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Электронный компонент: HM62G18512ABP-33

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Regarding the change of names mentioned in the document, such as Hitachi
Electric and Hitachi XX, to Renesas Technology Corp.
The semiconductor operations of Mitsubishi Electric and Hitachi were transferred to Renesas
Technology Corporation on April 1st 2003. These operations include microcomputer, logic, analog
and discrete devices, and memory chips other than DRAMs (flash memory, SRAMs etc.)
Accordingly, although Hitachi, Hitachi, Ltd., Hitachi Semiconductors, and other Hitachi brand
names are mentioned in the document, these names have in fact all been changed to Renesas
Technology Corp. Thank you for your understanding. Except for our corporate trademark, logo and
corporate statement, no changes whatsoever have been made to the contents of the document, and
these changes do not constitute any alteration to the contents of the document itself.
Renesas Technology Home Page: http://www.renesas.com
Renesas Technology Corp.
Customer Support Dept.
April 1, 2003
To all our customers
Cautions
Keep safety first in your circuit designs!
1. Renesas Technology Corporation puts the maximum effort into making semiconductor products better
and more reliable, but there is always the possibility that trouble may occur with them. Trouble with
semiconductors may lead to personal injury, fire or property damage.
Remember to give due consideration to safety when making your circuit designs, with appropriate
measures such as (i) placement of substitutive, auxiliary circuits, (ii) use of nonflammable material or
(iii) prevention against any malfunction or mishap.
Notes regarding these materials
1. These materials are intended as a reference to assist our customers in the selection of the Renesas
Technology Corporation product best suited to the customer's application; they do not convey any
license under any intellectual property rights, or any other rights, belonging to Renesas Technology
Corporation or a third party.
2. Renesas Technology Corporation assumes no responsibility for any damage, or infringement of any
third-party's rights, originating in the use of any product data, diagrams, charts, programs, algorithms, or
circuit application examples contained in these materials.
3. All information contained in these materials, including product data, diagrams, charts, programs and
algorithms represents information on products at the time of publication of these materials, and are
subject to change by Renesas Technology Corporation without notice due to product improvements or
other reasons. It is therefore recommended that customers contact Renesas Technology Corporation
or an authorized Renesas Technology Corporation product distributor for the latest product information
before purchasing a product listed herein.
The information described here may contain technical inaccuracies or typographical errors.
Renesas Technology Corporation assumes no responsibility for any damage, liability, or other loss
rising from these inaccuracies or errors.
Please also pay attention to information published by Renesas Technology Corporation by various
means, including the Renesas Technology Corporation Semiconductor home page
(http://www.renesas.com).
4. When using any or all of the information contained in these materials, including product data, diagrams,
charts, programs, and algorithms, please be sure to evaluate all information as a total system before
making a final decision on the applicability of the information and products. Renesas Technology
Corporation assumes no responsibility for any damage, liability or other loss resulting from the
information contained herein.
5. Renesas Technology Corporation semiconductors are not designed or manufactured for use in a device
or system that is used under circumstances in which human life is potentially at stake. Please contact
Renesas Technology Corporation or an authorized Renesas Technology Corporation product distributor
when considering the use of a product contained herein for any specific purposes, such as apparatus or
systems for transportation, vehicular, medical, aerospace, nuclear, or undersea repeater use.
6. The prior written approval of Renesas Technology Corporation is necessary to reprint or reproduce in
whole or in part these materials.
7. If these products or technologies are subject to the Japanese export control restrictions, they must be
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Any diversion or reexport contrary to the export control laws and regulations of Japan and/or the
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8. Please contact Renesas Technology Corporation for further details on these materials or the products
contained therein.
Preliminary: The specification of this device are subject to change without notice. Please contact your
nearest Hitachi's Sales Dept. regarding specification.
HM62G18512A Series
9M Synchronous Fast Static RAM
(512k-word
18-bit)
ADE-203-1268B (Z)
Preliminary
Rev. 0.2
Sep. 12, 2001
Description
The HM62G18512A is a synchronous fast static RAM organized as 512-kword
18-bit. It has realized
high speed access time by employing the most advanced CMOS process and high speed circuit designing
technology. It is most appropriate for the application which requires high speed, high density memory and
wide bit width configuration, such as cache and buffer memory in system. It is packaged in standard 119-
bump BGA.
Note:
All power supply and ground pins must be connected for proper operation of the device.
Features
2.5 V
5% and 3.3 V
5% operation and 0.9 V (V
REF
)
Internal self-timed late write
Byte write control (2 byte write selects, one for each 9-bit)
Optional
36 configuration
HSTL compatible I/O
Programmable impedance output drivers
User selective input trip-point
Differential, HSTL clock inputs
Asynchronous
G output control
Asynchronous sleep mode
Limited set of boundary scan JTAG IEEE 1149.1 compatible
Protocol: Single clock register-register mode
HM62G18512A Series
2
Ordering Information
Type No.
Access time
Cycle time
Package
HM62G18512ABP-30
HM62G18512ABP-33
HM62G18512ABP-40
1.7 ns
1.7 ns
2.0 ns
3.0 ns
3.3 ns
4.0 ns
119-bump 1. 27 mm
14 mm
22 mm BGA (BP-119C)
Pin Arrangement
1
2
3
4
5
6
7
A
V
DDQ
SA0
SA1
NC
SA13
SA12
V
DDQ
B
NC
NC
SA2
NC
SA14
SA11
NC
C
NC
SA3
SA4
V
DD
SA5
SA6
NC
D
DQb5
NC
V
SS
ZQ
V
SS
DQa0
NC
E
NC
DQb3
V
SS
SS
V
SS
NC
DQa4
F
V
DDQ
NC
V
SS
G
V
SS
DQa1
V
DDQ
G
NC
DQb6
SWEb
NC
V
SS
NC
DQa8
H
DQb7
NC
V
SS
NC
V
SS
DQa2
NC
J
V
DDQ
V
DD
V
REF
V
DD
V
REF
V
DD
V
DDQ
K
NC
DQb2
V
SS
K
V
SS
NC
DQa7
L
DQb8
NC
V
SS
K
SWEa
DQa6
NC
M
V
DDQ
DQb1
V
SS
SWE
V
SS
NC
V
DDQ
N
DQb4
NC
V
SS
SA8
V
SS
DQa3
NC
P
NC
DQb0
V
SS
SA10
V
SS
NC
DQa5
R
NC
SA7
M1
V
DD
M2
SA15
NC
T
NC
SA18
SA9
NC
SA17
SA16
ZZ
U
V
DDQ
TMS
TDI
TCK
TDO
NC
V
DDQ
(Top view)
HM62G18512A Series
3
Pin Description
Name
I/O type
Descriptions
Notes
V
DD
Supply
Core power supply
V
SS
Supply
Ground
V
DDQ
Supply
Output power supply
V
REF
Supply
Input reference: provides input reference voltage
K
Input
Clock input. Active high.
K
Input
Clock input. Active low.
SS
Input
Synchronous chip select
SWE
Input
Synchronous write enable
SAn
Input
Synchronous address input
n = 0-18
SWEx
Input
Synchronous byte write enables
x = a, b
G
Input
Asynchronous output enable
ZZ
Input
Power down mode select
ZQ
Input
Output impedance control
1
DQxn
I/O
Synchronous data input/output
x = a, b
n = 0, 1, 2...8
M1, M2
Input
Output protocol mode select
TMS
Input
Boundary scan test mode select
TCK
Input
Boundary scan test clock
TDI
Input
Boundary scan test data input
TDO
Output
Boundary scan test data output
NC
--
No connection
M1
M2
Protocol
Notes
V
SS
V
DD
Synchronous register to register operation
2
Notes: 1. ZQ is to be connected to V
SS
via a resistance RQ where 225
RQ
275
. If ZQ = V
DDQ
or
open, output buffer impedance will be maximum.
2. There is 1 protocol with mode pin. For this application, M1 and M2 need to connect to V
SS
and
V
DD
, respectively. The state of the Mode control inputs must be set before power-up and must
not change during device operation. Mode control inputs are not standard inputs and may not
meet V
IH
or V
IL
specification. This SRAM is tested only in the synchronous register to register
operation.