EMIF4100
1
05193.R0 8/03
www.protekdevices.com
EMI FILTER/TVS ARRAY
Only One Name Means ProTek'TionTM
APPLICATIONS
Cellular Phones
Color Display Panel
Notebooks
Personal Digital Assistant (PDA)
Ground Positioning System (GPS)
SMART Cards
IEC COMPATIBILITY (EN61000-4)
61000-4-2 (ESD): Air - 15kV, Contact - 8kV
61000-4-4 (EFT): 40A - 5/50ns
FEATURES
ESD Protection > 25 kilovolts
Bidirectional EMI Filtering/TVS Low Pass Filters
Low Insertion Loss: -3db Roll-Off @ 132MHz
Protects Up to Four(4) Data Lines
MECHANICAL CHARACTERISTICS
Flip Chip Package
Weight 0.73 milligrams (Approximate)
Flammability rating UL 94V-0
8mm Tape and Reel Per EIA Standard 481
05193
PIN CONFIGURATION
2
www.protekdevices.com
05193.R0 8/03
EMIF4100
DEVICE CHARACTERISTICS
FIGURE 1
RESISTANCE VS TEMPERATURE
(Normalized to Resistance at 25C)
Temperature C
0.900
Normalized Resistance
1.100
1.060
1.020
0.940
0.980
-40 -20 0 20 40 60 80 100
MAXIMUM RATINGS @ 25C Unless Otherwise Specified
Operating Temperature
SYMBOL
VALUE
-55
C to 150
C
C
C
-40
C to 85
C
UNITS
T
J
T
STG
PARAMETER
Storage Temperature
DC Power Per Resistor
mW
400
P
Typical Resistance @ 20%
OHMS
100
R
ELECTRICAL CHARACTERISTICS PER LINE @ 25C Unless Otherwise Specified
PART
NUMBER
MINIMUM
BREAKDOWN
VOLTAGE
@ 1mA
V
(BR)
VOLTS
MAXIMUM
REVERSE
LEAKAGE
CURRENT
@ 3V
I
D
A
TYPICAL
FORWARD
VOLTAGE
@10mA
V
F
VOLTS
TYPICAL
CAPACITANCE
PER LINE
(See Note 1)
@2.5V, 1 MHz
C
pF
EMIF4100
6.0
0.1
0.8
30
CUT-OFF
FREQUENCY
(50 Ohms I/O
ZERO BIAS)
fc
MHz
132
RATED
STAND-OFF
VOLTAGE
V
WM
VOLTS
5.0
MINIMUM
ATTENUATION
@
800-3000 MHz
dB
28
Note 1: 42pF @ 0V, 1MHz, 20% tolerance.
3
www.protekdevices.com
05193.R0 8/03
EMIF4100
GRAPHS
0
0.2
0.4
0.6
0.8
1
1.2
1.4
1.6
0
1
2
3
4
5
6
V
R
- Reverse Voltage - Volts
C
j
- Capacitance (Normalized) - pF
FIGURE 2
CAPACITANCE VS REVERSE VOLTAGE
(Normalized to Capacitance at 2.5V DC & 25C
-35
-30
-25
-20
-15
-10
-5
0
0.1
1
10
100
1000
10000
FIGURE 3
INSERTION LOSS - EMIF4100
(T
A
= 25C, DC Bias = 0V, 50 Ohm Environment)
Gain (dB)
Frequency (MHz)
4
www.protekdevices.com
05193.R0 8/03
EMIF4100
FIGURE 5
RECOMMENDED NON-SOLDER MASK DEFINED PAD ILLUSTRATION
Non-Solder Mask Defined Pad
0.275mm DIA.
Solder Mask Opening
0.325mm DIA.
Solder Stencil Opening
0.330mm DIA.
FIGURE 6
SOLDER REFLOW PROFILE
0.275mm
Round
Non-Solder Mask Defined Pads
0.325mm Round
0.150mm
0.330mm Round
50/50 By Volume
No Clean
OSP(Entek Cu Plus 106A)
50m
20m
60 Seconds
240C
Pad Size on PCB
Pad Shape
Pad Definition
Solder Mask Opening
Solder Stencil Thickness
Solder Stencil Aperture Opening (laser cut, 5% tapered walls)
Solder Flux Ratio
Solder Paste Type
Pad Protective Finish
Tolerance - Edge To Corner Ball
Solder Ball Side Coplanarity
Maximum Dwell Time Above Liquidous (183C)
Soldering Maximum Temperature
PRINTED CIRCUIT BOARD RECOMMENDATIONS
PARAMETER
VALUE
225C
5-10 sec
Instantaneous
to 200C
Soldering
Time
Cool Down
Time
1-2 Minutes
to 150C
1-2 Minutes to 25C
Pre-Heat
Time
100C
200C
Note: This reflow profile does not take
into account the printed circuit board
(PCB) material heating time.
Additional time may be required for the
preheat time and cool down time upon
the PCB or board material.
APPLICATION INFORMATION
5
www.protekdevices.com
05193.R0 8/03
EMIF4100
COPYRIGHT ProTek Devices 2003
SPECIFICATIONS: ProTek reserves the right to change the electrical and or mechanical
characteristics described herein without notice (except JEDEC).
DESIGN CHANGES: ProTek reserves the right to discontinue product lines without notice, and that
the final judgement concerning selection and specifications is the buyer's and that in furnishing
engineering and technical assistance, ProTek assumes no responsibility with respect to the
selection or specifications of such products.
PACKAGE OUTLINE & DIMENSIONS
ProTek Devices
2929 South Fair Lane, Tempe, AZ 85282
Tel: 602-431-8101 Fax: 602-431-2288
E-Mail:
sales@protekdevices.com
Web Site:
www.protekdevices.com
A
B
C
G
H
I
J
2.362
1.173
0.495
0.180
0.495
0.064
0.356
0.093
0.0462
0.0195
0.0071
0.0195
0.0025
0.014
DIM
MILLIMETERS
INCHES
PACKAGE DIMENSIONS
PACKAGE OUTLINE
2.413
1.250
0.505
0.280
0.505
0.102
0.457
0.095
0.0492
0.0199
0.0110
0.0199
0.004
0.018
MIN
MIN
MAX
MAX
NOTE:
1. Controlling dimensions in millimeters.
1
2
3
4
5
O
G
I
O
O
O
G
I
I
I
A
C
G
H
J
I
B
0.30 DIA.
63/37 Sn/Pb
Solder Bumps
BOTTOM VIEW
SIDE VIEW
TAPE & REEL SPECIFICATIONS
PART NUMBER
CHIP SIZE (mm)
POCKET SIZE (mm)
B
0
x A
0
x K
0
TAPE WIDTH
W
REEL
DIAMETER
QTY PER
REEL
P
0
P
1
EMIF4100
2.96 x 1.33 x 0.6
3.18 x 1.52 x 0.76
8mm
7"
5,000
4mm
4mm
Top Cover
Tape
For Tape Feeder Reference
Only Including Draft
Concentric Around B
K
0
P
0
A
0
P
1
Embossment
B
0
Direction of Feed
10 Pitches Cumulative
Tolerance On Tape
0.2mm
W
Outline & Dimensions: Rev 0 - 8/03, 60xx
TAPE & REEL ORDERING NOMENCLATURE
1. Surface mount product is taped and reeled in accordance
with EIA-481.
2. Suffix-T75-1 = 7 Inch Reel - 5,000 pieces per 8mm reel,
i.e.,
EMIF4100-T7.
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