PKFC3.3C*
thru
PKFC36C*
1
05180.R3 12/05
www.protekdevices.com
PACKAGED FLIP CHIP ARRAY
Only One Name Means ProTek'TionTM
*PATENT PENDING"
APPLICATIONS
Cellular Phones
MCM Boards
Wireless Communication Circuits
IR LEDs
SMART & PCMCIA Cards
IEC COMPATIBILITY (EN61000-4)
61000-4-2 (ESD): Air - 15kV, Contact - 8kV
61000-4-4 (EFT): 40A - 5/50ns
FEATURES
CHIP SCALE PACKAGE 0.050" (1.270mm) x 0.030" (0.762mm)
ESD Protection > 25 kilovolts
Available in Multiple Voltage Types Ranging From 3.3V to 36V
250 Watts Peak Pulse Power per Line (tp = 8/20s)
Bidirectional Configuration & Monolithic Structure
Protects 1 Line
RoHS Compliant in Lead-Free Versions
MECHANICAL CHARACTERISTICS
Encapsulated 0502 Chip
Weight 0.73 milligrams (Approximate)
Available in Tin-Lead or Lead-Free Pure-Tin Plating(Annealed)
Solder Reflow Temperature:
Tin-Lead - Sn/Pb, 85/15: 240-245C
Pure-Tin - Sn, 100: 260-270C
Flammability Rating UL 94V-0
8mm Plastic & Paper Tape and Reel Per EIA Standard 481
Device Marking On Reel
05180
PIN CONFIGURATION
2
www.protekdevices.com
05180.R3 12/05
PKFC3.3C*
thru
PKFC36C*
*PATENT PENDING
DEVICE CHARACTERISTICS
MAXIMUM RATINGS @ 25C Unless Otherwise Specified
Operating Temperature
SYMBOL
VALUE
-55C to 150C
C
C
-55C to 150C
UNITS
T
J
T
STG
PARAMETER
Storage Temperature
Peak Pulse Power (t
p
= 8/20s) - See Figure 1
P
PP
250
Watts
0 5 10 15 20 25 30
t - Time - s
0
20
40
60
80
100
120
I
PP
- Peak Pulse Current - % of I
PP
TEST
WAVEFORM
PARAMETERS
t
f
= 8s
t
d
= 20s
t
f
Peak Value I
PP
e
-t
t
d
= t
I
PP
/2
FIGURE 2
PULSE WAVE FORM
0.01 1 10 100 1,000 10,000
t
d
- Pulse Duration - s
10
100
1,000
10,000
P
PP
- Peak Pulse Current - Watts
FIGURE 1
PEAK PULSE POWER VS PULSE TIME
250W, 8/20s Waveform
ELECTRICAL CHARACTERISTICS PER LINE @ 25C Unless Otherwise Specified
PART
NUMBER
(See Note 1)
MINIMUM
BREAKDOWN
VOLTAGE
@ 1mA
V
(BR)
VOLTS
MAXIMUM
CLAMPING
VOLTAGE
(See Fig. 2)
@ I
P
= 1A
V
C
VOLTS
MAXIMUM
CLAMPING
VOLTAGE
(See Fig. 2)
@8/20s
V
C
@ I
PP
TYPICAL
CAPACITANCE
@0V, 1 MHz
C
pF
PKFC3.3C
PKFC05C
PKFC08C
PKFC12C
PKFC15C
PKFC24C
PKFC36C
3.3
5.0
8.0
12.0
15.0
24.0
36.0
4.0
6.0
8.5
13.3
16.7
26.7
40.0
7.0
9.8
13.4
19.0
24.0
43.0
64.0
12.5V @ 20A
14.7V @ 17A
19.2V @ 13A
29.7V @ 9.0A
35.7V @ 7.0A
55.0V @ 5.0A
84.0V @ 3.0A
150
100
75
50
40
30
25
MAXIMUM
LEAKAGE
CURRENT
(See Note 2)
@V
WM
I
D
A
75*
10**
10***
1
1
1
1
RATED
STAND-OFF
VOLTAGE
V
WM
VOLTS
Note 1: All devices are bidirectional. Electrical characteristics apply in both directions.
Note 2: *Typical leakage current < 5A @ 2.8V. **Typical leakage current <500nA @ 3.3V. ***Typical leakage current <200nA @ 5V.
DEVICE
MARKING
CODE
03
05
08
12
15
24
36
3
www.protekdevices.com
05180.R3 12/05
PKFC3.3C*
thru
PKFC36C*
*PATENT PENDING
GRAPHS
0 25 50 75 100 125 150
T
L
- Lead Temperature - C
20
40
60
80
100
% Of Rated Power
Peak Pulse Power
8/20s
Average Power
FIGURE 3
POWER DERATING CURVE
0
ESD Test Pulse - 25 kilovolt, 1/30ns (waveshape)
FIGURE 4
OVERSHOOT & CLAMPING VOLTAGE FOR PKFC05C
5 Volts per Division
-5
5
15
25
35
0 5 10 15 20
V
C
- Clamping Voltage - Volts
0
4
8
12
14
FIGURE 5
TYPICAL CLAMPING VOLTAGE VS PEAK PULSE CURRENT FOR PKFC05C
10
6
2
I
PP
- Peak Pulse Current - Amps
4
www.protekdevices.com
05180.R3 12/05
PKFC3.3C*
thru
PKFC36C*
*PATENT PENDING
APPLICATION INFORMATION
Ramp-up
Ramp-down
Ramp-up
15 seconds
Solder Time
15-20 seconds
Ramp-down
T
S
- Preheat
T
SMAX
T
SMIN
T
L
t 25C to Peak
30-60 seconds
T
emperature - C
T
P
155
140
0.275mm
Round
Non-Solder Mask Defined Pads
0.325mm Round
0.150mm
0.330mm Round
No Clean
OSP(Entek Cu Plus 106A)
50m
20m
60 Seconds
270C
Pad Size on PCB
Pad Shape
Pad Definition
Solder Mask Opening
Solder Stencil Thickness
Solder Stencil Aperture Opening (laser cut, 5% tapered walls)
Solder Paste Type
Pad Protective Finish
Tolerance - Edge To Corner Ball
Solder Ball Side Coplanarity
Maximum Dwell Time Above Liquidous (183C)
Soldering Maximum Temperature
PRINTED CIRCUIT BOARD RECOMMENDATIONS
PARAMETER
VALUE
REQUIREMENTS
Temperature:
T
P
for Lead-Free (SnAgCu): 260-270C
T
P
for Tin-Lead: 240-245C
Preheat time and temperature depends on solder paste and flux
activation temperature, component size, weight, surface area &
plating.
RECOMMENDED NON-SOLDER MASK
DEFINED PAD ILLUSTRATION
Non-Solder Mask Defined Pad
0.275mm DIA.
Solder Mask Opening
0.325mm DIA.
Solder Stencil Opening
0.330mm DIA.
5
www.protekdevices.com
05180.R3 12/05
PKFC3.3C*
thru
PKFC36C*
*PATENT PENDING
PACKAGE OUTLINE & DIMENSIONS
COPYRIGHT ProTek Devices 2005
SPECIFICATIONS: ProTek reserves the right to change the electrical and or mechanical characteristics described herein without notice (except
JEDEC).
DESIGN CHANGES: ProTek reserves the right to discontinue product lines without notice, and that the final judgement concerning selection and
specifications is the buyer's and that in furnishing engineering and technical assistance, ProTek assumes no responsibility with respect to the
selection or specifications of such products.
NOTES
1. Controlling dimensions in inches.
2. Decimal tolerances for mounting pad : 0.003" ( 0.08mm).
3. Maximum size: 0.052" (1.321mm) by 0.036" (0.914mm).
4. All dimensions 0.003" on package outline.
PACKAGE OUTLINE
MOUNTING PAD
DIM
MILLIMETERS
INCHES
PACKAGE DIMENSIONS
A
B
C
D
E
F
G
H
J
K
0.73
1.22
0.73
0.54
0.10
0.55
0.27
0.38
0.35
0.35
0.029
0.048
0.029
0.021
0.004
0.022
0.011
0.015
0.014
0.014
DIM
MILLIMETERS
INCHES
PAD DIMENSIONS
A
B
C
E
F
G
J
1.00
0.62
1.44
0.18
0.49
0.31
0.31
0.040
0.025
0.058
0.008
0.020
0.013
0.013
TAPE & REEL ORDERING NOMENCLATURE
1. Surface mount product is taped and reeled in accordance with EIA 481.
2.
8mm Plastic Tape: 7 Inch Reels - 5,000 pieces per reel. Ordering Suffix: -T75-1 (i.e., PKFC05C-T75-1).
3. Suffix - LF = Lead-Free, Pure-Tin Plating, i.e.,
PKFC05C-LF-T75-1.
Outline & Dimensions: Rev 1 - 8/03, 06040
TAPE & REEL ORIENTATION
NOTE
1. Top view of tape. Solder PADS face down in tape package.
ProTek Devices
2929 South Fair Lane, Tempe, AZ 85282
Tel: 602-431-8101 Fax: 602-431-2288
E-Mail:
sales@protekdevices.com
Web Site:
www.protekdevices.com
A
TOP
BOTTOM
SIDE
H
C
G
J
D
F
E
B
K
A
F
G
Solder Print Diameter
0.010" - 0.012"
J
B
C
E
Package Contact Pads
Package Outline
0.76
1.27
0.76
0.57
0.13
0.58
0.30
0.41
0.38
0.38
0.79
1.32
0.79
0.60
0.16
0.61
0.33
0.44
0.41
0.41
0.030
0.050
0.030
0.023
0.005
0.023
0.012
0.016
0.015
0.015
0.031
0.052
0.031
0.024
0.006
0.024
0.013
0.017
0.016
0.016
MIN
MIN
MAX
NOM
MAX
NOM
MIN
MIN
MAX
NOM
MAX
NOM
1.02
0.64
1.47
0.20
0.51
0.33
0.33
1.04
0.66
1.50
0.22
0.53
0.35
0.35
0.039
0.024
0.056
0.007
0.019
0.012
0.012
0.041
0.026
0.060
0.009
0.021
0.014
0.014
XX
Top cover tape
K0
t
D
P0
P2
10 Pitches Cumulative
Tolerance on Tape. 0.2
A0
B0
P
E
F
W
User Direction of Feed
Tape & Reel Specifications (Dimensions in millimeters)
D
E
P0
t
F
P2
W
1.50 0.10 1.75 0.10 3.50 0.05 8.00 0.30 4.00 0.10 2.00 0.05
P
4.00 0.10 0.200.025
A0
B0
K0
Reel Dia.
Tape Width
178mm (7")
8mm
1.08 0.05 1.60 0.05 0.72 0.05
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