2004 Mar 09

Philips Semiconductors

Product specification

4-channel BTL driver for CD/DVD drives

TZA1049

FEATURES

Two Bridge-Tied Load (BTL) driver channels for sled
and spindle motors and actuators

Pulse Width Modulation (PWM) input

Integral thermal shut-down circuit

Integral mute control

Two regulated reference voltage outputs for other chips
in system; 3.3 V and 1.8 V respectively

HSOP28 package.

APPLICATIONS

BTL driver for CD and DVD players.

GENERAL DESCRIPTION

The TZA1049 is a four-channel BTL driver IC for driving
motors and actuators in CD and DVD players.
Two reference voltage outputs are also available for
peripheral ICs such as servo and pick-up head drivers.
The spindle motor control inputs to the IC can be either
differential or single-ended.

ORDERING INFORMATION

TYPE NUMBER

PACKAGE

NAME

DESCRIPTION

VERSION

TZA1049TH

HSOP28

plastic, heatsink small outline package; 28 leads

SOP007

2004 Mar 09

Philips Semiconductors

Product specification

4-channel BTL driver for CD/DVD drives

TZA1049

PINNING

SYMBOL

PIN

DESCRIPTION

supply voltage

RADOUTN

radial coil driver negative output

FOCOUTP

focus coil driver positive output

GND

ground

FOCOUTN

focus coil driver negative output

RADOUTP

radial coil driver positive output

supply voltage

SLOUTP

sled motor driver positive output

SLOUTN

sled motor driver negative output

GND

ground

MOTOUTP

spindle motor driver positive output

MOTOUTN

spindle motor driver negative output

supply voltage

MOTIN2

spindle motor driver input 2

MOTIN1

spindle motor driver input 1

MOTBIAS

spindle motor bias input

VBIASOUT

1.65 V bias voltage output

GND

ground

VBIASIN

bias voltage input

SLIN

sled motor driver input

FOCIN

focus coil driver input

RADIN

radial coil driver input

MUTE

mute control input

VFBIN1.8

1.8 V generator/regulator feedback voltage input

VOUT1.8

1.8 V generator/regulator output

VFBIN3.3

3.3 V generator/regulator feedback voltage input

VOUT3.3

3.3 V generator/regulator output

2004 Mar 09

Philips Semiconductors

Product specification

4-channel BTL driver for CD/DVD drives

TZA1049

FUNCTIONAL DESCRIPTION

7.1

General notes

1. The integral thermal shut-down circuit mutes the

output current when the chip temperature reaches
175

C (typical). The hysteresis is set to 25

(typical), so the circuit will restart when the chip
temperature falls to 150

C (typical).

2. Mute mode is activated when the voltage at pin MUTE

is below 0.5 V, and deactivated when the voltage at
pin MUTE is above 1.2 V. In mute mode, both positive
and negative output terminals will be at
high-impedance state. However, the 3.3 V and 1.8 V
outputs are not affected.

3. It is recommended that a 220

F decoupling capacitor

is connected between pins V

and pin GND and

physically located as close as possible to these supply
pins.

4. The positive outputs of the focus, radial and sled driver

channels are in phase with their respective input
signals. The positive output of the spindle driver
channel is in phase with the input signal on
pin MOTIN1.

5. The values of the resistors connected to each input

channel must be equal to, or larger than, 4.7 k

ensure that the gain of each input stage is less than, or
equal to 1.

6. The GND pins are internally connected to heat

dissipation fins within the package. You must ensure
that these pins are connected to an external ground.

7. The 1.65 V bias voltage output from pin VBIASOUT is

derived from the internal 3.3 V generator/regulator,
and will be affected by any variation in the 3.3 V
generator/regulator voltage.

TZA1049TH

VOUT3.3

RADOUTN

VFBIN3.3

FOCOUTP

VOUT1.8

GND

VFBIN1.8

FOCOUTN

MUTE

RADOUTP

RADIN

FOCIN

SLIN

SLOUTP

VBIASIN

SLOUTN

GND

VBIASOUT

MOTOUTP

MOTBIAS

MOTOUTN

MOTIN1

MOTIN2

mce479

Fig.2 Pin configuration.

2004 Mar 09

Philips Semiconductors

Product specification

4-channel BTL driver for CD/DVD drives

TZA1049

LIMITING VALUES

In accordance with the Absolute Maximum Rating System (IEC 60134).

CHARACTERISTICS

amb

= 25

C; V

= 9 V; R

= 8

; unless otherwise specified.

SYMBOL

PARAMETER

MIN.

MAX.

UNIT

supply voltage

13.5

power dissipation

1.7

oper

operating temperature

+85

stg

storage temperature

+150

SYMBOL

PARAMETER

CONDITIONS

MIN.

TYP.

MAX.

UNIT

bandwidth

100

kHz

power supply

PSRR

power supply rejection ratio

at V

= 5 V

quiescent current

unloaded

20.3

stb

standby current

mute mode active;
unloaded

2.1

MUTE(L)

low level voltage on pin MUTE; mute
mode active

0.8

MUTE(H)

high level voltage on pin MUTE; mute
mode inactive

Radial coil driver

OO(rad)

output offset voltage

con(rad)

maximum constant current

= 8

250

300

p(max)(rad)

maximum peak current

= 8

250

430

rad

gain

= 9 V;

= 700 mV (p-p);

ext

= 4.7 k

; note 1

Focus coil driver

OO(foc)

output offset voltage

con(foc)

maximum constant current

= 8

250

300

p(max)(foc)

maximum peak current

= 8

370

430

foc

gain

= 9 V;

= 700 mV (p-p);

ext

= 4.7 k

; note 1

Sled motor driver

OO(sle)

output offset voltage

con(sle)

maximum constant current

= 8

200

300

p(sle)

maximum peak current

= 8

370

430

sle

gain

= 9 V;

= 700 mV (p-p);

ext

= 4.7 k

; note 1

V/V

2004 Mar 09

Philips Semiconductors

Product specification

4-channel BTL driver for CD/DVD drives

TZA1049

Note

1. For gain measurements, only the channel being tested is active, the others are inactive; see Fig.4.

Spindle motor driver

OO(spin)

output offset voltage

con(spin)

maximum constant current

= 4

400

430

p(spin)

maximum peak current

= 4

560

600

spin

gain

= 9 V;

= 700 mV (p-p);

ext

= 4.7 k

; note 1

1.12

1.26

V/V

3.3 V generator

fb(3.3)

feedback voltage

3.1

3.3

3.5

O(3.3)

output current

4.4

1.8 V generator

fb(1.8)

feedback voltage

1.7

1.8

1.9

O(1.8)

output current

4.2

SYMBOL

PARAMETER

CONDITIONS

MIN.

TYP.

MAX.

UNIT

2004 Mar 09

Philips Semiconductors

Product specification

4-channel BTL driver for CD/DVD drives

TZA1049

12 SOLDERING

12.1

Introduction to soldering surface mount
packages

This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our

"Data Handbook IC26; Integrated Circuit Packages"

(document order number 9398 652 90011).

There is no soldering method that is ideal for all surface
mount IC packages. Wave soldering can still be used for
certain surface mount ICs, but it is not suitable for fine pitch
SMDs. In these situations reflow soldering is
recommended.

12.2

Reflow soldering

Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.
Driven by legislation and environmental forces the
worldwide use of lead-free solder pastes is increasing.

Several methods exist for reflowing; for example,
convection or convection/infrared heating in a conveyor
type oven. Throughput times (preheating, soldering and
cooling) vary between 100 and 200 seconds depending
on heating method.

Typical reflow peak temperatures range from
215 to 270

C depending on solder paste material. The

top-surface temperature of the packages should
preferably be kept:

below 225

C (SnPb process) or below 245

C (Pb-free

process)

for all BGA, HTSSON-T and SSOP-T packages

for packages with a thickness

2.5 mm

for packages with a thickness < 2.5 mm and a

volume

350 mm

so called thick/large packages.

below 240

C (SnPb process) or below 260

C (Pb-free

process) for packages with a thickness < 2.5 mm and a
volume < 350 mm

so called small/thin packages.

Moisture sensitivity precautions, as indicated on packing,
must be respected at all times.

12.3

Wave soldering

Conventional single wave soldering is not recommended
for surface mount devices (SMDs) or printed-circuit boards
with a high component density, as solder bridging and
non-wetting can present major problems.

To overcome these problems the double-wave soldering
method was specifically developed.

If wave soldering is used the following conditions must be
observed for optimal results:

Use a double-wave soldering method comprising a
turbulent wave with high upward pressure followed by a
smooth laminar wave.

For packages with leads on two sides and a pitch (e):

larger than or equal to 1.27 mm, the footprint

longitudinal axis is preferred to be parallel to the
transport direction of the printed-circuit board;

smaller than 1.27 mm, the footprint longitudinal axis

must be parallel to the transport direction of the
printed-circuit board.

The footprint must incorporate solder thieves at the
downstream end.

For packages with leads on four sides, the footprint must
be placed at a 45

angle to the transport direction of the

printed-circuit board. The footprint must incorporate
solder thieves downstream and at the side corners.

During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.

Typical dwell time of the leads in the wave ranges from
3 to 4 seconds at 250

C or 265

C, depending on solder

material applied, SnPb or Pb-free respectively.

A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.

12.4

Manual soldering

Fix the component by first soldering two
diagonally-opposite end leads. Use a low voltage (24 V or
less) soldering iron applied to the flat part of the lead.
Contact time must be limited to 10 seconds at up to
300

When using a dedicated tool, all other leads can be
soldered in one operation within 2 to 5 seconds between
270 and 320

2004 Mar 09

Philips Semiconductors

Product specification

4-channel BTL driver for CD/DVD drives

TZA1049

12.5

Suitability of surface mount IC packages for wave and reflow soldering methods

Notes

1. For more detailed information on the BGA packages refer to the

"(LF)BGA Application Note" (AN01026); order a copy

from your Philips Semiconductors sales office.

2. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum

temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the

"Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods".

3. These transparent plastic packages are extremely sensitive to reflow soldering conditions and must on no account

be processed through more than one soldering cycle or subjected to infrared reflow soldering with peak temperature
exceeding 217

C measured in the atmosphere of the reflow oven. The package body peak temperature

must be kept as low as possible.

4. These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the solder

cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink on the top side,
the solder might be deposited on the heatsink surface.

5. If wave soldering is considered, then the package must be placed at a 45

angle to the solder wave direction.

The package footprint must incorporate solder thieves downstream and at the side corners.

6. Wave soldering is suitable for LQFP, TQFP and QFP packages with a pitch (e) larger than 0.8 mm; it is definitely not

suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.

7. Wave soldering is suitable for SSOP, TSSOP, VSO and VSSOP packages with a pitch (e) equal to or larger than

0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.

8. Image sensor packages in principle should not be soldered. They are mounted in sockets or delivered pre-mounted

on flex foil. However, the image sensor package can be mounted by the client on a flex foil by using a hot bar
soldering process. The appropriate soldering profile can be provided on request.

9. Hot bar or manual soldering is suitable for PMFP packages.

PACKAGE

(1)

SOLDERING METHOD

WAVE

REFLOW

(2)

BGA, HTSSON..T

(3)

, LBGA, LFBGA, SQFP, SSOP..T

(3)

, TFBGA,

USON, VFBGA

not suitable

suitable

DHVQFN, HBCC, HBGA, HLQFP, HSO, HSOP, HSQFP, HSSON,
HTQFP, HTSSOP, HVQFN, HVSON, SMS

not suitable

(4)

suitable

PLCC

(5)

, SO, SOJ

suitable

LQFP, QFP, TQFP

not recommended

(5)(6)

suitable

SSOP, TSSOP, VSO, VSSOP

not recommended

(7)

suitable

CWQCCN..L

(8)

, PMFP

(9)

, WQCCN..L

(8)

not suitable

2004 Mar 09

Philips Semiconductors

Product specification

4-channel BTL driver for CD/DVD drives

TZA1049

13 DATA SHEET STATUS

Notes

1. Please consult the most recently issued data sheet before initiating or completing a design.

2. The product status of the device(s) described in this data sheet may have changed since this data sheet was

published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com.

3. For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status.

LEVEL

DATA SHEET

STATUS

(1)

PRODUCT

STATUS

(2)(3)

DEFINITION

Objective data

Development

This data sheet contains data from the objective specification for product
development. Philips Semiconductors reserves the right to change the
specification in any manner without notice.

Preliminary data Qualification

This data sheet contains data from the preliminary specification.
Supplementary data will be published at a later date. Philips
Semiconductors reserves the right to change the specification without
notice, in order to improve the design and supply the best possible
product.

III

Product data

Production

This data sheet contains data from the product specification. Philips
Semiconductors reserves the right to make changes at any time in order
to improve the design, manufacturing and supply. Relevant changes will
be communicated via a Customer Product/Process Change Notification
(CPCN).

14 DEFINITIONS

Short-form specification

The data in a short-form

specification is extracted from a full data sheet with the
same type number and title. For detailed information see
the relevant data sheet or data handbook.

Limiting values definition

Limiting values given are in

accordance with the Absolute Maximum Rating System
(IEC 60134). Stress above one or more of the limiting
values may cause permanent damage to the device.
These are stress ratings only and operation of the device
at these or at any other conditions above those given in the
Characteristics sections of the specification is not implied.
Exposure to limiting values for extended periods may
affect device reliability.

Application information

Applications that are

described herein for any of these products are for
illustrative purposes only. Philips Semiconductors make
no representation or warranty that such applications will be
suitable for the specified use without further testing or
modification.

15 DISCLAIMERS

Life support applications

These products are not

designed for use in life support appliances, devices, or
systems where malfunction of these products can
reasonably be expected to result in personal injury. Philips
Semiconductors customers using or selling these products
for use in such applications do so at their own risk and
agree to fully indemnify Philips Semiconductors for any
damages resulting from such application.

Right to make changes

Philips Semiconductors

reserves the right to make changes in the products -
including circuits, standard cells, and/or software -
described or contained herein in order to improve design
and/or performance. When the product is in full production
(status `Production'), relevant changes will be
communicated via a Customer Product/Process Change
Notification (CPCN). Philips Semiconductors assumes no
responsibility or liability for the use of any of these
products, conveys no licence or title under any patent,
copyright, or mask work right to these products, and
makes no representations or warranties that these
products are free from patent, copyright, or mask work
right infringement, unless otherwise specified.

SCA76

All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.

The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.

Philips Semiconductors a worldwide company

Contact information

For additional information please visit http://www.semiconductors.philips.com.

Fax: +31 40 27 24825

For sales offices addresses send e-mail to: sales.addresses@www.semiconductors.philips.com.

Printed in The Netherlands

R32/01/pp

Date of release:

2004 Mar 09

Document order number:

9397 750 11573

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Document Outline

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