Multilayer Ceramic Capacitor

- 1 -

INTRODUCTION

MLCC(Multilayer Ceramic Capacitor) is SMD(Surface Mounted Device) type capacitor that is used
in wide ranges of capacitance. MLCC is paid more attentions than other capacitors due to the
better frequency characteristics, higher reliability, higher withstanding voltage and so on.
MLCC is made of many layers of ceramic and inner electrodes like sandwich. Pd was used for
inner electrodes. But the price of Pd was skyrocketed and Pd was replaced by the BME(Base
Metal Electrode), which reduced the total cost of MLCC.
This inner electrode is connected to outer termination for surface mounting, which is composed of
three layers, Cu or Ag layer, Ni plating layer, and SnPb or Sn plating layer. Most of MLCCs
become Pb free by the environmental issue at present.
MLCC is divided into two classes. Class I(C0G, etc) is the temperature compensating type. It has
a small TCC(Temperature Coefficient of Capacitance) and a better frequency performance.
Therefore, it is used in RF applications such as cellular phone, tuner, and so on. Class II(X7R,
X5R, Y5V, etc) is the high dielectric constant type, which is used in general electronic circuit.
Especially high capacitance MLCC is replacing other capacitors (Tantalum and Aluminum
capacitor) due to the low ESR(Equivalent Series Resistance) value.

FEATURE AND APPLICATION

Feature

- Miniature Size
- Wide Capacitance and Voltage Range
- Highly Reliable Performance
- Tape & Reel for Surface Mount Assembly
- Low ESR
- High Q at High Frequencies
- Stable Temperature Dependence of Capacitance

Application

- High Frequency Circuit(Tuner, VCO, PAM etc)
- General Power Supply Circuit(SMPS etc)
- DC-DC Converter
- General Electronic Circuit

Multilayer Ceramic Capacitor

- 4 -

PREVIOUS PART NUMBERING

Symbol

EIA Code

Temperature

Coefficient(PPM/

)

Temperature

Characteristics

Operation

Temperature Range

C0G(CH)

-55 ~ +125

P2H

-150

R2H

-220

S2H

-330

T2H

-470

U2J

-750

120

S2L

+350 ~ -1000

CLASS

(Temperature Compensation)

Temperature

Characteristics

below 2.0pF 2.2 ~ 3.9pF above 4.0pF above 10pF

C0G

P2J

P2H

R2J

R2H

S2J

S2H

T2J

T2H

U2J

Symbol

EIA Code

Capacitance Change

(

C : %)

Operation

Temperature Range

X5R

-55 ~ +85

X7R

-55 ~ +125

Y5V

+22 ~ -82

-30 ~ +85

CLASS

(High Dielectric Constant)

SAMSUNG Multilayer Ceramic Capacitor
Type(Size)
Capacitance Temperature Characteristics
Nominal Capacitance
Capacitance Tolerance
Rated Voltage
Thickness Option
Packaging Type

101

CAPACITANCE TEMPERATURE CHARACTERISTICS

Temperature Characteristics

K :

250 PPM/

J :

120 PPM/

H :

60 PPM/

G :

30 PPM/

Multilayer Ceramic Capacitor

- 5 -

Temperature

Characteristics

Symbol

Tolerance

Applicable Capacitance & Range

C0G(NPO)

T.C Series

0.1pF

0.5 ~ 3pF

0.25pF

0.5 ~ 10pF

0.5pF

1pF

6 ~ 10pF

E-24 Series for over 10pF

10%

A(X5R)
B(X7R)

E-12 Series

10%

20%

F(Y5V)

-20% ~ +80%

E-6 Series

CAPACITANCE TOLERANCE

The nominal capacitance value is expressed in pico-Farad(pF) and identified by three-
digit number, first two digits represent significant figures and last digit specifies the
number of zeros to follow. For values below 1pF, the letter "R" is used as the decimal
point and the last digit becomes significant.

example)

100 : 10

10pF

102 : 10

= 1000pF

020 : 2

2pF

1R5 : 1.5pF

NOMINAL CAPACITANCE

Please consult us for special tolerances.

Symbol

Rated Voltage(Vdc)

Symbol

Rated Voltage(Vdc)

6.3V

200V

10V

500V

16V

1000V

25V

2000V

50V

3000V

100V

RATED VOLTAGE

Multilayer Ceramic Capacitor

- 6 -

Symbol

Packaging

Symbol

Packaging

Bulk

Embossed Tape, 13" Reel

Cassette

Paper 13" Reel

Paper Tape, 7" Reel

Paper 10" Reel

Paper Tape, 13" Reel

Embossed Tape, 10" Reel

Embossed Tape, 7" Reel

PACKAGING TYPE

THICKNESS OPTION

Symbol

Description of the Code

Standard thickness (please refer to standard thickness table on next page)

Thinner than standard thickness

Thicker than standard thickness

Standard Thickness High Q ( Low ` D.F ` )

Sn-100% (High-Q)

Sn-100% (General)

Please Consult us for other termination type.

Series

Capacitance Step

E- 3

1.0

2.2

4.7

E- 6

1.0

1.5

2.2

3.3

4.7

6.8

E-12

1.0

1.2

1.5

1.8

2.2

2.7

3.3

3.9

4.7

5.6

6.8

8.2

E-24

1.0

1.2

1.5

1.8

2.2

2.7

3.3

3.9

4.7

5.6

6.8

8.2

1.1

1.3

1.6

2.0

2.4

3.0

3.6

4.3

5.1

6.2

7.5

9.1

Standard Capacitance is " Each step

STANDARD CAPACITANCE STEP

Multilayer Ceramic Capacitor

- 7 -

NEW PART NUMBERING

101

PRODUCT ABBREVIATION

Symbol

Product Abbreviation

SAMSUNG Multilayer Ceramic Capacitor

SIZE(mm)

Symbol

Size(mm)

Length

Width

0.6

0.3

1.0

0.5

1.6

0.8

2.0

1.2

3.2

1.6

3.2

2.5

4.5

3.2

5.7

5.0

SAMSUNG Multilayer Ceramic Capacitor
Size(mm)
Capacitance Temperature Characteristic
Nominal Capacitance
Capacitance Tolerance
Rated Voltage
Thickness Option
Product & Plating Method
Samsung Control Code
Reserved For Future Use
Packaging Type

Multilayer Ceramic Capacitor

- 8 -

CAPACITANCE TEMPERATURE CHARACTERISTIC

Symbol

Temperature Characteristics

Temperature

Range

Class

COG

30(ppm/

)

-55 ~ +125

P2H

-150

R2H

-220

S2H

-330

T2H

-470

U2J

-750

S2L

+350 ~ -1000

Class

X5R

15%

-55 ~ +85

X7R

15%

-55 ~ +125

Y5V

+22 ~ -82%

-30 ~ +85

Temperature Characteristic

Temperature

Characteristics

Below 2.0pF

2.2 ~ 3.9pF

Above 4.0pF

Above 10pF

C0G

P2J

P2H

R2J

R2H

S2J

S2H

T2J

T2H

U2J

J :

120PPM/

, H :

60PPM/

, G :

30PPM/

NOMINAL CAPACITANCE

Nominal capacitance is identified by 3 digits.
The first and second digits identify the first and second significant figures of the capacitance.
The third digit identifies the multiplier. 'R' identifies a decimal point.

Example

Symbol

Nominal Capacitance

1R5

1.5pF

103

10,000pF, 10nF, 0.01

104

100,000pF, 100nF, 0.1

Multilayer Ceramic Capacitor

- 11 -

PRODUCT & PLATING METHOD

Symbol

Electrode

Termination

Plating Type

Sn_100%

SAMSUNG CONTROL CODE

Symbol

Description of the code

Symbol

Description of the code

Array (2-element)

Normal

Array (4-element)

Automotive

High - Q

3 Terminal EMI Filter

LICC

RESERVED FOR FUTURE USE

Symbol

Description of the code

Reserved for future use

PACKAGING TYPE

Symbol

Packaging Type

Symbol

Packaging Type

Bulk

Embossing 13" (10,000EA)

Bulk Case

Paper 13" (15,000EA)

Paper 7"

Paper 10"

Paper 13" (10,000EA)

Embossing 10"

Embossing 7"

Multilayer Ceramic Capacitor

- 12 -

CAPACITANCE vs CHIP THICKNESS STANDARD

Description

0603

(0201)

1005

(0402)

1608

(0603)

2012 Type

(0805)

3216 Type

(1206)

3225 Type

(1210)

4532 Type

(1812)

5750 Type

(2220)

Dimension

(mm)

0.6

0.03

1.0

0.05

1.6

0.1

2.0

0.1

3.2

0.15

3.2

0.2

3.2

0.3

4.5

0.4

5.7

0.4

0.3

0.03

0.5

0.05

0.8

0.1

1.25

0.1

1.6

0.15

1.6

0.2

2.5

0.2

3.2

0.3

5.0

0.4

0.3

0.03

0.5~

0.05

0.8

0.1

0.65

0.1

0.85

0.1

1.25

0.1

0.85

0.15

1.25

0.15

1.6

0.2

1.25

0.2

1.6

0.2

2.0

0.2

2.5

0.2

1.25

0.2

1.6

0.2

2.0

0.2

2.5

0.2

1.6

0.2

2.0

0.2

2.5

0.2

(

)

50V

0.5~

240

0.5 ~

1000

0.5

~1000

1100 ~

1500

1600~

2700

0.5 ~

2700

3000~

5600

6200~

8200

C, TC

(Except

SL,UJ)

25V

0.5~

220

0.5 ~

1000

3300~

8200

1500~

3600

3900~

6800

7500~

10000

100000

50V

0.5 ~

180

0.5 ~

1000

0.5 ~

560

620~

1000

1100~

3300

0.5 ~

2200

2400~

4700

560~

10000

11000

22000

24000~

47000

1000~

13000

15000~

22000

24000~

47000

62000~

68000 43000 93000 130000

E
R

(

)

(X5R)

6.3V

220

2200

10000

22000

47000

10V

100

1000

2200

4700~

10000

22000

47000

16V

330~

470

1000

4700

6800~

10000

25V

50V

6.8~

(X7R)

6.3V

0.1~

47~

100

470~

1000

6800~

10000

22000

10V

0.1~

33~

100

220~

470

220~

270

330~

470

560~

1000

1000~

3300

4700 1500~

2200 3300

3900~

4700

22000

16V

0.1~

10~

100~

220

68~

200

220~

330

390~

1000

330~

680

1000~

1500

2200~

3300

1500~

2200 3300

3900~

4700

2200

25V

4.7~

47~

100

39~

82~

100

150~

470

100~

330

470~

620

680~

1000

680~

1500 1800

2200

1000

10000

50V

0.22~

4.7

0.22~

100

0.22~

47~

100

220

150

220

390~

1000

2.2~

680

820~

1000

10~

1000

3300~

4700

(Y5V)

6.3V

10~

100

2200

10000

47000

10V

220~

330

100~

1000

4700

4700 10000~

22000

100000

16V

10~

220

100~

1000

10~

680

820~

1000

1200~

2200

1000~

2200

2700~

4700 10000

3300~

6800 10000 15000

22000

25V

10~

22~

330

10~

220

270~

470

560~

1000

470~

1000

1200~

2200

2700~

3300

1000~

3300

4700~

10000

50V

2.2~

100

2.2~

82~

150

180~

1000

10~

470

560~

1000

100~

1000

10000

Multilayer Ceramic Capacitor

- 13 -

PACKAGING

CARDBOARD PAPER TAPE

Symbol

Type

8.0

0.3

3.5

0.05

1.75

0.1

2.0

0.05

2.0

0.05

4.0

0.1

1.5

+0.1/-0

0.37

0.03

0.38

0.03

0.68

0.03

0.6

0.05

0.65

+0.05/-0.1

1.15

+0.05/-0.1

4.0

0.1

1.1

MAX

1.1

0.2

1.9

0.2

1.6

0.2

2.4

0.2

2.0

0.2

3.6

0.2

unit : mm

EMBOSSED PLASTIC TAPE

Symbol

Type

8.0

0.3

3.5

0.05

1.75

0.1

4.0

0.1

2.0

0.05

4.0

0.1

1.5

+0.1/-0

0.6

max

2.5

max

1.45

0.2

2.3

0.2

2.0

0.2

3.6

0.2

2.9

0.2

3.6

0.2

3.6

0.2

4.9

0.2

5.4

0.2

6.0

0.2

unit : mm

Feeding round holes

Perforated square
holes for inserting a chip

Feeding round holes

Perforated square
holes for inserting a chip

Multilayer Ceramic Capacitor

- 18 -

CLASS

, B(X7R)

Temperature

Characteristics

Size

Voltage

Capacitance Range (

)

B(X7R)

(0201)

6.3V

10V

16V

(0402)

6.3V

10V

16V

25V

50V

(0603)

6.3V

10V

16V

25V

50V

(0805)

6.3V

10V

16V

25V

50V

(1206)

6.3V

10V

16V

25V

50V

100

1000

10000

100000

1000000 10000000 100000000

100000

47000

4700000

470000

100000

1000000

470000

220000

1000000

3300000

1000000

100

10000

10000000

100000

100

10000

100

1000

6800000

33000

10000

33000

10000

4700

220

470000

220000

100000

47000

220

220000

1000000

68000

39000

220

1000000

330000

100000

1000000

1000

Multilayer Ceramic Capacitor

- 20 -

CLASS

, F(Y5V)

Temperature

Characteristics

Size

Voltage

Capacitance Range (

)

F(Y5V)

(0201)

6.3V

(0402)

10 V

16 V

25 V

50 V

(0603)

6.3V

10 V

16 V

25 V

50 V

(0805)

6.3V

10 V

16 V

25 V

50 V

(1206)

10 V

16 V

25 V

50 V

(1210)

6.3V

10 V

16 V

25 V

50 V

(1812)

16V

25 V

50 V

(2220)

10 V

330000

33000

10000

220000

10000

2200

1000000

330000

100000

22000

2200

1000000

2200000

10000

22000000

4700000

10000000

3300000

1000000

470000

10000

4700000

1000000

15000000

3300000

1000000

100000

10000000

22000000

10000

220000

10000000

100000000

2200000

10000000

100000

10000

1000000

100000

1000000

2200

47000000

22000000

100

1000

10000

100000 1000000 10000000 100000000

Multilayer Ceramic Capacitor

- 21 -

RELIABILITY TEST DATA

ITEM

PERFORMANCE

TEST CONDITION

APPEARANCE

NO ABNORMAL EXTERIOR APPEARANCE

THROUGH MICROSCOPE(

10)

INSULATION

RESISTANCE

10,000

OR 500

PRODUCT WHICHEVER IS

SMALLER

(RATED VOLTAGE IS BELOW 16V

: 10,000

OR 100

)

RATED VOLTAGE SHALL BE APPLIED.

MEASUREMENT TIME IS 60 ~ 120 RATED VOLTAGE

TIME 60 SEC.

WITHSTANDING

VOLTAGE

NO DIELECTRIC BREAKDOWN OR

MECHANICAL BREAKDOWN

CLASS

: 300% OF THE RATED VOLTAGE FOR 1~5 SEC,

CLASS

:250% OF THE RATED VOLTAGE FOR 1~5 SEC

IS APPLIED WITH LESS THAN 50

CURRENT

CAPACIT

ANCE

CLASS

WITHIN THE SPECIFIED

TOLERANCE

CAPACITANCE

FREQUENCY

VOLTAGE

1,000

AND

BELOW

10%

0.5 ~ 5 Vrms

MORE THAN

1,000

10%

CLASS

WITHIN THE SPECIFIED

TOLERANCE

CAPACITANCE

FREQUENCY

VOLTAGE

AND BELOW

10%

1.0

0.2Vrms

MORE THAN

120

20%

0.5

0.1Vrms

CLASS

OVER 30

: Q

1,000

LESS THAN 30

: Q

400 +20C

( C : CAPACITANCE )

CAPACITANCE

FREQUENCY

VOLTAGE

1,000

AND

BELOW

10%

0.5 ~ 5 Vrms

MORE THAN

1,000

10%

Tan

CLASS

1. CHAR : B

2. CHAR : F

CAPACITANCE

FREQUENCY

VOLTAGE

AND BELOW

10%

1.0

0.2Vrms

MORE THAN 10

120

20%

0.5

0.1Vrms

RATED VOLTAGE

DF SPEC

6.3V

0.05 max

10V

0.05 max

16V

0.035 max

25V

0.025 max

50V

0.025 max

6.3V

10V

16V

25V

50V

1005

0.125max

0.09max (C

220nF)

0.125max (C

220nF)

0.05max

1608

0.16max

0.125max

0.09max

0.05max(C

100nF)

0.07max(C>100nF)

0.05max

2012

0.16max

0.125max

0.09max

0.07max

0.05max

3216

0.16max

0.125max

0.09max

0.07max

0.05max

3225

0.16max

0.125max

0.09max

0.07max(C

6.8

)

0.09max(C>6.8

)

0.05max

4532

0.16max

0.09max

5750

0.125max

Multilayer Ceramic Capacitor

- 22 -

ITEM

PERFORMANCE

TEST CONDITION

CAPACITANCE

TEMPERATURE

COEFFICIENT

CLASS

THESE SYMMETRICAL TOLERANCE APPLY TO

2 POINT MEASUREMENT OF TEMPERATURE

COEFFICIENT: ONE AT 25

AND AT 85

TEMPERATURE

CHARACTERISTIC

CLASS

CAPACITANCE CHANGE

The change of capacitance should be got from

the capacitance at 25

After capacitance measured from Min. Temp. to

Max. Temp.,

it should be calculated from the formula below.

C2 - C1

C1 : CAPACITANCE AT STANDARD

TEMPERATURE(25

)

C2 : CAPACITANCE AT EACH

TEMPERATURE

ADHESIVE STRENGTH

OF TERMINATION

NO INDICATION OF PEELING SHALL

OCCUR ON THE TERMINAL

ELECTRODE.

A 500g.f PRESSURE SHALL BE

APPLIED FOR 10

1 SECOND.

SEE (FIG.1)

BENDING

STRENGTH

APPEARANCE

NO MECHANICAL DAMAGE SHALL

OCCUR.

BENDING SHALL BE APPLIED TO

THE LIMIT(1mm) WITH 0.3mm/SEC.

KEEP THE TEST BOARD AT THE LIMIT POINT

IN 5 SEC., THEN MEASURE CAPACITANCE.

SEE (FIG.2)

CAPACITANCE

CHARACTER

CHANGE OF

CAPACITANCE

CLASS I

WITHIN

0.5 pF

WHICHEVER IS

LARGER

CLASS II

A,B

WITHIN

12.5%

WITHIN

30%

CHAR.

CAP. CHANGE(%)

A,B

15%

+22% ~ -82%

500g.f

× 100 %

R=340

BENDING

LIMIT

CHARACTER

LIMIT

C, A, B, F

1mm

CHARACTERISTIC

TEMP. COEFFICIENT

(PPM/

)

C0G

-150

-220

-330

-470

-750

120

+350 ~ -1000

STEP

TEMPERATURE

MIN RATED TEMP

MAX RATED TEMP

Multilayer Ceramic Capacitor

- 23 -

THE INITIAL VALUE OF HIGH DIELECTRIC CONSTANT SERIES SHALL BE MEASURED

AFTER THE HEAT TREATMENT OF 150 +0/-10

, 1Hr AND SITTING OF 48

4hr AT ROOM TEMPERATURE & ROOM HUMIDITY.

ITEM

PERFORMANCE

TEST CONDITION

SOLDERABILITY

MORE THAN 75% OF THE TERMINAL

SURFACE IS TO BE SOLDERED NEWLY,

SO METAL PART DOES NOT COME

OUT OR DISSOLVE

IN PB--FREE PART, MORE THAN 95%

OF THE TERMINAL SURFACE IS TO BE

SOLDERED NEWLY

SOLDER TEMPERATURE : 230

DIP TIME : 3

1 Sec

SOLDER

: H63A

FLUX

: RMA TYPE

*PB-FREE

SOLDER TEMPERATURE : 260

SOLDER : Sn96.5-3Ag-0.5Cu

Flux : RMA TYPE

DIP TIME : 3

0.1Sec

* PRE-HEATING : AT 80~120

FOR 10~30SEC.

RESISTANCE

TO SOLDERING

HEAT

APPEARANCE

NO MECHANICAL DAMAGE

SHALL OCCUR

DIP : SOLDER TEMPERATURE OF

270

DIP TIME :10

1 SEC.

EACH TERMINATION SHALL BE FULLY

IMMERSED AND PREHEATED

AS FOLLOWING:

MEASURE AT ROOM TEMP. AFTER

COOLING FOR

CLASS

: 24

2 HOURS

CLASS

: 48

4 HOURS

CAPACITANCE

CHARACTERISTIC

CAP. CHANGE

CLASS

WITHIN

2.5% OR

0.25

WHICHEVER

IS LARGER

CLASS

A,B

WITHIN

7.5%

WITHIN

20%

CLASS

AND OVER : Q

1000

LESS THAN 30

: Q

400+20

Tan

CLASS

TO SATISFY THE SPECIFIED

INITIAL VALUE

INSULATION

RESISTANCE

TO SATISFY THE SPECIFIED

INITIAL VALUE

WITHSTANDING

VOLTAGE

TO SATISFY THE SPECIFIED

INITIAL VALUE

VIBRATION

TEST

APPEARANCE

NO MECHANICAL DAMAGE SHALL

OCCUR.

BENDING SHALL BE APPLIED TO

THE LIMIT(1mm) WITH 0.3mm/SEC.

KEEP THE TEST BOARD AT THE LIMIT POINT

IN 5 SEC., THEN MEASURE CAPACITANCE.

THE ENTIRE FREQUENCY RANGE,

FROM 10 TO 55Hz AND RETURN

TO 10Hz, SHALL BE TRAVERSED

IN 1 MINUTE.

THIS CYCLE SHALL BE PERFORMED

2 HOURS IN EACH THERE MUTUALLY

PERPENDICULAR DIRECTION,

FOR TOTAL PERIOD OF 6 HOURS.

CAPACITANCE

CHARACTERISTIC

CAP. CHANGE

CLASS

WITHIN

2.5% OR

0.25

WHICHEVER

IS LARGER

CLASS

A,B

WITHIN

20%

CLASS

AND OVER : Q

1000

LESS THAN 30

: Q

400+20

Tan

CLASS

TO SATISFY THE SPECIFIED

INITIAL VALUE

INSULATION

RESISTANCE

TO SATISFY THE SPECIFIED

INITIAL VALUE

STEP

TEMP.(

)

TIME

(SEC.)

80~100

150~180

CHAR.

FREQUENCY RANGE

A,B,C,F

10Hz

55Hz

10Hz

CHAR.

TRAVERSED TIME

A,B,C,F

1 min

Multilayer Ceramic Capacitor

- 24 -

ITEM

PERFORMANCE

TEST CONDITION

HUMIDITY

(STEADY

STATE)

APPEARANCE

NO MECHANICAL DAMAGE SHALL OCCUR

TEMPERATURE

: 40

RELATIVE HUMIDITY:90~95 %RH

TEST TIME

: 500 +12/-0 Hr.

MEASURE AT ROOM TEMPERATURE

AFTER COOLING FOR

CLASS

: 24

2 Hr.

CLASS

: 48

4 Hr.

CAPACITANCE

CHARACTERISTIC

CAPACITANCE CHANGE

CLASS

WITHIN

5% OR

0.5

WHICHEVER

IS LARGER

CLASS

A,B

WITHIN

12.5%

WITHIN

30%

CLASS

AND OVER : Q

350

10 ~30

: Q

275 + 2.5

LESS THAN 10pF : Q

200 + 10

Tan

CLASS

INSULATION

RESISTANCE

MINIMUM INSULATION RESISTANCE:

1,000

OR 50

PRODUCT WHICHEVER IS

SMALLER

MOISTURE

RESISTANCE

APPEARANCE

NO MECHANICAL DAMAGE SHALL OCCUR

APPLIED VOLTAGE :

RATED VOLTAGE

TEMPERATURE : 40

RELATIVE HUMIDITY:90~95%RH

TEST TIME : 500 +12/-0 Hr.

CURRENT APPLIED : 50

MAX.

<INITIAL MEASUREMENT>

CLASS

SHOULD BE MEASURED

INITIAL VALUE AFTER BE HEAT-TREATED

FOR 1 HR IN 150

+0/-10

AND BE LEFT

FOR 48

4HR AT ROOM TEMPERATURE.

<LATTER MEASUREMENT>

CLASS

SHOULD BE MEASURED AFTER

LEFT FOR 24

2 HRS IN ROOM

TEMPERATURE AND HUMIDITY.

CLASS

SHOULD BE MEASURED

LATTER VALUE AFTER BE

HEAT-TREATED FOR 1 HR IN 150

+0/-10

AND BE LEFT FOR 48

4HR AT ROOM

TEMPERATURE.

CAPACITANCE

CHARACTERISTIC

CAPACITANCE CHANGE

CLASS

WITHIN

7.5% OR

0.75

WHICHEVER

IS LARGER

CLASS

A,B

WITHIN

12.5%

WITHIN

30%

WITHIN +30~

40%

1005 C>0.47

1608 C>1.0

2012 C>4.7

3216 C>10.0

3225 C>22.0

4532 C>47.0

CLASS

AND OVER : Q

200

AND BELOW : Q

100 + 10/3

Tan

CLASS

INSULATION

RESISTANCE

MINIMUM INSULATION RESISTANCE:

500

OR 25

PRODUCT,

WHICHEVER IS SMALLER.

CHAR.

25V

AND

OVER

16V

10V

6.3V

A,B

0.05

0.05 MAX

0.05

MAX

0.075

MAX

0.1

MAX

0.075

MAX

0.1MAX

1.0

)

0.125

MAX

1.0

)

0.15

MAX

0.195

MAX

0.25

MAX

CHAR.

25V

AND

OVER

16V

10V

6.3V

A,B

0.05

MAX

0.05

MAX

0.05

MAX

0.075

MAX

0.1

MAX

0.075

MAX

0.1MAX

1.0

)

0.125MAX

1.0

)

0.15

MAX

0.195

MAX

0.25

MAX

6.3V

Tan

0.125 MAX *Condition

CLASS

(A,B)

1005 C

0.22

1608 C

2.2

2012 C

4.7

3216 C

10.0

3225 C

22.0

4532 C

47.0

5750 C

100.0

6.3V Tan

0.125 MAX *Condition

CLASS

(A,B)

1005 C

0.22

1608 C

2.2

2012 C

4.7

3216 C

10.0

3225 C

22.0

4532 C

47.0

5750 C

100.0

Multilayer Ceramic Capacitor

- 25 -

ITEM

PERFORMANCE

TEST CONDITION

HIGH

TEMPERATURE

RESISTANCE

APPEARANCE

NO MECHANICAL DAMAGE SHALL OCCUR

APPLIED VOLTAGE :

150%, 200% OF RATED VOLTAGE

TEST TIME : 1000 +48/-0 Hr.
CURRENT APPLIED : 50

MAX.

<INITIAL MEASUREMENT>
CLASS

SHOULD BE MEASURED INITIAL

VALUE AFTER BE HEAT-TREATED FOR 1
HR IN 150

+0/-10

AND BE LEFT FOR 48

4HR AT ROOM TEMPERATURE.
<LATTER MEASUREMENT>
CLASS

SHOULD BE MEASURED AFTER

LEFT FOR 24

2 HRS IN ROOM

TEMPERATURE AND HUMIDITY.
CLASS

SHOULD BE MEASURED LATTER

VALUE AFTER BE HEAT-TREATED FOR 1
HR IN 150

+0/-10

AND BE LEFT FOR 48

4HR AT ROOM TEMPERATURE.

(TWICE OF RATED VOLTAGE WILL BE
APPLIED TO ALL SERIES BUT ABOVE)

** HOWEVER, A/B

1005 C

0.22

SEE (FIG.3)

CAPACITANCE

CHARACTERISTIC

CAP. CHANGE

CLASS

WITHIN

3% OR

0.3

WHICHEVER IS LARGER

CLASS

A,B

WITHIN

12.5%

WITHIN

30%

WITHIN+30~40%

1005 C>0.47

1608 C>1.0

2012 C>4.7

3216 C>10.0

3225 C>22.0

4532 C>47.0

CLASS

AND OVER : Q

350

10 ~ 30

: Q

275 + 2.5

LESS THAN 10

200 + 10

Tan

CLASS

INSULATION

RESISTANCE

MINIMUM INSULATION RESISTANCE:

1,000

OR 50

PRODUCT

WHICHEVER IS SMALLER

TEMPERATURE

CYCLE

APPEARANCE

NO MECHANICAL DAMAGE SHALL OCCUR

CAPACITORS SHALL BE SUBJECTED

TO FIVE CYCLES OF THE

TEMPERATURE CYCLE AS FOLLOWING

STEP

TEMP.(

)

TIME(MIN)

MIN.RATED

TEMP.+0/-3

2~3

MAX.RATED

TEMP.+3/-0

2~3

MEASURE AT ROOM TEMPERATURE

AFTER COOLING FOR

CLASS

: 24

2 Hr.

CLASS

: 48

4 Hr.

CAPACITANCE

CHARACTERISTIC

CAP. CHANGE

CLASS

WITHIN

2.5%

0.25

WHICHEVER IS

LARGER

CLASS

A,B

WITHIN

7.5%

WITHIN

20%

CLASS

AND OVER : Q

1000

LESS THAN 30

400 +20

Tan

CLASS

TO SATISFY THE SPECIFIED

INITIAL VALUE

INSULATION

RESISTANCE

TO SATISFY THE SPECIFIED

INITIAL VALUE

CHAR.

25V

AND

OVER

16V

10V

6.3V

A,B

0.05

MAX

0.05

MAX

0.05

MAX

0.075

MAX

0.1

MAX

0.075

MAX

0.1MAX

(C<1.0

)

0.125MAX

1.0

)

0.15

MAX

0.195

MAX

0.25

MAX

CHAR.

TEMP.

CLASS

125

CLASS

125

*150% Authorization Conditions

CLASS

(A,B,F)

1005 C>0.47

1608 C

2.2

2012 C

4.7

3216 C

10.0

3225 C

22.0

4532 C

47.0

5750 C

100.0

Multilayer Ceramic Capacitor

- 26 -

CHARACTERISTIC GRAPH

50 100

1000

10000

-10

-20

-30

Time(Hr)

C0G

X7R

Y5V

CAPACITANCE CHANGE - AGING

-60

140

-20

100

Temperature(

)

-5

-10

C0G

IMPEDANCE - FREQUENCY CHARACTERISTICS

CAPACITANCE - DC VOLTAGE CHARACTERISTICS

C0G

0.01

0.1

100

1.E+06

1.E+07

1.E+08

1.E+09

1.E+10

Ohm

1MHz

10MHz

100MHz

1GHz

10GHz

1000pF

100pF

10pF

X7R/Y5V

0.01

0.1

100

1.E+06

1.E+07

1.E+08

1.E+09

Ohm

0.1

0.01

0.001

1MHz

10MHz

100MHz

1GHz

-100

-80

-60

-40

-20

DC V o l t a g e (V d c )

C0G 50V

X7R

50V

Y5V

50V

-60

120

-20

20 40

-80

-60

-40

-20

X7R

Y5V

Temperature(

)

CAPACITANCE - TEMPERATURE CHARACTERISTICS

ELECTRICAL CHARACTERISTICS

Multilayer Ceramic Capacitor

- 27 -

APPLICATION MANUAL

Storage Condition

Storage Environment

The electrical characteristics of MLCCs were degraded by the environment of high temperature
or humidity. Therefore, the MLCCs shall be stored in the ambient temperature and the relative
humidity of less than 40

and 70%, respectively. Guaranteed storage period is within 6 months

from the outgoing date of delivery.

Corrosive Gases

Since the solderability of the end termination in MLCC was degraded by a chemical atmosphere
such as chlorine, acid or sulfide gases, MLCCs must be avoid from these gases.

Temperature Fluctuations

Since dew condensation may occur by the differences in temperature when the MLCCs are
taken out of storage, it is important to maintain the temperature-controlled environment.

Design of Land Pattern

When designing printed circuit boards, the shape and size of the lands must allow for the
proper amount of solder on the capacitor. The amount of solder at the end terminations has a
direct effect on the crack.

The crack in MLCC will be easily occurred by the tensile stress which

was due to too much amount of solder. In contrast, if too little solder is applied, the termination
strength will be insufficiently. Use the following illustrations

as guidelines for proper land design.

Recommendation of Land Shape and Size

Solder

Land

Solder Resist

2/3W < b < W

Solder Resist

2/3T < a < T

Adhesives

When flow soldering the MLCCs, apply the adhesive in accordance with the following conditions.

Requirements for Adhesives

They must have enough adhesion, so that, the chips will not fall off or move during the
handling of the circuit board.
They must maintain their adhesive strength when exposed to soldering temperature.
They should not spread or run when applied to the circuit board.
They should harden quickly.
They should not corrode the circuit board or chip material.

Multilayer Ceramic Capacitor

- 28 -

They should be a good insulator.
They should be non-toxic, and not produce harmful gases, nor be harmful when touched.

Application Method

It is important to use the proper amount of adhesive. Too little

and much adhesive will cause

poor adhesion and overflow into the land, respectively.

Adhesive hardening Characteristics

To prevent oxidation of the terminations, the adhesive must harden at 160

or less, within

2 minutes or less.

Mounting

Mounting Head Pressure

Excessive pressure will cause crack to MLCCs. The pressure of nozzle will be 300g maximum
during mounting.

Bending Stress

When double-sided circuit boards are used,

MLCCs first are mounted and soldered onto one side

of the board. When the MLCCs are mounted onto the other side, it is important to support the
board as shown in the illustration.

If the circuit board is not supported, the crack occur to the

ready-installed MLCCs by the bending stress.

support pin

force

nozzle

Flux

Although the solderability increased by the highly-activated flux, increase of activity in flux may

also degrade the insulation of the chip capacitors. To avoid such degradation, it is recommended

that a mildly activated rosin flux(less than 0.2% chlorine) be used.

Multilayer Ceramic Capacitor

- 29 -

Soldering

Since a multilayer ceramic chip capacitor comes into direct contact with melted solder during
soldering, it is exposed to potentially mechanical stress caused by the sudden temperature
change. The capacitor may also be subject to silver migration, and to contamination by the
flux. Because of these factors, soldering technique is critical.

Soldering Methods

Method

Classification

Reflow

soldering

- Overall heating

- Infrared rays
- Hot plate
- VPS(vapor phase)

- Local heating

- Air heater
- Laser
- Light beam

Flow

soldering

- Single wave
- Double wave

* We recommend the reflow soldering method.

Soldering Profile

To avoid crack problem by sudden temperature change, follow the temperature profile in the
adjacent graph.

300

250

200

150

100

preheating

soldering

cooling

60~120sec

10~20sec

Reflow Soldering

300

250

200

150

100

preheating

soldering

cooling

150

60~120sec

3~4sec

Flow Soldering

Manual Soldering

Manual soldering can pose a great risk of creating thermal cracks in chip capacitors. The hot

soldering iron tip comes into direct contact with the end terminations, and operator's carelessness

may cause the tip of the soldering iron to come into direct contact with the ceramic body of
the capacitor. Therefore the soldering iron must be handled carefully, and close attention must
be paid to the selection of the soldering iron tip and to temperature control of the tip.

Multilayer Ceramic Capacitor

- 30 -

Amount of Solder

Too much

Solder

Not enough

Solder

Cracks tend to occur due
to large stress

Weak holding force may
cause bad connections or
detaching of the capacitor

Good

Cooling

Natural cooling using air is recommended. If the chips are dipped into solvent for cleaning,
the temperature difference(

T) must be less than 100

6-6. Cleaning
If rosin flux is used, cleaning usually is unnecessary. When strongly activated flux is used,
chlorine in the flux may dissolve into some types of cleaning fluids, thereby affecting the chip
capacitors. This means that the cleaning fluid must be carefully selected, and should always
be new.

Notes for Separating Multiple, Shared PC Boards.

A multi-PC board is separated into many individual circuit boards after soldering has been
completed. If the board is bent or distorted at the time of separation, cracks may occur in the
chip capacitors. Carefully choose a separation method that minimizes the bending of the
circuit board.

Multilayer Ceramic Capacitor

- 31 -

CROSS REFERENCE

P/N

COMPANY

SAMSUNG

AVX

JOHANSON

KEMET

KYOCERA

MURATA

NOVACAP

PANASONIC

ROHM

TAIYO

- YUDEN

TDK

VITRAMON

COMPANY MODEL(MLCC)

GRM

ECJ

MCH

SIZE

(EIA/JIS)

0201(0603)

063

0603

0402(1005)

0402

R07

0402

105

1005

0402

0603(1608)

0603

R14

0603

105

0603

107

1608

0603

0805(2012)

0805

R15

0805

212

2012

0805

1206(3216)

1206

R18

1206

316

42-6

1206

316

3216

1206

1210(3225)

1210

S41

1210

42-2

1210

325

3225

1210

1808(4520)

1808

R29

1808

4520

1808

1812(4532)

1812

S43

1812

43-2

1812

432

4532

1812

2220(5750)

2220

44-1

2221

550

5650

TEMPERATURE

CHARACTERISTIC

COG(NPO)

COG/CH

P2H(N150)

P2H

R2H(N220)

R2H

S2H(N330)

S2H

T2H(N470)

T2H

U2J(N750)

U2J

S2L

X7R

R(X)

X7R

X7R(B)

Y(X)

Z5U

Z5U

Y5V

Y5V

NOMINAL CAPACITANCE

EX) 103=10,000

221=220

225=2,200,000

=2.2

1R5=1.5

010=1

CAPACITANCE TOLERANCE

0.1

0.25

0.5

10%

20%

Z:-20~+80%

RATED

VOLTAGE

6.3V

6.3

10 V

100

16 V

160

25 V

250

50 V

500

100 V

101

100

101

200V

201

200

201

250V

250

251

500V

501

500

501

630V

630

1000V

102

1000

102

2000V

202

2000

202

3000V

302

3000

302

4000V

4000

402

TERMINATION

NICKEL BARRIER

(GRM)

(MCH)

Ag/Pd

(GR)

(MC)

PACKAGE

BULK(VINYL)

(NONE)

PAPER TAPING

2, 4

T, R

T, L

E,V,W

K, L

C, P

PLASTIC TAPING

1, 3

E, U

H, N

F, Y

P, Q

T, R

BULK CASE

Multilayer Ceramic Capacitor

- 32 -

SAMSUNG : CL10B104KA8NNNC

104

AVX : 06033C104KAT2A

0603

104

JOHANSON : 250R14W104KV6T

250

R14

104

KEMET : C0603C104K3RAC

0603

104

Series

Size

03 = 0201
05 = 0402
10 = 0603
21 = 0805
31 = 1206
32 = 1210
43 = 1812
55 = 2220

Dielectric

C = C0G
P = P2H
R = R2H
S = S2H
T = T2H
U = U2H
L = S2L
B = X7R
A = X5R
F = Y5V

Capacitance

significant

figures

number

of zeros

Use "R" for

decimal point

Tolerance

A =

0.05pF

B =

0.1pF

C =

0.25pF

D =

0.5pF

F =

G =

J =

K =

10%

M =

20%

Z = +80,-20%

Voltage

Q = 6.3V
P = 10V
O = 16V
A = 25V
B = 50V
C = 100V
D = 200V
E = 250V
G = 500V
H = 630V
I = 1000V

Thickness

3 = 0.30
5 = 0.50
8 = 0.80
A = 0.65
C = 0.85
H = 1.60
I = 2.00
J = 2.50
L = 3.20

Electrode/
Termination/
Plating

A = Pd/Ag/

Sn 100%

N = Ni/Cu/

Sn 100%

G = Cu/Cu/

Sn 100%

Products

A = Array

(2-element)

B = Array

(4-element)

C = High - Q
L = LICC
N = Normal
P = Automotive
W = 3 terminal

chip

Special

Various

Packaging

B = Bulk
P = Cassette
C = Paper 7"
D = Paper 13"

(10,000EA)

E = Embossing 7"
F = Embossing 13"
L = Paper 13"

(15,000EA)

O = Paper 10"
S = Embossing 10"

Size

0201
0402
0603
0805
1206
1210
1812
2220
2225

Voltage

4 = 4V
6 = 6.3V
Z = 10V
Y = 16V
3 = 25V
B = 50V
C = 100V
D = 200V
E = 250V
G = 500V
I = 1000V

Dielectric

A = C0G
C = X7R
D = X5R
E = Z5U
G = Y5V

Capacitance

significant

figures

number

of zeros

Use "R" for

decimal

point

Tolerance

B =

0.1pF

C =

0.25pF

D =

0.5pF

F =

G =

J =

K =

10%

M =

20%

Z = +80, -20%
P = GMV,+100,-0%

Failure Rate

A = N/A

Termination

T = Sn 100%
7 = Gold Plated
1 = Pd/Ag

Packaging

2 = 7" Reel
4 = 13" Reel
7 = Cassette
9 = Bulk

Special

A = Standard
T = 0.66mm
S = 0.56mm
R = 0.46mm

Voltage

significant

figures

number

of zeros

Size

R07 = 0402
R14 = 0603
R15 = 0805
R18 = 1206
S41 = 1210
S43 = 1812
S47 = 2220
S48 = 2225
S49 = 1825
S54 = 3640

Dielectric

N = C0G
W = X7R
X = X5R
Z = Z5U
Y = Y5V

Capacitance

significant

figures

number

of zeros

Use "R" for

decimal point

Termination

V = Ni Barrier

Marking

4 = No Mark
6 = Marking

Packaging

E = 7" Reel Plastic
T = 7" Reel Paper
R = 13" Reel Paper
U = 13" Reel Plastic
None = Bulk

Series

Size

0402
0603
0805
1206
1210
1812
2220
2225

Specification

C = Standard
A = GR900
P = Mil-C-55681

CDR01-CDR06

N = Mil-C-55681

CDR31-CDR35

Z = Mil-C-123
E = Mil Equivalent

(Group A Only)

Capacitance

significant

figures

number

of zeros

Use "R" for

decimal point

Tolerance

B =

0.1pF

C =

0.25pF

D =

0.5pF

F =

G =

J =

K =

10%

M =

20%

Z = +80, -20%
P = +100, 0%

Voltage

9 = 6.3V
8 = 10V
4 = 16V
3 = 25V
5 = 50V
1 = 100V
2 = 200V

Dielectric

G = C0G
R = X7R
P = X5R
U = Z5U
X = BX(Mil)
V = Y5V

Tolerance

B =

0.1pF

C =

0.25pF

D =

0.5pF

F =

G =

J =

K =

10%

M =

20%

Z = +80, -20%
P = GMV,+100,-0%

Failure Rate

A = Standard
M = 1.0 (Mil)
P = 0.1 (Mil)
R = 0.01 (Mil)
S = 0.001 (Mil)

Termination

C = Ni w/Tin Plate
H = Ni w/Solder
T = Silver
G = Gold Plated

Multilayer Ceramic Capacitor

- 33 -

KYOCERA : CM105X7R104K25AT

105

X7R

104

MURATA : GRM188R71E104KA01D

GRM

104

A01

NOVACAP : 0603B104K250N_TM

1206

104

250

PANASONIC : ECJ1EB1E104K

ECJ

104

Series

Size

03 = 0201
05 = 0402
105 = 0603
21 = 0805
316 = 1206
32 = 1210
42 = 1808
43 = 1812
55 = 2220

Dielectric

X8R
X7R
X5R
Z5U

Y5V
Y5U

Capacitance

significant

figures

number

of zeros

Use "R" for

decimal point

Tolerance

B =

0.1pF

C =

0.25pF

D =

0.5pF

F =

G =

J =

K =

10%

M =

20%

Z = +80, -20%
P = +100, 0%

Voltage

04 = 4V
06 = 6.3V
10 = 10V
16 = 16V
25 = 25V
50 = 50V
100 = 100V
250 = 250V
500 = 500V
1000 = 1000V

Termination

A = Ni Barrier

Packaging

T = 7" Reel (4mm Pitch)
L = 13" Reel (4mm Pitch)
H = 7" Reel (2mm Pitch)
N = 13" Reel (2mm Pitch)
B = Bulk (Vinyl Bags)
C = Bulk Cassette

Series

Ni Barrier

Size

03 = 0201
15 = 0402
18 = 0603
21 = 0805
31 = 1206
32 = 1210
42 = 1808
43 = 1812
55 = 2220

Thickness

3 = 0.3mm
5 = 0.5mm
8 = 0.8mm

A = 1.0mm

B = 1.25mm

C = 1.6mm
D = 2.0mm
E = 2.5mm

F = 3.2mm

Dielectric

5C = C0G

R7 = X7R
R6 = X5R

E4 = Z5U
F5 = Y5V

Voltage

0J = 6.3V
1A = 10V
1C = 16V
1E = 25V
1H = 50V
2A = 100V
2E = 250V
2H = 500V
3A = 1000V

Capacitance

significant

figures

number

of zeros

Use "R" for

decimal

point

Tolerance

B =

0.1pF

C =

0.25pF

D =

0.5pF

F =

G =

J =

K =

10%

M =

20%

Z = +80,-20%
P = +100, 0%

Individual

Specification

Code

Packaging

D = 7" Reel Paper
L = 7" Reel Plastic
J = 13" Reel Paper
K = 13" Reel Plastic
B = Bulk
C = Bulk Cassette
T = Bulk Tray

Size

0402
0603
0805
1005
1206
1210
1808
1812
2220

Dielectric

N = C0G
B = X7R
X = BX
Z = Z5U
Y = Y5V

Capacitance

significant

figures

number

of zeros

Use "R" for

decimal point

Tolerance

B =

0.1pF

C =

0.25pF

D =

0.5pF

F =

G =

J =

K =

10%

M =

20%

Z = +80,-20%
P = +100,
0%

Voltage

significant

figures

number

of zeros

Termination

P = Pd/Ag
N = Ni Barrier

(Sn 100%)

Y = Ni Barrier

(Sn/Pb)

Thickness

Per Specified

Packaging

T = Reel
None = Bulk
W = Waffle Pack

Marking

Series

Size

Z = 0201
0 = 0402
1 = 0603
2 = 0805
3 = 1206
4 = 1210

Packaging

X = Bulk
E = Paper 2mm
V = Paper 4mm
F, Y = Plastic 4mm
W = Large Reels 2mm
Z = Large Reels 4mm
C = Bulk Cassette

Dielectric

C = C0G
B = X7R, X5R
F = Y5V

Voltage

0J = 6.3V
1A = 10V
1C = 16V
1E = 25V
1H = 50V
2A = 100V
2D = 200V

Tolerance

C =

0.25pF

D =

0.5pF

F =

J =

K =

10%

M =

20%

Z = +80, -20%

Capacitance

significant

figures

number

of zeros

Use "R" for

decimal point

Multilayer Ceramic Capacitor

- 34 -

ROHM : MCH182C104KKN

MCH

104

TAIYO-YUDEN : TMK107BJ104K_T

107

104

TDK : C1608X7R1E104KT

1608

X7R

104

VITRAMON : VJ0603Y104KXXMC
VJ

0603

104

Series

Size

15 = 0402
18 = 0603
21 = 0805
31 = 1206
32 = 1210
43 = 1812

Voltag

4 = 10V
3 = 16V
2 = 25V
5 = 50V

Dielectric

A = C0G
C = X7R
F = Y5V

Capacitance

significant

figures

number

of zeros

Use "R" for

decimal point

Tolerance

B =

0.1pF

C =

0.25pF

D =

0.5pF

F =

G =

J =

K =

10%

M =

20%

Z = +80,-20%
P = +100, 0%

Packaging

K = 7" Reel Paper
P = 7" Reel Plastic
L = 13" Reel Paper
Q = 13" Reel Plastic
B = Bulk
C = Bulk Cassette

Marking/Thickness

N = Marked
Special Thickness

Voltage

A = 4V
J = 6.3V
L = 10V
E = 16V
T = 25V
U = 50V

Type

M = Multilayer
V = Hi Q

Termination

K = Ni Barrier

Size

105 = 0402
107 = 0603
212 = 0805
316 = 1206
325 = 1210
432 = 1812
550 = 2220

Dielectric

CG = C0G
CH = C0H
CJ = C0J
CK = C0K
BJ = X5R,

X7R

F = Y5V

Capacitance

significant

figures

number

of zeros

Use "R" for

decimal point

Tolerance

C =

0.25pF

D =

0.5pF

F =

G =

J =

K =

10%

M =

20%

Z = +80,-20%

Special

Various

Packaging

T = Reel
B = Bulk

Series

Size

0603 = 0201
1005 = 0402
1608 = 0603
2012 = 0805
3216 = 1206
3225 = 1210
4532 = 1812
5650 = 2220

Dielectric

CG
X7R

Z5U
Y5V

Voltage

0J = 6.3V
1A = 10V
1C = 16V
1E = 25V
1H = 50V

Capacitance

significant

figures

number

of zeros

Use "R" for

decimal point

Tolerance

C =

0.25pF

D =

0.5pF

F =

G =

J =

K =

10%

M =

20%

Z = +80, -20%

Packaging

T = Reel
B = Bulk

Series

Size

0402
0603
0805
1206
1210
1812
2225

Dielectric

X = BX
A,N = C0G
Y = X7R
U = Z5U
H = X8R

Capacitance

significant

figures

number

of zeros

Use "R" for

decimal point

Tolerance

B =

0.1pF

C =

0.25pF

D =

0.5pF

F =

G =

J =

K =

10%

M =

20%

Z = +80, -20%
P = +100, 0%

Termination

X = Silver,

Ni Barrier
Tin Plated

Voltage

J = 16V
X = 25V
A = 50V
B = 100V
C = 200V

Marking

M = Marking
A = No Marking

Packaging

C = 7" Reel Paper
T = 7" Reel Plastic
P = 13" Reel Paper
R = 13" Reel Plastic
B = Bulk

Ð­Ð»ÐµÐºÑ‚Ñ€Ð¾Ð½Ð½Ñ‹Ð¹ ÐºÐ¾Ð¼Ð¿Ð¾Ð½ÐµÐ½Ñ‚: CL10C101JBNC

ÐÐ»ÐµÐºÑ‚Ñ€Ð¾Ð½Ð½Ñ‹Ð¹ ÐºÐ¾Ð¼Ð¿Ð¾Ð½ÐµÐ½Ñ‚: CL10C101JBNC