Regarding the change of names mentioned in the document, such as Hitachi
Electric and Hitachi XX, to Renesas Technology Corp.
The semiconductor operations of Mitsubishi Electric and Hitachi were transferred to Renesas
Technology Corporation on April 1st 2003. These operations include microcomputer, logic, analog
and discrete devices, and memory chips other than DRAMs (flash memory, SRAMs etc.)
Accordingly, although Hitachi, Hitachi, Ltd., Hitachi Semiconductors, and other Hitachi brand
names are mentioned in the document, these names have in fact all been changed to Renesas
Technology Corp. Thank you for your understanding. Except for our corporate trademark, logo and
corporate statement, no changes whatsoever have been made to the contents of the document, and
these changes do not constitute any alteration to the contents of the document itself.
Renesas Technology Home Page: http://www.renesas.com
Renesas Technology Corp.
Customer Support Dept.
April 1, 2003
To all our customers
Cautions
Keep safety first in your circuit designs!
1. Renesas Technology Corporation puts the maximum effort into making semiconductor products better
and more reliable, but there is always the possibility that trouble may occur with them. Trouble with
semiconductors may lead to personal injury, fire or property damage.
Remember to give due consideration to safety when making your circuit designs, with appropriate
measures such as (i) placement of substitutive, auxiliary circuits, (ii) use of nonflammable material or
(iii) prevention against any malfunction or mishap.
Notes regarding these materials
1. These materials are intended as a reference to assist our customers in the selection of the Renesas
Technology Corporation product best suited to the customer's application; they do not convey any
license under any intellectual property rights, or any other rights, belonging to Renesas Technology
Corporation or a third party.
2. Renesas Technology Corporation assumes no responsibility for any damage, or infringement of any
third-party's rights, originating in the use of any product data, diagrams, charts, programs, algorithms, or
circuit application examples contained in these materials.
3. All information contained in these materials, including product data, diagrams, charts, programs and
algorithms represents information on products at the time of publication of these materials, and are
subject to change by Renesas Technology Corporation without notice due to product improvements or
other reasons. It is therefore recommended that customers contact Renesas Technology Corporation
or an authorized Renesas Technology Corporation product distributor for the latest product information
before purchasing a product listed herein.
The information described here may contain technical inaccuracies or typographical errors.
Renesas Technology Corporation assumes no responsibility for any damage, liability, or other loss
rising from these inaccuracies or errors.
Please also pay attention to information published by Renesas Technology Corporation by various
means, including the Renesas Technology Corporation Semiconductor home page
(http://www.renesas.com).
4. When using any or all of the information contained in these materials, including product data, diagrams,
charts, programs, and algorithms, please be sure to evaluate all information as a total system before
making a final decision on the applicability of the information and products. Renesas Technology
Corporation assumes no responsibility for any damage, liability or other loss resulting from the
information contained herein.
5. Renesas Technology Corporation semiconductors are not designed or manufactured for use in a device
or system that is used under circumstances in which human life is potentially at stake. Please contact
Renesas Technology Corporation or an authorized Renesas Technology Corporation product distributor
when considering the use of a product contained herein for any specific purposes, such as apparatus or
systems for transportation, vehicular, medical, aerospace, nuclear, or undersea repeater use.
6. The prior written approval of Renesas Technology Corporation is necessary to reprint or reproduce in
whole or in part these materials.
7. If these products or technologies are subject to the Japanese export control restrictions, they must be
exported under a license from the Japanese government and cannot be imported into a country other
than the approved destination.
Any diversion or reexport contrary to the export control laws and regulations of Japan and/or the
country of destination is prohibited.
8. Please contact Renesas Technology Corporation for further details on these materials or the products
contained therein.
HD151TS404SS
Mother Board Clock Generator
for SiS746 AMD Athlon/Duron Chipset
ADE-205-711A (Z)
Rev.1
Nov. 2002
Description
The HD151TS404 is a high-performance, low-skew, low-jitter, PC motherboard Clock generator. It is
specifically designed for SiS746 chip set.
Features
1 Differential pair of open drain CPU clock.
1 open drain CPU clock for chipset.
6 PCI clocks and 2 PCI_F clocks @3.3 V, 33.3 MHz typ.
2 copies of AGP clock @3.3V, 66.6 MHz typ.
2 Zclock @3.3 V, up to 133.3 MHz.
1 copy of 48 MHz for USB @3.3 V
24 MHz / 48 MHz selectable clock @3.3 V
2 copies of 14.318 MHz reference clock @3.3 V
Power save and clock stop function.
Programmable clock output skew control function.
I
2
C
TM
serial port programming.
Spread Spectrum modulation (0.5% or 0.25%).
48pin SSOP (300 mils).
Supports 3
DDR DIMM application with clock buffer HD74CDCV851 (SSOP48pin)
Supports 2
DDR DIMM Micro-ATX application with clock buffer HD74CDCV852 (SSOP28pin)
Ordering Information
Part Name
Package Type
Package Code
Package
Abbreviation
Taping
Abbreviation (Quantity)
HD151TS404SSEL
SSOP-48 pin
SS
EL (1,000 pcs / Reel)
Note: Please consult the sales office for the above package availability.
Note:
I
2
C is a trademark of Philips Corporation.
Pentium is registered trademark of Intel Corporation
HD151TS404SS
Rev.1, Nov. 2002, page 2 of 27
Key Specifications
Supply Voltages: VDD = 3.3 V 5%
Clock cycle to cycle jitter = |125| ps Typ
CPU clock group Skew = 150 ps max
AGP clock group Skew = 175 ps max
PCI clock group Skew = 500 ps max
CPU(early) to PCI, AGP & ZCLK offset = 1 to 4 ns (typ. 2ns)
HD151TS404SS
Rev.1, Nov. 2002, page 3 of 27
Pin Arrangement
1
2
3
4
5
6
7
8
9
10
VDDREF
*FS0/REF0
*FS1/REF1
NC
GNDREF
X1
X2
GNDZ
ZCLK1
VDDZ
PCI_STP#
VDDPCI
FS2*/PCI_F0
FS3*/PCI_F1
PCI0
PCI1
GNDPCI
VDDPCI
PCI2
PCI3
PCI4
PCI5
GNDPCI
ZCLK0
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
GND48
24_48MHz
48MHz
VDDAGP
AGPCLK1
VDDA
GNDAGP
PD#
GNDA
CPU0C(OD)
CPU0T(OD)
GNDCPU
AGPCLK0
VDDCPU
CPU1T(OD)
CPU_STP#
IOAPIC0
VDDAPIC
IOAPIC1
VDD48
SDATA
SCLK
VDDCPU
GNDAPIC
(Top view)
* Latch input / multi function pin.
Note:
FS0, 1, 2, 3 = 120 k
Internal Pull-down.
PCI
_
STP#, PD#, CPU
_
STP# = 120 k
Internal Pull-up.
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