz

d(f)

flatness delay

= 5 pF; f = 0.1 to 32 MHz

200

servo satellite detector gain

HG = 1

HG = 0

amb

ambient temperature

TYPE

NUMBER

PACKAGE

NAME

DESCRIPTION

VERSION

TZA1027HL

LQFP32

plastic low profile quad flat package; 32 leads; body 5

1.4 mm

SOT401-1

1999 Sep 17

Philips Semiconductors

Preliminary specification

Analog current buffer for CD-R and CD-RW
systems

TZA1027

PINNING

SYMBOL

PIN

DESCRIPTION

central photo diode current input

satellite diode current input

central photo diode current input

satellite diode current input

central photo diode current input

n.c.

not connected

n.c.

not connected

n.c.

not connected

n.c.

not connected

AGND

analog ground

DGND

digital ground

DDD

digital power supply

DDA

analog power supply

n.c.

not connected

HFGND

ground connection of CAHF output stage

CAHF

central aperture high-frequency output

n.c.

not connected

PDWN

digital input power-down

C2LF

C2 central detector signal output

A1LF

A1 satellite detector signal output

B1LF

B1 satellite detector signal output

C3LF

C3 central detector signal output

C4LF

C4 central detector signal output

B2LF

B2 satellite detector signal output

A2LF

A2 satellite detector signal output

C1LF

C1 central detector signal output

digital input high gain selection

WRON

digital input write on gain selection

n.c.

not connected

1999 Sep 17

Philips Semiconductors

Preliminary specification

Analog current buffer for CD-R and CD-RW
systems

TZA1027

FUNCTIONAL DESCRIPTION

All detector signals are applied to wide-band amplifiers for servo and laser power calibration functions of the TZA1020.
Signals from the central detector are added and amplified to suitable levels for the decoder circuit. Current gain can be
selected for CD-R and CD-RW discs.

LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).

THERMAL CHARACTERISTICS

LOGIC FUNCTIONS

Note

1. X = don't care.

SYMBOL

PARAMETERS

MIN.

MAX.

UNIT

supply voltage

5.5

stg

storage temperature

6.5

+150

amb

ambient temperature

electrostatic handling:

Machine model

100

+100

Human body model

500

+500

SYMBOL

PARAMETER

CONDITION

VALUE

UNIT

th(j-a)

thermal resistance from junction to
ambient

in free air

K/W

PDWN

WRON

MODE

X; note 1

power-down

CD-R read

CD-RW read

CD-R write

CD-RW write

1999 Sep 17

Philips Semiconductors

Preliminary specification

Analog current buffer for CD-R and CD-RW
systems

TZA1027

CHARACTERISTICS
V

DDA

= V

DDD

= 5 V; T

amb

= 25

C; I

i(cd)

= 25

A with x = 1LF to 4LF; I

i(sd)

= 4

A with y = A or B and z = 1LF or 2LF;

PDWN = 0; WRON = 0; HG = 0 and C

= C

= 5 pF; the given maximum and minimum values are 4

values; unless

otherwise specified. Signals available on the IC pins are upper case. Signals not visible on the IC pins are lower case.

SYMBOL

PARAMETERS

CONDITIONS

MIN.

TYP.

MAX.

UNIT

Supplies

DDA

analog supply voltage

4.5

5.0

5.5

DDD

digital supply voltage

4.5

5.0

5.5

difference between
V

DDA

and V

DDD

0.3

+0.3

DDA

analog supply current

PDWN = 1

0.1

DDD

digital supply current

PDWN = 1

Detector inputs

NPUT CURRENT RANGE

i(cd)

central diode input current

1.0

WRON = 1

3400

i(sd)

satellite diode input current

0.6

WRON = 1

520

NPUT VOLTAGE LEVEL

i(cd)

central diode input voltage level

2.5

2.9

3.3

WRON = 1

2.6

3.0

3.4

i(sd)

satellite diode input voltage level

1.6

1.9

2.2

WRON = 1

1.7

2.0

2.3

NPUT RESISTANCE

i(cd)

central diode input resistance

420

WRON = 1; I

i(cd)

= 1 mA

220

i(sd)

satellite diode input resistance

620

WRON = 1; I

i(cd)

= 200

370

Transfer functions

ERVO OUTPUTS CD

servo central detector gain

0.93

1.07

HG = 1

2.8

3.2

WRON = 1

0.94

1.06

WRON = 1; HG = 1

0.93

1.07

gain mismatch

bandwidth

MHz

HG = 1; I

i(cd)

= 6

MHz

WRON = 1; I

i(cd)

= 1000

150

230

MHz

WRON = 1; HG = 1; I

i(cd)

= 250

100

130

MHz

1999 Sep 17

Philips Semiconductors

Preliminary specification

Analog current buffer for CD-R and CD-RW
systems

TZA1027

Note

1. X = don't care.

rise time

WRON = 1; 30

A < I

i(cd)

< 520

delay time

WRON = 1;
30

A < I

i(cd)

< 520

2.5

ERVO OUTPUTS SD

servo satellite detector gain

HG = 1

2.85

3.05

3.25

WRON = 0; HG = 0

0.96

1.02

1.08

WRON = 1; HG = 0

0.88

0.95

1.02

WRON = 1; HG = 1

0.88

0.95

1.02

bandwidth

HG = 1; I

i(cd)

= 1

MHz

WRON = X; note 1; HG = X; note 1 46

MHz

rise time

WRON = 1; 4

A < I

i(cd)

< 65

3.6

delay time

WRON = 1; 4

A < I

i(cd)

< 65

4.5

ATA OUTPUT

;

CAHF

servo satellite detector gain

7.5

8.1

8.7

HG = 1

WRON = 1; HG = X; note 1

CAHF

bandwidth

MHz

HG = 1; I

i(cd)

= 6

MHz

d(f)

flatness delay

200

HG = 1; I

i(cd)

= 6

170

noise current

1.4

HG = 1; I

i(cd)

= 6

Output pins

o(cd)

central diode output voltage

0.2

DDD

o(sd)

satellite diode output voltage

0.2

DDD

o(CAHF)

data output voltage

DDD

+ 0.2 V

o(cd)

central diode output resistance

o(sd)

satellite diode output resistance

CAHF

data output resistance

Digital control signals

NPUT VOLTAGE LEVELS

;

PINS

PDWN, WRON

AND

LOW-level input voltage

0.2

+1.2

HIGH-level input voltage

1.8

DDD

+ 0.2 V

NPUT CURRENT

input leakage current

ELAY TIME

delay time

0.3

SYMBOL

PARAMETERS

CONDITIONS

MIN.

TYP.

MAX.

UNIT

1999 Sep 17

Philips Semiconductors

Preliminary specification

Analog current buffer for CD-R and CD-RW
systems

TZA1027

SOLDERING

Introduction to soldering surface mount packages

This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our

"Data Handbook IC26; Integrated Circuit Packages"

(document order number 9398 652 90011).

There is no soldering method that is ideal for all surface
mount IC packages. Wave soldering is not always suitable
for surface mount ICs, or for printed-circuit boards with
high population densities. In these situations reflow
soldering is often used.

Reflow soldering

Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.

Several methods exist for reflowing; for example,
infrared/convection heating in a conveyor type oven.
Throughput times (preheating, soldering and cooling) vary
between 100 and 200 seconds depending on heating
method.

Typical reflow peak temperatures range from
215 to 250

C. The top-surface temperature of the

packages should preferable be kept below 230

Wave soldering

Conventional single wave soldering is not recommended
for surface mount devices (SMDs) or printed-circuit boards
with a high component density, as solder bridging and
non-wetting can present major problems.

To overcome these problems the double-wave soldering
method was specifically developed.

If wave soldering is used the following conditions must be
observed for optimal results:

Use a double-wave soldering method comprising a
turbulent wave with high upward pressure followed by a
smooth laminar wave.

For packages with leads on four sides, the footprint must
be placed at a 45

angle to the transport direction of the

printed-circuit board. The footprint must incorporate
solder thieves downstream and at the side corners.

For packages with leads on two sides and a pitch (e):

larger than or equal to 1.27 mm, the footprint

longitudinal axis is preferred to be parallel to the
transport direction of the printed-circuit board;

smaller than 1.27 mm, the footprint longitudinal axis

must be parallel to the transport direction of the
printed-circuit board.

The footprint must incorporate solder thieves at the
downstream end.

During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.

Typical dwell time is 4 seconds at 250

C. A

mildly-activated flux will eliminate the need for removal of
corrosive residues in most applications.

Manual soldering

Fix the component by first soldering two
diagonally-opposite end leads. Use a low voltage (24 V or
less) soldering iron applied to the flat part of the lead.
Contact time must be limited to 10 seconds at up to
300

When using a dedicated tool, all other leads can be
soldered in one operation within 2 to 5 seconds between
270 and 320

1999 Sep 17

Philips Semiconductors

Preliminary specification

Analog current buffer for CD-R and CD-RW
systems

TZA1027

Suitability of surface mount IC packages for wave and reflow soldering methods

Notes

1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum

temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the

"Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods".

2. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink

(at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version).

3. If wave soldering is considered, then the package must be placed at a 45

angle to the solder wave direction.

The package footprint must incorporate solder thieves downstream and at the side corners.

4. Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8 mm;

it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.

5. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is

definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.

DEFINITIONS

LIFE SUPPORT APPLICATIONS

These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.

PACKAGE

SOLDERING METHOD

WAVE

REFLOW

(1)

BGA, SQFP

not suitable

suitable

HLQFP, HSQFP, HSOP, HTSSOP, SMS

not suitable

(2)

suitable

PLCC

(3)

, SO, SOJ

suitable

LQFP, QFP, TQFP

not recommended

(3)(4)

suitable

SSOP, TSSOP, VSO

not recommended

(5)

suitable

Data sheet status

Objective specification

This data sheet contains target or goal specifications for product development.

Preliminary specification

This data sheet contains preliminary data; supplementary data may be published later.

Product specification

This data sheet contains final product specifications.

Limiting values

Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.

Application information

Where application information is given, it is advisory and does not form part of the specification.

SCA

All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.

The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.

Internet: http://www.semiconductors.philips.com

1999

Philips Semiconductors a worldwide company

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Printed in The Netherlands

545002/01/pp

Date of release:

1999 Sep 17

Document order number:

9397 750 04724

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