2004 May 04

Philips Semiconductors

Preliminary specification

Photodiode and amplifier IC
for CD and DVD applications

TZA1046

FEATURES

High frequency RF amplifiers

Power-down mode for standby condition

Suitable for all CD (785 nm) and DVD (655 nm)
read/write applications

Four high-bandwidth central outputs (A, B, C and D);
four satellite outputs (EG, FH, ETST and HTST) and one
high-bandwidth differential RF output (RFP and RFN)

Internal current clamp and current fold back (power
reduction)

Versatile programmable gain switches (CD/DVD, H/L
and R/W)

Single 5 V supply

Current outputs for optimum signal transport over flex
cable

Small outline package HTSSON16T with good
positional tolerance.

APPLICATIONS

CD and DVD read/write applications.

GENERAL DESCRIPTION

The TZA1046 is a single optical pick-up IC for read/write
systems and is suitable for CD and DVD applications.

The device contains eight RF amplifiers for the central and
satellite diodes and one differential RF amplifier (RFP and
RFN) which handles the sum of the four A, B, C and D
central diode signals.

Programming the gain is a very versatile way to optimize
interfacing between the TZA1046 and the preamplifier.
The gain can be programmed for CD or DVD media with
the gain switch CD/DVD.

The H/L switch is a three level switch that can be used to
adjust the gain for different dye and phase change media.
The third level (high-impedance state) invokes the
power-down mode for standby condition.

Gain switch R/W is used to reduce the gain during writing.
During CD-R writing with clipping, the high peak signals for
the central and satellite segments are clamped internally
and the output currents of the A, B, C, D, E, F, G and H
segments are folded back to reduce power consumption.
The output currents can be folded back to almost zero,
depending on the light power detected. CD-R writing can
also be done without clipping for applications where
averaging is used.

All outputs are current outputs that can supply a maximum
of 8 mA. In CD-R write clip mode, the clipping level of the
output currents is between 5 mA and 8 mA.

The HTSSON16T package has a low spread on the
Z tolerance. The Z tolerance is measured between the
diodes (chip surface) and the bottom of the leads. The
diodes have an offset of 54

m the y direction with respect

to the leadframe centre and a tolerance of 50

m in both

x- and y-directions.

In normal operation the satellite outputs F and H are
combined as one output FH and the satellite outputs
E and G are combined as one output EG. In normal mode
the ETST and HTST outputs are not used (high ohmic).
When pulling the R/W pin above the supply or is left open
the device comes into a testing mode where all four
separate satellite channels are directed to the outputs.
This mode is used for Optical Pick-up Unit (OPU)
alignment of the diodes where all satellite channels must
be available.

ORDERING INFORMATION

TYPE

NUMBER

PACKAGE

NAME

DESCRIPTION

VERSION

TZA1046TM

HTSSON16T plastic thermal enhanced thin shrink small outline package/transparent;

no leads; 16 terminals; body 6.6

5.2

1.1 mm

SOT814-1

2004 May 04

Philips Semiconductors

Preliminary specification

Photodiode and amplifier IC
for CD and DVD applications

TZA1046

QUICK REFERENCE DATA

SYMBOL

PARAMETER

CONDITIONS

MIN.

TYP.

MAX.

UNIT

Supplies

DD1

supply voltage
front-end

4.5

5.0

5.5

DD2

supply voltage
back-end

4.5

5.0

5.5

DD1

supply current
front-end

dark conditions; 6-channel mode

writing DVD+R

writing CDR clipping

writing DVD+RW or CDR no-clip

writing CDRW

reading DVD

reading CD

reading DVD+RW

reading CDRW

power-down mode

0.4

DD2

supply current
back-end

dark conditions; 6-channel mode

writing DVD+R

5.3

writing CDR clipping

5.3

writing DVD+RW or CDR no-clip

5.3

writing CDRW

5.3

reading DVD

5.3

reading CD

5.3

reading DVD+RW

5.3

reading CDRW

6.6

power-down mode

0.1

Temperature range

amb

ambient temperature

RF bandwidth

3dB(cen)

bandwidth of central
channels A, B, C and D

= 1.0 mA; 6-channel mode

reading DVD

130

165

MHz

reading CD

100

142

MHz

reading DVD+RW

130

162

MHz

reading CDRW

124

MHz

3dB(RF)

bandwidth of differential
channels RFP and RFN

= 1.0 mA

reading DVD

130

175

MHz

reading CD

100

130

MHz

reading DVD+RW

130

166

MHz

reading CDRW

114

MHz

2004 May 04

Philips Semiconductors

Preliminary specification

Photodiode and amplifier IC
for CD and DVD applications

TZA1046

Settling time

settling time

CD-R write mode (all channels);
I

set

> 300

A; accuracy set level

within

5 %; write peak level to set

level factor < 50

CD-RW and DVD+RW write modes
(all channels); I

set

> 100

accuracy set level within

5 %; write

peak level to set level factor 2; peak
current

o(max)

DVD+R write mode (all channels);
I

set

> 100

A; accuracy set level

within

5 %; write peak level to set

level factor 20; peak current

o(max)

Phase delay and group delay variation

d(p)(RF)

phase delay variation
differential channels
RFP and RFN

= 1.0 mA; f

= 2 to 104 MHz

reading DVD

0.2

reading CD

0.3

reading DVD+RW

0.25

reading CDRW

0.5

d(g)(RF)

group delay variation
differential channels
RFP and RFN

= 1.0 mA; f

= 2 to 104 MHz

reading DVD

0.4

reading CD

0.6

reading DVD+RW

0.4

reading CDRW

Sensitivity

output current
sensitivity

values depend on operating mode;
see Table 1

A/W

SYMBOL

PARAMETER

CONDITIONS

MIN.

TYP.

MAX.

UNIT

2004 May 04

Philips Semiconductors

Preliminary specification

Photodiode and amplifier IC
for CD and DVD applications

TZA1046

Table 1

Output current sensitivity; typical values

Note

1. The sensitivity of the TZA1046 is specified in A/W because it has current outputs. In the application diagram (see

Fig.6) the resistors of 150

convert the currents into voltages. The maximum absolute spread is

20 %.

MODE

OUTPUT CURRENT SENSITIVITY (A/W)

(1)

CENTRAL

SATELLITE

DIFFERENTIAL

(RFP AND RFN)

Writing DVD+R with averaging

0.72

1.44

0.27

Reading high reflective DVD media: single layer DVD
and DVD+R

21.6

43.2

8.10

Writing DVD+RW with averaging

2.88

5.76

1.08

Reading low reflective DVD media: dual layer DVD and
DVD+RW

43.2

86.4

16.2

Writing CDR with sampling

43.2

86.4

1.08

Reading high reflective CD media

86.4

173

32.4

Writing CDR with averaging

1.44

2.88

0.54

Writing CDRW with averaging

5.76

11.5

2.16

Reading low reflective CD media: CDRW

173

346

64.8

2004 May 04

Philips Semiconductors

Preliminary specification

Photodiode and amplifier IC
for CD and DVD applications

TZA1046

PINNING

Note

1. In test mode all separate satellite signals are available.

In normal mode HTST and ETST are high ohmic, FH
is the sum of F and H and EG is the sum of E and G.

SYMBOL

PIN

DESCRIPTION

central segment output A

central segment output D

DD2

supply voltage back-end

RFP

positive RF output

RFN

negative RF output

GND

ground

central segment output B

central segment output C

HTST

satellite segment output H in test
mode; note 1

sum of satellite segment F and
segment H output, segment F output
in test mode; note 1

R/W

gain select switch for reading or
writing and to select the test mode

H/L

gain select switch for low reflective
(H/L = 1) and high reflective (H/L = 0)
media

CD/DVD

gain select switch for CD or DVD

DD1

supply voltage front-end

Sum of satellite segment E and
segment G output, satellite output G
in test mode; note 1

ETST

segment E output in test mode;
note 1

001aaa407

TZA1046TM

RFP

RFN

GND

DD2

CD/DVD

H/L

R/W

HTST

DD1

ETST

terminal 1
index area

Fig.2 Pin configuration.

2004 May 04

Philips Semiconductors

Preliminary specification

Photodiode and amplifier IC
for CD and DVD applications

TZA1046

MODE SELECTION

Table 2

Coder switching

Note

1. The 8-channel test mode is activated when V

I(test-on)

or I

I(test-on)

is applied to pin R/W or if pin R/W is left open. The

values of V

I(test-on)

or I

I(test-on)

can be found in Chapter 11.

MECHANICAL DATA

PIN LEVEL

MODE

R/W

H/L

CD/DVD

6-channel mode

don't care

open

LOW

Power-down

LOW

writing DVD+R no-clip or averaging mode

LOW

HIGH

writing CDR write-clip or sample mode

LOW

open

HIGH

writing CDR no-clip or averaging mode

LOW

HIGH

LOW

writing DVD+RW no-clip mode; either sampling or averaging mode

LOW

HIGH

writing CDRW no-clip mode, either sampling or averaging mode

HIGH

LOW

reading DVD+R; DVD-SL

HIGH

LOW; open

HIGH

reading CD and CDR

HIGH

LOW

reading DVD+RW; DVD-DL

HIGH

reading CDRW

8-channel test mode; note 1

test mode

LOW

reading DVD+R and DVD-SL

LOW; open

HIGH

reading CD and CDR

HIGH

LOW

reading DVD+RW and DVD-DL

HIGH

reading CDRW

handbook, full pagewidth

115

145

100

MGU616

150

Fig.3 Photodiode configuration.

Dimensions in

Space between central segments: < 1

Space between satellite segments: < 1

2004 May 04

Philips Semiconductors

Preliminary specification

Photodiode and amplifier IC
for CD and DVD applications

TZA1046

10 LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 60134).

11 CHARACTERISTICS
V

DD1

= V

DD2

= 2.0 V; pin R/W = LOW; pin H/L = LOW; pin CD/DVD = HIGH; V

= V

= 2.0 V;

= V

ETST

= V

HTST

= 2.0 V; V

RFP

= V

RFN

= 2.0 V; measured in dark conditions; T

amb

= 25

C; 6-channel mode;

unless otherwise specified.

SYMBOL

PARAMETER

MIN.

MAX.

UNIT

DD1

supply voltage front-end

0.3

+5.5

DD2

supply voltage back-end

0.3

+5.5

DD1

supply voltage difference with respect to V

DD2

0.3

DD2

+ 0.3

DD2

supply voltage difference with respect to V

DD1

0.3

DD1

+ 0.3

voltage at pins

A, B, C, D, ETST, FH, EG, HTST, RFP and RFN

0.3

DD2

+ 0.3

CD/DVD and H/L

0.3

DD1

+ 0.3

R/W

0.3

DD1

+ 2.5

SYMBOL

PARAMETER

CONDITIONS

MIN.

TYP.

MAX.

UNIT

Supplies

DD1

supply voltage
front-end

note 1

4.5

5.0

5.5

DD2

supply voltage
back-end

note 1

4.5

5.0

5.5

DD1

supply current
front-end

dark conditions; 6-channel mode;
note 2

writing DVD+R

writing CDR clipping

writing DVD+RW or CDR no-clip

writing CDRW

reading DVD

reading CD

reading DVD+RW

reading CDRW

power-down mode

0.4

2004 May 04

Philips Semiconductors

Preliminary specification

Photodiode and amplifier IC
for CD and DVD applications

TZA1046

DD2

supply current
back-end

dark conditions; 6-channel mode;
note 2

writing DVD+R

5.3

writing CDR clipping

5.3

writing DVD+RW or CDR no-clip

5.3

writing CDRW

5.3

reading DVD

5.3

reading CD

5.3

reading DVD+RW

5.3

reading CDRW

6.6

power-down mode

0.1

Temperature range

amb

ambient temperature

Central segment output channels: pins A, B, C and D

3dB

bandwidth

= 1.0 mA

writing DVD+R

172

MHz

writing CDR clipping

206

MHz

writing DVD+RW or CDR no-clip

211

MHz

writing CDRW

125

MHz

reading DVD

130

165

MHz

reading CD

100

142

MHz

reading DVD+RW

130

162

MHz

reading CDRW

124

MHz

d(p)

phase delay variation

= 1mA; f

= 2 to 104 MHz

reading DVD

0.25

reading CD

0.15

reading DVD+RW

0.2

reading CDRW

0.3

sens

channel matching
sensitivity

note 3

output voltage range

DD2

output current

o(offset)

output offset current

dark conditions; T

amb

= 0 to 70

reading CDRW

1.5

+11

other modes

0.9

+12

o(clip)

output current clipping
level

CD-R writing; note 4

n(o)

spot noise output
current

= 1.0 mA; f

= 50 MHz; note 5

reading CD

1.2

nA/

reading DVD+RW

0.4

nA/

reading CDRW

2.0

nA/

SYMBOL

PARAMETER

CONDITIONS

MIN.

TYP.

MAX.

UNIT

2004 May 04

Philips Semiconductors

Preliminary specification

Photodiode and amplifier IC
for CD and DVD applications

TZA1046

Differential RF outputs channel: pins RFP and RFN

3dB

bandwidth

= 1.0 mA

writing DVD+R

120

MHz

writing CDR clipping

205

MHz

writing DVD+RW or CDR no-clip

375

MHz

writing CDRW

118

MHz

reading DVD

130

175

MHz

reading CD

100

130

MHz

reading DVD+RW

130

166

MHz

reading CDRW

114

MHz

d(p)

phase delay variation

= 1.0 mA; f

= 2 to 104 MHz

reading DVD

0.2

reading CD

0.3

reading DVD+RW

0.25

reading CDRW

0.5

d(g)

group delay variation

= 1.0 mA; f

= 2 to 104 MHz

reading DVD

0.4

reading CD

0.6

reading DVD+RW

0.4

reading CDRW

CMR

common mode ripple

= 2 mA (peak); f

up to 104 MHz;

note 6

output voltage range

DD2

output current

o(offset)

output offset current

dark conditions; T

amb

= 0 to 70

pin RFP

pin RFN

pin RFP; reading CDRW

pin RFN; reading CDRW

n(o)

spot noise output
current

= 1.0 mA; f

= 50 MHz; note 5

reading CD

0.9

nA/

reading DVD+RW

0.3

nA/

reading CDRW

1.5

nA/

SYMBOL

PARAMETER

CONDITIONS

MIN.

TYP.

MAX.

UNIT

2004 May 04

Philips Semiconductors

Preliminary specification

Photodiode and amplifier IC
for CD and DVD applications

TZA1046

Satellite segment output channels: pins ETST, FH, EG and HTST; note 7

3dB

bandwidth

= 1.0 mA; 6-channel mode

writing DVD+R

MHz

writing CDR clipping

MHz

writing DVD+RW or CDR no-clip

107

MHz

writing CDRW

MHz

reading DVD

MHz

reading CD

MHz

reading DVD+RW

MHz

reading CDRW

MHz

sens

channel matching
sensitivity

note 8

output voltage range

DD2

output current

o(offset)

output offset current

dark conditions; T

amb

= 0 to 70

reading CDRW

other modes

5.4

o(clip)

current clipping level

CD-R writing; note 4

n(o)

spot noise output
current

= 1.0 mA; f

= 25 MHz; note 5

reading CD

2.2

nA/

reading DVD+RW

0.8

nA/

reading CDRW

4.3

nA/

Settling time, all channels; note 9

settling time

CD-R write mode; I

set

> 300

accuracy set level within

5 %;

write peak level to set level
factor < 50

CD-RW and DVD+RW write modes;
I

set

> 100

A; accuracy set level

within

5 %; write peak level to set

level factor 2; peak current

o(max)

DVD+R write mode; I

set

> 100

accuracy set level within

5 %;

write peak level to set level
factor 20; peak current

o(max)

Control inputs: pins R/W, H/L and CD/DVD

LOW-level input voltage note 10

0.6

HIGH-level input
voltage

note 10

2.5

DD1

I(pd)

pull-down input
impedance

only pin CD/DVD

200

SYMBOL

PARAMETER

CONDITIONS

MIN.

TYP.

MAX.

UNIT

2004 May 04

Philips Semiconductors

Preliminary specification

Photodiode and amplifier IC
for CD and DVD applications

TZA1046

Notes

1. The supplies are connected internally by diodes. Differences between the supply voltages should not exceed 0.3 V.

2. Estimated average power consumption (6 channel mode):

P = I

DD1

+ I

DD2

o(RF)

DD2

o(RF)

ref

o(EG)

+ I

o(FH)

)

DD2

ref

)

o(RF)

o(EG)

o(FH)

, where:

is the load resistance on each of the differential RF outputs RFP and RFN and R

is the load resistance on all

other outputs.

= 1.35 and K

= 1.6 for CD-RW reading; K

= 1.50 and K

= 1.40 for other modes.

ref

= V

ref1

= V

ref2

; see Fig.6.

3. Outputs A, B, C, and D: I

= 3 mA output current. Definition of matching:

4. The clipping function is active in the CD-R write mode for the segment outputs (not for outputs RFP and RFN) and

in the read mode for all outputs. In the read mode, the clipping level is increased above I

o(max)

5. The S/N ratio improves significantly when the sensitivity is lowered.

6. Definition:

7. In test mode all channels are active, in normal mode channels EG and FH are active and channels ETST and HTST

are off.

8. Outputs ETST, FH, EG, and HTST: I

= 1.5 mA output current; M

sens

7 % for reading CD-RW, CD-ROM,

DVD+RW and writing CD-R.

Definition of matching in normal mode:

Definition of matching in test mode:

9. The settling time includes the recovery time.

10. Pins R/W and H/L are three-level switches. When these pins are left open-circuit two internal resistors (150 k

GND and 350 k

to V

) will keep them between 1.3 and 1.7 V.

11. The test mode is also activated when the R/W pin is left open-circuit.

Test mode: pin R/W

I(test-on)

input voltage to activate
the test mode

note 11

DD1

I(test-on)

force current into pin to
activate the test mode

800

1200

Sensitivity

output current
sensitivity

values depend on operating mode;
see Table 3

A/W

SYMBOL

PARAMETER

CONDITIONS

MIN.

TYP.

MAX.

UNIT

o(max)

o(min)

(

)

1
4

---

------------------------------------------------------

RFP

RFN

RFP

RFN

-----------------------------

log

o max

(

)

o min

(

)

(

)

1
2

---

---------------------------------------

o(max)

o(min)

ETST

HTST

(

)

1
4

---

--------------------------------------------------------------------------------

2004 May 04

Philips Semiconductors

Preliminary specification

Photodiode and amplifier IC
for CD and DVD applications

TZA1046

Table 3

Output current sensitivity; typical values

Note

1. The sensitivity of the TZA1046 is specified in A/W because it has current outputs. In the application diagram

(see Fig.6) the resistors of 150

convert the currents into voltages. The maximum absolute spread is

20 %.

MODE

OUTPUT CURRENT SENSITIVITY (A/W)

(1)

CENTRAL

SATELLITE

DIFFERENTIAL

(RFP AND RFN)

Writing DVD+R with averaging

0.72

1.44

0.27

Reading high reflective DVD media: single layer DVD
and DVD+R

21.6

43.2

8.10

Writing DVD+RW with averaging

2.88

5.76

1.08

Reading low reflective DVD media; dual layer DVD and
DVD+RW

43.2

86.4

16.2

Writing CDR with sampling

43.2

86.4

1.08

Reading high reflective CD media

86.4

173

32.4

Writing CDR with averaging

1.44

2.88

0.54

Writing CDRW with averaging

5.76

11.5

2.16

Reading low reflective CD media: CDRW

173

346

64.8

2004 May 04

Philips Semiconductors

Preliminary specification

Photodiode and amplifier IC
for CD and DVD applications

TZA1046

12.2

Test mode description

Alignment of the diodes during OPU manufacturing requires the availability of all satellite outputs. In normal mode the
F and H channels are combined to a single output FH and the E and G channels are combined to a single output EG.
This is done to switch off two channels in the normal mode (application usage) which saves power consumption. For
alignment of the diodes each individual satellite output must be available and therefore the TZA1046 can be put in a test
mode where all satellite channels are available. The test mode is activated by pulling the R/W digital input pin above the
supply (2 to 2.5 V higher than V

DD1

), by forcing an input current into this pin (800 to 1200

A) or by leaving the pin

open-circuit. Fig.7 shows the R/W input configuration.

handbook, full pagewidth

MDB576

1 k

350

150

100
k

40 k

100
k

300
k

6 k

100

GND

R/W input

R/W internal

8-channel
test mode

VDD1

VDD2

Fig.7 R/W input configuration.

2004 May 04

Philips Semiconductors

Preliminary specification

Photodiode and amplifier IC
for CD and DVD applications

TZA1046

13 PACKAGE OUTLINE

REFERENCES

OUTLINE

VERSION

EUROPEAN

PROJECTION

ISSUE DATE

IEC

JEDEC

JEITA

SOT814-1

- - -

03-10-10
03-11-19

HTSSON16T: plastic thermal enhanced thin shrink small outline package / transparent; no leads;
16 terminals; body 6.6 x 5.2 x 1.1 mm

SOT814-1

2.5

5 mm

scale

y1 C

terminal 1
index area

UNIT

max.

1.1

0.5
0.3

0.33
0.23

0.65

4.55

5.4
5.2

5.15
4.95

min.

0.05

0.1

DIMENSIONS (mm are the original dimensions)

0.3

1.50

1.00

5.3
5.1

4.5
4.0

6.7
6.5

4.2
3.7

D1
D2

detail X

2004 May 04

Philips Semiconductors

Preliminary specification

Photodiode and amplifier IC
for CD and DVD applications

TZA1046

14 SOLDERING

14.1

Introduction to soldering surface mount
packages

This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our

"Data Handbook IC26; Integrated Circuit Packages"

(document order number 9398 652 90011).

There is no soldering method that is ideal for all surface
mount IC packages. Wave soldering can still be used for
certain surface mount ICs, but it is not suitable for fine pitch
SMDs. In these situations reflow soldering is
recommended.

14.2

Reflow soldering

Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.
Driven by legislation and environmental forces the
worldwide use of lead-free solder pastes is increasing.

Several methods exist for reflowing; for example,
convection or convection/infrared heating in a conveyor
type oven. Throughput times (preheating, soldering and
cooling) vary between 100 and 200 seconds depending
on heating method.

Typical reflow peak temperatures range from
215 to 270

C depending on solder paste material. The

top-surface temperature of the packages should
preferably be kept:

below 225

C (SnPb process) or below 245

C (Pb-free

process)

for all BGA, HTSSON-T and SSOP-T packages

for packages with a thickness 2.5 mm

for packages with a thickness < 2.5 mm and a

volume

350 mm

so called thick/large packages.

below 240

C (SnPb process) or below 260

C (Pb-free

process) for packages with a thickness < 2.5 mm and a
volume < 350 mm

so called small/thin packages.

Moisture sensitivity precautions, as indicated on packing,
must be respected at all times.

14.3

Wave soldering

Conventional single wave soldering is not recommended
for surface mount devices (SMDs) or printed-circuit boards
with a high component density, as solder bridging and
non-wetting can present major problems.

To overcome these problems the double-wave soldering
method was specifically developed.

If wave soldering is used the following conditions must be
observed for optimal results:

Use a double-wave soldering method comprising a
turbulent wave with high upward pressure followed by a
smooth laminar wave.

For packages with leads on two sides and a pitch (e):

larger than or equal to 1.27 mm, the footprint

longitudinal axis is preferred to be parallel to the
transport direction of the printed-circuit board;

smaller than 1.27 mm, the footprint longitudinal axis

must be parallel to the transport direction of the
printed-circuit board.

The footprint must incorporate solder thieves at the
downstream end.

For packages with leads on four sides, the footprint must
be placed at a 45

angle to the transport direction of the

printed-circuit board. The footprint must incorporate
solder thieves downstream and at the side corners.

During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.

Typical dwell time of the leads in the wave ranges from
3 to 4 seconds at 250

C or 265

C, depending on solder

material applied, SnPb or Pb-free respectively.

A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.

14.4

Manual soldering

Fix the component by first soldering two
diagonally-opposite end leads. Use a low voltage (24 V or
less) soldering iron applied to the flat part of the lead.
Contact time must be limited to 10 seconds at up to
300

When using a dedicated tool, all other leads can be
soldered in one operation within 2 to 5 seconds between
270 and 320

2004 May 04

Philips Semiconductors

Preliminary specification

Photodiode and amplifier IC
for CD and DVD applications

TZA1046

14.5

Suitability of surface mount IC packages for wave and reflow soldering methods

Notes

1. For more detailed information on the BGA packages refer to the

"(LF)BGA Application Note" (AN01026); order a copy

from your Philips Semiconductors sales office.

2. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum

temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the

"Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods".

3. These transparent plastic packages are extremely sensitive to reflow soldering conditions and must on no account

be processed through more than one soldering cycle or subjected to infrared reflow soldering with peak temperature
exceeding 217

C measured in the atmosphere of the reflow oven. The package body peak temperature

must be kept as low as possible.

4. These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the solder

cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink on the top side,
the solder might be deposited on the heatsink surface.

5. If wave soldering is considered, then the package must be placed at a 45

angle to the solder wave direction.

The package footprint must incorporate solder thieves downstream and at the side corners.

6. Wave soldering is suitable for LQFP, TQFP and QFP packages with a pitch (e) larger than 0.8 mm; it is definitely not

suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.

7. Wave soldering is suitable for SSOP, TSSOP, VSO and VSSOP packages with a pitch (e) equal to or larger than

0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.

8. Image sensor packages in principle should not be soldered. They are mounted in sockets or delivered pre-mounted

on flex foil. However, the image sensor package can be mounted by the client on a flex foil by using a hot bar
soldering process. The appropriate soldering profile can be provided on request.

9. Hot bar or manual soldering is suitable for PMFP packages.

15 ADDITIONAL SOLDERING INFORMATION

Reflow peak temperature for TZA1046TM should be no higher than 215

Manual soldering for TZA1046TM is not encouraged. In case of touch-up desolder the defective device manually and
use reflow soldering for the assembly of the replacing device.

PACKAGE

(1)

SOLDERING METHOD

WAVE

REFLOW

(2)

BGA, HTSSON..T

(3)

, LBGA, LFBGA, SQFP, SSOP..T

(3)

, TFBGA,

USON, VFBGA

not suitable

suitable

DHVQFN, HBCC, HBGA, HLQFP, HSO, HSOP, HSQFP, HSSON,
HTQFP, HTSSOP, HVQFN, HVSON, SMS

not suitable

(4)

suitable

PLCC

(5)

, SO, SOJ

suitable

LQFP, QFP, TQFP

not recommended

(5)(6)

suitable

SSOP, TSSOP, VSO, VSSOP

not recommended

(7)

suitable

CWQCCN..L

(8)

, PMFP

(9)

, WQCCN..L

(8)

not suitable

2004 May 04

Philips Semiconductors

Preliminary specification

Photodiode and amplifier IC
for CD and DVD applications

TZA1046

16 DATA SHEET STATUS

Notes

1. Please consult the most recently issued data sheet before initiating or completing a design.

2. The product status of the device(s) described in this data sheet may have changed since this data sheet was

published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com.

3. For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status.

LEVEL

DATA SHEET

STATUS

(1)

PRODUCT

STATUS

(2)(3)

DEFINITION

Objective data

Development

This data sheet contains data from the objective specification for product
development. Philips Semiconductors reserves the right to change the
specification in any manner without notice.

Preliminary data Qualification

This data sheet contains data from the preliminary specification.
Supplementary data will be published at a later date. Philips
Semiconductors reserves the right to change the specification without
notice, in order to improve the design and supply the best possible
product.

III

Product data

Production

This data sheet contains data from the product specification. Philips
Semiconductors reserves the right to make changes at any time in order
to improve the design, manufacturing and supply. Relevant changes will
be communicated via a Customer Product/Process Change Notification
(CPCN).

17 DEFINITIONS

Short-form specification

The data in a short-form

specification is extracted from a full data sheet with the
same type number and title. For detailed information see
the relevant data sheet or data handbook.

Limiting values definition

Limiting values given are in

accordance with the Absolute Maximum Rating System
(IEC 60134). Stress above one or more of the limiting
values may cause permanent damage to the device.
These are stress ratings only and operation of the device
at these or at any other conditions above those given in the
Characteristics sections of the specification is not implied.
Exposure to limiting values for extended periods may
affect device reliability.

Application information

Applications that are

described herein for any of these products are for
illustrative purposes only. Philips Semiconductors make
no representation or warranty that such applications will be
suitable for the specified use without further testing or
modification.

18 DISCLAIMERS

Life support applications

These products are not

designed for use in life support appliances, devices, or
systems where malfunction of these products can
reasonably be expected to result in personal injury. Philips
Semiconductors customers using or selling these products
for use in such applications do so at their own risk and
agree to fully indemnify Philips Semiconductors for any
damages resulting from such application.

Right to make changes

Philips Semiconductors

reserves the right to make changes in the products -
including circuits, standard cells, and/or software -
described or contained herein in order to improve design
and/or performance. When the product is in full production
(status `Production'), relevant changes will be
communicated via a Customer Product/Process Change
Notification (CPCN). Philips Semiconductors assumes no
responsibility or liability for the use of any of these
products, conveys no licence or title under any patent,
copyright, or mask work right to these products, and
makes no representations or warranties that these
products are free from patent, copyright, or mask work
right infringement, unless otherwise specified.

2004 May 04

Philips Semiconductors

Preliminary specification

Photodiode and amplifier IC
for CD and DVD applications

TZA1046

ICs with CD functionality

Purchase of a Philips IC with

CD functionality does not convey an implied license under
any patent right to use this IC in any CD application.
A license under the Philips CD patents can be obtained via
Philips Intellectual Property & Standards
(Internet at URL http://www.ip.philips.com;
e-mail info.licensing@philips.com).

ICs with DVD functionality

Purchase of a Philips IC

with DVD functionality does not convey an implied license
under any patent right to use this IC in any DVD
application. A license under the Philips DVD patents can
be obtained via Philips Intellectual Property & Standards
(Internet at URL http://www.ip.philips.com;
e-mail info.licensing@philips.com).

SCA76

All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.

The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.

Philips Semiconductors a worldwide company

Contact information

For additional information please visit http://www.semiconductors.philips.com.

Fax: +31 40 27 24825

For sales offices addresses send e-mail to: sales.addresses@www.semiconductors.philips.com.

Printed in The Netherlands

R04/01/pp

Date of release:

2004 May 04

Document order number:

9397 750 11525

Document Outline

Ð­Ð»ÐµÐºÑ‚Ñ€Ð¾Ð½Ð½Ñ‹Ð¹ ÐºÐ¾Ð¼Ð¿Ð¾Ð½ÐµÐ½Ñ‚: TZA1046TM

Document Outline

ÐÐ»ÐµÐºÑ‚Ñ€Ð¾Ð½Ð½Ñ‹Ð¹ ÐºÐ¾Ð¼Ð¿Ð¾Ð½ÐµÐ½Ñ‚: TZA1046TM