1
05206.R1 10/05
www.protekdevices.com
EMI FILTER/TVS ARRAY
Only One Name Means ProTek'TionTM
EMIF4-100FCD4
APPLICATIONS
Cellular Phones
Notebooks
Personal Digital Assistant (PDA)
Ground Positioning System (GPS)
SMART Cards
IEC COMPATIBILITY (EN61000-4)
61000-4-2 (ESD): Air - 15kV, Contact - 8kV
61000-4-4 (EFT): 40A - 5/50ns
FEATURES
ESD Protection > 25 kilovolts
4 Symmetrical I/O Channel EMI Filtering/TVS for ESD Protection
Low Insertion Loss: -3db Roll-Off @ 60MHz
Four Seperate TVS Diodes for ESD Protection
Low Lead Inductance
RoHS Compliant on Lead-Free Versions
MECHANICAL CHARACTERISTICS
15 Bump Flip Chip Package
Weight 0.73 milligrams (Approximate)
Available in Tin-Lead or Lead-Free Plating
Solder Reflow Temperature:
Tin-Lead - Sn/Pb, 85/15: 240-245C
Lead-Free - Sn/Ag/Cu, 96/3.5/0.5: 260-270C
Flammability Rating UL 94V-0
8mm Tape and Reel Per EIA Standard 481
05206
PIN CONFIGURATION
G1
G2
G3
D2
D1
D3
D4
I/O1
I/O1
I/O2
I/O2
I/O3
I/O3
I/O4
I/O4
15 BUMP FC
Note:
All grounds are connected internally.
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www.protekdevices.com
05206.R1 10/05
EMIF4-100FCD4
DEVICE CHARACTERISTICS
FIGURE 1
RESISTANCE VS TEMPERATURE
(Normalized to Resistance at 25C)
Temperature C
0.900
Normalized Resistance
1.100
1.060
1.020
0.940
0.980
-40 -20 0 20 40 60 80 100
MAXIMUM RATINGS @ 25C Unless Otherwise Specified
Operating Temperature
SYMBOL
VALUE
-55C to 150C
C
C
-40C to 85C
UNITS
T
J
T
STG
PARAMETER
Storage Temperature
DC Power Per Resistor
mW
100
P
Typical Resistance @ 20%
OHMS
100
R
ELECTRICAL CHARACTERISTICS PER LINE @ 25C Unless Otherwise Specified
PART
NUMBER
MINIMUM
BREAKDOWN
VOLTAGE
@ 1mA
V
(BR)
VOLTS
MAXIMUM
REVERSE
LEAKAGE
CURRENT
@ 3.3V
I
D
A
TYPICAL
FORWARD
VOLTAGE
@10mA
V
F
VOLTS
TYPICAL
CAPACITANCE
PER DIODE
(See Note 1)
@2.5V, 1 MHz
C
pF
EMIF4-100FCD4
6.0
0.5
0.8
30
CUT-OFF
FREQUENCY
(50 Ohms I/O
ZERO BIAS)
fc
MHz
60
RATED
STAND-OFF
VOLTAGE
V
WM
VOLTS
5.0
MINIMUM
ATTENUATION
@
800-3000 MHz
dB
30
Note 1:
20% tolerance.
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www.protekdevices.com
05206.R1 10/05
EMIF4-100FCD4
GRAPHS
FIGURE 4
OVERSHOOT & FORWARD CLAMPING VOLTAGE
ESD Test Pulse: -15 kilovolt, 1/30ns (waveform)
1 Volts per Division
-4
-2
0
2
4
FIGURE 3
OVERSHOOT & CLAMPING VOLTAGE
ESD Test Pulse: +15 kilovolt, 1/30ns (waveform)
5 Volts per Division
-5
5
15
25
35
-50
-45
-40
-35
-30
-25
-20
-15
-10
-5
0
0.1
1
10
100
1000
10000
FIGURE 2
INSERTION LOSS - EMIF4-100FCD4
Gain (dB
)
Frequency (MHz)
0 Volts
2.5 Volts
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www.protekdevices.com
05206.R1 10/05
EMIF4-100FCD4
APPLICATION INFORMATION
Ramp-up
Ramp-down
Ramp-up
15 seconds
Solder Time
15-20 seconds
Ramp-down
T
S
- Preheat
T
SMAX
T
SMIN
T
L
t 25C to Peak
30-60 seconds
T
emperature - C
T
P
155
140
0.275mm
Round
Non-Solder Mask Defined Pads
0.325mm Round
0.150mm
0.330mm Round
No Clean
OSP(Entek Cu Plus 106A)
50m
20m
60 Seconds
270C
Pad Size on PCB
Pad Shape
Pad Definition
Solder Mask Opening
Solder Stencil Thickness
Solder Stencil Aperture Opening (laser cut, 5% tapered walls)
Solder Paste Type
Pad Protective Finish
Tolerance - Edge To Corner Ball
Solder Ball Side Coplanarity
Maximum Dwell Time Above Liquidous (183C)
Soldering Maximum Temperature
PRINTED CIRCUIT BOARD RECOMMENDATIONS
PARAMETER
VALUE
REQUIREMENTS
Temperature:
T
P
for Lead-Free (SnAgCu): 260-270C
T
P
for Tin-Lead: 240-245C
Preheat time and temperature depends on solder paste and flux
activation temperature, component size, weight, surface area &
plating.
RECOMMENDED NON-SOLDER MASK
DEFINED PAD ILLUSTRATION
Non-Solder Mask Defined Pad
0.275mm DIA.
Solder Mask Opening
0.325mm DIA.
Solder Stencil Opening
0.330mm DIA.
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www.protekdevices.com
05206.R1 10/05
EMIF4-100FCD4
PACKAGE OUTLINE & DIMENSIONS
TAPE & REEL ORDERING NOMENCLATURE
1. Surface mount product is taped and reeled in accordance with EIA-481.
2. Plastic 8mm Tape: Suffix-T73-1 = 7 Inch Reel - 3,000 pieces per reel, i.e.,
EMIF4-100FCD4-T73-1.
3. Suffix - LF - Lead-Free, i.e.,
EMIF4-100FCD4-LF-T73-1.
4. Suffix - C = Coated Version, i.e.,
EMIF4-100FCD4-LF-T73C-1.
COPYRIGHT ProTek Devices 2005
SPECIFICATIONS: ProTek reserves the right to change the electrical and or mechanical characteristics described herein without notice (except JEDEC).
DESIGN CHANGES: ProTek reserves the right to discontinue product lines without notice, and that the final judgement concerning selection and
specifications is the buyer's and that in furnishing engineering and technical assistance, ProTek assumes no responsibility with respect to the selection or
specifications of such products.
ProTek Devices
2929 South Fair Lane, Tempe, AZ 85282
Tel: 602-431-8101 Fax: 602-431-2288
E-Mail:
sales@protekdevices.com
Web Site:
www.protekdevices.com
Outline & Dimensions: Rev 1 - 8/05, 06042
FCD4
MARKING CODE
DIAGRAM
FCD4
FCD4
Top cover tape
K0
t
D
P0
P2
10 Pitches Cumulative
Tolerance on Tape. 0.2
A0
B0
P
E
F
W
User Direction of Feed
Tape & Reel Specifications (Dimensions in millimeters)
D
E
P0
t
F
P2
W
1.50 0.10 1.75 0.10 3.50 0.05 8.00 0.30 4.00 0.10 2.00 0.05
P
4.00 0.10 0.200.025
A0
B0
K0
Reel Dia.
Tape Width
178mm (7")
8mm
1.78 0.05 3.35 0.05 0.76 0.05
1
2
3
4
5
6
O
G
I
G
A
C
D
E
F
H
I
J
B
SIDE VIEW
BOTTOM VIEW
0.30 DIA.
63/67 Sn/Pb
Solder Bumps
A
B
C
D
E
F
G
H
I
J
2.915
1.285
0.495
0.245
0.430
0.430
0.180
0.180
0.432
0.330
0.1148
0.0506
0.0195
0.0096
0.0169
0.0169
0.0071
0.0071
0.0170
0.0130
DIM
MILLIMETERS
INCHES
PACKAGE DIMENSIONS
PACKAGE OUTLINE
3.005
1.375
0.505
0.255
0.440
0.440
0.280
0.280
0.559
0.457
0.1183
0.0541
0.0199
0.0100
0.0173
0.0173
0.0110
0.0110
0.0220
0.0180
MIN
MIN
MAX
MAX
NOTE:
1. Controlling dimensions in millimeters.
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