Document Outline
- Description
- Features
- Card Line Up
- Card Pin Assignment
- Card Pin Explanation
- Card Block Diagram
- Card Function Explanation
- Register Construction
- Host Access Specifications
- Task File Register Specification
- ATA Command specifications
- Absolute Maximum Ratings
- Recommended Operating Conditions
- Capacitance
- DC Characteristics-1
- DC Characteristics-2
- AC Characteristics
- Register Access AC Characteristics
- PIO Mode Access AC Characteristics
- Register Access/PIO Mode Access Timing
- Multiword DMA Mode Access AC Characteristics
- Multiword DMA Mode Access Timing
- Ultra DMA Mode Access AC Characteristics
- Timing of Initializing an Ultra DMA data-in Burst
- Timing of Sustained Ultra DMA data-in Burst
- Timing of Host pausing an Ultra DMA data-in Burst
- Timing of Card Terminating Ultra DMA data-in Burst
- Timing of Host terminating an Ultra DMA data-in Burst
- Timing of Initializing an Ultra DMA data-out Burst
- Timing of Sustained Ultra DMA data-out Burst
- Timing of Card pausing an Ultra DMA data-out Burst
- Timing of Host terminating an Ultra DMA data-out Burst
- Timing of Card Terminating Ultra DMA data-out Burst
- Attention for Card Use
- Physical Outline
- Caution for Handling Cards
Regarding the change of names mentioned in the document, such as Hitachi
Electric and Hitachi XX, to Renesas Technology Corp.
The semiconductor operations of Mitsubishi Electric and Hitachi were transferred to Renesas
Technology Corporation on April 1st 2003. These operations include microcomputer, logic, analog
and discrete devices, and memory chips other than DRAMs (flash memory, SRAMs etc.)
Accordingly, although Hitachi, Hitachi, Ltd., Hitachi Semiconductors, and other Hitachi brand
names are mentioned in the document, these names have in fact all been changed to Renesas
Technology Corp. Thank you for your understanding. Except for our corporate trademark, logo and
corporate statement, no changes whatsoever have been made to the contents of the document, and
these changes do not constitute any alteration to the contents of the document itself.
Renesas Technology Home Page: http://www.renesas.com
Renesas Technology Corp.
Customer Support Dept.
April 1, 2003
To all our customers
Cautions
Keep safety first in your circuit designs!
1. Renesas Technology Corporation puts the maximum effort into making semiconductor products better
and more reliable, but there is always the possibility that trouble may occur with them. Trouble with
semiconductors may lead to personal injury, fire or property damage.
Remember to give due consideration to safety when making your circuit designs, with appropriate
measures such as (i) placement of substitutive, auxiliary circuits, (ii) use of nonflammable material or
(iii) prevention against any malfunction or mishap.
Notes regarding these materials
1. These materials are intended as a reference to assist our customers in the selection of the Renesas
Technology Corporation product best suited to the customer's application; they do not convey any
license under any intellectual property rights, or any other rights, belonging to Renesas Technology
Corporation or a third party.
2. Renesas Technology Corporation assumes no responsibility for any damage, or infringement of any
third-party's rights, originating in the use of any product data, diagrams, charts, programs, algorithms, or
circuit application examples contained in these materials.
3. All information contained in these materials, including product data, diagrams, charts, programs and
algorithms represents information on products at the time of publication of these materials, and are
subject to change by Renesas Technology Corporation without notice due to product improvements or
other reasons. It is therefore recommended that customers contact Renesas Technology Corporation
or an authorized Renesas Technology Corporation product distributor for the latest product information
before purchasing a product listed herein.
The information described here may contain technical inaccuracies or typographical errors.
Renesas Technology Corporation assumes no responsibility for any damage, liability, or other loss
rising from these inaccuracies or errors.
Please also pay attention to information published by Renesas Technology Corporation by various
means, including the Renesas Technology Corporation Semiconductor home page
(http://www.renesas.com).
4. When using any or all of the information contained in these materials, including product data, diagrams,
charts, programs, and algorithms, please be sure to evaluate all information as a total system before
making a final decision on the applicability of the information and products. Renesas Technology
Corporation assumes no responsibility for any damage, liability or other loss resulting from the
information contained herein.
5. Renesas Technology Corporation semiconductors are not designed or manufactured for use in a device
or system that is used under circumstances in which human life is potentially at stake. Please contact
Renesas Technology Corporation or an authorized Renesas Technology Corporation product distributor
when considering the use of a product contained herein for any specific purposes, such as apparatus or
systems for transportation, vehicular, medical, aerospace, nuclear, or undersea repeater use.
6. The prior written approval of Renesas Technology Corporation is necessary to reprint or reproduce in
whole or in part these materials.
7. If these products or technologies are subject to the Japanese export control restrictions, they must be
exported under a license from the Japanese government and cannot be imported into a country other
than the approved destination.
Any diversion or reexport contrary to the export control laws and regulations of Japan and/or the
country of destination is prohibited.
8. Please contact Renesas Technology Corporation for further details on these materials or the products
contained therein.
HB28B1700IA2SR/HB28B1000IA2SR
HB28B512IA2SR
Wide Temperature Range Version
IDE Card
ADE-203-1381A (Z)
Rev. 1.0
Dec. 27, 2002
Description
HB28B1700IA2SR, HB28B1000IA2SR, HB28B512IA2SR are IDE cards. These cards comply with ATA-5
specification standard, and are suitable for the usage of data storage memory medium for PC or any other
electric equipment. These cards are equipped with Hitachi 512 Mega bit Flash memory. By using these cards
it is possible to operate good performance for a system which has ATA interface.
Features
Conform to ANSI AT Attachment-5 (ATA-5) specification standard
Card density is 1.7 Giga bytes maximum
This card is equipped with Hitachi 512 Mega bit Flash memory
5 V power supplies are used
Temperature range: -25 to +85C
Data write is 300,000 cycle/block
High reliability based on internal ECC (Error Correcting Code) function
Data reliability is less than 1 error in 10
14
bits read
HB28B1700IA2SR, HB28B1000IA2SR, HB28B512IA2SR
Rev.1.0, Dec. 2002, page 2 of 46
Card Line Up*
1
Type No.
Card density
Capacity*
4
Total sectors/
card*
3
Sectors/
track*
2
Number of
head
Number of
cylinder
HB28B1700IA2SR
1.7 GB
1,794,465,792 byte 3,504,816
63
16
3,477
HB28B1000IA2SR
1.0 GB
1,025,482,752 byte 2,002,896
63
16
1,987
HB28B512IA2SR
512 MB
512,483,328 byte
1,000,944
63
16
933
Notes: 1. These data are written in ID.
2. Total tracks = number of head
number of cylinder.
3. Total sectors/card = sectors/track
number of head number of cylinder.
4. It is the logical address capacity including the area which is used for file system.
HB28B1700IA2SR, HB28B1000IA2SR, HB28B512IA2SR
Rev.1.0, Dec. 2002, page 3 of 46
Card Pin Assignment
Pin No.
Signal name
Pin No.
Signal name
Pin No.
Signal name
1 GND
24
47
2 D3
25
48
3 D4
26
49
4 D5
27
A2
50
5 D6
28
A1
51
VCC
6 D7
29
A0
52
7 -CS0
30
D0
53
8
31
D1 54
9
32
D2 55
10
33
-IOIS16
56
-CSEL
11
34
GND
57
*
1
12
35
GND
58
-RESET
13
36
*
1
59
IORDY
14
37
D11
60
DMARQ
15
38
D12
61
-DMACK
16 INTRQ
39 D13
62 -DASP
17 V
CC
40
D14 63
-PDIAG
18
41
D15
64
D8
19
42
-CS1
65
D9
20
43
*
1
66
D10
21
44
-IORD
67
*
1
22
45
-IOWR
68
GND
23
46
Note: 1. Host system should not connect these pin.
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