Data Sheet
1
Data Sheet, Rev. 3.7
91-SR-002-42-8L
DiskOnChip
2000 DIP
From 16MByte to 1GByte
Highlights
DiskOnChip 2000 DIP is a member of M-Systems'
family of DiskOnChip flash disk products. It is
available in capacities of 16MByte to 1GByte.
Note: The following abbreviation is used in this
document: MB for MByte, GB for GByte.
DiskOnChip 2000 DIP features:
Single-chip plug-n-play flash disk
Low power, single 3.3V or 5V power supply
16MByte (MB) to 1GByte (GB) capacity
Simple, easy-to-integrate interface
8KB sized memory window
Boot OS capability
Proprietary TrueFFS
technology for full hard disk
emulation, high data reliability and maximum flash
lifetime
Software tools for programming, duplicating,
testing and debugging
Reliability
On-the-fly Reed-Solomon Error Detection
Code/Error Correction Code (EDC/ECC)
Guaranteed data integrity, even after power failure
Transparent bad block management
Dynamic and static wear-leveling
TrueFFS Software
Full hard-disk read/write emulation for transparent
file system management
Identical software for all DiskOnChip capacities
Patented methods to extend flash lifetime,
including:
o
Dynamic virtual mapping
o
Dynamic and static wear-leveling
Support for all major OSs, including: VxWorks,
Windows CE/.NET, Linux, Windows NT/XP,
QNX and others.
Operates with TrueFFS Software Development Kit
(SDK) in OS-less environment.
Hardware Compatibility
32-pin DIP, JEDEC standard,
EEPROM-compatible pinout
Pinout compatible with DiskOnChip Millennium
DIP 8MB
Compatible with all major CPUs, including:
x86
StrongARM
Xscale
Geode
SCxxxx
PowerPCTM MPC8xx
MediaGX
68K
MIPS
SuperHTM SH-x
8-bit, 16-bit and 32-bit bus architecture support
Applications
Embedded systems
Internet access devices
Internet set-top boxes/ITV, Web browsers
WBT, thin clients, network computers
Routers, networking
Web phones, car PCs, DVD, HPC
Point of sale, industrial PCs
Telecom, medical
Capacities
Low profile: 16, 24, 32, 48, 64, 96, 128, 192, 256,
384MB
High profile: 576, 768, 1024MB
Commercial (0C to 70C) and Extended
Temperature Range (-40C to +85C) for all
capacities
DiskOnChip 2000 DIP Data Sheet
2
Data Sheet, Rev. 3.7
91-SR-002-42-8L
Table of Contents
1.
Introduction .......................................................................................................... 4
2.
Product Overview................................................................................................. 5
2.1
Product Description..................................................................................................................... 5
2.2
I/O Operation............................................................................................................................... 6
2.3
Pin Diagram ................................................................................................................................ 6
2.4
Signal Descriptions ..................................................................................................................... 7
3.
Theory of Operation ............................................................................................. 8
3.1
Overview ..................................................................................................................................... 8
3.2
System Interface ......................................................................................................................... 8
3.3
Boot Block ................................................................................................................................... 8
3.4
Error Detection Code/Error Correction Code (EDC/ECC) .......................................................... 9
3.5
Flash Control............................................................................................................................... 9
4.
Operating Modes .................................................................................................. 9
5.
TrueFFS Technology.......................................................................................... 10
5.1
General Description .................................................................................................................. 10
5.1.1
Built-In Operating System Support........................................................................................ 10
5.1.2
TrueFFS Software Development Kit (SDK)........................................................................... 11
5.1.3
File Management................................................................................................................... 11
5.1.4
Bad-Block Management ........................................................................................................ 11
5.1.5
Wear-Leveling ....................................................................................................................... 11
5.2
Power Failure Management...................................................................................................... 12
5.2.1
Error Detection/Correction..................................................................................................... 12
5.2.2
Special Features through I/O Control (IOCTL) Mechanism .................................................. 12
5.2.3
Compatibility .......................................................................................................................... 12
5.3
8KB Memory Window ............................................................................................................... 13
6.
Booting from DiskOnChip 2000 ........................................................................ 14
6.1
Introduction ............................................................................................................................... 14
6.2
Boot Procedure in PC-Compatible Platforms ........................................................................... 14
DiskOnChip 2000 DIP Data Sheet
3
Data Sheet, Rev. 3.7
91-SR-002-42-8L
7.
Design Considerations ...................................................................................... 15
7.1
Design Environment.................................................................................................................. 15
7.2
System Interface ....................................................................................................................... 16
7.3
Connecting Signals ................................................................................................................... 16
7.4
Platform-Specific Issues ........................................................................................................... 17
7.4.1
Wait State .............................................................................................................................. 17
7.4.2
Big and Little Endian Systems............................................................................................... 17
7.4.3
Working with 8/16/32-Bit Systems......................................................................................... 17
8.
Product Specifications ...................................................................................... 18
8.1
Environmental Specifications.................................................................................................... 18
8.1.1
Temperature Ranges ............................................................................................................ 18
8.1.2
DiskOnChip Assembly........................................................................................................... 18
8.1.3
Humidity................................................................................................................................. 18
8.1.4
Shock and Vibration .............................................................................................................. 18
8.2
Electrical Specifications ............................................................................................................ 18
8.2.1
Absolute Maximum Ratings................................................................................................... 18
8.2.2
Capacitance........................................................................................................................... 18
8.2.3
DC Electrical Characteristics over Operating Range ............................................................ 19
8.2.4
AC Operating Conditions....................................................................................................... 20
8.3
Timing Specifications ................................................................................................................ 21
8.3.1
Read Cycle Timing ................................................................................................................ 21
8.3.2
Write Cycle Timing ................................................................................................................ 22
8.4
Mechanical Dimensions ............................................................................................................ 23
9.
Ordering Information ......................................................................................... 24
DiskOnChip 2000 DIP Data Sheet
4
Data Sheet, Rev. 3.7
91-SR-002-42-8L
1. Introduction
This data sheet includes the following sections:
Section 1:
Overview of data sheet contents
Section 2:
Product overview, including brief product description, a pin diagram and signal descriptions
Section 3:
Theory of operation for the major building blocks
Section 4:
Modes of operation
Section 5:
Description of TrueFFS technology
Section 6:
Using DiskOnChip 2000 DIP as a boot device
Section 7:
Design considerations for implementing popular applications and for maximizing built-in
flexibility features
Section 8:
Environmental, mechanical, electrical and production specifications
To contact M-Systems' worldwide offices for general information and technical support, please see the listing on the
back page, or visit M-Systems' website (
www.m-sys.com
).
DiskOnChip 2000 DIP Data Sheet
5
Data Sheet, Rev. 3.7
91-SR-002-42-8L
2. Product
Overview
2.1 Product
Description
The DiskOnChip 2000 product line is the second-generation of M-Systems' DiskOnChip series of products. The
DiskOnChip 2000 series provides a small, single-chip, solid-state flash disk in a standard 32-pin DIP package.
Combining a disk controller with flash memory on a single chip, DiskOnChip 2000 is the solution where minimal
weight, space, and power consumption are essential. DiskOnChip 2000 is used in a wide range of products, such as
information appliances, set-top boxes, thin clients, thin servers, network computers, and embedded, portable
computers.
By placing DiskOnChip 2000 in a standard socket, physical space requirements are reduced. Unlike standard IDE
drives, no cables or extra space are required. DiskOnChip 2000 has no moving parts, resulting in significantly
decreased power consumption and increased reliability. It is easy to use and reduces integration overhead.
DiskOnChip 2000 is therefore a very attractive alternative to conventional hard and floppy disk drives.
Using TrueFFS technology, DiskOnChip 2000 delivers full hard disk emulation. As such, the design and integration
stages can be considerably reduced, thereby enabling very fast time-to-market and ease of production. Combined
with its very attractive cost structure, DiskOnChip 2000 is a superior alternative to resident flash array (RFA).
DiskOnChip 2000 products are available in capacities ranging from 16MB to 1GB. In addition, they are 100%
pinout and software compatible with the DiskOnChip Millennium DIP 8MB package. In future versions, the
capacity will increase (up to 4GB during 2003). Since the same pinout will be retained, the socket on the target
platform will not have to be changed to accommodate the larger capacities.
DiskOnChip technology provides broad support for all major operating systems and processors in the market,
enabling it to be readily integrated with any architecture.
DiskOnChip 2000 is shipped as a plug-and-play device that is fully tested and formatted, and programmed with a
DOS driver. Future driver, software or content upgrades, or formatting, can be made on-board or off-board using
DiskOnChip utilities and accessories provided by M-Systems.
PDF 
ZIP