Rev.4.00, Apr.09.2003, page 1 of 10
HAT2164H
Silicon N Channel Power MOS FET Power Switching
REJ03G0003-0400Z
Rev.4.00
Apr.09.2003
Features
Capable of 4.5 V gate drive
Low drive current
High density mounting
Low on-resistance
R
DS(on)
= 2.5 m
typ. (at V
GS
= 10 V)
Outline
LFPAK
1 2
3
4
5
1, 2, 3 Source
4 Gate
5 Drain
G
D
S S S
4
1 2
3
5
HAT2164H
Rev.4.00, Apr.09.2003, page 2 of 10
Absolute Maximum Ratings
(Ta = 25C)
Item
Symbol
Ratings
Unit
Drain to source voltage
V
DSS
30
V
Gate to source voltage
V
GSS
20
V
Drain current
I
D
60
A
Drain peak current
I
D(pulse)
Note1
240
A
Body-drain diode reverse drain current I
DR
60
A
Avalanche current
I
AP
Note 2
30
A
Avalanche energy
E
AR
Note 2
90
mJ
Channel dissipation
Pch
Note3
30
W
Channel to Case Thermal Resistance
ch-C
4.17
C/W
Channel temperature
Tch
150
C
Storage temperature
Tstg
55 to +150
C
Notes: 1. PW
10
s, duty cycle
1%
2. Value at Tch = 25
C, Rg
50
3. Tc = 25
C
HAT2164H
Rev.4.00, Apr.09.2003, page 3 of 10
Electrical Characteristics
(Ta = 25C)
Item
Symbol Min
Typ
Max
Unit
Test Conditions
Drain to source breakdown voltage V
(BR)DSS
30
--
--
V
I
D
= 10 mA, V
GS
= 0
Gate to source breakdown voltage
V
(BR)GSS
20
--
--
V
I
G
= 100
A, V
DS
= 0
Gate to source leak current
I
GSS
--
--
10
A
V
GS
= 16 V, V
DS
= 0
Zero gate voltage drain current
I
DSS
--
--
1
A
V
DS
= 30 V, V
GS
= 0
Gate to source cutoff voltage
V
GS(off)
0.8
--
2.3
V
V
DS
= 10 V,
I
D
= 1 mA
Static drain to source on state
R
DS(on)
--
2.5
3.1
m
I
D
= 30 A, V
GS
= 10 V
Note4
resistance
R
DS(on)
--
3.0
4.4
m
I
D
= 30 A, V
GS
= 4.5 V
Note4
Forward transfer admittance
|y
fs
|
78
130
--
S
I
D
= 30 A, V
DS
= 10 V
Note4
Input capacitance
Ciss
--
7600
--
pF
V
DS
= 10 V
Output capacitance
Coss
--
1050
--
pF
V
GS
= 0
Reverse transfer capacitance
Crss
--
470
--
pF
f = 1 MHz
Gate Resistance
Rg
--
0.5
--
Total gate charge
Qg
--
50
--
nc
V
DD
= 10 V
Gate to source charge
Qgs
--
22
--
nc
V
GS
= 4.5 V
Gate to drain charge
Qgd
--
10
--
nc
I
D
= 60 A
Turn-on delay time
t
d(on)
--
18
--
ns
V
GS
= 10 V, I
D
= 30 A
Rise time
t
r
--
60
--
ns
V
DD
10 V
Turn-off delay time
t
d(off)
--
65
--
ns
R
L
= 0.33
Fall time
t
f
--
15
--
ns
Rg = 4.7
Bodydrain diode forward voltage
V
DF
--
0.82
1.07
V
IF = 60 A, V
GS
= 0
Note4
Bodydrain diode reverse recovery
time
t
rr
--
40
--
ns
IF = 60 A, V
GS
= 0
diF/ dt = 100 A/ s
Notes: 4. Pulse test
HAT2164H
Rev.4.00, Apr.09.2003, page 4 of 10
Main Characteristics
Channel Dissipation Pch (W)
Case Temperature Tc (
C)
Power vs. Temperature Derating
Drain to Source Voltage V (V)
DS
Drain Current I (A)
D
Typical Output Characteristics
Gate to Source Voltage V (V)
GS
Drain Current I (A)
D
Typical Transfer Characteristics
100
80
60
40
20
0
2
4
6
8
10
100
80
60
40
20
0
1
2
3
4
5
Tc = 75
C
25
C
-25
C
40
30
20
10
0
50
100
150
200
V = 10 V
Pulse Test
DS
V = 2.4 V
GS
10 V
4 V
2.6 V
2.8 V
3.0 V
3.2 V
Pulse Test
Drain to Source Voltage V (V)
DS
Drain Current I (A)
D
Maximum Safe Operation Area
100
10
1
0.1
0.01
0.1
0.3
1
3
10
30
100
500
Tc = 25
C
1 shot Pulse
PW = 10 ms
10
s
100
s
Operation in
this area is
limited by R
DS(on)
DC Operation
1 ms
HAT2164H
Rev.4.00, Apr.09.2003, page 5 of 10
Gate to Source Voltage V (V)
GS
Drain to Source Voltage V (mV)
DS(on)
Drain to Source Saturation Voltage vs.
Gate to Source Voltage
Forward Transfer Admittance |yfs| (S)
Drain Current I (A)
D
Forward Transfer Admittance vs.
Drain Current
250
200
150
100
50
0
4
8
12
16
20
Pulse Test
I = 50 A
D
10 A
20 A
3
30
0.1
1
10
100
0.3
10
1000
100
30
300
1
0.3
3
0.1
Tc = -25
C
DS
V = 10 V
Pulse Test
75
C
25
C
Drain Current I (A)
D
Drain to Source On State Resistance
R (m )
DS(on)
Static Drain to Source on State Resistance
vs. Drain Current
10
2
5
1
30
300
1
10
100
1000
3
V = 4.5 V
GS
10 V
Pulse Test
Case Temperature Tc (
C)
Static Drain to Source on State Resistance
Static Drain to Source on State Resistance
vs. Temperature
8
6
4
2
-25
0
25
50
75
100 125 150
0
R (m )
DS(on)
I = 10 A, 20 A
D
10 A, 20 A, 50 A
V = 4.5 V
GS
10 V
Pulse Test
50 A
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