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Product specification
Supersedes data of 1998 Jun 11
File under Integrated Circuits, IC03
1999 Feb 17
INTEGRATED CIRCUITS
UBA1707
Cordless telephone, answering
machine line interface
1999 Feb 17
2
Philips Semiconductors
Product specification
Cordless telephone, answering machine
line interface
UBA1707
FEATURES
Line interface
Low DC line voltage; operates down to 1.2 V (excluding
polarity guard)
Voltage regulator with adjustable DC voltage
DC mask for voltage or current regulation (CTR 21)
Line current limitation for protection
Electronic hook switch control input
Transmit amplifier with:
Symmetrical inputs
Fixed gain
Large signals handling capability.
Receive amplifier with fixed gain
Transmit and receive amplifiers AGC for line loss
compensation.
Auxiliary amplifier
Fixed gain.
Loudspeaker channel
Dual inputs
Rail-to-rail output stage for single-ended load drive
High output current capability
Dynamic limiter to prevent distortion
Digital volume control
Fixed maximum gain.
General purpose switches
Three switches with open-collector.
3-wires serial bus interface
Allows to control:
DC mask (voltage or current regulation)
Receive amplifier mute function
AGC:
On/off
Slope
I
start
line current.
Auxiliary amplifier mute function
Loudspeaker channel:
Input selection
Volume setting
Dynamic limiter inhibition
Power-down mode.
General purpose switches state
Global power-down mode.
Supply
Operates with external supply voltage from 3.0 to 5.5 V.
APPLICATIONS
Cordless base stations
Answering machines
Mains or battery-powered telephone sets.
GENERAL DESCRIPTION
The UBA1707 is a BiCMOS integrated circuit intended for
use in mains-powered telecom terminals. It performs all
speech and line interface functions, DC mask for voltage
or current regulation and electronic hook switch control.
The device includes an auxiliary amplifier, a loudspeaker
channel and general purpose switches.
Most of the characteristics are programmable via a 3-wire
serial bus interface.
ORDERING INFORMATION
TYPE
NUMBER
PACKAGE
NAME
DESCRIPTION
VERSION
UBA1707T
SO28
plastic small outline package; 28 leads; body width 7.5 mm
SOT136-1
UBA1707TS
SSOP28
plastic shrink small outline package; 28 leads; body width 5.3 mm
SOT341-1
1999 Feb 17
3
Philips Semiconductors
Product specification
Cordless telephone, answering machine
line interface
UBA1707
QUICK REFERENCE DATA
I
line
= 15 mA; V
CC
= 3.3 V; R
SLPE
= 10
; AGC pin connected to GND; Z
line
= 600
; Z
SET
= 619
; EHI = HIGH;
f = 1 kHz; T
amb
= 25
C; bit AGC at logic 1, all other configuration bits at logic 0; measured in test circuit of Fig.17;
unless otherwise specified.
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
V
CC
operating voltage range
3.0
-
5.5
V
I
CC
current consumption from pin V
CC
normal operation; bit PD = 0
-
2.2
3.2
mA
power-down mode; bit PD = 1
-
110
150
A
I
line
line current operating range
normal operation
11
-
140
mA
with reduced performance
3
-
11
mA
V
LN
DC line voltage
2.7
3.0
3.3
V
R
REGC
DC mask slope in current regulation
mode
I
line
> 35 mA (typical);
R
LVI
= 1 M
; R
RGL
= 7.15 k
;
bit CRC = 1
-
1.4
-
k
G
v(trx)
voltage gain
transmit amplifier from TXI to LN
V
TXI
= 50 mV (RMS)
10.6
11.6
12.6
dB
receive amplifier from RXI to RXO V
RXI
= 2 mV (RMS)
36.9
37.9
38.9
dB
G
v(trx)
gain control range for transmit and
receive amplifiers with respect to
I
line
= 15 mA
I
line
= 90 mA
-
6.5
-
dB
G
v(AX)
voltage gain from AXI to AXO
V
AXI
= 2 mV (RMS)
30.8
31.8
32.8
dB
G
v(LSA)
voltage gain from LSAI1 or LSAI2 to
LSAO for maximum volume
V
LSAI
= 8 mV (RMS);
bits LSA1 = 1 and LSA2 = 1
26.5
28
29.5
dB
G
v(LSA)
voltage gain adjustment range for
loudspeaker channel
bits (VOL0, VOL1, VOL2)
from (0, 0, 0) to (1, 1, 1)
-
21
-
dB
G
v(LSA)s
voltage gain adjustment step for
loudspeaker channel
VOL0 from 0 to 1
-
3
-
dB
1999 Feb 17
4
Philips Semiconductors
Product specification
Cordless telephone, answering machine
line interface
UBA1707
BLOCK DIAGRAM
Fig.1 Block diagram.
Bit names are given in italics.
handbook, full pagewidth
MGK705
SERIAL
INTERFACE
EN
CLK
DATA
13
14
12
19
SUPPLY
PD
GENERAL SWITCHES
SWI1
SWI2
SWI3
21
20
19
2
REG
LSAI1
LSAI2
2Vd
2Vd
LSPD
LSPD
LSPD
SWC1, SWC2,
SWC3
VOL0
TO
VOL2
LSA2
LSA1
0.5VCC
2Vd
DYNAMIC LIMITER
VOLUME CONTROL
VCC
DLCI
CDLC
DLC
LSAO
28
24
27
LSPGND
23
26
LOUDSPEAKER CHANNEL
AXI
2Vd
AXO
16
LVI
4
15
RGL
5
AGC
9
TXI
-
17
TXI
+
18
RXI
10
AUXILIARY AMPLIFIER
LINE INTERFACE
UBA1707
AXM
CRC
RAGC1
SAGC,
AGC
RAGC2
RXM
EHI
EHI
EHI
SLPE
600 mV
300 mV
AGC
LOW VOLTAGE
PART
CURRENT
LIMITATION
200 nA
VCC
CST
7
LCC
6
EHI
11
REG
3
SLPE
1
LN
2
RXO
8
GND
22
CCST
RLVI
VCC
TPDARL
D
TNSW
TNON-HOOK
LN
-
LN
+
VCC 25
2Vd
RSLPE
ZSET
CREG
3
3
RRGL
V
I
V
I
V
I
V
I
1999 Feb 17
5
Philips Semiconductors
Product specification
Cordless telephone, answering machine
line interface
UBA1707
PINNING
SYMBOL
PIN
DESCRIPTION
SLPE
1
connection for slope resistor
LN
2
positive line terminal
REG
3
line voltage regulator decoupling
LVI
4
negative line voltage sense input
RGL
5
reference for current regulation mode
LCC
6
line current control output
CST
7
input for stability capacitor
RXO
8
receive amplifier output
AGC
9
automatic gain control/line loss
compensation adjustment
RXI
10
receiver amplifier input
EHI
11
electronic hook switch control input
DATA
12
serial bus data input
EN
13
programming serial bus enable input
CLK
14
serial bus clock input
AXI
15
auxiliary amplifier input
AXO
16
auxiliary amplifier output
TXI
-
17
inverted transmit amplifier input
TXI+
18
non-inverted transmit amplifier input
SWI3
19
NPN open-collector output 3
SWI2
20
NPN open-collector output 2
SWI1
21
NPN open-collector output 1
GND
22
ground reference
LSPGND
23
ground reference for the loudspeaker
amplifier
LSAO
24
loudspeaker amplifier output
V
CC
25
supply voltage
LSAI1
26
loudspeaker amplifier input 1
LSAI2
27
loudspeaker amplifier input 2
DLC
28
dynamic limiter timing adjustment
Fig.2 Pin configuration.
handbook, halfpage
SLPE
LN
REG
LVI
RGL
LCC
CST
RXO
AGC
RXI
EHI
DATA
EN
CLK
DLC
LSAI2
LSAI1
VCC
LSPGND
GND
LSAO
SWI1
SWI2
SWI3
TXI
+
TXI
-
AXO
AXI
1
2
3
4
5
6
7
8
9
10
11
12
13
28
27
26
25
24
23
22
21
20
19
18
17
16
15
14
UBA1707
MGK704
1999 Feb 17
6
Philips Semiconductors
Product specification
Cordless telephone, answering machine
line interface
UBA1707
FUNCTIONAL DESCRIPTION
All data given in this chapter are typical values, except
when otherwise specified.
Supply (pins V
CC
and GND; bits PD and LSPD)
The UBA1707 must be supplied with an external stabilized
voltage source between pins V
CC
and GND.
Pins GND and LSPGND must be connected together.
Without any signal, with the loudspeaker channel enabled
at minimum volume and without any general purpose
switch selected, the internal current consumption is
2.2 mA at V
CC
= 3.3 V. Each selected switch
(pins SWI1, SWI2, or SWI3) increases the current
consumption by 600
A.
The supply current can be reduced when the loudspeaker
channel is not used by switching it off (bit LSPD at logic 1).
The current consumption is then decreased by
approximately 800
A at minimum volume.
To drastically reduce current consumption, the UBA1707
is provided with a power-down mode controlled by bit PD.
When bit PD is at logic 1, the current consumption from
V
CC
becomes 110
A. In this mode, the serial interface is
the only function which remains active.
Line interface
DC
CHARACTERISTICS
(
PINS
LN, SLPE, REG, CST, LVI,
LCC, RGL
AND
GND;
BIT
CRC)
The IC generates a stabilized reference voltage (V
ref
)
between pins LN and SLPE. This reference voltage is
equal to 2.9 V, is temperature compensated and can be
adjusted by means of an external resistor (R
VA
). It can be
increased by connecting the R
VA
resistor between
pins REG and SLPE (see Fig.3).
The voltage at pin REG is used by the internal regulator to
generate the stabilized reference voltage and is decoupled
by a capacitor (C
REG
) which is connected to GND. This
capacitor, converted into an equivalent inductance
(see Section "Set impedance") realizes the set impedance
conversion from its DC value (R
SLPE
) to its AC value
(Z
SET
in the audio-frequency range). Figure 4 illustrates
the reference voltage supply configuration. As can be seen
from Fig.4, part of the line current flows into the Z
SET
impedance network and is not sensed by the UBA1707.
Therefore using the R
VA
resistor to change value of the
reference voltage will also modify all parameters related to
the line current such as:
The automatic gain control
The DC mask management
The low voltage area characteristics.
In the same way, changing the value of Z
SET
also affects
the characteristics. The IC has been optimized for
V
ref
= 2.9 V and Z
SET
= 619
.
The IC regulates the line voltage at pin LN which can be
calculated as follows:
Where:
I
line
= line current
I
ZSET
= current flowing through Z
SET
I* = current consumed between LN and GND
(approximately 100
A).
The preferred value for R
SLPE
is 10
. Changing R
SLPE
will
affect more than the DC characteristics; it also influences
the transmit gain, the gain control characteristics, the
sidetone level and the maximum output swing on the line.
However, for compliance with CTR 21 8.66
is the best
value for R
SLPE
.
Fig.3 Reference voltage adjustment with R
VA
.
(1) Influence of R
VA
on V
ref
.
(2) V
ref
without influence of R
VA
.
handbook, halfpage
8.5
2.5
(1)
(2)
10
5
10
4
10
3
10
6
MGK706
3.5
4.5
6.5
5.5
7.5
Vref
(V)
RVA (
)
V
LN
V
ref
R
SLPE
I
SLPE
+
=
I
SLPE
I
line
I
ZSET
I*
I
line
I
ZSET
=
1999 Feb 17
7
Philips Semiconductors
Product specification
Cordless telephone, answering machine
line interface
UBA1707
Fig.4 Reference voltage supply configuration.
handbook, full pagewidth
MGK707
Rp
Vd
35 k
Rd
4 k
*
I
CREG
4.7
F
ISLPE
RSLPE
10
REG
GND
SLPE
IZSET
ZSET
619
ILN
Iline
LN
+
UBA1707
LN
Fig.5 Line current settling simplified configuration.
handbook, full pagewidth
MGK708
Rp
Vd
35 k
Rd
4 k
CREG
4.7
F
ISLPE
RSLPE
10
REG
GND
LCC
EHI
SLPE
ZSET
619
IZSET
Rexch
Vexch
VEHI
ILN
Vref
VCE (TNSW)
TNSW
Iline
Vline
Zline
LN
+
LN
-
UBA1707
LN
HOOK SWITCH
MANAGEMENT
1999 Feb 17
8
Philips Semiconductors
Product specification
Cordless telephone, answering machine
line interface
UBA1707
The DC line current flowing into the set is determined by
the exchange supply voltage (V
exch
), the feeding bridge
resistance (R
exch
), the DC resistors of the telephone line
(R
line
) and the set (R
SET
), the reference voltage (V
ref
) and
the voltage introduced by the transistor (TN
SW
) used as
line interrupter (see Fig.5). With a line current below I
low
(8 mA with Z
SET
= 619
), the internal reference voltage
(V
ref
) is automatically adjusted to a lower value. This
means that more sets can operate in parallel with DC line
voltages (excluding the polarity guard) down to 1.2 V.
At line current below I
low
, the circuit has limited transmit
and receive levels. This is called the low voltage area.
Figure 6 shows in more details how the UBA1707, in
association with some external components, manages the
line interrupter (TN
SW
external transistor).
In on-hook conditions (voltage at pin EHI is LOW), the
voltage at pin LCC is pulled-up to the supply voltage level
(V
CC
) to turn off the TP
DARL
transistor. As a result, because
of the R
PLD
resistor, the TN
SW
and TN
ON-HOOK
transistors
are switched off. The TN
ON-HOOK
transistor disconnects
the R
LVI
resistor from the LN
-
line terminal in order to
guarantee a high on-hook impedance.
In off-hook conditions (voltage at pin EHI is HIGH), an
operational amplifier drives (at pin LCC) the base of
TP
DARL
which forms a current amplifier structure in
association with TN
SW
. The line current flows through
TN
SW
transistor. The TN
ON-HOOK
transistor is forced into
deep saturation. A virtual ground is created at pin LVI
because of the operational amplifier. A DC current (I
LVI
) is
sourced from pin LVI into the R
LVI
resistor in order to
generate a voltage source. Thus the voltage between pin
GND and the negative line terminal (LN
-
) becomes:
V
CE
(TN
SW
) = R
LVI
I
LVI
+ V
CE
(TN
ON-HOOK
)
R
LVI
I
LVI
The voltage V
line
between the line terminals LN+ and LN
-
can be calculated as follows:
V
line
V
ref
+ R
SLPE
(I
line
-
I
ZSET
) + V
CE
(TN
SW
)
Where:
I
line
= line current
I
ZSET
= current flowing through Z
SET
.
1999
Feb
17
9
Philips Semiconductors
Product specification
Cordless telephone, answering machine
line interface
UBA1707
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a
ndbook, full pagewidth
MGK709
CURRENT
REGULATION
MODE
MANAGEMENT
ILVIV
200 nA
VEHI
CREG
4.7
F
ILVI
RPLU
150 k
VCC
TPDARL
CRC
RRGL
7.15 k
CLVI
470 pF
TNON-HOOK
TNSW
DPROT
DSW
RPLD
20 k
RON-HOOK
100 k
CCST
22 pF
GND
LVI
RGL
CST
LCC
SLPE
LN
8.2 V
Iline
LN
-
Vd
Rd
4 k
Rp
35 k
REG
EHI
UBA1707
LN
+
Vref
ILN
ISLPE
Iline
Vline
IZSET
ZSET
619
RSLPE
10
RLVI
1 M
CURRENT
LIMITATION
Fig.6 Line interrupter management and DC mask regulation configuration.
Bit names are given in italics.
1999 Feb 17
10
Philips Semiconductors
Product specification
Cordless telephone, answering machine
line interface
UBA1707
The UBA1707 offers the possibility to choose two kinds of
regulations for the DC characteristic between the line
terminals LN+ and LN
-
(see Fig.7):
Voltage regulation mode
Current regulation mode.
The regulation mode is selected by the bit CRC via the
serial interface.
The DC mask regulation is realised by adjusting the DC
voltage V
CE
(TN
SW
) between pin GND and line terminal
LN
-
as a function of the line current.
Voltage regulation mode
In voltage regulation mode (bit CRC at logic 0),
V
CE
(TN
SW
) voltage is fixed by means of a 200 nA DC
constant current I
LVIV
flowing through R
LVI
.
Fig.7
General form of the DC mask as a function
of regulation mode.
(1) Low voltage area.
(2) Small slope (determined by R
SLPE
).
(3) Small slope (dashed line; determined by R
SLPE
) in voltage
regulation mode.
High slope (full line; determined by R
SLPE
, R
LVI
and R
RGL
) in
current regulation mode.
(4) Current limitation.
handbook, halfpage
MGK710
Vline
Iline
Iprot
(4)
Iknee
Ilow
(1)
(2)
(3)
Therefore V
CE
(TN
SW
)
R
LVI
I
LVIV
= 200 mV in typical
application (see Fig.18).
The slope
V
line
/
I
line
of the V
line
, I
line
characteristic is
R
REGV
R
SLPE.
Current regulation mode
In current regulation mode (bit CRC at logic 1), when the
line current is lower than I
knee
= 35 mA (with
Z
SET
= 619
), V
CE
(TN
SW
) is fixed by means of a 200 nA
DC constant current I
LVIV
flowing through R
LVI
. When the
line current is higher than 35 mA, an additional current
(proportional to the line current) flows through R
LVI
. As a
result, TN
SW
works as a DC voltage source increasing with
the line current. V
CE
(TN
SW
) can be calculated as follows:
Where:
I
line
= line current
R
RGL
= resistor connected at pin RGL.
The slope
V
line
/
I
line
of the V
line
, I
line
characteristic is
determined by the ratio of resistors connected at
pins SLPE, LVI and RGL, and can be calculated as
follows:
in
typical application (see Fig.18).
Current limitation
Whatever the selected mode is, the line current is limited
to approximately 145 mA. This current is sensed on SLPE,
for this purpose the external zener diode must be
connected between pins LN and SLPE. The speech
function no longer operates in this condition.
E
LECTRONIC HOOK SWITCH CONTROL
(
PIN
EHI)
The electronic hook switch input (EHI) controls the state of
TP
DARL
transistor. When the voltage applied at pin EHI is
LOW, TP
DARL
transistor is turned off. Voltage at pin LCC is
pulled up to supply voltage (V
CC
). TN
SW
and TN
ON-HOOK
transistors are also turned off by means of a pull-down
resistor (R
PLD
). When the voltage applied at pin EHI is
HIGH, TP
DARL
transistor is driven by the operational
amplifier at pin LCC and the regulation mode selected is
operating. An internal 165 k
pull-up resistor is connected
between pins LCC and V
CC
.
V
CE
TN
SW
(
)
R
LVI
R
SLPE
R
RGL
----------------
I
line
I
knee
(
)
I
LVIV
+
R
REGC
R
SLPE
R
LVI
R
SLPE
R
RGL
----------------
1400
=
+
1999 Feb 17
11
Philips Semiconductors
Product specification
Cordless telephone, answering machine
line interface
UBA1707
The EHI input can also be used for pulse dialling or
register recall (timed loop break). During line breaks
(voltage at pin EHI is LOW or open-circuit), the voltage
regulator is switched off and the capacitor at pin REG is
internally disconnected to prevent its discharge. As a
result, the voltage stabilizer will have negligible switch-on
delay after line interruptions. This minimizes the
contribution of the IC to the current waveform during pulse
dialling or register recall.
When the UBA1707 is in power-down mode (bit PD at
logic 1), the TP
DARL
transistor is forced to be turned off
whatever the voltage applied at pin EHI.
S
ET IMPEDANCE
In the audio frequency range, the dynamic impedance
between pins LN and GND (illustrated in Fig.8) is mainly
determined by the Z
SET
impedance.
The impedance introduced by the external TN
SW
transistor
connected between pin GND and the negative line
terminal (LN
-
) is negligible.
Fig.8
Equivalent impedance between
LN and GND.
L
eq
= C
REG
R
SLPE
R
P
R
P
= internal resistance = 35 k
.
handbook, halfpage
LN
GND
SLPE
RSLPE
CREG
REG
ZSET
4.7
F
619
10
RP
Vref
LEQ
MGL215
T
RANSMIT AMPLIFIER
(
PINS
TXI+
AND
TXI
-
)
The UBA1707 has symmetrical transmit inputs TXI+ and
TXI
-
. The input impedance between pins TXI+ or TXI
-
and
GND is 21 k
. The voltage gain from pins TXI+ or TXI
-
to
pin LN is set at 11.6 dB with 600
line load (Z
line
) and
619
set impedance. The inputs are biased at
2
V
d
1.4 V, with V
d
representing the diode voltage.
Automatic gain control is provided on this amplifier for line
loss compensation.
R
ECEIVE AMPLIFIER
(
PINS
RXI
AND
RXO;
BIT
RXM)
The receive amplifier (see Fig.9) has one input (RXI) and
one output (RXO). The input impedance between pins
RXI and GND is 21 k
. The rail-to-rail output stage is
designed to drive a 500
A peak current. The output
impedance at pin RXO is approximately 100
.
The voltage gain from pin RXI to pin RXO is set at 37.9 dB.
This gain value compensates typically the attenuation of
the anti-sidetone network (see Fig.10). The output as well
as the input are biased at 2
V
d
1.4 V. Automatic gain
control is provided on this amplifier for line loss
compensation. This amplifier can be muted by activating
the receive mute function (bit RXM at logic 1).
1999 Feb 17
12
Philips Semiconductors
Product specification
Cordless telephone, answering machine
line interface
UBA1707
Fig.9 Receive amplifier.
handbook, full pagewidth
MGK711
V
I
V
I
RXM
2Vd
2Vd
from AGC
RXI
RXO
UBA1707
Bit names are given in italics.
S
IDETONE SUPPRESSION
The UBA1707 anti-sidetone network comprising
Z
SET
//Z
line
, R
ast1
, R
ast2
, R
ast3
, R
SLPE
and Z
bal
(see Fig.10)
suppresses the transmitted signal in the received signal.
Maximum compensation is obtained when the following
conditions are fulfilled:
R
SLPE
R
ast1
= Z
SET
(R
ast2
+ R
ast3
)
Z
bal
= k
Z
line
The scale factor `k' is chosen to meet the compatibility with
a standard capacitor from the E6 or E12 range for Z
bal
.
In practice, Z
line
varies considerably with the line type and
the line length.
k
R
ast2
R
ast3
R
SLPE
+
(
)
(
)
R
ast1
R
SLPE
(
)
--------------------------------------------------------------------
=
Therefore, the value chosen for Z
bal
should be for an
average line length which gives satisfactory sidetone
suppression with short and long lines.
The suppression also depends on the accuracy of the
match between Z
bal
and the impedance of the average
line.
The anti-sidetone network for the UBA1707 (see Fig.18)
attenuates the receiving signal from the line by 38 dB
before it enters the receiving amplifier. The attenuation is
almost constant over the whole audio frequency range.
A Wheatstone bridge configuration (see Fig.11) may also
be used.
More information on the balancing of an anti-sidetone
bridge can be obtained in our publication
"Applications
Handbook for Wired Telecom Systems, IC03b".
handbook, full pagewidth
MGL216
Im
ZRXI
RXI
Rast1
Rast3
Rast2
SLPE
RSLPE
GND
Zline
ZSET
LN
Zbal
Fig.10 Equivalent circuit of UBA1707 anti-sidetone bridge.
1999 Feb 17
13
Philips Semiconductors
Product specification
Cordless telephone, answering machine
line interface
UBA1707
Fig.11 Equivalent circuit of an anti-sidetone network in a Wheatstone bridge configuration.
handbook, full pagewidth
MGL217
Im
ZRXI
RXI
Zbal
Rast1
SLPE
RSLPE
GND
Zline
ZSET
LN
RA
A
UTOMATIC GAIN CONTROL
(
PIN
AGC;
BITS
RAGC1,
RAGC2, SAGC
AND
AGC)
The UBA1707 performs automatic line loss compensation.
The automatic gain control varies the gain of the transmit
amplifier and the gain of the receive amplifier in
accordance with the DC line current. The control range is
6.5 dB (which roughly corresponds to a line length of
5.5 km for a 0.5 mm diameter twisted-pair copper cable
with a DC resistance of 176
/km and an average
attenuation of 1.2 dB/km).
When the line current is greater than I
stop
, the voltage
gains are minimum. When the line current is less than I
start
,
the voltage gains are maximum. When the AGC pin is
connected to pin GND, the start line current (I
start
) can be
chosen between 22.5 and 29.5 mA via bits RAGC1 and
RAGC2 through the serial interface. Two values for the
I
stop
/I
start
ratio (slope of the AGC) are possible via the bit
SAGC through the serial interface. When bit SAGC is at
logic 0 then I
stop
= 2.7
I
start
(optimized for voltage
regulation mode). When SAGC is at logic 1 then
I
stop
= 1.9
I
start
(optimized for current regulation mode).
An external resistor R
AGC
(connected between pins GND
and AGC) enables the I
start
and I
stop
line currents to be
increased (the ratio between I
start
and I
stop
is not affected
by this external resistor). So internal and external
adjustments of the automatic gain control allow
optimization of the IC for many configurations of exchange
supply voltage and feeding bridge resistance. Part of the
line current flows into the Z
SET
impedance network. The IC
has been optimized for Z
SET
= 619
. Changing this 619
value slightly modifies I
stop
and I
start
line currents as well as
the value of the two AGC slopes.
The automatic gain control function can be disabled by
setting the AGC bit to logic 0 via the serial interface or
when pin AGC is left open-circuit. In this case both of the
voltage gains are maximum.
1999 Feb 17
14
Philips Semiconductors
Product specification
Cordless telephone, answering machine
line interface
UBA1707
Auxiliary amplifier (pins AXI and AXO; bit AXM)
The auxiliary amplifier (see Fig.12) has one input (AXI) and one output (AXO). The input impedance between pins AXI
and GND is 3.8 k
. The rail-to-rail output stage is designed to drive a 500
A peak current. The output impedance at pin
AXO is approximately 100
.
The output as well as the input are biased at 2
V
d
1.4 V DC voltage. The voltage gain from pin AXI to pin AXO is set
at 31.8 dB.The amplifier can be muted by setting bit AXM at logic 1 via the serial interface. In this case, the input
impedance between pins AXI and GND is infinite.
Fig.12 Auxiliary amplifier.
handbook, full pagewidth
MGK712
AXM
2Vd
AXI
AXO
UBA1707
Bit names are given in italics.
Loudspeaker channel (see Fig.13)
L
OUDSPEAKER AMPLIFIER
(
PINS
LSAI1, LSAI2, LSAO
AND
LSPGND;
BITS
LSPD, LSA1
AND
LSA2)
The loudspeaker amplifier has two symmetrical inputs
LSAI1 and LSAI2 selectable independently by the bits
LSA1 and LSA2 respectively. The input impedance
between pins LSAI1or LSAI2 and GND is typically 21 k
.
Each of these two inputs stages can accommodate signals
up to 500 mV (RMS) at room temperature for less than 2%
of Total Harmonic Distortion (THD) at minimum voltage
gain.
The inputs are biased at 2
V
d
1.4 V DC voltage
(whatever the state of bits LSA1 and LSA2).
The rail-to-rail output stage is designed to power a
loudspeaker connected as a single-ended load (between
pins LSAO and LSPGND). The output LSAO is able to
drive at least a 150 mA peak current.
As a result, it can drive loudspeaker loads down to 8
at
V
CC
= 4.0 V and 16
at V
CC
= 5.5 V. The output is biased
at
1
/
2
V
CC
. Its output voltage capability is specified for
continuous wave drive and depends on the value of V
CC
.
In order to avoid crosstalk from the loudspeaker to other
amplifiers, the loudspeaker current flows via pin LSPGND.
This pin must be externally connected to pin GND.
The nominal value of the voltage gain for maximum
volume from pins LSAI1 or LSAI2 to pin LSAO is set at
28 dB.
This amplifier is no longer supplied by setting the LSPD bit
at logic 1 via the serial interface.
1999 Feb 17
15
Philips Semiconductors
Product specification
Cordless telephone, answering machine
line interface
UBA1707
Fig.13 Loudspeaker channel.
Bit names are given in italics.
handbook, full pagewidth
MGK713
LSAI1
LSAI2
2Vd
2Vd
LSPD
LSPD
LSPD
LSA2
LSA1
0.5VCC
DYNAMIC LIMITER
VOLUME CONTROL
VCC
UBA1707
DLCI
LSPD
VOL0
TO
VOL2
DLC
LSPGND
LSAO
3
V
I
V
I
I
V
LSP
CDLC
CLSAO
D
YNAMIC LIMITER
(
PIN
DLC;
BIT
DLCI)
The dynamic limiter of the UBA1707 prevents clipping of
the loudspeaker output stage and protects the operation of
the circuit when the supply voltage at V
CC
falls below
2.7 V.
Hard clipping of the loudspeaker output stage is prevented
by rapidly reducing the gain when the output stage starts
to saturate. The time in which gain reduction is effected
(clipping attack time) is approximately a few milliseconds.
The circuit stays in the reduced gain mode until the peaks
of the loudspeaker signals no longer cause saturation.
The gain of the loudspeaker amplifier then returns to its
normal value within the clipping release time (typically
250 ms). Both attack and release times are proportional to
the value of the capacitor C
DLC
. The total harmonic
distortion of the loudspeaker output stage, in reduced gain
mode, stays below 5% up to 10 dB (minimum) of input
voltage overdrive [providing V
LSAI
is below
500 mV (RMS)].
When the supply voltage drops below an internal threshold
voltage of 2.7 V, the gain of the loudspeaker amplifier is
rapidly reduced (approximately 1 ms). When the supply
voltage exceeds 2.7 V, the gain of the loudspeaker
amplifier is increased again.
The hard clipping of the dynamic limiter can be inhibited by
setting the DLCI bit at logic 1, via the serial interface.
The dynamic limiter is no longer supplied by setting the
LSPD bit at logic 1. In this case, the C
DLC
capacitor charge
is maintained to allow the gain of the loudspeaker amplifier
to return to its nominal value as soon as the loudspeaker
channel is supplied again.
V
OLUME CONTROL
(
BITS
VOL0, VOL1
AND
VOL2)
The loudspeaker amplifier voltage gain can be reduced in
steps of 3 dB via the serial interface (via bits VOL0, VOL1
and VOL2). These bits provide 7 steps of voltage gain
adjustment. The voltage gain is maximum when all bits are
at logic 1 and is reduced by 21 dB when all bits are at
logic 0.
1999 Feb 17
16
Philips Semiconductors
Product specification
Cordless telephone, answering machine
line interface
UBA1707
General purpose switches (pins SWI1, SWI2 and
SWI3; bits SWC1, SWC2 and SWC3)
The UBA1707 is equipped with 3 general purpose
open-collector switches which short the pins SWI1, SWI2
and SWI3 to ground. They are respectively controlled by
bits SWC1, SWC2 and SWC3 and have an operating
voltage limited to 12 V. The outputs have to be current
biased.
For a bias current between 2 and 20 mA, the AC
impedance is 30
maximum.
Serial interface (pins DATA, CLK and EN)
A simple 3-wire unidirectional serial bus is used to program
the circuit. The 3 wires of the bus are EN, CLK and DATA.
The data sent to the device is loaded in bursts framed by
EN. Programming clock edges (falling edges) and their
appropriate data bits are ignored until EN goes active
HIGH. The programmed information is loaded into the
addressed register when EN returns inactive (LOW) or left
open-circuit.
During normal operation, EN should be kept LOW. Only
the last 8 bits serially clocked into the device are retained
within the programming register. Additional leading bits
are ignored and no check is made on the number of clock
pulses. It can always capture new programming data even
during global power-down (bit PD at logic 1).
Data is entered with the most significant bit first.
The leading 6 bits make up the data field (bits D0 to D5)
while the trailing 2 bits are the address field
(bits ADO and AD1). The first bit entered is D5, the last
bit AD0. This organisation allows to send only the number
of bits of the addressed register.
Figure 16 shows the serial timing diagram. Table 1 gives
the list of registers.
When the supply voltage V
CC
drops below 2.5 V, all
register files are set in the initial state (see Table 1) defined
by the power-up reset. At start-up, the circuit is in
power-down mode.
In the event that the IC is used in a noisy environment, it is
advised to periodically refresh the content of registers.
1999 Feb 17
17
Philips Semiconductors
Product specification
Cordless telephone, answering machine
line interface
UBA1707
Table 1
Register description
Note
1. See Section "Automatic gain control (pin AGC; bits RAGC1, RAGC2, SAGC and AGC)".
BIT
NAME
FUNCTION
POLARITY
DATA
ADDRESS
STATE AT
POWER-UP
RESET
Register 0: general purpose switches state and DC mask regulation mode
SWC1
SWI1 output connection
0: SWI1 switched off
D0
(AD1, AD0) = (0,0)
0
1: SWI1 switched on
SWC2
SWI2 output connection
0: SWI2 switched off
D1
0
1: SWI2 switched on
SWC3
SWI3 output connection
0: SWI3 switched off
D2
0
1: SWI3 switched on
un
unused
must be set to logic 0
D3
0
CRC
current regulation mode
0: voltage regulation
D4
0
1: current regulation
Register 1: automatic gain control
RAGC1
AGC range selection 1
D0
(AD1, AD0) = (0,1)
0
RAGC2
AGC range selection 2
D1
0
SAGC
AGC slope selection
0: 2.7 type slope; note 1
D2
0
1: 1.9 type slope; note 1
AGC
line loss compensation mode
0: AGC inhibited
D3
0
1: AGC enabled
Register 2: loudspeaker channel
LSA1
loudspeaker channel input 1
selection
0: LSAI1 unselected
D0
(AD1, AD0) = (1,0)
0
1: LSAI1 selected
LSA2
loudspeaker channel input 2
selection
0: LSAI2 unselected
D1
0
1: LSAI2 selected
LSPD
loudspeaker channel power-down
0: channel on
D2
0
1: channel in power-down
VOL0
volume control (least significant bit)
D3
0
VOL1
volume control
D4
0
VOL2
volume control (most significant bit)
D5
0
Register 3: mute functions and power-down
AXM
auxiliary amplifier mute
0: amplifier enabled
D0
(AD1, AD0) = (1,1)
0
1: amplifier muted
RXM
receive amplifier mute
0: amplifier enabled
D1
0
1: amplifier muted
PD
reduced consumption mode
0: normal operating mode
D2
1
1: power-down mode
DLCI
dynamic limiter inhibit
0: limiter enabled
D3
0
1: limiter inhibited
1999 Feb 17
18
Philips Semiconductors
Product specification
Cordless telephone, answering machine
line interface
UBA1707
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
THERMAL CHARACTERISTICS
SYMBOL
PARAMETER
CONDITIONS
MIN.
MAX.
UNIT
V
CC
supply voltage on pin V
CC
GND
-
0.4
5.5
V
V
LN
positive continuous line voltage on pin LN
GND
-
0.4
12.0
V
repetitive line voltage during switch-on or
line interruption
GND
-
0.4
13.2
V
V
SWIn
voltage on pins SWI1, SWI2, and SWI3
continuous
GND
-
0.4
12.0
V
during switching
GND
-
0.4
13.2
V
V
n(max)
maximum voltage on all other pins
GND
-
0.4
V
CC
+ 0.4
V
I
LN
current sunk by pin LN
see Figs 14 and 15
-
150
mA
I
SWIn
continuous current sunk by
pins SWI1, SWI2, and SWI3
bit SWCn = 1
-
20
mA
P
tot
total power dissipation
T
amb
= 75
C;
see Figs 14 and 15
UBA1707T
-
625
mW
UBA1707TS
-
416
mW
T
stg
IC storage temperature
-
40
+125
C
T
amb
operating ambient temperature
-
25
+75
C
SYMBOL
PARAMETER
CONDITIONS
VALUE
UNIT
R
th j-a
thermal resistance from junction to ambient in free air
UBA1707T
70
K/W
UBA1707TS
104
K/W
1999 Feb 17
19
Philips Semiconductors
Product specification
Cordless telephone, answering machine
line interface
UBA1707
Fig.14 Safe operating area (UBA1707T).
LINE
T
amb
(
C)
P
tot
(mW)
(1)
45
1000
(2)
55
875
(3)
65
750
(4)
75
625
When power is delivered to a loudspeaker with R
L
impedance, the curves must be shifted to the left by:
with maximum power dissipated by the loudspeaker amplifier (dotted line given for V
CC
= 5.5 V, R
L
= 16
).
V
ref
V
CC
2
2
2
R
L
I
LN
------------------------------------------
=
The line current value can be calculated from I
LN
value as follows:
where R
SET
is the resistive part of Z
SET
.
I
line
I
LN
R
SET
R
SLPE
+
(
)
V
LN
V
SLPE
+
R
SET
----------------------------------------------------------------------------------------------
=
handbook, full pagewidth
12
150
30
2
3
4
5
6
8
9
10
11
MGK714
7
50
70
90
110
130
VLN
-
VSLPE (V)
ILN
(mA)
(1)
(2)
(3)
(4)
no power delivered to the loudspeaker
with power delivered to the loudspeaker
Vref
1999 Feb 17
20
Philips Semiconductors
Product specification
Cordless telephone, answering machine
line interface
UBA1707
LINE
T
amb
(
C)
P
tot
(mW)
(1)
45
666
(2)
55
583
(3)
65
500
(4)
75
416
Fig.15 Safe operating area (UBA1707TS).
When power is delivered to a loudspeaker with R
L
impedance, the curves must be shifted to the left by:
with maximum power dissipated by the loudspeaker amplifier (dotted line given for V
CC
= 5.5 V, R
L
= 16
).
V
ref
V
CC
2
2
2
R
L
I
LN
------------------------------------------
=
The line current value can be calculated from I
LN
value as follows:
where R
SET
is the resistive part of Z
SET
.
I
line
I
LN
R
SET
R
SLPE
+
(
)
V
LN
V
SLPE
+
R
SET
----------------------------------------------------------------------------------------------
=
handbook, full pagewidth
12
140
20
2
4
8
MGK715
6
3
7
5
10
11
9
40
60
80
100
120
VLN
-
VSLPE (V)
ILN
(mA)
(1)
(2)
(3)
no power delivered to the loudspeaker
with power delivered to the loudspeaker
Vref
(4)
1999 Feb 17
21
Philips Semiconductors
Product specification
Cordless telephone, answering machine
line interface
UBA1707
CHARACTERISTICS
I
line
= 15 mA; V
CC
= 3.3 V; R
SLPE
= 10
; AGC pin connected to GND; Z
line
= 600
; Z
SET
= 619
; EHI = HIGH;
f = 1 kHz; T
amb
= 25
C; bit AGC at logic 1, all other configuration bits at logic 0; measured in test circuit of Fig.17;
unless otherwise specified.
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
Supply (pins V
CC
and GND; bit PD)
V
CC
operating supply voltage
3.0
-
5.5
V
I
CC
current consumption from
pin V
CC
-
2.2
3.2
mA
I
CC(pd)
current consumption from
pin V
CC
in power-down mode
bit PD = 1
-
110
150
A
Line interface (pins LN, SLPE and REG)
DC
CHARACTERISTICS
V
ref
stabilized voltage between
pins LN and SLPE
I
line
= 11 to 140 mA
2.6
2.9
3.2
V
V
LN
DC line voltage between pins
LN and GND
I
line
= 2 mA
-
1.2
-
V
I
line
= 4 mA
-
1.8
-
V
I
line
= 15 mA
2.7
3.0
3.3
V
I
line
= 140 mA
-
4.35
-
V
V
LN(Rext)
DC line voltage between pins
LN and GND with an external
resistor R
VA
R
VA(SLPE
-
REG)
= 8 k
-
4.5
-
V
V
LN(T)
DC line voltage variation with
temperature referenced to
25
C
T
amb
=
-
25 to +75
C
-
8.0
-
mV
Masks regulation (pins LCC, LVI, CST and RGL; bit CRC)
DC
CHARACTERISTICS
I
LCC(max)
maximum current sunk by
pin LCC
500
-
-
A
R
int(LCC)
internal resistance between
pins V
CC
and LCC
-
165
-
k
Voltage regulation mode
I
LVIV
current sourced from pin LVI
bit CRC = 0
-
200
-
nA
Current regulation mode
I
knee
start line current for current
regulation mode
bit CRC = 1
-
35
-
mA
R
REGC
DC mask slope in current
regulation mode
I
line
> I
knee
; R
LVI
= 1 M
;
R
RGL
= 7.15 k
; bit CRC = 1
-
1.4
-
k
Current limitation
I
prot
current limitation level
-
145
-
mA
1999 Feb 17
22
Philips Semiconductors
Product specification
Cordless telephone, answering machine
line interface
UBA1707
Electronic hook-switch control (pin EHI)
V
IH
HIGH-level input voltage
2.3
-
V
CC
+ 0.4
V
V
IL
LOW-level input voltage
V
CC
= 3.0 to 5.5 V
GND
-
0.4
-
0.3V
CC
V
I
bias
input bias current
input level = HIGH
1
2
5
A
Transmit amplifier (pins TXI+, TXI
-
and LN)
Z
i
input impedance
between pins TXI+ and GND
or TXI
-
and GND
-
21
-
k
between pins TXI+ and TXI
- -
36
-
k
G
v(TX)
voltage gain from TXI+/TXI
-
to LN
V
TXI
= 50 mV (RMS)
10.6
11.6
12.6
dB
G
v(TX)(f)
voltage gain variation with
frequency referenced to 1 kHz
f = 300 to 3400 Hz
-
0.3
-
dB
G
v(TX)(T)
voltage gain variation with
temperature referenced to
25
C
T
amb
=
-
25 to +75
C
-
0.3
-
dB
CMRR
common mode rejection ratio
-
65
-
dB
PSRR
power supply rejection ratio
-
36
-
dB
V
LN(max)(rms)
maximum sending signal
(RMS value)
I
line
= 15 mA; THD = 2%
1.2
1.4
-
V
I
line
= 4 mA; THD = 10%
-
0.26
-
V
V
iTX(max)(rms)
maximum transmit input
voltage (RMS value) for
2% THD on pin LN
I
line
= 15 mA
-
0.35
-
V
I
line
= 90 mA
-
0.75
-
V
V
no(LN)
noise output voltage at pin LN
pins TXI+ and TXI
-
short-circuited through
200
in series with 10
F;
psophometrically weighted
(P53 curve)
-
-
74
-
dBmp
Receive amplifier (pins RXI and RXO; bit RXM)
Z
i
input impedance between pins
RXI and GND
-
21
-
k
G
v(RX)
voltage gain from RXI to RXO
V
RXI
= 2 mV (RMS)
36.9
37.9
38.9
dB
G
v(RX)(f)
voltage gain variation with
frequency referenced to 1 kHz
f = 300 to 3400 Hz
-
0.2
-
dB
G
v(RX)(T)
voltage gain variation with
temperature referenced to
25
C
T
amb
=
-
25 to +75
C
-
0.3
-
dB
PSRR
power supply rejection ratio
-
68
-
dB
THD
total harmonic distortion
V
RXI
= 2 mV (RMS)
-
0.03
-
%
V
RXI
= 12.5 mV (RMS)
-
2
-
%
V
RXI
= 19.5 mV (RMS);
I
line
= 90 mA
-
2
-
%
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
1999 Feb 17
23
Philips Semiconductors
Product specification
Cordless telephone, answering machine
line interface
UBA1707
V
no(RXO)(rms)
noise output voltage at
pin RXO (RMS value)
RXI open-circuit;
psophometrically weighted
(P53 curve)
-
-
81
-
dBVp
G
v(RX)(m)
voltage gain reduction from
pin RXI to RXO when muted
V
RXI
= 10 mV (RMS);
bit RXM = 1
-
80
-
dB
Automatic gain control (pin AGC; bits RAGC1, RAGC2, SAGC and AGC)
G
v(trx)
gain control range for transmit
and receive amplifiers with
respect to I
line
= 15 mA
I
line
= 90 mA
-
6.5
-
dB
I
start
highest line current for
maximum gain
bits RAGC1 = 1; RAGC2 = 1
-
22.5
-
mA
bits RAGC1 = 1; RAGC2 = 0
-
25
-
mA
bits RAGC1 = 0; RAGC2 = 1
-
27
-
mA
bits RAGC1 = 0; RAGC2 = 0
-
29.5
-
mA
I
stop
lowest line current for
minimum gain when
I
start
= 23 mA
bits SAGC = 0; RAGC1 = 1;
RAGC2 = 1
-
62
-
mA
bits SAGC = 1; RAGC1 = 1;
RAGC2 = 1
-
43
-
mA
G
v(trxoff)
gain variation for transmit and
receive amplifiers when AGC
is off
bit AGC = 0;
I
line
= 15 to 140 mA
-
-
0.2
dB
Amplifiers
A
UXILIARY AMPLIFIER
(
PINS
AXI
AND
AXO;
BIT
AXM)
Z
i
input impedance between pins
AXI and GND
-
3.8
-
k
G
v(AX)
voltage gain from pin
AXI to AXO
V
AXI
= 2 mV (RMS)
30.8
31.8
32.8
dB
G
v(AX)(f)
voltage gain variation with
frequency referenced to 1 kHz
f = 300 to 3400 Hz
-
0.2
-
dB
G
v(AX)(T)
voltage gain variation with
temperature referenced to
25
C
T
amb
=
-
25 to +75
C
-
0.2
-
dB
PSRR
power supply rejection ratio
-
79
-
dB
V
no(AXO)(rms)
noise output voltage at
pin AXO (RMS value)
pin AXI connected to pin
GND through 200
in series
with 10
F;
psophometrically weighted
(P53 curve)
-
-
83
-
dBVp
G
v(AX)(m)
voltage gain reduction from
pin AXI to AXO when amplifier
muted
V
AXI
= 10 mV (RMS);
bit AXM = 1
-
80
-
dB
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
1999 Feb 17
24
Philips Semiconductors
Product specification
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L
OUDSPEAKER CHANNEL
(
PINS
LSAI1, LSAI2, LSAO, DLC
AND
LSPGND;
BITS
LSA1, LSA2, LSPD, VOL0, VOL1, VOL2
AND
DLCI)
Loudspeaker amplifier
Z
i
input impedance between pins
LSAI1 or LSAI2 and GND
bits LSA1 = 1, LSA2 = 1
-
21
-
k
G
v(LSA)
voltage gain from LSAI1 or
LSAI2 to LSAO for maximum
volume
V
LSAI
= 8 mV (RMS);
bits LSA1 = 1, LSA2 = 1
26.5
28
29.5
dB
G
v(LSA)(f)
voltage gain variation with
frequency referenced to 1 kHz
V
LSAI
= 8 mV (RMS);
f = 300 to 3400 Hz
-
0.3
-
dB
G
v(LSA)(T)
voltage gain variation with
temperature referenced to
25
C
T
amb
=
-
25 to +75
C
-
0.3
-
dB
V
LSAI(rms)
maximum input voltage
between pins LSAI1 or
LSAI2 and GND (RMS value)
V
CC
= 5.0 V; G
v(LSA)
= 7 dB;
for 2% of THD in input stage
-
500
-
mV
V
no(LSAO)(rms)
noise output voltage at
pin LSAO (RMS value)
pin LSAI1 (with bits
LSA1 = 1, LSA2 = 0) or pin
LSAI2 (with bits LSA1 = 0,
LSA2 = 1) connected to pin
GND through 200
in series
with 10
F;
psophometrically weighted
(P53 curve)
-
-
80
-
dBVp
Output capability
V
LSAO(p-p)
output voltage capability at pin
LSAO (peak-to-peak value)
V
CC
= 5.0 V;
G
v(LSA)
= 28 dB;
V
LSAI
= 100 mV (RMS);
R
L
= 16
3.0
3.6
-
V
V
CC
= 3.3 V;
G
v(LSA)
= 28 dB;
V
LSAI
= 100 mV (RMS);
R
L
= 8
-
2.0
-
V
I
LSAO(max)
maximum current capability at
pin LSAO (peak value)
150
-
-
mA
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
1999 Feb 17
25
Philips Semiconductors
Product specification
Cordless telephone, answering machine
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UBA1707
Dynamic limiter
t
att
attack time
V
CC
= 3 V; G
v(LSA)
= 28 dB
when V
LSAI
jumps from
20 mV (RMS) to
20 mV (RMS) + 10 dB;
bit DLCI = 0
-
-
5
ms
when V
CC
drops below
2.7 V; bit DLCI = don't
care
-
1
-
ms
t
rel
release time
V
CC
= 3 V; G
v(LSA)
= 28 dB;
when V
LSAI
jumps from
20 mV (RMS) + 10 dB to
20 mV (RMS); bit DLCI = 0
-
250
-
ms
THD
total harmonic distortion at
V
LSAI
= 20 mV (RMS) + 10 dB
V
CC
= 3 V; G
v(LSA)
= 28 dB;
t > t
att
-
0.5
5
%
Volume control
G
v(LSA)
voltage gain adjustment range bits (VOL0, VOL1, VOL2)
from (0, 0, 0) to (1, 1, 1)
-
21
-
dB
G
v(LSA)(s)
voltage gain adjustment step
VOL0 from 0 to 1
-
3
-
dB
Switches (pins SWI1, SWI2 and SWI3; bits SWC1, SWC2 and SWC3)
Z
i(off)
AC impedance between pins
SWIn and GND when not
selected
bit SWCn = 0
700
-
-
k
Z
i(on)
AC impedance between pins
SWIn and GND when selected
2 mA < I
SWIn
< 20 mA;
bit SWCn = 1
-
-
30
Serial interface (pins DATA, CLK and EN)
V
IH
HIGH-level input voltage
2.3
-
V
CC
+ 0.4
V
V
IL
LOW-level input voltage
V
CC
= 3 to 5.5 V
GND
-
0.4
-
0.3V
CC
V
I
bias
input bias current
input level = HIGH
1
2
5
A
C
i
input capacitance at pins
DATA, CLK and EN
-
4
-
pF
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
1999 Feb 17
26
Philips Semiconductors
Product specification
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SERIAL BUS TIMING CHARACTERISTICS
V
CC
= 3.3 V; T
amb
= 25
C; unless otherwise specified.
SYMBOL
PARAMETER
MIN.
MAX.
UNIT
Serial programming clock; pin CLK
f
clk
clock frequency
0
300
kHz
Enable programming; pin EN
t
START
delay to falling clock edge
1
-
s
t
END
delay from last rising clock edge
0.1
-
s
t
W(min)
minimum inactive pulse width
1.5
-
s
t
SU;EN
enable set-up time to next clock edge
0.1
-
s
Serial data; pin DATA
t
SU;DATA
input data to clock set-up time
2
-
s
t
HD;DATA
input data to clock hold time
2
-
s
Fig.16 Serial bus timing diagram.
handbook, full pagewidth
MGK716
tSU;DATA
1/fclk
tSU;EN
tEND
tW
tHD;DATA
tSTART
CLK
DATA
EN
D5
D4
AD1
AD0
1999
Feb
17
27
Philips Semiconductors
Product specification
Cordless telephone, answering machine
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UBA1707
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TEST AND APPLICA
TION INFORMA
TION
d
book, full pagewidth
MGK717
LN
SWI3
GND
SWI1
EHI
SWI2
2
22
20
19
21
11
DATA
12
EN
13
CLK
14
RXI
10
RXO
8
LCC
CST
REG
LVI
6
7
4
3
AGC
9
RGL
5
LSPGND
1
23
TXI
+
18
TXI
-
17
VCC
ICC
25
AXI
15
DLC
28
AXO
16
LSAI2
27
LSAI1
26
LSAO
24
from
microcontroller
UBA1707
CRXI
220 nF
VRXI
CLVI
470 pF
Cline
100
F
CEMC
10 nF
CREG
4.7
F
CLSAO
220
F
RLVI
1 M
RRGL
7.15 k
SLPE
RSLPE
10
RLSAO
16
ZSET
619
Zline
600
CAXI
CDLC
1
F
CLSAI2
220 nF
220 nF
CCST
22 pF
CLSAI1
VAXI
VLSAI2
VLSAI1
220 nF
TNON-HOOK
MPSA42
TPDARL
MPSA92
100 k
RON-HOOK
DPROT
1N4148
RPLD
20 k
DSW
1N4148
TNSW
BUX86
VVCC
VLN
Iline
VTXI
CVCC
10
F
CLCC
6.8 pF
Fig.17 Test circuit.
1999
Feb
17
28
Philips Semiconductors
Product specification
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UBA1707
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full pagewidth
MGK718
LN
SWI2
SWI1
EHI
SWI3
2
19
20
21
11
DATA
12
EN
13
CLK
14
RXI
10
RXO
8
LCC
CST
REG
LVI
6
7
4
3
AGC
9
RGL
5
DLC
28
LSPGND
23
TXI
+
18
TXI
-
17
VCC
ICC
25
SLPE
1
AXI
15
AXO
16
LSAI2
GND
27
LSAI1
26
LSAO
24
MICROCONTROLLER
UBA1707
CRXI
100 nF
CDLC
220 nF
CLVI
(2)
470 pF
CVCC
10
F
CEMC
(3)
10 nF
CREG
4.7
F
CLSAO
220
F
CRXO
RSLPE
Rast3
392
RLVI
1 M
RRGL
7.15 k
ZSET
619
10
Zbal
Rast2
3.92 k
Rast1
260 k
BZX79C8V2
CAXI
100 nF
CTXIP
100 nF
CTXIM
100 nF
22
CLSAI2
100 nF
CAXO
CCST
22 pF
CLSAI1
100 nF
TNON-HOOK
MPSA42
TPDARL
MPSA92
100 k
RON-HOOK
DPROT
1N4148
RPLD
20 k
DSW
1N4148
TNSW
BUX86
(MPSA42
(1)
)
VVCC
VLN
BRIDGE
4
BAS11
a/b
b/a
BOD
BR211-240
LSP
16
CLCC
(4)
6.8 pF
Fig.18 Typical application.
(1) In case of low line current in voltage regulation mode.
(2) Only required in current regulation mode.
(3) To improve EMC performance; necessary for stability.
(4) To improve stability only in current regulation mode.
1999 Feb 17
29
Philips Semiconductors
Product specification
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UBA1707
PACKAGE OUTLINES
UNIT
A
max.
A
1
A
2
A
3
b
p
c
D
(1)
E
(1)
(1)
e
H
E
L
L
p
Q
Z
y
w
v
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC
JEDEC
EIAJ
mm
inches
2.65
0.30
0.10
2.45
2.25
0.49
0.36
0.32
0.23
18.1
17.7
7.6
7.4
1.27
10.65
10.00
1.1
1.0
0.9
0.4
8
0
o
o
0.25
0.1
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
Note
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
1.1
0.4
SOT136-1
X
14
28
w
M
A
A
1
A
2
b
p
D
H
E
L
p
Q
detail X
E
Z
c
L
v
M
A
e
15
1
(A )
3
A
y
0.25
075E06
MS-013AE
pin 1 index
0.10
0.012
0.004
0.096
0.089
0.019
0.014
0.013
0.009
0.71
0.69
0.30
0.29
0.050
1.4
0.055
0.419
0.394
0.043
0.039
0.035
0.016
0.01
0.25
0.01
0.004
0.043
0.016
0.01
0
5
10 mm
scale
SO28: plastic small outline package; 28 leads; body width 7.5 mm
SOT136-1
95-01-24
97-05-22
1999 Feb 17
30
Philips Semiconductors
Product specification
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UNIT
A
1
A
2
A
3
b
p
c
D
(1)
E
(1)
(1)
e
H
E
L
L
p
Q
Z
y
w
v
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC
JEDEC
EIAJ
mm
0.21
0.05
1.80
1.65
0.38
0.25
0.20
0.09
10.4
10.0
5.4
5.2
0.65
1.25
7.9
7.6
0.9
0.7
1.1
0.7
8
0
o
o
0.13
0.1
0.2
DIMENSIONS (mm are the original dimensions)
Note
1. Plastic or metal protrusions of 0.20 mm maximum per side are not included.
1.03
0.63
SOT341-1
MO-150AH
93-09-08
95-02-04
X
w
M
A
A
1
A
2
b
p
D
H
E
L
p
Q
detail X
E
Z
e
c
L
v
M
A
(A )
3
A
1
14
28
15
0.25
y
pin 1 index
0
2.5
5 mm
scale
SSOP28: plastic shrink small outline package; 28 leads; body width 5.3 mm
SOT341-1
A
max.
2.0
1999 Feb 17
31
Philips Semiconductors
Product specification
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SOLDERING
Introduction to soldering surface mount packages
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our
"Data Handbook IC26; Integrated Circuit Packages"
(document order number 9398 652 90011).
There is no soldering method that is ideal for all surface
mount IC packages. Wave soldering is not always suitable
for surface mount ICs, or for printed-circuit boards with
high population densities. In these situations reflow
soldering is often used.
Reflow soldering
Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.
Several methods exist for reflowing; for example,
infrared/convection heating in a conveyor type oven.
Throughput times (preheating, soldering and cooling) vary
between 100 and 200 seconds depending on heating
method.
Typical reflow peak temperatures range from
215 to 250
C. The top-surface temperature of the
packages should preferable be kept below 230
C.
Wave soldering
Conventional single wave soldering is not recommended
for surface mount devices (SMDs) or printed-circuit boards
with a high component density, as solder bridging and
non-wetting can present major problems.
To overcome these problems the double-wave soldering
method was specifically developed.
If wave soldering is used the following conditions must be
observed for optimal results:
Use a double-wave soldering method comprising a
turbulent wave with high upward pressure followed by a
smooth laminar wave.
For packages with leads on two sides and a pitch (e):
larger than or equal to 1.27 mm, the footprint
longitudinal axis is preferred to be parallel to the
transport direction of the printed-circuit board;
smaller than 1.27 mm, the footprint longitudinal axis
must be parallel to the transport direction of the
printed-circuit board.
The footprint must incorporate solder thieves at the
downstream end.
For packages with leads on four sides, the footprint must
be placed at a 45
angle to the transport direction of the
printed-circuit board. The footprint must incorporate
solder thieves downstream and at the side corners.
During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.
Typical dwell time is 4 seconds at 250
C.
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.
Manual soldering
Fix the component by first soldering two
diagonally-opposite end leads. Use a low voltage (24 V or
less) soldering iron applied to the flat part of the lead.
Contact time must be limited to 10 seconds at up to
300
C.
When using a dedicated tool, all other leads can be
soldered in one operation within 2 to 5 seconds between
270 and 320
C.
1999 Feb 17
32
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Product specification
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Suitability of surface mount IC packages for wave and reflow soldering methods
Notes
1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum
temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the
"Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods".
2. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink
(at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version).
3. If wave soldering is considered, then the package must be placed at a 45
angle to the solder wave direction.
The package footprint must incorporate solder thieves downstream and at the side corners.
4. Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8 mm;
it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
5. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
DEFINITIONS
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
PACKAGE
SOLDERING METHOD
WAVE
REFLOW
(1)
BGA, SQFP
not suitable
suitable
HLQFP, HSQFP, HSOP, HTSSOP, SMS not suitable
(2)
suitable
PLCC
(3)
, SO, SOJ
suitable
suitable
LQFP, QFP, TQFP
not recommended
(3)(4)
suitable
SSOP, TSSOP, VSO
not recommended
(5)
suitable
Data sheet status
Objective specification
This data sheet contains target or goal specifications for product development.
Preliminary specification
This data sheet contains preliminary data; supplementary data may be published later.
Product specification
This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
1999 Feb 17
33
Philips Semiconductors
Product specification
Cordless telephone, answering machine
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NOTES
1999 Feb 17
34
Philips Semiconductors
Product specification
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NOTES
1999 Feb 17
35
Philips Semiconductors
Product specification
Cordless telephone, answering machine
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UBA1707
NOTES
Internet: http://www.semiconductors.philips.com
Philips Semiconductors a worldwide company
Philips Electronics N.V. 1999
SCA62
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.
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Australia: 34 Waterloo Road, NORTH RYDE, NSW 2113,
Tel. +61 2 9805 4455, Fax. +61 2 9805 4466
Austria: Computerstr. 6, A-1101 WIEN, P.O. Box 213,
Tel. +43 1 60 101 1248, Fax. +43 1 60 101 1210
Belarus: Hotel Minsk Business Center, Bld. 3, r. 1211, Volodarski Str. 6,
220050 MINSK, Tel. +375 172 20 0733, Fax. +375 172 20 0773
Belgium: see The Netherlands
Brazil: see South America
Bulgaria: Philips Bulgaria Ltd., Energoproject, 15th floor,
51 James Bourchier Blvd., 1407 SOFIA,
Tel. +359 2 68 9211, Fax. +359 2 68 9102
Canada: PHILIPS SEMICONDUCTORS/COMPONENTS,
Tel. +1 800 234 7381, Fax. +1 800 943 0087
China/Hong Kong: 501 Hong Kong Industrial Technology Centre,
72 Tat Chee Avenue, Kowloon Tong, HONG KONG,
Tel. +852 2319 7888, Fax. +852 2319 7700
Colombia: see South America
Czech Republic: see Austria
Denmark: Sydhavnsgade 23, 1780 COPENHAGEN V,
Tel. +45 33 29 3333, Fax. +45 33 29 3905
Finland: Sinikalliontie 3, FIN-02630 ESPOO,
Tel. +358 9 615 800, Fax. +358 9 6158 0920
France: 51 Rue Carnot, BP317, 92156 SURESNES Cedex,
Tel. +33 1 4099 6161, Fax. +33 1 4099 6427
Germany: Hammerbrookstrae 69, D-20097 HAMBURG,
Tel. +49 40 2353 60, Fax. +49 40 2353 6300
Greece: No. 15, 25th March Street, GR 17778 TAVROS/ATHENS,
Tel. +30 1 489 4339/4239, Fax. +30 1 481 4240
Hungary: see Austria
India: Philips INDIA Ltd, Band Box Building, 2nd floor,
254-D, Dr. Annie Besant Road, Worli, MUMBAI 400 025,
Tel. +91 22 493 8541, Fax. +91 22 493 0966
Indonesia: PT Philips Development Corporation, Semiconductors Division,
Gedung Philips, Jl. Buncit Raya Kav.99-100, JAKARTA 12510,
Tel. +62 21 794 0040 ext. 2501, Fax. +62 21 794 0080
Ireland: Newstead, Clonskeagh, DUBLIN 14,
Tel. +353 1 7640 000, Fax. +353 1 7640 200
Israel: RAPAC Electronics, 7 Kehilat Saloniki St, PO Box 18053,
TEL AVIV 61180, Tel. +972 3 645 0444, Fax. +972 3 649 1007
Italy: PHILIPS SEMICONDUCTORS, Piazza IV Novembre 3,
20124 MILANO, Tel. +39 2 6752 2531, Fax. +39 2 6752 2557
Japan: Philips Bldg 13-37, Kohnan 2-chome, Minato-ku,
TOKYO 108-8507, Tel. +81 3 3740 5130, Fax. +81 3 3740 5077
Korea: Philips House, 260-199 Itaewon-dong, Yongsan-ku, SEOUL,
Tel. +82 2 709 1412, Fax. +82 2 709 1415
Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA, SELANGOR,
Tel. +60 3 750 5214, Fax. +60 3 757 4880
Mexico: 5900 Gateway East, Suite 200, EL PASO, TEXAS 79905,
Tel. +9-5 800 234 7381, Fax +9-5 800 943 0087
Printed in The Netherlands
465002/750/03/pp36
Date of release: 1999 Feb 17
Document order number:
9397 750 04964