ESD4-LFC
1
05210.R2 8/05
www.protekdevices.com
LOW CAPACITANCE FLIP CHIP ARRAY
Only One Name Means ProTek'TionTM
APPLICATIONS
Cellular Phones
I/O Ports
Notebooks & Pocket PCs
Personal Digital Assistant (PDA)
Ground Positioning System (GPS)
SMART Cards
IEC COMPATIBILITY (EN61000-4)
61000-4-2 (ESD): Air - 15kV, Contact - 8kV
61000-4-4 (EFT): 40A - 5/50ns
FEATURES
ESD Protection > 25 kilovolts
Unidirectional Configuration
Low Capacitance: 15pF
Protects Up to Four(4) Data Lines
RoHS Compliant on Lead-Free Versions
MECHANICAL CHARACTERISTICS
5 Bump Flip Chip Package
Weight 0.73 milligrams (Approximate)
Available in Tin-Lead or Lead-Free Plating
Solder Reflow Temperature:
Tin-Lead - Sn/Pb, 85/15: 240-245C
Lead-Free - Sn/Ag/Cu, 96/3.5/0.5: 260-270C
Flammability Rating UL 94V-0
8mm Tape and Reel Per EIA Standard 481
05210
PIN CONFIGURATION
G1
5 BUMP FC
2
www.protekdevices.com
05210.R2 8/05
ESD4-LFC
DEVICE CHARACTERISTICS
MAXIMUM RATINGS @ 25C Unless Otherwise Specified
Operating Temperature
SYMBOL
VALUE
-55C to 150C
C
C
-40C to 85C
UNITS
T
J
T
STG
PARAMETER
Storage Temperature
DC Power Rating
P
200
mW
Note 1:
20% tolerance.
ELECTRICAL CHARACTERISTICS PER LINE @ 25C Unless Otherwise Specified
PART
NUMBER
RATED
STAND-OFF
VOLTAGE
V
WM
VOLTS
MAXIMUM
LEAKAGE
CURRENT
@3.3V
I
D
A
TYPICAL
CAPACITANCE
PER LINE
(See Note 1)
@2.5V, 1 MHz
C
pF
ESD4-LFC
0.1
15
TYPICAL
FORWARD
VOLTAGE
@10mA
V
F
VOLTS
0.8
MINIMUM
BREAKDOWN
VOLTAGE
@ 1mA
V
(BR)
VOLTS
6.0
5.0
MAXIMUM
CLAMPING
VOLTAGE
@ I
P
= 10mA
V
C
VOLTS
8
0
0.2
0.4
0.6
0.8
1
1.2
1.4
1.6
0
1
2
3
4
5
6
V
R
- Reverse Voltage - Volts
C
j
- Capacitance (Normalized)
FIGURE 1
CAPACITANCE VS REVERSE VOLTAGE
(Normalized to Capacitance at 2.5V DC & 25C)
3
www.protekdevices.com
05210.R2 8/05
ESD4-LFC
APPLICATION INFORMATION
Ramp-up
Ramp-down
Ramp-up
15 seconds
Solder Time
15-20 seconds
Ramp-down
T
S
- Preheat
T
SMAX
T
SMIN
T
L
t 25C to Peak
30-60 seconds
T
emperature - C
T
P
155
140
0.275mm
Round
Non-Solder Mask Defined Pads
0.325mm Round
0.150mm
0.330mm Round
No Clean
OSP(Entek Cu Plus 106A)
50m
20m
60 Seconds
270C
Pad Size on PCB
Pad Shape
Pad Definition
Solder Mask Opening
Solder Stencil Thickness
Solder Stencil Aperture Opening (laser cut, 5% tapered walls)
Solder Paste Type
Pad Protective Finish
Tolerance - Edge To Corner Ball
Solder Ball Side Coplanarity
Maximum Dwell Time Above Liquidous (183C)
Soldering Maximum Temperature
PRINTED CIRCUIT BOARD RECOMMENDATIONS
PARAMETER
VALUE
REQUIREMENTS
Temperature:
T
P
for Lead-Free (SnAgCu): 260-270C
T
P
for Tin-Lead: 240-245C
Preheat time and temperature depends on solder paste and flux
activation temperature, component size, weight, surface area &
plating.
RECOMMENDED NON-SOLDER MASK
DEFINED PAD ILLUSTRATION
Non-Solder Mask Defined Pad
0.275mm DIA.
Solder Mask Opening
0.325mm DIA.
Solder Stencil Opening
0.330mm DIA.
4
www.protekdevices.com
05210.R2 8/05
ESD4-LFC
PACKAGE OUTLINE & DIMENSIONS
TAPE & REEL ORDERING NOMENCLATURE
1. Surface mount product is taped and reeled in accordance with EIA-481.
2. Plastic 8mm Tape: Suffix-T73-1 = 7 Inch Reel - 3,000 pieces per reel, i.e.,
ESD4-LFC-T73-1.
3. Suffix - LF - Lead-Free, i.e.,
ESD4-LFC-LF-T73-1.
4. Suffix - C - Coated Version, i.e.,
ESD4-LFC-LF-T73C-1.
Outline & Dimensions: Rev 1 - 8/05, 06055
COPYRIGHT ProTek Devices 2005
SPECIFICATIONS: ProTek reserves the right to change the electrical and or mechanical characteristics described herein without notice (except JEDEC).
DESIGN CHANGES: ProTek reserves the right to discontinue product lines without notice, and that the final judgement concerning selection and
specifications is the buyer's and that in furnishing engineering and technical assistance, ProTek assumes no responsibility with respect to the selection or
specifications of such products.
ProTek Devices
2929 South Fair Lane, Tempe, AZ 85282
Tel: 602-431-8101 Fax: 602-431-2288
E-Mail:
sales@protekdevices.com
Web Site:
www.protekdevices.com
Top cover tape
K0
t
D
P0
P2
10 Pitches Cumulative
Tolerance on Tape. 0.2
A0
B0
P
E
F
W
User Direction of Feed
Tape & Reel Specifications (Dimensions in millimeters)
D
E
P0
t
F
P2
W
1.50 0.10 1.75 0.10 3.50 0.05 8.00 0.30 4.00 0.10 2.00 0.05
P
4.00 0.10 0.200.025
A0
B0
K0
Reel Dia.
Tape Width
178mm (7")
8mm
1.08 0.05 1.60 0.05 0.72 0.05
A
B
C
D
E
F
G
H
I
J
0.914
1.285
0.495
0.245
0.430
0.430
0.180
0.180
0.432
0.330
0.036
0.0506
0.0195
0.0096
0.0169
0.0169
0.0071
0.0071
0.017
0.013
DIM
MILLIMETERS
INCHES
PACKAGE DIMENSIONS
PACKAGE OUTLINE
1.016
1.375
0.505
0.255
0.440
0.440
0.280
0.280
0.559
0.457
0.040
0.0541
0.0199
0.0100
0.0173
0.0173
0.0110
0.0110
0.022
0.018
MIN
MIN
MAX
MAX
NOTE:
1. Controlling dimensions in millimeters.
1
2
O
G
I
BOTTOM VIEW
G
A
C
E
F
H
I
B
J
D
0.30 DIA.
63/67 Sn/Pb
SOLDER BUMPS
SIDE VIEW
4L
MARKING CODE
DIAGRAM
PDF 
ZIP