TIP31D, TIP31E, TIP31F
NPN SILICON POWER TRANSISTORS
P R O D U C T I N F O R M A T I O N
1
AUGUST 1978 - REVISED MARCH 1997
Copyright 1997, Power Innovations Limited, UK
Information is current as of publication date. Products conform to specifications in accordance
with the terms of Power Innovations standard warranty. Production processing does not
necessarily include testing of all parameters.
q
40 W at 25C Case Temperature
q
3 A Continuous Collector Current
q
5 A Peak Collector Current
q
Customer-Specified Selections Available
B
C
E
TO-220 PACKAGE
(TOP VIEW)
Pin 2 is in electrical contact with the mounting base.
MDTRACA
1
2
3
absolute maximum ratings
at 25C case temperature (unless otherwise noted)
NOTES: 1. This value applies for t
p
0.3 ms, duty cycle
10%.
2. Derate linearly to 150C case temperature at the rate of 0.32 W/C.
3. Derate linearly to 150C free air temperature at the rate of 16 mW/C.
4. This rating is based on the capability of the transistor to operate safely in a circuit of: L = 20 mH, I
B(on)
= 0.4 A, R
BE
= 100
,
V
BE(off)
= 0, R
S
= 0.1
, V
CC
= 20 V.
RATING
SYMBOL
VALUE
UNIT
Collector-base voltage (I
E
= 0)
TIP31D
TIP31E
TIP31F
V
CBO
160
180
200
V
Collector-emitter voltage (I
B
= 0)
TIP31D
TIP31E
TIP31F
V
CEO
120
140
160
V
Emitter-base voltage
V
EBO
5
V
Continuous collector current
I
C
3
A
Peak collector current (see Note 1)
I
CM
5
A
Continuous base current
I
B
1
A
Continuous device dissipation at (or below) 25C case temperature (see Note 2)
P
tot
40
W
Continuous device dissipation at (or below) 25C free air temperature (see Note 3)
P
tot
2
W
Unclamped inductive load energy (see Note 4)
LI
C
2
32
mJ
Operating junction temperature range
T
j
-65 to +150
C
Storage temperature range
T
stg
-65 to +150
C
Lead temperature 3.2 mm from case for 10 seconds
T
L
250
C
TIP31D, TIP31E, TIP31F
NPN SILICON POWER TRANSISTORS
2
AUGUST 1978 - REVISED MARCH 1997
P R O D U C T I N F O R M A T I O N
NOTES: 5. These parameters must be measured using pulse techniques, t
p
= 300 s, duty cycle
2%.
6. These parameters must be measured using voltage-sensing contacts, separate from the current carrying contacts.
Voltage and current values shown are nominal; exact values vary slightly with transistor parameters.
electrical characteristics at 25C case temperature
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
V
(BR)CEO
Collector-emitter
breakdown voltage
I
C
= 30 mA
(see Note 5)
I
B
= 0
TIP31D
TIP31E
TIP31F
120
140
160
V
I
CES
Collector-emitter
cut-off current
V
CE
= 160 V
V
CE
= 180 V
V
CE
= 200 V
V
BE
= 0
V
BE
= 0
V
BE
= 0
TIP31D
TIP31E
TIP31F
0.2
0.2
0.2
mA
I
CEO
Collector cut-off
current
V
CE
= 90 V
I
B
= 0
0.3
mA
I
EBO
Emitter cut-off
current
V
EB
= 5 V
I
C
= 0
1
mA
h
FE
Forward current
transfer ratio
V
CE
= 4 V
V
CE
= 4 V
I
C
= 1 A
I
C
= 3 A
(see Notes 5 and 6)
25
5
V
CE(sat)
Collector-emitter
saturation voltage
I
B
= 750 mA
I
C
= 3 A
(see Notes 5 and 6)
2.5
V
V
BE
Base-emitter
voltage
V
CE
= 4 V
I
C
= 3 A
(see Notes 5 and 6)
1.8
V
h
fe
Small signal forward
current transfer ratio
V
CE
= 10 V
I
C
= 0.5 A
f = 1 kHz
20
|
h
fe
|
Small signal forward
current transfer ratio
V
CE
= 10 V
I
C
= 0.5 A
f = 1 MHz
3
thermal characteristics
PARAMETER
MIN
TYP
MAX
UNIT
R
JC
Junction to case thermal resistance
3.125
C/W
R
JA
Junction to free air thermal resistance
62.5
C/W
resistive-load-switching characteristics at 25C case temperature
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
t
on
Turn-on time
I
C
= 1 A
V
BE(off)
= -4.3 V
I
B(on)
= 0.1 A
R
L
= 30
I
B(off)
= -0.1 A
t
p
= 20 s, dc
2%
0.5
s
t
off
Turn-off time
2
s
3
AUGUST 1978 - REVISED MARCH 1997
TIP31D, TIP31E, TIP31F
NPN SILICON POWER TRANSISTORS
P R O D U C T I N F O R M A T I O N
TYPICAL CHARACTERISTICS
Figure 1.
Figure 2.
Figure 3.
TYPICAL DC CURRENT GAIN
vs
COLLECTOR CURRENT
I
C
- Collector Current - A
0001
001
01
10
10
h
FE
- DC Current Gain
10
100
1000
TCS631AA
V
CE
= 4 V
T
C
= 25C
t
p
= 300 s, duty cycle < 2%
COLLECTOR-EMITTER SATURATION VOLTAGE
vs
BASE CURRENT
I
B
- Base Current - mA
01
10
10
100
1000
V
CE(sat)
- Collector-Emitter Saturation Voltage - V
001
01
10
10
TCS631AB
I
C
= 100 mA
I
C
= 300 mA
I
C
= 1 A
I
C
= 3 A
BASE-EMITTER VOLTAGE
vs
COLLECTOR CURRENT
I
C
- Collector Current - A
001
01
10
10
V
BE
- Base-Emitter Voltage - V
05
06
07
08
09
10
TCS631AC
V
CE
= 4 V
T
C
= 25C
TIP31D, TIP31E, TIP31F
NPN SILICON POWER TRANSISTORS
4
AUGUST 1978 - REVISED MARCH 1997
P R O D U C T I N F O R M A T I O N
MAXIMUM SAFE OPERATING REGIONS
Figure 4.
THERMAL INFORMATION
Figure 5.
MAXIMUM FORWARD-BIAS
SAFE OPERATING AREA
V
CE
- Collector-Emitter Voltage - V
10
10
100
1000
I
C
- Collector Current - A
001
01
10
10
100
SAS631AB
TIP31D
TIP31E
TIP31F
t
p
= 300 s, d = 0.1 = 10%
t
p
= 1 ms, d = 0.1 = 10%
t
p
= 10 ms, d = 0.1 = 10%
DC Operation
MAXIMUM POWER DISSIPATION
vs
CASE TEMPERATURE
T
C
- Case Temperature - C
0
25
50
75
100
125
150
P
tot
- Maximum Power Dissipation - W
0
10
20
30
40
50
TIS631AA
5
AUGUST 1978 - REVISED MARCH 1997
TIP31D, TIP31E, TIP31F
NPN SILICON POWER TRANSISTORS
P R O D U C T I N F O R M A T I O N
TO-220
3-pin plastic flange-mount package
This single-in-line package consists of a circuit mounted on a lead frame and encapsulated within a plastic
compound. The compound will withstand soldering temperature with no deformation, and circuit performance
characteristics will remain stable when operated in high humidity conditions. Leads require no additional
cleaning or processing when used in soldered assembly.
MECHANICAL DATA
TO220
ALL LINEAR DIMENSIONS IN MILLIMETERS
1,23
1,32
4,20
4,70
1
2
3
0,97
0,61
see Note C
see Note B
10,0
10,4
2,54
2,95
6,0
6,6
14,55
15,90
12,7
14,1
3,5
6,1
1,07
1,70
2,34
2,74
4,88
5,28
3,71
3,96
0,41
0,64
2,40
2,90
VERSION 2
VERSION 1
NOTES: A. The centre pin is in electrical contact with the mounting tab.
B. Mounting tab corner profile according to package version.
C. Typical fixing hole centre stand off height according to package version.
Version 1, 18.0 mm. Version 2, 17.6 mm.
MDXXBE
TIP31D, TIP31E, TIP31F
NPN SILICON POWER TRANSISTORS
6
AUGUST 1978 - REVISED MARCH 1997
P R O D U C T I N F O R M A T I O N
IMPORTANT NOTICE
Power Innovations Limited (PI) reserves the right to make changes to its products or to discontinue any
semiconductor product or service without notice, and advises its customers to verify, before placing orders, that the
information being relied on is current.
PI warrants performance of its semiconductor products to the specifications applicable at the time of sale in
accordance with PI's standard warranty. Testing and other quality control techniques are utilized to the extent PI
deems necessary to support this warranty. Specific testing of all parameters of each device is not necessarily
performed, except as mandated by government requirements.
PI accepts no liability for applications assistance, customer product design, software performance, or infringement
of patents or services described herein. Nor is any license, either express or implied, granted under any patent
right, copyright, design right, or other intellectual property right of PI covering or relating to any combination,
machine, or process in which such semiconductor products or services might be or are used.
PI SEMICONDUCTOR PRODUCTS ARE NOT DESIGNED, INTENDED, AUTHORIZED, OR WARRANTED TO BE
SUITABLE FOR USE IN LIFE-SUPPORT APPLICATIONS, DEVICES OR SYSTEMS.
Copyright 1997, Power Innovations Limited
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