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Product Description
Ordering Information
Typical Applications
Features
Functional Block Diagram
RF Micro Devices, Inc.
7628 Thorndike Road
Greensboro, NC 27409, USA
Tel (336) 664 1233
Fax (336) 664 0454
http://www.rfmd.com
Optimum Technology Matching Applied
Si BJT
GaAs MESFET
GaAs HBT
Si Bi-CMOS
SiGe HBT
Si CMOS
InGaP/HBT
GaN HEMT
SiGe Bi-CMOS
3
VREG
2
RF IN
1
VCC1
6
RF OUT
7
GND
5
VCC2
4
VM
O
D
E
RF3100-3
3V 1900MHz LINEAR AMPLIFIER MODULE
3V CDMA US-PCS Handsets
3V CDMA2000/1X PCS Handsets
Spread-Spectrum Systems
Designed for Compatibility with Qualcomm
Chipsets
The RF3100-3 is a high-power, high-efficiency linear
amplifier IC targeting 3V hand-held systems. The device
is manufactured on an advanced Gallium Arsenide Het-
erojunction Bipolar Transistor (HBT) process, and has
been designed for use as the final RF amplifier in dual-
mode 3V CDMA hand-held digital cellular equipment,
spread-spectrum systems, and other applications in the
1850MHz to 1910MHz band. The RF3100-3 has a digital
control line for low power application to reduce the cur-
rent drain. The device is self-contained with 50
input
and output that is matched to obtain optimum power, effi-
ciency, and linearity characteristics. The module is an
ultra-small 6mmx6mm land grid array with backside
ground.
Input/Output Internally Matched@50
Single 3V Supply
28dBm Linear Output Power
-141dBm/Hz Noise Power
35% Linear Efficiency
45mA Idle Current (Low Power Mode)
RF3100-3
3V 1900MHz Linear Amplifier Module
RF3100-3 PCBA Fully Assembled Evaluation Board
0
Rev B1 021126
6.0 sq
0.100
3.000
4.390
0.600
0.800 sq
typ
NOTE: Nominal thickness, 1.55 mm.
1.700
0.100
2.500
Dimensions in mm.
Package Style: LGM (6mmx6mm)
NOT FOR NEW DESIGNS
See Upgraded Product RF6000-3
!
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Absolute Maximum Ratings
Parameter
Rating
Unit
Supply Voltage (RF off)
+8.0
V
DC
Supply Voltage (P
OUT
28dBm)
+5.2
V
DC
Control Voltage (V
REG
)
+4.2
V
DC
Mode Voltage (V
MODE
)
+3.5
V
DC
Input RF Power
+10
dBm
Operating Case Temperature
-30 to +110
C
Storage Temperature
-30 to +150
C
Parameter
Specification
Unit
Condition
Min.
Typ.
Max.
High Power State
(V
MODE
Low)
Typical Performance at V
CC
=3.2V,
V
REG
=2.85V, T
AMB
=25C,
Frequency=1850MHz to 1910MHz
(unless otherwise specified)
Frequency Range
1850
1910
MHz
Linear Gain
24
26.5
dB
Second Harmonic
-43
dBc
Third Harmonic
-56
dBc
Maximum Linear Output Power
(CDMA Modulation)
28
dBm
Total Linear Efficiency
35
%
P
OUT
=28dBm
Adjacent Channel Power
Rejection
-48
-45
dBc
ACPR@1.25MHz, V
CC
=3.4V,
P
OUT
=28dBm
-62
-58
dBc
ACPR@2.25MHz, V
CC
=3.4V,
P
OUT
=28dBm
Input VSWR
<2.5:1
Output VSWR
10:1
No damage.
6:1
No oscillations. >-70dBc
Noise Power
-141
dBm/Hz
At 80MHz offset.
Low Power State
(V
MODE
High)
Typical Performance at V
CC
=3.2V,
V
REG
=2.85V, T
AMB
=25C,
Frequency=1850MHz to 1910MHz
(unless otherwise specified)
Frequency Range
1850
1910
MHz
Linear Gain
14
19
dB
Second Harmonic
-43
dBc
Third Harmonic
-56
dBc
Maximum Linear Output Power
(CDMA Modulation)
16
dBm
Adjacent Channel Power
Rejection
-52
-46
dBc
ACPR@1.25MHz
-66
-59
dBc
ACPR@2.25MHz
Input VSWR
<2.5:1
Output VSWR
10:1
No damage.
6:1
No oscillations. >-70dBc
Caution! ESD sensitive device.
RF Micro Devices believes the furnished information is correct and accurate
at the time of this printing. However, RF Micro Devices reserves the right to
make changes to its products without notice. RF Micro Devices does not
assume responsibility for the use of the described product(s).
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Parameter
Specification
Unit
Condition
Min.
Typ.
Max.
DC Supply
T
AMB
=25C
Supply Voltage
3.2
3.7
4.2
V
Quiescent Current
170
240
mA
V
MODE
=Low, V
REG
=2.85V
50
80
mA
V
MODE
=High, V
REG
=2.85V
V
REG
Current
6
10
mA
V
MODE
Current
1.5
mA
Turn On/Off Time
6
s
Total Current (Power Down)
5
10
A
V
REG
=Low, V
MODE
=Low
V
REG
"Low" Voltage
0
0.5
V
V
REG
"High" Voltage
2.8
2.85
2.9
V
V
MODE
"Low" Voltage
0
0.5
V
V
MODE
"High" Voltage
2.0
3.0
V
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Pin
Function
Description
Interface Schematic
1
VCC1
First stage collector supply. A low frequency decoupling capacitor
(e.g., 1
F) is required.
2
RF IN
RF input internally matched to 50
. This input is internally AC-coupled.
3
VREG
Regulated voltage supply for amplifier bias. In Power Down mode, both
V
REG
and V
MODE
need to be LOW (<0.5V).
4
VMODE
For nominal operation (High Power Mode), V
MODE
is set LOW. When
set HIGH, devices are turned off to improve efficiency.
5
VCC2
Output stage collector supply. A low frequency decoupling capacitor
(e.g., 1
F) is required.
6
RF OUT
RF output internally matched to 50
. This output is internally
AC-coupled.
7
GND
Ground connection. Connect to package base ground. For best perfor-
mance, keep traces physically short and connect immediately to
ground plane.
Pkg
Base
GND
Ground connection. The backside of the package should be soldered to
a top side ground pad which is connected to the ground plane with mul-
tiple vias. The pad should have a short thermal path to the ground
plane.
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Evaluation Board Schematic
(Download Bill of Materials from www.rfmd.com.)
3
2
1
6
7
5
4
50
strip
J6
RF OUT
50
strip
J2
RF IN
C2
4.7
F
C2
4.7
F
VCC1
VMODE
VCC2
VREG
C4
4.7
F
C3
4.7
F
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Evaluation Board Layout
Board Size 1.5" x 1.5"
Board Thickness 0.032", Board Material FR-4, Multi-Layer, Ground Plane at 0.014"
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