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Электронный компонент: UAA3220

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DATA SHEET
Product specification
Supersedes data of 1998 April 10
File under Integrated Circuits, IC01
1999 Jan 22
INTEGRATED CIRCUITS
UAA3220TS
Frequency Shift Keying
(FSK)/Amplitude Shift Keying
(ASK) receiver
1999 Jan 22
2
Philips Semiconductors
Product specification
Frequency Shift Keying (FSK)/Amplitude
Shift Keying (ASK) receiver
UAA3220TS
FEATURES
Low cost single-chip ASK or FSK receiver
Superheterodyne architecture with high integration level
Few external low cost components and crystal required
Wide supply voltage range
Low power consumption
Wide frequency range, 250 to 920 MHz
High sensitivity
IF bandwidth determined by application
High selectivity
Automotive temperature range
SSOP24 package.
Applications
Keyless entry systems
Car alarm systems
Remote control systems
Security systems
Telemetry systems
Wireless data transmission
Domestic appliance.
GENERAL DESCRIPTION
The UAA3220TS is a fully integrated single-chip receiver,
primarily intended for use in VHF and UHF systems.
It supports both Amplitude Shift Keying (ASK) and
Frequency Shift Keying (FSK) demodulation.
By connecting DEMO1 (pin 10) to ground during
realisation of the receiver module the UAA3220TS works
as an ASK receiver (see Fig.10). By connecting pin 10 as
shown in Fig.9 the UAA3220TS works as an FSK receiver.
The UAA3220TS incorporates a crystal stabilized local
oscillator, frequency multiplier, balanced mixer, post mixer
amplifier, limiter, Received Signal Strength Indicator
(RSSI), FSK demodulator, data filter, data slicer and
power down circuit.
QUICK REFERENCE DATA
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
V
CC
supply voltage
2.7
-
5.5
V
I
CC
supply current
f
i(RF)
= 433.92 MHz; FSK mode
operating mode on;
V
PWD
= 0 V
2.8
4.3
5.8
mA
operating mode off;
V
PWD
= V
CC
-
3
30
A
ASK mode
P
i(max)(ASK)
maximum input power
BER
3%
-
22
-
16
-
10
dBm
i(ASK)
sensitivity into pin MIXIN
f
i(RF)
= 433.92 MHz; BER
3%
-
-
119
-
113
dBm
FSK mode
P
i(max)(FSK)
maximum input power
BER
3%
-
6
0
+1
dBm
i(FSK)
sensitivity into pin MIXIN
f
i(RF)
= 433.92 MHz; BER
3%
-
-
103
-
100
dBm
1999 Jan 22
3
Philips Semiconductors
Product specification
Frequency Shift Keying (FSK)/Amplitude
Shift Keying (ASK) receiver
UAA3220TS
ORDERING INFORMATION
BLOCK DIAGRAM
TYPE
NUMBER
PACKAGE
NAME
DESCRIPTION
VERSION
UAA3220TS
SSOP24
plastic shrink small outline package; 24 leads; body width 5.3 mm
SOT340-1
Fig.1 Block diagram.
handbook, full pagewidth
MGM742
PMA
DEMODULATOR
AM/FM
SWITCH
DATA SLICER
MIXER
BIAS
22
FA
23
MIXIN
24
MGND
16
15
18
CPB
17
CPC
CPA
11
DEMO2
12
GND
10
DEMO1
9
PWD
MULTIPLIER
3
7
TN
8
TP
6
TEM
OSCILLATOR
2
OSE
3
OSB
4
VCC
5
OSC
1
OGND
RSSI
LIN
VCCI
21
20
LFB
19
DATA
14
CGND
13
LIMITER
AMPLIFIER
-
+
UAA3220TS
2/
3
1999 Jan 22
4
Philips Semiconductors
Product specification
Frequency Shift Keying (FSK)/Amplitude
Shift Keying (ASK) receiver
UAA3220TS
PINNING
SYMBOL
PIN
DESCRIPTION
OGND
1
oscillator ground
OSE
2
oscillator emitter
OSB
3
oscillator base
V
CC
4
positive supply voltage
OSC
5
oscillator collector
TEM
6
frequency multiplier emitter resistor
TN
7
frequency multiplier negative output
TP
8
frequency multiplier positive output
PWD
9
power down control input
DEMO1
10
FM demodulator 1, ASK/FSK switch
DEMO2
11
FM demodulator 2
GND
12
general ground
CGND
13
comparator ground
DATA
14
data output
CPA
15
comparator input A
CPB
16
comparator input B
CPC
17
comparator input C
RSSI
18
RSSI output
LFB
19
limiter feedback
LIN
20
limiter input
V
CCI
21
IF amplifier positive supply voltage
FA
22
IF amplifier output
MIXIN
23
mixer input
MGND
24
mixer ground
Fig.2 Pin configuration.
handbook, halfpage
OGND
OSE
OSB
VCC
OSC
TEM
TN
TP
PWD
DEMO1
DEMO2
GND
MGND
MIXIN
FA
VCCI
LFB
RSSI
LIN
CPC
CPB
CPA
DATA
CGND
1
2
3
4
5
6
7
8
9
10
11
12
24
23
22
21
20
19
18
17
16
15
14
13
UAA3220TS
MGM743
1999 Jan 22
5
Philips Semiconductors
Product specification
Frequency Shift Keying (FSK)/Amplitude
Shift Keying (ASK) receiver
UAA3220TS
FUNCTIONAL DESCRIPTION
Mixer
The mixer is a single-balanced emitter-coupled mixer with
internal biasing. Matching of the RF source impedance to
the mixer input requires an external matching network.
Oscillator
The oscillator is based on a transistor connected in
common collector configuration followed by a cascode
stage driving a tuned circuit. The voltage at this tuned
circuit drives the frequency multiplier. The bias current of
the oscillator is set by an off-chip resistor (R40 in the
application diagram of Fig.9) to a typical value of 260
A at
433.92 MHz (R40 = 1.8 k
). The oscillator frequency is
controlled by an off-chip overtone crystal (X40). Off-chip
capacitors between base and emitter (C42) and ground
(C41) make the oscillator transistor appear as having
negative resistance at small signal levels. This causes the
oscillator to start. A parallel resonance circuit (L40 and
C41) connected to the emitter of the oscillator transistor
prevents oscillation at the fundamental frequency of the
crystal. The LC tank circuit at the output of the oscillator is
used to select either the fundamental, the second or the
third harmonic of the oscillator frequency.
Frequency multiplier
The frequency multiplier is an emitter-coupled transistor
pair driving an off-chip balanced tuned circuit. The bias
current of this emitter coupled pair is set by an off-chip
resistor (R50) to a typical value of 350
A at 433.92 MHz
(R50 = 1.2 k
). The oscillator output signal is AC-coupled
to one of the inputs of the emitter-coupled pair. The other
input is connected to ground via an on-chip capacitor.
The output voltage of the frequency multiplier drives the
switching stage of the mixer. The bias voltage at this point
is set by an off-chip resistor (R51) to allow sufficient
voltage swing at the mixer outputs.
Post mixer amplifier
The Post Mixer Amplifier (PMA) is a differential input,
single-ended output amplifier. Amplifier gain is provided in
order to reduce the influence of the limiter noise figure on
the total noise figure.
Limiter
The limiter is a single-ended input multiple stage amplifier
with high total gain. Amplifier stability is achieved by
means of an external DC feedback capacitor (C21), which
is also used to determine the lower limiter cut-off
frequency. An RSSI signal proportional to the limiter input
signal is provided. Figure 3 shows the DC voltage at pin 18
(RSSI) as a function of the input voltage (RMS value) at
pin 20 (LIN). It also gives the typical IF of 10.7 MHz.
The lower knee of the level curve (see Fig.3) is determined
by the effective noise bandwidth and is, consequently,
slightly higher.
IF filter
IF filtering with high selectivity is realized by means of an
external ceramic filter (X20), which feeds the IF from the
PMA to the limiter.
FM demodulator
Coming from the limiter the FSK signal is fed differential to
the input of the FM demodulator. After buffering the signal
is fed to a phase detector. The phase shift is generated by
an external LC combination connected to DEMO1 (pin 10)
and DEMO2 (pin 11). The baseband signal is coupled out
single ended via an output buffer and is fed to the FSK
input of the ASK/FSK switch.
ASK/FSK switch
The selection of either ASK or FSK reception will be done
by the DEMO1 (pin 10). Grounding this pin to 0 V will
switch the IC to ASK mode. Additional the FM demodulator
and parts of the data slicer will be switched off. In FSK
mode DEMO1 (pin 10) is connected to DEMO2 (pin 11)
via a LC combination (see Fig.9).
Data filters
After demodulation a two-stage data filtering circuit is
provided in order to suppress unwanted frequency
components. Two RC low-pass filters with on-chip
resistors are provided which are separated by a buffer
stage.
1999 Jan 22
6
Philips Semiconductors
Product specification
Frequency Shift Keying (FSK)/Amplitude
Shift Keying (ASK) receiver
UAA3220TS
Data slicer
Data detection is provided by means of a level comparator
with adaptive slice reference. After the first data filter stage
the pre-filtered data is split into two paths. One passes the
second data filter stage and is fed to the positive
comparator input. The other path is fed to an integration
circuit with a large time constant in order to derive the
average value (DC component) as an adaptive slice
reference which is presented to the negative comparator
input. The internal buffer provides 13 dB AC voltage gain.
The adaptive reference allows to detect the received data
over a large range of noise floor levels. The integration
circuit consists of a simple RC low-pass filter with on-chip
resistors. The data slicer output is designed with internal
pull-up.
RSSI buffer
The RSSI buffer is an amplifier with a voltage gain of 0 dB.
At FSK receive mode the RSSI output provides a field
strength indication. It has an output impedance of 10 k
.
Figure 3 shows the level curve (RSSI curve) as a function
of the limiter input voltage (RMS value).
Fig.3 Level curve V
RSSI
as a function of V
LIN(rms)
.
handbook, full pagewidth
1.55
1.25
1.15
1.45
1.35
MGM744
10
-7
10
-6
10
-5
10
-4
10
-3
10
-2
10
-1
VRSSI
(V)
VLIN(rms) (V)
(1)
(2)
(3)
(1) T
amb
= 85
C.
(2) T
amb
= 27
C.
(3) T
amb
=
-
40
C.
1999 Jan 22
7
Philips Semiconductors
Product specification
Frequency Shift Keying (FSK)/Amplitude
Shift Keying (ASK) receiver
UAA3220TS
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
Note
1. Machine model: C = 200 pF, R = 0
and L = 0.75
H; pins are connected to GND and V
CC
.
THERMAL CHARACTERISTICS
SYMBOL
PARAMETER
CONDITIONS
MIN.
MAX.
UNIT
V
CC
supply voltage
-
0.3
+8.0
V
P
i(max)
absolute maximum input power
-
3
dBm
T
amb
operating ambient temperature
-
40
+85
C
T
stg
storage temperature
-
55
+125
C
V
es
electrostatic handling
note 1
pins 3 and 6
-
50
+50
V
pin 2
-
100
+100
V
pin 5
-
250
+150
V
pin 23
-
200
+250
V
all other pins
-
250
+250
V
SYMBOL
PARAMETER
CONDITIONS
VALUE
UNIT
R
th(j-a)
thermal resistance from junction to ambient
in free air
125
K/W
1999 Jan 22
8
Philips Semiconductors
Product specification
Frequency Shift Keying (FSK)/Amplitude
Shift Keying (ASK) receiver
UAA3220TS
DC CHARACTERISTICS
V
CC
= 2.7 V; T
amb
= 25
C; for application diagram see Figs 9 and 10; crystal disconnected; unless otherwise specified.
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
Supplies
V
CC
supply voltage
2.7
-
5.5
V
I
CC
supply current
operating mode on;
V
PWD
= 0 V; notes 1 and 2
FSK demodulation;
note 3
2.8
4.3
5.8
mA
ASK demodulation;
note 4
2.5
3.7
4.9
mA
operating mode off;
V
PWD
= V
CC
-
3
30
A
V
PWD
voltage on pin PWD
operating mode on
(receiving mode)
0
-
300
mV
operating mode off
(sleep mode)
V
CC
-
0.3
-
V
CC
V
I
PWD
current into pin PWD
operating mode on
(receiving mode);
V
PWD
= 0 V
-
30
-
10
-
3
A
operating mode off
(sleep mode);
V
PWD
= V
CC
-
2
15
A
Oscillator
V
OSE
DC voltage at pin 2
independent of oscillator
0.33
0.38
0.43
V
V
OSB
DC voltage at pin 3
independent of oscillator
1.05
1.15
1.25
V
Multiplier
V
TEM
DC voltage at pin 6
independent of oscillator
0.33
0.39
0.45
V
V
TN,TP
DC voltage at pins 7 and 8
independent of oscillator
2.01
2.21
2.41
V
Mixer
V
MIXIN
DC voltage at pin 23
independent of oscillator
0.68
0.78
0.88
V
Post mixer amplifier
V
FA
DC voltage at pin 22
independent of oscillator
1.10
1.25
1.40
V
Limiter
V
LIN
DC voltage at pin 20
independent of oscillator
1.85
1.95
2.05
V
V
LFB
DC voltage at pin 19
independent of oscillator
1.85
1.95
2.05
V
V
RSSI
DC voltage at pin 18
independent of oscillator
1.00
1.16
1.32
V
1999 Jan 22
9
Philips Semiconductors
Product specification
Frequency Shift Keying (FSK)/Amplitude
Shift Keying (ASK) receiver
UAA3220TS
Notes
1. For f
i(RF)
= 868.35 MHz all values + 0.6 mA.
2. Crystal connected; oscillator and multiplier active.
3. Pin DEMO1 connected to pin DEMO2 via tank circuit.
4. Pin DEMO1 short circuited to ground.
5. The given values are applicable for FSK reception mode. In ASK mode pin 10 is short circuited to ground.
6. No modulation and f
IF
= 10.7 MHz.
Demodulator
V
DEMO1,2
DC voltage at pins 10 and 11
independent of oscillator;
note 5
2.00
2.24
2.48
V
V
DEMO1(ASK)
DC voltage at pin 10 to switch in
ASK mode
0
-
300
mV
Data filter and slicer
V
CPA,CPB,CPC
DC voltage at pins 15, 16 and 17
ASK mode
1.27
1.42
1.57
V
FSK mode; note 6
1.81
2.01
2.21
V
V
OH(DATA)
HIGH-level output voltage at pin 14 I
DATA
=
-
10
A
V
CC
-
0.5
-
V
CC
V
V
OL(DATA)
LOW-level output voltage at pin 14
I
DATA
= 200
A
0
-
0.6
V
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
1999 Jan 22
10
Philips Semiconductors
Product specification
Frequency Shift Keying (FSK)/Amplitude
Shift Keying (ASK) receiver
UAA3220TS
AC CHARACTERISTICS
V
CC
= 2.7 V; T
amb
= 25
C; for application diagram see Figs 9 and 10; f
i(RF)
= 433.92 MHz (see Table 4) and
f
i(RF)
= 868.35 MHz (see Table 5); f
mod
= 1 kHz square wave; unless otherwise specified.
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
System performance
f
i(RF)
RF input frequency
250
-
920
MHz
f
IF
IF frequency
10.56
10.7
10.84
MHz
P
i(max)
maximum input power
-
-
3
dBm
ASK mode; BER
3%;
notes 1 and 2
-
22
-
16
-
10
dBm
FSK mode; BER
3%;
notes 2 and 3
-
6
0
+1
dBm
P
SPUR
spurious radiation
note 4
-
-
-
57
dBm
f
DATA
data frequency
note 5
-
1
-
kHz
t
on(RX)
receiver turn-on time
notes 6 and 7
f
i(RF)
= 433.92 MHz
-
6
10
ms
f
i(RF)
= 868.35 MHz
-
3
7
ms
V
RSSI
RSSI voltage
1.1
-
1.6
V
ASK mode
i(ASK)
input sensitivity directly into pin MIXIN
BER
3%; notes 1 and 2
f
i(RF)
= 433.92 MHz
-
-
119
-
113
dBm
f
i(RF)
= 868.35 MHz
-
-
116
-
110
dBm
FSK mode
i(FSK)
input sensitivity directly into pin MIXIN
BER
3%; notes 2 and 3
-
-
103
-
100
dBm
f
frequency deviation (peak value)
4
10
75
kHz
(FSK)(max)
maximum sensitivity degradation
f = 4 kHz
-
-
3
dB
G
dem
demodulator gain
note 8
0.75
1.0
1.25
Mixer and post mixer amplifier
Z
i
input impedance of mixer
f
i(RF)
= 433.92 MHz
-
600
-
f
i(RF)
= 868.35 MHz
-
300
-
IP3
PMA
interception point (mixer + PMA)
-
38
-
30
-
dBm
G
PMA
gain (mixer + PMA)
note 9
40
42
50
dB
Z
o(IF)
output impedance of IF amplifier
280
330
380
mV
kHz
----------
1999 Jan 22
11
Philips Semiconductors
Product specification
Frequency Shift Keying (FSK)/Amplitude
Shift Keying (ASK) receiver
UAA3220TS
Notes
1. 100% AM modulation (ASK); available power from generator into a 50
load.
2. With external matching network, to transform the impedance to 50
.
3.
f = 10 kHz; available power from generator into a 50
load.
4. Measured at the RF input connector of the test board into a 50
load; f
i(RF)
= 25 MHz to 1 GHz.
5. The data frequency range can be varied by changing C30 to C32 (see Figs 9 and 10) to match other bit rates.
Data frequency determined by data slicer application.
6. t
on
= 50 ms; t
off
= 138 ms; P = P
sens
+ 3 dB.
7. The given turn-on time is only valid during strobing by pin PWD; if the IC is strobed on and off by the supply voltage
the turn-on time will be longer.
8. LC tank circuit (L60, C60) tuned to maximum phase slope.
9. G
PMA
is typically 6 dB lower when measured in the application, because of the load of the ceramic filter.
Limiter
R
i(LIN)
limiter input resistance
40
48
56
k
Buffer
R
CPC
data buffer output resistance at pin 17
24
30
36
k
G
buffer
data buffer AC gain
12
13
14
dB
R
CPA,CPB
data buffer output resistance at
pins 15 and 16
120
150
180
k
Data slicer; see Chapter "DC characteristics"
B
ds
internal data slicer bandwidth
50
-
100
kHz
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
1999 Jan 22
12
Philips Semiconductors
Product specification
Frequency Shift Keying (FSK)/Amplitude
Shift Keying (ASK) receiver
UAA3220TS
INTERNAL CIRCUITRY
Table 1
Equivalent pin circuits and pin voltages for rough test of printed-circuit board; V
CC
= 2.7 V; no input signal
PIN
NO.
PIN
SYMBOL
DC VOLTAGE
(V)
EQUIVALENT CIRCUIT
1
OGND
0
2
OSE
0.38
3
OSB
1.15
5
OSC
2.7
4
V
CC
2.7
6
TEM
0.39
7
TN
2.21
8
TP
2.21
9
PWD
-
10
DEMO1
2.24
11
DEMO2
2.24
12
GND
0
MHA780
3
1
5
2
VCC
8.15 k
GND
MHA781
9.6 k
GND
5
6
7
8
VCC
MGM750
210 k
9
VCC
MGM751
7 k
7 k
10 k
11
12
10
1999 Jan 22
13
Philips Semiconductors
Product specification
Frequency Shift Keying (FSK)/Amplitude
Shift Keying (ASK) receiver
UAA3220TS
13
CGND
0
15
CPA
1.95
16
CPB
1.95
14
DATA
-
17
CPC
1.95
18
RSSI
1.16
PIN
NO.
PIN
SYMBOL
DC VOLTAGE
(V)
EQUIVALENT CIRCUIT
MGM753
16
150 k
150 k
13
15
VCC
MGM754
1 k
13
14
VCC
MGM755
30 k
17
VCC
GND
MGM752
12
18
10 k
1999 Jan 22
14
Philips Semiconductors
Product specification
Frequency Shift Keying (FSK)/Amplitude
Shift Keying (ASK) receiver
UAA3220TS
19
LFB
1.95
20
LIN
1.95
21
V
CCI
2.7
22
FA
1.25
23
MIXIN
0.78
24
MGND
0
PIN
NO.
PIN
SYMBOL
DC VOLTAGE
(V)
EQUIVALENT CIRCUIT
MGM756
19
VCC
GND
MGM757
48 k
VCC
20
GND
MGM758
330
21
22
GND
MGM759
24
23
15
1999 Jan 22
15
Philips Semiconductors
Product specification
Frequency Shift Keying (FSK)/Amplitude
Shift Keying (ASK) receiver
UAA3220TS
TEST INFORMATION
Tuning procedures
T
UNING PROCEDURE FOR
AC
TESTS
1. Turn on the signal generator (f
i(RF)
= 433.92 or 868.35 MHz; no modulation; RF input level =
-
50 dBm).
2. Tune first C50 (multiplier tank circuit), second C11 (RF stage input) to obtain a peak IF voltage at pin FA.
T
UNING PROCEDURE FOR
ASK
RECEPTION
1. Make sure that pin DEMO1 is short circuited to ground.
2. Turn on ASK modulation and check that data is appearing on the DATA output pin and proceed with the AC tests.
T
UNING PROCEDURE FOR
FSK
RECEPTION
1. Make sure that pins DEMO1 and DEMO2 are connected by the LC tank circuit.
2. Turn on FSK modulation (
f = 10 kHz; RF input level =
-
103 dBm).
3. Tune C61 (or L60) (phase shifter LC tank circuit) to obtain a peak LF voltage at pin CPC.
4. Check that data is appearing on pin DATA and proceed with the AC tests.
AC test conditions
Table 2
Test signals
The reference signal level P
ref
for the following tests is defined as the minimum input level in dBm to give a
BER
3
10
-
2
(e.g. 60 bit errors per second for 2000 bits/s). All test signal levels refer to 50
load condition.
TEST
SIGNAL
FREQUENCY
(MHz)
DATA SIGNAL
MODULATION
MODULATION
INDEX
FREQUENCY
DEVIATION
1
433.92/868.35
1000 Hz square wave
AM (ASK)
100%
-
2
433.92/868.35
1000 Hz square wave
FM (FSK)
-
10 kHz
3
433.92/868.35
-
no modulation
-
-
4
433.82/868.35
-
no modulation
-
-
1999 Jan 22
16
Philips Semiconductors
Product specification
Frequency Shift Keying (FSK)/Amplitude
Shift Keying (ASK) receiver
UAA3220TS
Table 3
Tests and results
P
1
is the maximum available power from signal generator 1 at the input of the test board; P
2
is the maximum available
power from signal generator 2 at the input of the test board.
Notes
1. The voltage at pin PWD of the test circuit alternates between operating mode: on (50 ms; 0 V) and off (138 ms; V
CC
);
see Fig.4.
2. Probe of spectrum analyzer connected to pin FA (pin 22).
3. Spectrum analyzer connected to the input of the test board.
TEST
GENERATOR
RESULT
1
2
ASK sensitivity into
pin MIXIN (see Fig.5)
modulated test signal 1;
P
1
-
113 dBm for
f
i(RF)
= 433.92 MHz;
P
1
-
110 dBm for
f
i(RF)
= 868.35 MHz
-
BER
3
10
-
2
(e.g. 60 bit errors per second for 2000 bits/s)
FSK sensitivity into
pin MIXIN (see Fig.5)
modulated test signal 2;
P
1
-
100 dBm
-
BER
3
10
-
2
(e.g. 60 bit errors per second for 2000 bits/s)
Maximum input power
for ASK (see Fig.5)
modulated test signal 1;
P
1
-
22 dBm
-
BER
3
10
-
2
(e.g. 60 bit errors per second for 2000 bits/s)
Maximum input power
for FSK (see Fig.5)
modulated test signal 2;
P
1
-
6 dBm
-
BER
3
10
-
2
(e.g. 60 bit errors per second for 2000 bits/s)
Receiver turn-on
time; see note 1 and
Fig.4
modulated test
signal 1 or 2;
P
1
= P
ref
+ 3 dB
-
check that the first 10 bits are correct;
error counting is started 10 ms after power down
is switched into operating mode on
Interception point
(mixer + PMA)
see note 2 and Fig.6
test signal 3;
P
1
=
-
40 dBm
test signal 4;
P
2
= P
1
measure with high impedance probe at pin FA
(for IM3 see Fig.6)
Spurious radiation;
see note 3 and Fig.7
-
-
no spurious signals (25 MHz to 1 GHz) with level
higher than maximum P
SPUR
IP3
PMA
P
1
IM3
2
---------- dBm
+
=
Fig.4 Timing diagram for pulsed power down voltage.
handbook, full pagewidth
MGM745
VPWD
(V)
2.7
0
0
50
188
238
376
426
t (ms)
1999 Jan 22
17
Philips Semiconductors
Product specification
Frequency Shift Keying (FSK)/Amplitude
Shift Keying (ASK) receiver
UAA3220TS
Fig.5 Test configuration A (single generator).
(1) For test circuit see Fig.9.
(2) For BER test facility see Fig.8.
TEST CIRCUIT
(1)
(2)
GENERATOR 1
50
MED900
BER TEST
FACILITY
Fig.6 Test configuration C (IP3).
(1) For test circuit see Fig.9.
SPECTRUM
ANALYZER
WITH
PROBE
TEST CIRCUIT
(1)
GENERATOR 1
50
2-SIGNAL
POWER
COMBINER
50
GENERATOR 2
50
MED901
f
f = 100 kHz
f
f
IM3
1999 Jan 22
18
Philips Semiconductors
Product specification
Frequency Shift Keying (FSK)/Amplitude
Shift Keying (ASK) receiver
UAA3220TS
Fig.7 Test configuration D (spurious radiation).
(1) For test circuit see Fig.9.
SPECTRUM
ANALYZER
INPUT IMPEDANCE
50
TEST CIRCUIT
(1)
MED902
Fig.8 BER test facility.
DEVICE
UNDER TEST
SIGNAL
GENERATOR
MASTER
CLOCK
BIT PATTERN
GENERATOR
PRESET
DELAY
DATA
COMPARATOR
INTEGRATE
AND DUMP
RX data
BER TEST BOARD
to error counter
TX data
MED904
delayed
TX data
1999
Jan
22
19
Philips Semiconductors
Product specification
Frequency Shift Keying (FSK)/Amplitude
Shift Keying (ASK) receiver
UAA3220TS
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APPLICA
TION INFORMA
TION
n
dbook, full pagewidth
MGM747
PMA
DEMODULATOR
AM/FM
SWITCH
DATA SLICER
MIXER
BIAS
22
FA
23
MIXIN
24
MGND
16
15
18
CPB
C31
17
CPC
CPA
11
DEMO2
12
GND
10
DEMO1
9
PWD
MULTIPLIER
3
7
TN
8
TP
6
TEM
OSCILLATOR
2
OSE
3
OSB
4
VCC
VCC
5
OSC
1
OGND
RSSI
LIN
VCCI
VCC
21
20
LFB
19
DATA
14
C32
C30
C33
C21
C20
R20
X20
C51
L50
R51
C43
L41
L51
C40
R40
C41
C44
C70
R50
L40
R41
C22
C11
L10
C10
C12
CGND
13
LIMITER
AMPLIFIER
-
+
UAA3220TS
data output
power-down
RSSI
50
RF
input
C60
C61
C50
C42
R60
L60
X40
2/
3
Fig.9 Application diagram (FSK reception).
1999
Jan
22
20
Philips Semiconductors
Product specification
Frequency Shift Keying (FSK)/Amplitude
Shift Keying (ASK) receiver
UAA3220TS
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n
dbook, full pagewidth
MGM748
PMA
DEMODULATOR
AM/FM
SWITCH
DATA SLICER
MIXER
BIAS
22
FA
23
MIXIN
24
MGND
16
15
18
CPB
C31
17
CPC
CPA
11
DEMO2
12
GND
10
DEMO1
9
PWD
MULTIPLIER
3
7
TN
8
TP
6
TEM
OSCILLATOR
2
OSE
3
OSB
4
VCC
VCC
5
OSC
1
OGND
RSSI
LIN
VCCI
VCC
21
20
LFB
19
DATA
14
C32
C30
C33
C21
C20
R20
X20
C51
L50
R51
C43
L41
L51
C40
R40
C41
C44
C70
R50
L40
R41
C22
C11
L10
C10
C12
CGND
13
LIMITER
AMPLIFIER
-
+
UAA3220TS
data output
power-down
RSSI
50
RF
input
C50
C42
X40
2/
3
Fig.10 Application diagram (ASK reception).
1999 Jan 22
21
Philips Semiconductors
Product specification
Frequency Shift Keying (FSK)/Amplitude
Shift Keying (ASK) receiver
UAA3220TS
Table 4
Component list for Figs 9 and 10; f
i(RF)
= 433.92 MHz
COMPONENT
COMPONENT CHARACTERISTICS
VALUE
TOLERANCE
TEMPERATURE
COEFFICIENT
(ppm/K)
LOSS FACTOR
AT 1 MHz
QUALITY
FACTOR
SELF
RESONANCE
FREQUENCY
R20
330
2%
+50
-
-
-
R40
1.8 k
2%
+50
-
-
-
R41
not placed
-
-
-
-
-
R50
1.2 k
2%
+50
-
-
-
R51
1.5 k
2%
+50
-
-
-
R60
4.7 k
2%
+50
-
-
-
C10
(1)
2.7 pF
10%
0
30
tan
20
10
-
4
-
-
C11
3 to 10 pF
-
0
300
tan
20
10
-
4
-
-
C12
100 pF
10%
0
30
tan
10
10
-
4
-
-
C20
1 nF
10%
0
30
tan
10
10
-
4
-
-
C21
47 nF
10%
0
30
tan
10
10
-
4
-
-
C22
1 nF
10%
0
30
tan
10
10
-
4
-
-
C30
2.7 nF
10%
0
30
tan
10
10
-
4
-
-
C31
470 pF
10%
0
30
tan
10
10
-
4
-
-
C32
47 nF
10%
0
30
tan
10
10
-
4
-
-
C33
10 nF
10%
0
30
tan
10
10
-
4
-
-
C40
1 nF
10%
0
30
tan
20
10
-
4
-
-
C41
(1)
15 pF
10%
0
30
tan
20
10
-
4
-
-
C42
15 pF
10%
0
30
tan
10
10
-
4
-
-
C43
(1)
8.2 pF
10%
0
30
tan
20
10
-
4
-
-
C44
1 nF
10%
0
30
tan
10
10
-
4
-
-
C50
3 to 10 pF
-
0
300
tan
20
10
-
4
-
-
C51
1 nF
10%
0
30
tan
10
10
-
4
-
-
C60
(2)
82 pF
10%
0
30
tan
10
10
-
4
-
-
C61
(2)
5 to 30 pF
-
0
300
tan
10
10
-
4
-
-
C70
not placed
-
-
-
-
-
L10
(3)
8 nH
5%
+25 to +125
-
140 at 150 MHz
3 GHz
L40
560 nH
10%
+25 to +125
-
45 at 100 MHz
400 MHz
L41
100 nH
10%
+25 to +125
-
60 at 350 MHz
1 GHz
L50
(3)
8 nH
5%
+25 to +125
-
140 at 150 MHz
3 GHz
L51
(3)
8 nH
5%
+25 to +125
-
140 at 150 MHz
3 GHz
L60
(2)
2.2
H
10%
+25 to +125
-
37 at 7.9 MHz
150 MHz
X20
ceramic filter, Murata SFE 10.7 MA 5 A; see note 4
X40
3rd overtone crystal, 70.5367 MHz; see note 5
1999 Jan 22
22
Philips Semiconductors
Product specification
Frequency Shift Keying (FSK)/Amplitude
Shift Keying (ASK) receiver
UAA3220TS
Notes
1. C10, C41 and C43 can be placed as tuning capacitors on the PCB.
2. C60, C61 and L60 can be substituted by an LC tank.
3. L10, L50 and L51 are 3 turn air coils.
4. 3 dB bandwidth: 280
50 kHz; insertion loss: 4 dB typical and 6 dB maximum; spurious: 30 dB minimum at
8 to 12 MHz; input and output impedance: 330
.
5. Motional resistance: R
m
20
;
static capacitance: C
0
6 pF; load capacitance: C
L
=
6 pF; loaded parallel
resonance frequency: 70.5367 MHz; drive level dependency: R
m
20
(1 nW
P
1 mW).
1999 Jan 22
23
Philips Semiconductors
Product specification
Frequency Shift Keying (FSK)/Amplitude
Shift Keying (ASK) receiver
UAA3220TS
Table 5
Component list for Figs 9 and 10; f
i(RF)
= 868.35 MHz
COMPONENT
COMPONENT CHARACTERISTICS
VALUE
TOLERANCE
TEMPERATURE
COEFFICIENT
(ppm/K)
LOSS FACTOR
AT 1 MHz
QUALITY
FACTOR
SELF
RESONANCE
FREQUENCY
R20
330
5%
100
-
-
-
R40
1.5 k
5%
100
-
-
-
R41
not placed
-
-
-
-
-
R50
390
5%
100
-
-
-
R51
330
5%
100
-
-
-
R60
4.7 k
5%
100
-
-
-
C10
27 pF
5%
0
30
tan
10
10
-
4
-
-
C11
1.7 to 3 pF
-
0
300
tan
20
10
-
4
-
-
C12
27 pF
5%
0
30
tan
10
10
-
4
-
-
C20
1 nF
10%
15%
(1)
tan
2.5%
-
-
C21
47 nF
10%
15%
(1)
tan
2.5%
-
-
C22
1 nF
10%
15%
(1)
tan
2.5%
-
-
C30
3.3 nF
10%
15%
(1)
tan
2.5%
-
-
C31
680 pF
10%
15%
(1)
tan
2.5%
-
-
C32
10 nF
10%
15%
(1)
tan
2.5%
-
-
C33
10 nF
10%
15%
(1)
tan
2.5%
-
-
C40
1 nF
10%
15%
(1)
tan
2.5%
-
-
C41
12 pF
5%
0
30
tan
10
10
-
4
-
-
C42
12 pF
5%
0
30
tan
10
10
-
4
-
-
C43
4 pF
0.25 pF
0
30
tan
15
10
-
4
-
-
C44
47 pF
5%
0
30
tan
10
10
-
4
-
-
C50
2.5 to 6 pF
-
0
300
tan
20
10
-
4
-
-
C51
47 pF
5%
0
30
tan
10
10
-
4
-
-
C60
(2)
82 pF
5%
0
30
tan
10
10
-
4
-
-
C61
(2)
5 to 30 pF
-
0
300
tan
3.4
10
-
4
-
-
C70
4.7
F
20%
15%
(1)
tan
0.06
-
-
L10
(3)
-
-
-
-
-
-
L40
560 nH
10%
+25 to +125
-
30 at 25 MHz
415 MHz
L41
39 nH
10%
+25 to +125
-
50 at 50 MHz
1.5 GHz
L50
(3)
-
-
-
-
-
-
L51
(3)
-
-
-
-
-
-
L60
(2)
2.2
H
10%
+25 to +125
-
20 at 7.9 MHz
140 MHz
X20
ceramic filter, Murata SFE 107 MA 5 A; see note 4
X40
3rd overtone crystal, 95.2944 MHz; see note 5
1999 Jan 22
24
Philips Semiconductors
Product specification
Frequency Shift Keying (FSK)/Amplitude
Shift Keying (ASK) receiver
UAA3220TS
Notes
1. Temperature coefficient given as maximum
C/C over temperature range.
2. C60, C61 and L60 can be substituted by an LC tank.
3. Realized as microstrip line; see Fig.12.
4. 3 dB bandwidth: 280
50 kHz; insertion loss: 4 dB typical and 6 dB maximum; spurious: 30 dB minimum at
8 to 12 MHz; input and output impedance: 330
.
5. Motional resistance: R
m
20
;
static capacitance: C
0
6 pF; load capacitance: C
L
=
6 pF; loaded parallel
resonance frequency: 95.2944 MHz; drive level dependency: R
m
20
(1 nW
P
1 mW).
1999 Jan 22
25
Philips Semiconductors
Product specification
Frequency Shift Keying (FSK)/Amplitude
Shift Keying (ASK) receiver
UAA3220TS
Fig.11 Printed-circuit board layout for f
i(RF)
= 433.92 MHz.
handbook, full pagewidth
bottom view
top view
MGM749
47
44
RF in
C11
C21
RSSI
DATA out
C12
C40
R40
R50
R51
C50
C70
X40
C51
L50
L60
VCC
L51
C44
C42
C61
C60
R60
C43
R41
C41
C10
L10
X10
L40
L41
UAA3220TS
R20
C20
C22
C33
C30
C32
C31
Dimensions in mm.
1999 Jan 22
26
Philips Semiconductors
Product specification
Frequency Shift Keying (FSK)/Amplitude
Shift Keying (ASK) receiver
UAA3220TS
Fig.12 Printed-circuit board layout for f
i(RF)
= 868.35 MHz.
Dimensions in mm.
handbook, full pagewidth
bottom view
DATA out
RSSI
RF in
C33
C30
C32
C31
CON9
C70
C51
C43
C44
C42
C41
R40
C40
R51
R41
L41
L40
X40
C20
X20
R20
C22
C21
C12
C11
C10
C60
C61
L60
jumper
R60
R50
UAA3220TS
C50
n.p.
47
46
MHB459
1999 Jan 22
27
Philips Semiconductors
Product specification
Frequency Shift Keying (FSK)/Amplitude
Shift Keying (ASK) receiver
UAA3220TS
PACKAGE OUTLINE
UNIT
A
1
A
2
A
3
b
p
c
D
(1)
E
(1)
(1)
e
H
E
L
L
p
Q
Z
y
w
v
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC
JEDEC
EIAJ
mm
0.21
0.05
1.80
1.65
0.38
0.25
0.20
0.09
8.4
8.0
5.4
5.2
0.65
1.25
7.9
7.6
0.9
0.7
0.8
0.4
8
0
o
o
0.13
0.1
0.2
DIMENSIONS (mm are the original dimensions)
Note
1. Plastic or metal protrusions of 0.20 mm maximum per side are not included.
1.03
0.63
SOT340-1
MO-150AG
93-09-08
95-02-04
X
w
M
A
A
1
A
2
b
p
D
H
E
L
p
Q
detail X
E
Z
e
c
L
v
M
A
(A )
3
A
1
12
24
13
0.25
y
pin 1 index
0
2.5
5 mm
scale
SSOP24: plastic shrink small outline package; 24 leads; body width 5.3 mm
SOT340-1
A
max.
2.0
1999 Jan 22
28
Philips Semiconductors
Product specification
Frequency Shift Keying (FSK)/Amplitude
Shift Keying (ASK) receiver
UAA3220TS
SOLDERING
Introduction to soldering surface mount packages
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our
"Data Handbook IC26; Integrated Circuit Packages"
(document order number 9398 652 90011).
There is no soldering method that is ideal for all surface
mount IC packages. Wave soldering is not always suitable
for surface mount ICs, or for printed-circuit boards with
high population densities. In these situations reflow
soldering is often used.
Reflow soldering
Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.
Several methods exist for reflowing; for example,
infrared/convection heating in a conveyor type oven.
Throughput times (preheating, soldering and cooling) vary
between 100 and 200 seconds depending on heating
method.
Typical reflow peak temperatures range from
215 to 250
C. The top-surface temperature of the
packages should preferable be kept below 230
C.
Wave soldering
Conventional single wave soldering is not recommended
for surface mount devices (SMDs) or printed-circuit boards
with a high component density, as solder bridging and
non-wetting can present major problems.
To overcome these problems the double-wave soldering
method was specifically developed.
If wave soldering is used the following conditions must be
observed for optimal results:
Use a double-wave soldering method comprising a
turbulent wave with high upward pressure followed by a
smooth laminar wave.
For packages with leads on two sides and a pitch (e):
larger than or equal to 1.27 mm, the footprint
longitudinal axis is preferred to be parallel to the
transport direction of the printed-circuit board;
smaller than 1.27 mm, the footprint longitudinal axis
must be parallel to the transport direction of the
printed-circuit board.
The footprint must incorporate solder thieves at the
downstream end.
For packages with leads on four sides, the footprint must
be placed at a 45
angle to the transport direction of the
printed-circuit board. The footprint must incorporate
solder thieves downstream and at the side corners.
During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.
Typical dwell time is 4 seconds at 250
C.
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.
Manual soldering
Fix the component by first soldering two
diagonally-opposite end leads. Use a low voltage (24 V or
less) soldering iron applied to the flat part of the lead.
Contact time must be limited to 10 seconds at up to
300
C.
When using a dedicated tool, all other leads can be
soldered in one operation within 2 to 5 seconds between
270 and 320
C.
1999 Jan 22
29
Philips Semiconductors
Product specification
Frequency Shift Keying (FSK)/Amplitude
Shift Keying (ASK) receiver
UAA3220TS
Suitability of surface mount IC packages for wave and reflow soldering methods
Notes
1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum
temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the
"Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods".
2. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink
(at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version).
3. If wave soldering is considered, then the package must be placed at a 45
angle to the solder wave direction.
The package footprint must incorporate solder thieves downstream and at the side corners.
4. Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8 mm;
it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
5. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
DEFINITIONS
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
PACKAGE
SOLDERING METHOD
WAVE
REFLOW
(1)
BGA, SQFP
not suitable
suitable
HLQFP, HSQFP, HSOP, HTSSOP, SMS not suitable
(2)
suitable
PLCC
(3)
, SO, SOJ
suitable
suitable
LQFP, QFP, TQFP
not recommended
(3)(4)
suitable
SSOP, TSSOP, VSO
not recommended
(5)
suitable
Data sheet status
Objective specification
This data sheet contains target or goal specifications for product development.
Preliminary specification
This data sheet contains preliminary data; supplementary data may be published later.
Product specification
This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
1999 Jan 22
30
Philips Semiconductors
Product specification
Frequency Shift Keying (FSK)/Amplitude
Shift Keying (ASK) receiver
UAA3220TS
NOTES
1999 Jan 22
31
Philips Semiconductors
Product specification
Frequency Shift Keying (FSK)/Amplitude
Shift Keying (ASK) receiver
UAA3220TS
NOTES
Internet: http://www.semiconductors.philips.com
Philips Semiconductors a worldwide company
Philips Electronics N.V. 1999
SCA61
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Printed in The Netherlands
545002/00/02/pp32
Date of release: 1999 Jan 22
Document order number:
9397 750 04896