2000 Apr 18

Philips Semiconductors

Product specification

UHF/VHF remote control receiver

UAA3201T

FEATURES

Oscillator with external Surface Acoustic Wave
Resonator (SAWR)

Wide frequency range from 150 to 450 MHz

High sensitivity

Low power consumption

Automotive temperature range

Superheterodyne architecture

Applicable to fulfil FTZ 17 TR 2100 (Germany)

High integration level, few external components

Inexpensive external components

IF filter bandwidth determined by application.

APPLICATIONS

Car alarm systems

Remote control systems

Security systems

Gadgets and toys

Telemetry.

GENERAL DESCRIPTION

The UAA3201T is a fully integrated single-chip receiver,
primarily intended for use in VHF and UHF systems
employing direct AM Return-to-Zero (RZ) Amplitude Shift
Keying (ASK) modulation.

QUICK REFERENCE DATA

ORDERING INFORMATION

SYMBOL

PARAMETER

CONDITIONS

MIN.

TYP.

MAX.

UNIT

supply voltage

3.5

6.0

supply current

3.4

4.8

ref

input reference sensitivity

i(RF)

= 433.92 MHz;

data rate = 250 bits/s;
BER

105

dBm

amb

ambient temperature

+85

TYPE

NUMBER

PACKAGE

NAME

DESCRIPTION

VERSION

UAA3201T

SO16

plastic small outline package; 16 leads; body width 3.9 mm

SOT109-1

2000 Apr 18

Philips Semiconductors

Product specification

UHF/VHF remote control receiver

UAA3201T

BLOCK DIAGRAM

handbook, full pagewidth

MHB679

OSCILLATOR

IF FILTER

LIN

LFB

CPC

CPO

OSC

OSE

MON

MOP

CPA

CPB

BUFFER

MIXER

VEE

VEM

MIXIN

RF_IN

BAND GAP

REFERENCE

VCC

Vref

LIMITER

IF AMPLIFIER

BUFFER

UAA3201T

COMPARATOR

data

DATA

C14

C19

C17

C12

C13

VCC

Fig.1 Block diagram.

PINNING

SYMBOL

PIN

DESCRIPTION

MON

negative mixer output

MOP

positive mixer output

positive supply voltage

OSC

oscillator collector

OSE

oscillator emitter

negative supply voltage

CPB

comparator input B

CPA

comparator input A

DATA

data output

CPO

comparator offset adjustment

CPC

comparator input C

LFB

limiter feedback

LIN

limiter input

MIXIN

mixer input

negative supply voltage for mixer

IF amplifier output

UAA3201T

MED897

VEM

MIXIN

LIN

LFB

CPC

CPO

DATA

MON

MOP

VCC

OSC

OSE

VEE

CPB

CPA

Fig.2 Pin configuration.

2000 Apr 18

Philips Semiconductors

Product specification

UHF/VHF remote control receiver

UAA3201T

FUNCTIONAL DESCRIPTION

The RF signal is fed directly into the mixer stage where it
is mixed down to nominal 500 kHz IF by the integrated
oscillator controlled by an external SAWR (see Fig.1). The
IF signal is then passed to the IF amplifier which increases
the level. A 5th-order elliptic low-pass filter acts as main
IF filtering. The output voltage of that filter is demodulated
by a limiter that rectifies the incoming IF signal. The
demodulated signal passes two RC filter stages and is
then limited by a data comparator which makes it available
at the data output.

Mixer

The mixer is a single balanced emitter coupled pair with
internally set bias current. The optimum impedance is
320

at 430 MHz. Capacitor C5 (see Fig.9) is used to

transform a 50

generator impedance to the optimum

value.

Oscillator

The oscillator consists of a transistor in common base
configuration and a tank circuit including the SAWR.
Resistor R2 (see Fig.9) is used to control the bias current
through the transistor. Resistor R3 is required to reduce
unwanted responses of the tank circuit.

IF amplifier

The IF amplifier is a differential input, single-ended output
emitter coupled pair. It is used to decouple the first and the
second IF filter and to provide some additional gain in
order to reduce the influence of the noise of the limiter on
the total noise figure.

IF filters

The first IF filter is an RC filter formed by internal resistors
and an external capacitor C7 (see Fig.1).

The second IF filter is an external elliptic filter. The source
impedance is 1.4 k

and the load is high-impedance. The

bandwidth of the IF filter in the application and test circuit
(see Fig.9) is 800 kHz due to the centre frequency spread
of the SAWR. It may be reduced when SAWRs with less
tolerances are used or temperature range requirements
are lower. A smaller bandwidth of the filter will yield a
higher sensitivity of the receiver. As the RF signal is mixed
down to a low IF signal there is no image rejection
possible.

Limiter

The limiting amplifier consists of three DC coupled
amplifier stages with a total gain of 60 dB. A Received
Signal Strength Indicator (RSSI) signal is generated by
rectifying the IF signal. The limiter has a lower frequency
limit of 100 kHz which can be controlled by capacitors C12
and C19. The upper frequency limit is 3 MHz.

Comparator

The 2

IF component in the RSSI signal is removed by the

first order low-pass capacitor C17. After passing a buffer
stage the signal is split into two paths, leading via
RC filters to the inputs of a voltage comparator. The time
constant of one path (C14) is compared to the bit duration.
Consequently the potential at the negative comparator
input represents the average magnitude of the RSSI
signal. The second path with a short time constant (C13)
allows the signal at the positive comparator input to follow
the RSSI signal instantaneously. This results in a variable
comparator threshold, depending on the strength of the
incoming signal. Hence the comparator output is switched
on, when the RSSI signal exceeds its average value, i.e.
when an ASK `on' signal is received.

The low-pass filter capacitor C13 rejects the unwanted
2

IF component and reduces the noise bandwidth of the

data filter.

The resistor R1 is used to set the current of an internal
source. This current is drawn from the positive comparator
input, thereby applying an offset and driving the output into
the `off' state during the absence of an input signal. This
offset can be increased by lowering the value of R1
yielding a higher noise immunity at the expense of reduced
sensitivity.

Band gap reference

The band gap reference controls the biasing of the whole
circuit. In this block currents are generated that are
constant over the temperature range and currents that are
proportional to the absolute temperature.

The current consumption of the receiver rises with
increasing temperature, because the blocks with the
highest current consumption are biased by currents that
are proportional to the absolute temperature.

2000 Apr 18

Philips Semiconductors

Product specification

UHF/VHF remote control receiver

UAA3201T

LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 60134).

Note

1. Human body model: equivalent to discharging a 100 pF capacitor through a 1.5 k

series resistor.

THERMAL CHARACTERISTICS

DC CHARACTERISTICS
V

= 3.5 V; all voltages referenced to V

; T

amb

40 to +85

C; typical value for T

amb

= 25

C; for test circuit

see Fig.9; SAWR disconnected; unless otherwise specified.

Note

1. I

DATA

is defined to be positive when the current flows into pin DATA.

SYMBOL

PARAMETER

CONDITIONS

MIN.

MAX.

UNIT

supply voltage

0.3

+8.0

amb

ambient temperature

+85

stg

storage temperature

+125

electrostatic handling voltage

note 1

pins OSC and OSE

2000

+1500

pins LFB and MIXIN

1500

+2000

all other pins

2000

+2000

SYMBOL

PARAMETER

CONDITIONS

VALUE

UNIT

th(j-a)

thermal resistance from junction to ambient

in free air

105

K/W

SYMBOL

PARAMETER

CONDITIONS

MIN.

TYP.

MAX.

UNIT

supply voltage

3.5

6.0

supply current

R2 = 680

3.4

4.8

OH(DATA)

HIGH-level output voltage at
pin DATA

DATA

A; note 1

0.5

OL(DATA)

LOW-level output voltage at
pin DATA

DATA

= +200

A; note 1

0.6

2000 Apr 18

Philips Semiconductors

Product specification

UHF/VHF remote control receiver

UAA3201T

AC CHARACTERISTICS
V

= 3.5 V; T

amb

= 25

C; for test circuit see Fig.9; R1 disconnected; for AC test conditions see Section "AC test

conditions"; unless otherwise specified.

Notes

1. P

ref

is the maximum available power at the input of the test board. The Bit Error Rate (BER) is measured using the

test facility shown in Fig.8.

2. Valid only for the reference PCB (see Figs 10 and 11). Spurious radiation is strongly dependent on the PCB layout.

3. The supply voltage V

is pulsed as explained in Fig.3.

INTERNAL PIN CONFIGURATION

SYMBOL

PARAMETER

CONDITIONS

MIN.

TYP.

MAX.

UNIT

ref

input reference sensitivity

BER

; note 1

105

dBm

i(max)

maximum input power

BER

dBm

spur

spurious radiation

note 2

dBm

IP3

mix

interception point (mixer)

dBm

IP3

interception point (mixer plus IF amplifier)

dBm

1dB

1 dB compression point (mixer)

dBm

on(RX)

receiver turn-on time

note 3

PIN

SYMBOL

EQUIVALENT CIRCUIT

MON

MOP

OSC

OSE

1.5

MHB680

from

oscillator

buffer

VCC

MHB681

6 k

1.2 V

MHB682

2000 Apr 18

Philips Semiconductors

Product specification

UHF/VHF remote control receiver

UAA3201T

Table 1

Test signals

Test results

is the maximum available power from signal generator 1 at the input of the test board; P

is the maximum available

power from signal generator 2 at the input of the test board.

Table 2

Test results

Notes

1. The supply voltage V

of the test circuit alternates between `on' (100 ms) and `off' (100 ms); see Fig.3.

2. Differential probe of spectrum analyser connected to pins MOP and MON.

3. Probe of spectrum analyser connected to pin LIN.

4. Spectrum analyser connected to the input of the test board.

5. Probe of spectrum analyser connected to either pin MOP or pin MON.

TEST

SIGNAL

FREQUENCY

(MHz)

DATA SIGNAL

MODULATION

INDEX

433.92

250 bits/s
(square wave)

RZ signal with duty cycle of 66% for logic 1;
RZ signal with duty cycle of 33% for logic 0

100%

434.02

no modulation

433.92

no modulation

TEST

GENERATOR

RESULT

Maximum input power;
see Fig.4

test signal 1;
P

30 dBm

(minimum P

max

)

BER

(e.g. 7.5 bit errors per second for 250 bits/s)

Receiver turn-on time;
see Fig.4 and note 1

test signal 1;
P

= P

ref

+ 10 dB

check that the first 10 bits are correct; error counting is
started 10 ms after V

is switched on

Interception point (mixer);
see Fig.5 and note 2

test signal 3;
P

50 dBm

test
signal 2;
P

= P

IP3 = P

IM3 (dB);

minimum value: IP3

mix

20 dBm

Interception point (mixer plus
IF amplifier); see Fig.5 and
note 3

test signal 3;
P

50 dBm

test
signal 2;
P

= P

IP3 = P

IM3 (dB);

minimum value: IP3

38 dBm

Spurious radiation; see Fig.6
and note 4

no spurious radiation (25 MHz to 1 GHz) with level
higher than

60 dBm (maximum P

spur

)

1 dB compression point
(mixer);
see Fig.7 and note 5

test signal 3;
P

70 dBm;

38 dBm

(minimum P

1dB

)

+ 70 dB)

+ 38 dB (minimum P

1dB

)]

1 dB,

where P

is the output power for test signal with P

and P

is the output power for test signal with P

2000 Apr 18

Philips Semiconductors

Product specification

UHF/VHF remote control receiver

UAA3201T

Components and layout of printed circuit board of test circuit for f

i(RF)

= 433.92 MHz

Table 3

Components list for Fig.9

Table 4

SAWR data

COMPONENT

VALUE

TOLERANCE

DESCRIPTION

27 k

TC = +50 ppm/K

680

TC = +50 ppm/K

220

TC = +50 ppm/K

4.7

20%

150 pF

10%

TC = 0

30 ppm/K; tan

; f = 1 MHz

1 nF

10%

TC = 0

30 ppm/K; tan

; f = 1 MHz

820 pF

10%

TC = 0

30 ppm/K; tan

; f = 1 MHz

3.3 pF

10%

TC = 0

150 ppm/K; tan

; f = 1 MHz

2.5 to 6 pF

TC = 0

300 ppm/K; tan

; f = 1 MHz

56 pF

10%

TC = 0

30 ppm/K; tan

; f = 1 MHz

150 pF

10%

TC = 0

30 ppm/K; tan

; f = 1 MHz

220 pF

10%

TC = 0

30 ppm/K; tan

; f = 1 MHz

C10

27 pF

10%

TC = 0

30 ppm/K; tan

; f = 1 MHz

C11

150 pF

10%

TC = 0

30 ppm/K; tan

; f = 1 MHz

C12

100 nF

10%

tan

; f = 1 kHz

C13

2.2 nF

10%

tan

; f = 1 kHz

C14

33 nF

10%

tan

; f = 1 kHz

C15

150 pF

10%

TC = 0

30 ppm/K; tan

; f = 1 MHz

C16

3.9 pF

10%

TC = 0

150 ppm/K; tan

; f = 1 MHz

C17

10 nF

10%

tan

; f = 1 kHz

C18

3.3 pF

10%

TC = 0

150 ppm/K; tan

; f = 1 MHz

C19

68 pF

10%

TC = 0

30 ppm/K; tan

; f = 1 MHz

C20

6.8 pF

10%

TC = 0

150 ppm/K; tan

; f = 1 MHz

C21

47 pF

TC = 0

30 ppm/K; tan

; f = 1 MHz

10 nH

10%

min

= 50 to 450 MHz; TC = 25 to 125 ppm/K

330

10%

min

= 45 to 800 kHz; C

stray

1 pF

330

10%

min

= 45 to 800 kHz; C

stray

1 pF

33 nH

10%

min

= 45 to 450 MHz; TC = 25 to 125 ppm/K

SAWR

see Table 4

DESCRIPTION

SPECIFICATION

Type

one-port (e.g. RFM R02112)

Centre frequency

433.42 MHz

75 kHz

Maximum insertion loss

1.5 dB

Typical loaded Q

1600 (50

load)

Temperature drift

0.032 ppm/K

Turnover temperature

2000 Apr 18

Philips Semiconductors

Product specification

UHF/VHF remote control receiver

UAA3201T

SOLDERING

Introduction to soldering surface mount packages

This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our

"Data Handbook IC26; Integrated Circuit Packages"

(document order number 9398 652 90011).

There is no soldering method that is ideal for all surface
mount IC packages. Wave soldering is not always suitable
for surface mount ICs, or for printed-circuit boards with
high population densities. In these situations reflow
soldering is often used.

Reflow soldering

Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.

Several methods exist for reflowing; for example,
infrared/convection heating in a conveyor type oven.
Throughput times (preheating, soldering and cooling) vary
between 100 and 200 seconds depending on heating
method.

Typical reflow peak temperatures range from
215 to 250

C. The top-surface temperature of the

packages should preferable be kept below 230

Wave soldering

Conventional single wave soldering is not recommended
for surface mount devices (SMDs) or printed-circuit boards
with a high component density, as solder bridging and
non-wetting can present major problems.

To overcome these problems the double-wave soldering
method was specifically developed.

If wave soldering is used the following conditions must be
observed for optimal results:

Use a double-wave soldering method comprising a
turbulent wave with high upward pressure followed by a
smooth laminar wave.

For packages with leads on two sides and a pitch (e):

larger than or equal to 1.27 mm, the footprint

longitudinal axis is preferred to be parallel to the
transport direction of the printed-circuit board;

smaller than 1.27 mm, the footprint longitudinal axis

must be parallel to the transport direction of the
printed-circuit board.

The footprint must incorporate solder thieves at the
downstream end.

For packages with leads on four sides, the footprint must
be placed at a 45

angle to the transport direction of the

printed-circuit board. The footprint must incorporate
solder thieves downstream and at the side corners.

During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.

Typical dwell time is 4 seconds at 250

A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.

Manual soldering

Fix the component by first soldering two
diagonally-opposite end leads. Use a low voltage (24 V or
less) soldering iron applied to the flat part of the lead.
Contact time must be limited to 10 seconds at up to
300

When using a dedicated tool, all other leads can be
soldered in one operation within 2 to 5 seconds between
270 and 320

2000 Apr 18

Philips Semiconductors

Product specification

UHF/VHF remote control receiver

UAA3201T

Suitability of surface mount IC packages for wave and reflow soldering methods

Notes

1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum

temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the

"Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods".

2. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink

(at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version).

3. If wave soldering is considered, then the package must be placed at a 45

angle to the solder wave direction.

The package footprint must incorporate solder thieves downstream and at the side corners.

4. Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8 mm;

it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.

5. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is

definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.

PACKAGE

SOLDERING METHOD

WAVE

REFLOW

(1)

BGA, LFBGA, SQFP, TFBGA

not suitable

suitable

HBCC, HLQFP, HSQFP, HSOP, HTQFP, HTSSOP, SMS

not suitable

(2)

suitable

PLCC

(3)

, SO, SOJ

suitable

LQFP, QFP, TQFP

not recommended

(3)(4)

suitable

SSOP, TSSOP, VSO

not recommended

(5)

suitable

2000 Apr 18

Philips Semiconductors

Product specification

UHF/VHF remote control receiver

UAA3201T

DATA SHEET STATUS

Note

1. Please consult the most recently issued data sheet before initiating or completing a design.

DATA SHEET STATUS

PRODUCT

STATUS

DEFINITIONS

(1)

Objective specification

Development

This data sheet contains the design target or goal specifications for
product development. Specification may change in any manner without
notice.

Preliminary specification

Qualification

This data sheet contains preliminary data, and supplementary data will be
published at a later date. Philips Semiconductors reserves the right to
make changes at any time without notice in order to improve design and
supply the best possible product.

Product specification

Production

This data sheet contains final specifications. Philips Semiconductors
reserves the right to make changes at any time without notice in order to
improve design and supply the best possible product.

DEFINITIONS

Short-form specification

The data in a short-form

specification is extracted from a full data sheet with the
same type number and title. For detailed information see
the relevant data sheet or data handbook.

Limiting values definition

Limiting values given are in

accordance with the Absolute Maximum Rating System
(IEC 60134). Stress above one or more of the limiting
values may cause permanent damage to the device.
These are stress ratings only and operation of the device
at these or at any other conditions above those given in the
Characteristics sections of the specification is not implied.
Exposure to limiting values for extended periods may
affect device reliability.

Application information

Applications that are

described herein for any of these products are for
illustrative purposes only. Philips Semiconductors make
no representation or warranty that such applications will be
suitable for the specified use without further testing or
modification.

DISCLAIMERS

Life support applications

These products are not

designed for use in life support appliances, devices, or
systems where malfunction of these products can
reasonably be expected to result in personal injury. Philips
Semiconductors customers using or selling these products
for use in such applications do so at their own risk and
agree to fully indemnify Philips Semiconductors for any
damages resulting from such application.

Right to make changes

Philips Semiconductors

reserves the right to make changes, without notice, in the
products, including circuits, standard cells, and/or
software, described or contained herein in order to
improve design and/or performance. Philips
Semiconductors assumes no responsibility or liability for
the use of any of these products, conveys no licence or title
under any patent, copyright, or mask work right to these
products, and makes no representations or warranties that
these products are free from patent, copyright, or mask
work right infringement, unless otherwise specified.

SCA

All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.

The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.

Internet: http://www.semiconductors.philips.com

2000

Philips Semiconductors a worldwide company

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Tel. +27 11 471 5401, Fax. +27 11 471 5398

South America: Al. Vicente Pinzon, 173, 6th floor,
04547-130 SÃO PAULO, SP, Brazil,
Tel. +55 11 821 2333, Fax. +55 11 821 2382

Spain: Balmes 22, 08007 BARCELONA,
Tel. +34 93 301 6312, Fax. +34 93 301 4107

Sweden: Kottbygatan 7, Akalla, S-16485 STOCKHOLM,
Tel. +46 8 5985 2000, Fax. +46 8 5985 2745

Switzerland: Allmendstrasse 140, CH-8027 ZÜRICH,
Tel. +41 1 488 2741 Fax. +41 1 488 3263

Taiwan: Philips Semiconductors, 6F, No. 96, Chien Kuo N. Rd., Sec. 1,
TAIPEI, Taiwan Tel. +886 2 2134 2886, Fax. +886 2 2134 2874

Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd.,
209/2 Sanpavuth-Bangna Road Prakanong, BANGKOK 10260,
Tel. +66 2 745 4090, Fax. +66 2 398 0793

Turkey: Yukari Dudullu, Org. San. Blg., 2.Cad. Nr. 28 81260 Umraniye,
ISTANBUL, Tel. +90 216 522 1500, Fax. +90 216 522 1813

Ukraine: PHILIPS UKRAINE, 4 Patrice Lumumba str., Building B, Floor 7,
252042 KIEV, Tel. +380 44 264 2776, Fax. +380 44 268 0461

United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes,
MIDDLESEX UB3 5BX, Tel. +44 208 730 5000, Fax. +44 208 754 8421

United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409,
Tel. +1 800 234 7381, Fax. +1 800 943 0087

Uruguay: see South America

Vietnam: see Singapore

Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD,
Tel. +381 11 3341 299, Fax.+381 11 3342 553

Printed in The Netherlands

03/pp

Date of release:

2000 Apr 18

Document order number:

9397 750 06929

Document Outline

Ð­Ð»ÐµÐºÑ‚Ñ€Ð¾Ð½Ð½Ñ‹Ð¹ ÐºÐ¾Ð¼Ð¿Ð¾Ð½ÐµÐ½Ñ‚: UAA3201T/V1

Document Outline

ÐÐ»ÐµÐºÑ‚Ñ€Ð¾Ð½Ð½Ñ‹Ð¹ ÐºÐ¾Ð¼Ð¿Ð¾Ð½ÐµÐ½Ñ‚: UAA3201T/V1