-20
P-Channel E nhancement Mode Field E ffect Trans is tor
AB S OLUTE MAXIMUM R ATINGS (T
A
=25 C unles s otherwis e noted)
Parameter
S ymbol
Limit
Unit
Drain-S ource Voltage
V
DS
V
Gate-S ource Voltage
V
GS
V
Drain Current-Continuous @ Tc=25 C
-Pulsed
I
D
-2
A
A
A
W
I
DM
-7
Drain-S ource Diode Forward Current
I
S
-1
Maximum Power Dissipation
P
D
Operating Junction and S torage
Temperature R ange
T
J
, T
S TG
-55 to 150
C
THE R MAL CHAR ACTE R IS TICS
Thermal R esistance, Junction-to-Ambient
R
thJA
125
/W
C
1.0
a
a
a
a
b
G
D
S
S OT-323
S
G
D
1
S amHop Microelectronics C orp.
P R ODUC T S UMMAR Y
V
DS S
I
D
R
DS (ON) ( m
W
) Max
-20V
-2A
145 @ V
G S
= -4.5V
195 @ V
G S
= -2.5V
F E AT UR E S
S uper high dense cell design for low R
DS (ON
).
R ugged and reliable.
S OT-323 package.
10
S T C 2201
Mar 15 2005 ver1.2
E LE CTR ICAL CHAR ACTE R IS TICS (T
A
25 C unless otherwise noted)
=
Parameter
Symbol
Condition
Min Typ Max Unit
OFF CHAR ACTER ISTICS
Drain-Source Breakdown Voltage
BV
DSS
=
V
GS
0V, I
D
-250uA
=
-20
V
Zero Gate Voltage Drain Current
I
DSS
V
DS
-16V, V
GS
0V
=
=
1
uA
Gate-Body Leakage
I
GSS
V
GS
10V, V
DS
0V
=
=
100 nA
ON CHAR ACTER ISTICS
b
Gate Threshold Voltage
V
GS(th)
V
DS
V
GS
, I
D
=-250uA
=
-0.5
-1.5
V
Drain-Source On-State R esistance
R
DS(ON)
V
GS
-4.5V, I
D
-2.0A
V
GS
-2.5V, I
D
-1.0A
On-State Drain Current
I
D(ON)
V
DS
= -5V, V
GS
= -4.5V
A
S
Forward Transconductance
FS
g
V
DS
-5V, I
D
DYNAMIC CHAR ACTER ISTICS
c
Input Capacitance
C
ISS
C
R SS
C
OSS
Output Capacitance
R everse Transfer Capacitance
V
DS
= -20V, V
GS
= 0V
f =1.0MH
Z
P
F
P
F
P
F
SWITCHING CHAR ACTER ISTICS
c
Turn-On Delay Time
R ise Time
Turn-Off Delay Time
t
D(ON)
t
r
t
D(OFF)
t
f
V
DD
= -10V,
I
D
= -1A,
V
GS
= -4.5V,
R
GEN
= 6
ohm
ns
ns
ns
ns
Total Gate Charge
Gate-Source Charge
Gate-Drain Charge
Q
g
Q
gs
Q
gd
V
DS
= -10V, I
D
= -2A,
V
GS
= -4.5V
nC
nC
nC
C
Fall Time
=
=
=
=
=
2
m-ohm
m-ohm
-5
= -2.0A
6
145
195
S T C 2201
216
55
28
12.7
15.4
25.7
20.4
2.9
0.5
1.1
-0.8
120
170
S T C 2201
Parameter
S ymbol
Condition
Min Typ Max Unit
E LE CTR ICAL CHAR ACTE R IS TICS (T
A
=25 C unless otherwise noted)
DR AIN-S OUR CE DIODE CHAR ACTE R IS TICS
Diode Forward Voltage
V
S D
V
GS
= 0V, Is =-1A
-0.83 -1.2
V
b
C
Notes
c.Guaranteed by design, not subject to production testing.
b.Pulse Test:Pulse Width 300us, Duty Cycle 2%.
F igure 1. Output C haracteristics
F igure 2. Transfer C haracteristics
F igure 4. On-R esistance Variation with
Temperature
F igure 3. C apacitance
-V
DS
, Drain-to S ource Voltage (V )
-V
G S
, G ate-to-S ource Voltage (V )
-V
DS
, Drain-to-S ource Voltage (V )
-
I
D
,
D
r
a
i
n
C
u
r
r
e
n
t
(
A
)
C
,
C
a
p
a
c
i
t
a
n
c
e
(
p
F
)
O
n
-
R
e
s
i
s
t
a
n
c
e
-
I
D
,
D
r
a
i
n
C
u
r
r
e
n
t
(
A
)
a.Surface Mounted on FR 4 Board, t 10sec.
R
D
S
(
O
N
)
,
5
0 5 10 15 20 25 30
C iss
C oss
500
400
300
200
100
0
20
16
12
8
4
0
0
0.5
1
1.5
2
2.5
3
-V
G S
=6V
3
2.2
1.8
1.4
1.0
0.6
0.2
0
-50
0
50
100
125
T j( C )
-25
25
75
V
G S
=-4.5V
I
D
=-2A
C rss
25 C
15
12
9
6
3
0
0.0
0.8
1.6
2.4
3.2
4.0
T j=125 C
-55 C
-V
G S
=2V
-V
G S
=3V
4.8
-V
G S
=4V
-V
G S
=4.5V
(
N
o
r
m
a
l
i
z
e
d
)
T j, J unction T emperature ( C )
-V
G S
=10V
with T emperature
F igure 6. B reakdown V oltage V ariation
with T emperature
V
t
h
,
N
o
r
m
a
l
i
z
e
d
G
a
t
e
-
S
o
u
r
c
e
T
h
r
e
s
h
o
l
d
V
o
l
t
a
g
e
g
F
S
,
T
r
a
n
s
c
o
n
d
u
c
t
a
n
c
e
(
S
)
-
V
G
S
,
G
a
t
e
t
o
S
o
u
r
c
e
V
o
l
t
a
g
e
(
V
)
B
V
D
S
S
,
N
o
r
m
a
l
i
z
e
d
D
r
a
i
n
-
S
o
u
r
c
e
B
r
e
a
k
d
o
w
n
V
o
l
t
a
g
e
-
I
s
,
S
o
u
r
c
e
-
d
r
a
i
n
c
u
r
r
e
n
t
(
A
)
F igure 7. T rans conductance V ariation
with Drain C urrent
-I
DS
, Drain-S ource C urrent (A)
F igure 9. G ate C harge
Qg, T otal G ate C harge (nC )
F igure 10. Maximum S afe
O perating Area
-V
DS
, Drain-S ource V oltage (V )
F igure 8. B ody Diode F orward V oltage
V ariation with S ource C urrent
-V
S D
, B ody Diode F orward V oltage (V )
T j, J unction T emperature ( C )
T j, J unction T emperature ( C )
-
I
D
,
D
r
a
i
n
C
u
r
r
e
n
t
(
A
)
20
10
0
1
0.4
0.8
1.2
1.6
2.0
2.4
4
3
2
1
0
0
0.5 1 1.5 2
2.5
3
3.5 4
V
DS
=-4.5V
I
D
=-2A
T
J
=25 C
13
10
1 1
0.1
0.03
0.1
1
10 20
50
R
DS
(O
N)
Li
mi
t
10m
s
100
ms
1s
DC
V
G S
=-4.5V
S ingle P ulse
Tc=25 C
4
-50 -25
0
25
50
75 100 125
1.15
1.10
1.05
1.00
0.95
0.90
0.85
I
D
=-250uA
1.3
1.2
1.1
1.0
0.9
0.8
0.7
0.6
-50 -25
0
25
50
75 100 125
V
DS
=V
G S
I
D
=-250uA
S T C 2201
5
4
3
2
6
0
0
3
6
9
12
15
1
V
DS
=-5V
5
F igure 11. S witching T est C ircuit
F igure 12. S witching Waveforms
t
V
V
t
t
d(on)
OUT
IN
on
r
10%
t
d(off)
90%
10%
10%
50%
50%
90%
t
off
t
f
90%
PULS E WIDTH
5
INVE R TE D
V
DD
R
D
V
V
R
S
V
G
G S
IN
G E N
OUT
L
5
S T C 2201
0.01
0.1
1
10
0.00001
0.0001
0.001
0.01
0.1
1
10
100
1000
Square Wave Pulse Duration(sec)
Normalized Thermal Transient Impedance Curve
N
o
r
m
a
l
i
z
e
d
T
r
a
n
s
i
e
n
t
T
h
e
r
m
a
l
R
e
s
i
s
t
a
n
c
e
Single Pulse
on
P
DM
t
1
t
2
1. R
thJ A
(t)=r (t) * R
J A
2. R
J A
=S ee Datasheet
3. T
J M-
T
A
= P
DM
* R
J A
(t)
4. Duty C ycle, D=t
1
/t
2
th
th
th
0.01
0.02
0.5
0.2
0.1
0.05
J
1.8
1.8
1.15
0.25
0
----
1.30 REF.
0.80
0.10
2.2
2.4
1.35
0.4
0.10
----
1.00
0.25
0.709
0.709
0.453
0.098
0
----
0.315
0.039
0.866
0.945
0.531
0.157
0.039
----
0.394
0.098
----
0.65
----
----
0.256
----
6
G
A
C
B
L
D (TYP.)
E
H
I
F
G
I
J
L
0.512 REF.
---
----
S O T -323
S T C 2201
SOT-323 Tape and Reel Data
SOT-323 Carrier Tape
SOT-323 Reel
7
2.40
0.10
2.40
0.10
1.19
0.10
1.00
+0.25
1.50
+0.10
8.00
+0.30
-0.10
1.75
0.10
3.50
0.05
4.00
0.10
4.00
0.10
2.00
0.05
0.254
0.02
178
178
1
60
1
9.00
0.5
12.00
0.5
13.5
0.5
2.00
0.5
10.0
18.00
5.00
8
V
UNIT:
R
G
S
K
H
W1
W
N
M
10.5
REEL SIZE
TAPE SIZE
UNIT:
PACKAGE
SOT-323
A0
B0
K0
D0
D1
E
E1
E2
P0
P1
P2
T
S T C 2201
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