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Электронный компонент: MD2241-D96-V3-X

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Data Sheet
1
Preliminary Data Sheet, Rev. 1.2
94-SR-002-08-8L
DiskOnChip
DIMM Plus
Flash Disk with Protection and Security-Enabling Features
Highlights
DiskOnChip DIMM Plus is a member of M-Systems'
growing family of DiskOnChip flash disk products.
Based on M-Systems' award-winning DiskOnChip
Millennium Plus, it packages the most advanced flash
disk technology in an SO-DIMM form factor.
Using Toshiba's state-of-the-art 0.16 NAND
technology, DiskOnChip DIMM Plus features:
Advanced protection and security-enabling
features for data and code
Proprietary TrueFFS
technology for full hard
disk emulation, high data reliability and
maximum flash lifetime
Capacities ranging from 32Mbyte (256Mbit) to
128MByte (1,024Mbit)
144-pin SO-DIMM package
NAND-based flash technology which enables
high density and small die size
Exceptional read, write and erase performance
with a unique, full 16-bit bus flash interface
Configurable for 8/16-bit bus interface
Programmable Boot Block (1KB)
Data integrity with Reed-Solomon Error
Detection Code/Error Correction Code
(EDC/ECC)
Deep Power-Down mode for reduced power
consumption
3.3 V power supply
Software tools for programming, duplicating,
testing and debugging
Support for all major OSs, including VxWorks,
Windows CE, Linux, pSOS, QNX, etc.
Performance
Burst read/write speed: 20MB/sec
Sustained write speed: 1.5MB/sec
Sustained read speed: 3MB/sec
Protection and Security-Enabling
Features
Unique Identification (UID) number
User-configurable One Time Programmable
(OTP) area
Two configurable write and read-protected
partitions for data and boot code
Two levels of hardware data and code protection:
Protection Key and LOCK# signal
Boot Capability
Programmable Boot Block (1KB) with eXecute
In Place (XIP) capability to replace boot ROM
Download Engine (DE) for automatic download
of boot code
Boot capabilities
Platform initialization
OS boot
DiskOnChip DIMM Plus
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Preliminary Data Sheet, Rev. 1.2
94-SR-002-08-8L
Reliability
On-the-fly Reed-Solomon Error Detection
Code/Error Correction Code (EDC/ECC)
Guaranteed data integrity after power failure
Automatic bad block management
Dynamic and static wear-leveling
Hardware Compatibility
Simple, SRAM-like hardware interface
Compatible with all major CPUs, including:
X86
Geode SCxxxx
StrongARM
PowerPCTM MPC8xx
MediaGX
68K
MIPS
SuperHTM SH-x
8-bit and 16-bit bus architecture support
TrueFFS Software
Full hard-disk read/write emulation for
transparent file system management
Identical software for all DiskOnChip capacities
Patented methods to extend flash lifetime,
including:
Dynamic virtual mapping
Dynamic and static wear-leveling
Support for all major OS environments,
including:
Windows CE
Linux
VxWorks
Windows Embedded NT 4.0
BE
PSOS+
QNX
LynxOS
ATI Nucleus
DOS
Support for OS-less environments
Small 8KB memory window
Applications
Internet set-top boxes, interactive TVs, web
browsers
WBT, thin clients, network computers
Embedded systems
Routers, switches, networking equipment
Car PCs, automotive computing
Point of sale (POS) terminals, industrial PCs
Medical equipment
PDAs and smart handsets
Power Requirements
Operating voltage: 3.3V
Current (Typical)
Active: 45mA
Deep Power-Down: 10-40A (depending on
capacity)
Capacity
32Mbyte (256Mbit) to 128MByte (1,024Mbit)
DiskOnChip DIMM Plus
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Preliminary Data Sheet, Rev. 1.2
94-SR-002-08-8L
Table of Contents
1.
Introduction ..........................................................................................................................6
2.
Product Overview ................................................................................................................7
2.1
Product Description.......................................................................................................................7
2.2
Pinout ............................................................................................................................................8
2.3
System Interface .........................................................................................................................10
2.4
Signal Descriptions .....................................................................................................................11
3.
Theory of Operation...........................................................................................................12
3.1
Overview .....................................................................................................................................12
3.2
System Interface .........................................................................................................................13
3.3
Configuration Interface................................................................................................................13
3.4
Protection and Security-Enabling Features ................................................................................13
3.4.1
Read/Write Protection .............................................................................................................13
3.4.2
Unique Identification (UID) Number ........................................................................................14
3.4.3
One-Time Programmable (OTP) Area ....................................................................................14
3.5
Programmable Boot Block with XIP Capability ...........................................................................14
3.6
Download Engine (DE) ...............................................................................................................14
3.7
Error Detection Code/Error Correction Code (EDC/ECC) ..........................................................14
3.8
Data Pipeline...............................................................................................................................15
3.9
Control and Status ......................................................................................................................15
3.10
Flash Architecture .......................................................................................................................15
3.10.1
Two Banks of 16MB NAND Flash ...........................................................................................15
3.10.2
Internal Architecture ................................................................................................................15
4.
Hardware Protection..........................................................................................................17
4.1
Method of Operation ...................................................................................................................17
4.2
Low Level Structure of Protected Area .......................................................................................18
5.
Modes of Operation ...........................................................................................................19
5.1
Normal Mode...............................................................................................................................19
5.2
Reset Mode.................................................................................................................................20
5.3
Deep Power-Down Mode............................................................................................................20
6.
TrueFFS Technology .........................................................................................................21
6.1
General Description ....................................................................................................................21
6.1.1
Built-in Operating System Support..........................................................................................21
6.1.2
TrueFFS Software Development Kit (SDK).............................................................................22
6.1.3
File Management.....................................................................................................................22
6.1.4
Bad Block Management ..........................................................................................................22
6.1.5
Wear-Leveling .........................................................................................................................22
6.1.6
Power Failure Management ....................................................................................................23
6.1.7
Error Detection/Correction.......................................................................................................23
6.1.8
Special Features through I/O Control (IOCTL) Mechanism ....................................................23
6.1.9
Compatibility ............................................................................................................................23
DiskOnChip DIMM Plus
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Preliminary Data Sheet, Rev. 1.2
94-SR-002-08-8L
6.2
8KB Memory Window..................................................................................................................24
7.
Register Descriptions........................................................................................................25
7.1
Definition of Terms ......................................................................................................................25
7.2
Reset Values...............................................................................................................................25
7.3
Chip Identification (ID) Register ..................................................................................................25
7.4
No Operation (NOP) Register .....................................................................................................25
7.5
Alias Resolution Register............................................................................................................26
7.6
DiskOnChip Control Register/Control Confirmation Register .....................................................26
7.7
Toggle Bit Register......................................................................................................................27
8.
Booting from DiskOnChip DIMM Plus..............................................................................28
8.1
Introduction .................................................................................................................................28
8.2
Boot Procedure in PC Compatible Platforms..............................................................................28
8.3
Boot Replacement.......................................................................................................................29
8.3.1
PC Architectures......................................................................................................................29
8.3.2
Non-PC Architectures..............................................................................................................29
9.
Design Considerations......................................................................................................30
9.1
Design Environment....................................................................................................................30
9.2
System Interface .........................................................................................................................31
9.2.1
Typical Design .........................................................................................................................31
9.2.2
Connecting Signals .................................................................................................................32
9.3
Platform-Specific Issues .............................................................................................................32
9.3.1
Wait State ................................................................................................................................32
9.3.2
Big and Little Endian Structures ..............................................................................................32
9.3.3
Busy Signal..............................................................................................................................32
9.3.4
8-Bit/16-Bit Bus Width Interface ..............................................................................................33
10.
Product Specifications ......................................................................................................34
10.1
Environmental Specifications......................................................................................................34
10.1.1
Operating Temperature Ranges..............................................................................................34
10.1.2
Thermal Characteristics ..........................................................................................................34
10.1.3
Humidity...................................................................................................................................34
10.1.4
Endurance ...............................................................................................................................34
10.2
Disk Capacity ..............................................................................................................................34
10.3
Electrical Specifications ..............................................................................................................35
10.3.1
Absolute Maximum Ratings.....................................................................................................35
10.3.2
Capacitance.............................................................................................................................35
10.3.3
DC Electrical Characteristics...................................................................................................35
10.3.4
AC Characteristics...................................................................................................................36
10.4
Timing Specifications ..................................................................................................................37
10.4.1
Read Cycle Timing ..................................................................................................................37
10.4.2
Write Cycle Timing ..................................................................................................................38
10.4.3
Power-Up Timing.....................................................................................................................39
10.5
Mechanical Dimensions ..............................................................................................................40
11.
Ordering Information .........................................................................................................41
DiskOnChip DIMM Plus
5
Preliminary Data Sheet, Rev. 1.2
94-SR-002-08-8L
Appendix A: Example Code .....................................................................................................42
How to Contact Us ....................................................................................................................44
DiskOnChip DIMM Plus
6
Preliminary Data Sheet, Rev. 1.2
94-SR-002-08-8L
1. Introduction
This data sheet includes the following sections:
Section 1:
Overview of data sheet contents
Section 2:
Product overview, including a brief product description, a pin diagram and signal descriptions
Section 3:
Theory of operation for the major building blocks
Section 4: Hardware
protection
mechanism
Section 5:
Modes of operation
Section 6:
TrueFFS technology, including power failure management and 8Kbyte memory window
Section 7:
Register description
Section 8:
Using DiskOnChip DIMM Plus as a boot device
Section 9:
Hardware and software design considerations
Section 10:
Environmental, electrical, timing and product specifications
Section 11:
Information on ordering DiskOnChip DIMM Plus
Appendix A:
Example code to verify DiskOnChip DIMM Plus operation
To contact M-Systems' worldwide offices for general information and technical support, please see the listing on the
back cover.
DiskOnChip DIMM Plus
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Preliminary Data Sheet, Rev. 1.2
94-SR-002-08-8L
2. Product
Overview
2.1 Product
Description
DiskOnChip DIMM Plus is a member of M-Systems' DiskOnChip product series. DiskOnChip DIMM Plus
provides a complete, easily integrated flash disk for highly reliable data and code storage. DiskOnChip DIMM Plus
also offers advanced protection and security-enabling features for both data and code storage. Available in 144-pin
SO-DIMM form factor, it is optimized for applications such as connected devices, set-top boxes, thin clients,
network computers, telecommunication and embedded systems.
DiskOnChip DIMM Plus protection and security-enabling features offer a number of benefits. Two write and read-
protected partitions, with both software and hardware-based protection, can be configured independently for
maximum design flexibility. The Unique ID (UID) identifies each flash device, eliminating the need for a separate
ID device (i.e. EEPROM) on the motherboard. The user-configurable One Time Programmable (OTP) area, written
to once and then locked to prevent data and code from being altered, is ideal for storing customer and product-
specific information.
DiskOnChip DIMM Plus is based on Toshiba's cutting-edge 0.16 NAND flash technology. This technology
enables DiskOnChip DIMM Plus to provide unmatched physical and performance-related benefits. It has the highest
flash density in the smallest die size available on the market, for the best cost structure and the smallest real estate.
Using 16-bit internal flash access, it features unrivaled write and read performance: 1.5MB/sec write and 3 MB/sec
read.
M-Systems' patented TrueFFS software technology fully emulates a hard disk to manage the files stored on
DiskOnChip DIMM Plus. This transparent file system management enables read/write operations that are identical
to a standard, sector-based hard disk. In addition, TrueFFS employs various patented methods, such as dynamic
virtual mapping, dynamic and static wear-leveling, and automatic bad block management to ensure high data
reliability and to maximize flash lifetime. TrueFFS binary drivers are available for a wide range of popular OSs,
including VxWorks, Windows CE, Windows XP, Linux, pSOS, QNX. Customers developing for target platforms
not supported by TrueFFS binary drivers can use the TrueFFS Software Development Kit (SDK). For customized
boot solutions, M-Systems provides the Boot SDK.
DiskOnChip DIMM Plus is a cost-effective solution for code storage as well as data storage. A Programmable Boot
Block with eXecute In Place (XIP) capability can store boot code, replacing the boot ROM to function as the only
non-volatile memory on board. This reduces hardware expenditures and board real-estate. M-Systems' Download
Engine (DE) is an automatic bootstrap mechanism that expands the functionality of the physical 1KB programmable
boot block to enable system initialization from DiskOnChip.
DiskOnChip DIMM Plus is available in capacities ranging from 32Mbyte (256Mbit) to 128Mbyte (1,024Mbit). The
same pinout is retained for all capacities, enabling an easy upgrade path and maximum design flexibility.
DiskOnChip DIMM Plus
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Preliminary Data Sheet, Rev. 1.2
94-SR-002-08-8L
2.2 Pinout
See Figure 1 and Figure 2 for the DiskOnChip DIMM Plus pin diagram.
DiskOnChip Millennium Plus
SO-DIMM Package
Component Side (Odd Pins)
1
59
61
143
1
VSS
3, 5, 7, 9
D[0:3]
11
VCC
13, 15, 17, 19
D[4:7]
21
VSS
23
CE#
25
Reserved
27
VCC
29, 31, 33
A[0:2]
35
VSS
37, 39, 41, 43
D[8:11]
45
VCC
47, 49, 51, 53
D[12:15]
55
VSS
57
Reserved
59
BUSY#
61
Reserved
63
VCC
65
RSTIN#
67
WE#
69
Reserved
71
Reserved1
73
OE#
75
VSS
77, 79
Reserved
81
VCC
83, 85, 87, 89
Reserved
91
VSS
93, 95, 97, 99
Reserved
101
VCC
103, 105
A6, A8
107
VSS
109.111
A9, A10
113
VCC
115, 117
Reserved
119
VSS
121, 123, 125, 127
Reserved
129
VCC
131, 133, 135, 137
Reserved
139
VSS
141
Reserved
143
VCC
Figure 1: SO-DIMM Component Side (CS) Pinout
DiskOnChip DIMM Plus
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Preliminary Data Sheet, Rev. 1.2
94-SR-002-08-8L
DiskOnChip Millennium Plus
SO-DIMM Package
Print Side (Even Pins)
60
2
144
62
62
Reserved
64
VCC
66
BHE#
68
Reserved
70
IF_CFG
72
LOCK#
74
Reserved
76
VSS
78, 80
Reserved
82
VCC
84, 86, 88, 90
Reserved
92
VSS
94, 96, 98, 100
Reserved
102
VCC
104, 106
A7, A11
108
VSS
110
A12
112
Reserved
114
VCC
116, 118
Reserved
120
VSS
122, 124, 126, 128
Reserved
130
VCC
132, 134, 136, 138
Reserved
140
VSS
142
Reserved
144
VCC
2
VSS
4, 6, 8, 10
Reserved
12
VCC
14, 16, 18, 20
Reserved
22
VSS
24, 26
Reserved
28
VCC
30, 32, 34
A[3:5]
36
VSS
38, 40, 42, 44
Reserved
46
VCC
48, 50, 52, 54
Reserved
56
VSS
58, 60
Reserved
Figure 2: SO-DIMM Print Side (PS) Pinout
DiskOnChip DIMM Plus
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Preliminary Data Sheet, Rev. 1.2
94-SR-002-08-8L
2.3 System
Interface
See Figure 3 for a simplified I/O diagram.
DiskOnChip
DIMM Plus
RSTIN#
BUSY#
Host System Bus
CE#, OE#, WE#
A[12:0]
BHE#
D[15:0]
Configuration
Control
System Interface
IF_CFG
LOCK#
Figure 3: Simplified I/O Diagram
DiskOnChip DIMM Plus
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Preliminary Data Sheet, Rev. 1.2
94-SR-002-08-8L
2.4 Signal
Descriptions
Table 1 contains brief signal descriptions, presented in logic groups. The following abbreviations are used:
IN
Standard (non-Schmidt) input
ST
Schmidt Trigger input
OD Open
drain
R8
Nominal 22 KOhm pull-up resistor, enabled only for 8-bit interface mode (IF_CFG input is 0)
R
3.7 MOhm nominal pull-up resistor
Table 1: Signal Description
Signal Pin
No. Input
Type
Description
Signal
Type
System Interface
A[12:0]
See Figure 1 and
Figure 2
ST Address
bus
Input
BHE# 66
ST,
R8
Byte High Enable, active low. When low, data transaction on
D[15:8] is enabled. Not used and may be left floating when
IF_CFG is set to 0 (8-bit mode). This signal is relevant only
during boot phase.
Input
CE#
23
ST, R
Chip Enable, active low
Input
D[7:0]
See Figure 1 and
Figure 2
IN
Data bus, low byte
Input/
Output
D[15:8]
See Figure 1 and
Figure 2
IN, R8 Data bus, high byte. Not used and may be left floating when
IF_CFG is set to 0 (8-bit mode).
Input
OE#
73
ST
Output Enable, active low
Input
WE#
67
ST
Write Enable, active low
Input
Configuration
IF_CFG 70 ST
Interface Configuration, 1 for 16-bit interface mode, 0 for 8-bit
interface mode.
Input
LOCK# 72
ST
Lock, active low. When active, provides full hardware data
protection of selected partitions.
Input
Control
BUSY# 59
OD
Busy, active low, open drain. Indicates that DiskOnChip is
initializing and should not be accessed. A 10 KOhm pull-up
resistor is required even if the pin is not used.
Output
RSTIN#
65
ST
Reset In, active low
Input
Power
VCC
See Figure 1 and
Figure 2
-
Device supply. All VCC pins must be connected.
Supply
VSS
See Figure 1 and
Figure 2
-
Ground. All VSS pins must be connected.
Supply
Reserved
Reserved
See Figure 1 and
Figure 2
-
Pins not listed in this tabled are reserved, and must be left
floating.
Reserved1 71
-
Reserved signal. To insure minimum power consumption, a
10K
pull-up resistor is required.
DiskOnChip DIMM Plus
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Preliminary Data Sheet, Rev. 1.2
94-SR-002-08-8L
3. Theory
of
Operation
3.1 Overview
DiskOnChip DIMM Plus consists of the following major functional blocks, as shown in Figure 4:
System Interface for host interface
Configuration Interface for configuring the DiskOnChip to operate in 8/16 bit mode, and hardware write
protection.
Protection and Security-Enabling block, containing Write/Read protection and One-Time Programming
(OTP), for advanced data/code security and protection
Programmable Boot Block enhanced with a Download Engine (DE) for system initialization capability
Reed-Solomon Error Detection and Error Correction Code (EDC/ECC) for on-the-fly error handling
Data Pipeline through which the data flows from the host to the NAND flash arrays.
Control & Status that
contains registers responsible for transferring the address, data and control
information between the TrueFFS driver and the flash media.
Flash Interface and a 32MB interleaved dual-bank architecture consisting of two embedded 16MB
NAND flash arrays
Bus Control for translating the host bus address, data and control signals into valid NAND flash signals.
Address Decoder to enable the relevant unit inside DiskOnChip controller, according to the address range
received from the system interface.
Figure 4: DiskOnChip DIMM Plus Simplified Block Diagram
DiskOnChip DIMM Plus
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Preliminary Data Sheet, Rev. 1.2
94-SR-002-08-8L
3.2 System
Interface
The system interface block provides an easy-to-integrate SRAM-like (also EEPROM-like) interface to DiskOnChip,
enabling it to interface with various CPU interfaces, such as a local bus, ISA bus, SRAM interface, EEPROM
interface or any other compatible interface. In addition, the EEPROM-like interface enables direct access to the
Programmable Boot Block to permit XIP functionality during system initialization.
A 13-bit wide address bus enables access to the DiskOnChip 8KB memory window (as shown in section
6.2). The
16-bit data bus permits full 16-bit wide access to the flash, due to an internal, dual-bank, interleaved-operation
architecture. With both internal and external 16-bit access, DiskOnChip DIMM Plus provides unrivaled
performance.
The Chip Enable (CE#), Write Enable (WE#) and Output Enable (OE#) signals trigger read and write cycles. A
write cycle occurs while both the CE# and the WE# inputs are asserted. Similarly, a read cycle occurs while both the
CE# and OE# inputs are asserted. Note that DiskOnChip DIMM Plus does not require a clock signal. DiskOnChip
features a unique analog static design, optimized for minimal power consumption. The CE#, WE# and OE# signals
trigger the controller (e.g., system interface block, bus control and data pipeline) and flash access.
The Reset In (RSTIN#) and Busy (BUSY#) control signals are used in the reset phase. See section
5.2 for details.
DiskOnChip DIMM Plus contains several configuration signals. The Interface Configuration (IF_CFG) signal
configures DiskOnChip for 16-bit or 8-bit mode of operation (see section
9.3.4). The Lock (LOCK#) signal enables
hard-wire hardware-controlled protection of code and data, as described below on protection and security-enabling
features.
3.3 Configuration
Interface
The Configuration Interface block enables the designer to configure the DiskOnChip to operate in certain modes.
The IF_CFG pin is used to configure the device for 8/16 bit access mode and the LOCK# pin is used for hardware
write/read protection.
3.4 Protection and Security-Enabling Features
The Protection and Security-Enabling block, consisting of read/write protection, Unique ID and OTP area, enables
advanced data and code security and protection. Located on the main route of traffic between the host and the flash,
this block monitors and controls all data and code transactions to and from DiskOnChip.
3.4.1 Read/Write Protection
Data and code protection is implemented through a Protection State Machine (PSM). The user can configure one or
two independently programmable areas of the flash memory as read protected, write protected, or read/write
protected.
A Protection Area may be protected by either/both of these hardware mechanisms:
64-bit Protection Key
Hard-wired LOCK# signal
The size and location of each area is user-defined to provide maximum flexibility for the target platform and
application requirements.
The configuration parameters of the protected areas are stored on the flash media and are automatically downloaded
from the flash to the PSM upon power-up, to enable robust protection throughout the flash lifetime.
In the event of an attempt to bypass the protection mechanism, illegally modify the protection key or in any way
sabotage the configuration parameters, the entire DiskOnChip becomes both read and write protected, and is
completely inaccessible.
For further information on the hardware protection mechanism, refer to section
4.
DiskOnChip DIMM Plus
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Preliminary Data Sheet, Rev. 1.2
94-SR-002-08-8L
3.4.2 Unique Identification (UID) Number
Each DiskOnChip DIMM Plus is assigned a 16-byte UID number. Burned onto the flash during production, the UID
cannot be altered and is unique worldwide. The UID is essential in security-related applications, and can be used to
identify end-user products in order to fight fraudulent duplication by imitators.
The UID on DiskOnChip DIMM Plus eliminates the need for an additional on-board ID device, such as a dedicated
EEPROM.
3.4.3 One-Time Programmable (OTP) Area
The 6 KByte OTP area is user-programmable for complete customization. The user can write to this area once, after
which it is automatically locked permanently. After it is locked, the OTP area becomes read only, just like a ROM
device.
Typically, the OTP area is used to store customer and product information such as: product ID, software version,
production data, customer ID and tracking information.
3.5 Programmable Boot Block with XIP Capability
During boot, code must be executed directly from the flash media, rather than first copied to the host RAM and then
executed from there. This direct XIP code execution capability is essential for booting.
The Programmable Boot Block with XIP capability enables DiskOnChip DIMM Plus to act as a boot ROM device
in addition to being a flash disk. This unique design enables the user to benefit from the advantages of NOR flash,
typically used for boot and code storage, and NAND flash, typically used for data storage. No other boot device is
required on the motherboard.
The Programmable Boot Block on DiskOnChip consists of 1KB of programmable SRAM. The Download Engine
(DE) described in the next section expands the functionality of this block by copying the boot code from the flash
into the internal SRAM.
3.6 Download
Engine
(DE)
Upon power up or when the RSTIN# signal is asserted, the DE automatically downloads the Initial Program Loader
from page 3 of the third block on the flash to the Programmable Boot Block. The Initial Program Loader (IPL) is
responsible for starting the booting process. The download process is fairly quick and is designed so that when the
CPU accesses DiskOnChip for code execution, the IPL code is already located in the internal SRAM in the
Programmable Boot Block.
In addition, the DE downloads the Data Protection Structures (DPS) from the flash to the Protection State Machines,
so that DiskOnChip is secure and protected from the first moment it is active.
During the download process, the DiskOnChip DIMM Plus asserts the BUSY# pin to indicate to the system that it is
not yet ready to be accessed. Once the BUSY# pin is negated, the system can access the DiskOnChip.
A failsafe mechanism prevents improper initialization due to a faulty VCC or invalid assertion of the RSTIN# input.
Another failsafe mechanism is designed to overcome possible NAND flash data errors. It prevents internal registers
from powering up in a state that bypasses the intended data protection. In addition, in any attempt to sabotage the
data structures the entire DiskOnChip will turn both read and write protected and will be completely inaccessible.
3.7 Error Detection Code/Error Correction Code (EDC/ECC)
NAND flash, being an imperfect memory, requires error handling. DiskOnChip DIMM Plus implements Reed-
Solomon Error Detection Code (EDC). A hardware-generated, 6-byte error detection signature is computed each
time a page (512 Bytes) is written to or read from DiskOnChip.
The TrueFFS driver implements complementary Error Correction Code (ECC). Unlike error detection, which is
required on every cycle, error correction is relatively seldom required, hence implemented in software. The
DiskOnChip DIMM Plus
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Preliminary Data Sheet, Rev. 1.2
94-SR-002-08-8L
combination of DiskOnChip built-in EDC mechanism and the TrueFFS driver ensures highly reliable error detection
and correction, while providing maximum performance.
The following detection and correction capability is provided for each 512 Bytes:
Corrects up to two 10-bit symbols, including two random bit errors.
Corrects single bursts up to 11 bits.
Detects single bursts up to 31 bits and double bursts up to 11 bits.
Detects up to 4 random bit errors.
3.8 Data
Pipeline
DiskOnChip DIMM Plus uses a two-stage pipeline mechanism, designed for maximum performance while enabling
on-the-fly data manipulation, such as read/write protection and Error Detection/Error Correction.
For more information on this mechanism, refer to technical note TN-DOC-014 Pipeline Mechanism in DiskOnChip.
3.9 Control and Status
The Control and Status block contains registers responsible for transferring the address, data and control information
between the DiskOnChip TrueFFS driver and the flash media. Additional registers are used to monitor the status of
the flash media (ready/busy) and of the DiskOnChip controller. For further information on the DiskOnChip DIMM
Plus registers, refer to section 7).
3.10 Flash Architecture
3.10.1 Two Banks of 16MB NAND Flash
DiskOnChip DIMM Plus is designed with a dual-bank interleave architecture consisting of two banks of 16MB
NAND flash, using 0.16 flash technology. The interleave architecture allows 16-byte flash access instead of the
standard 8-byte flash access, thereby providing double the performance for read, write and erase operations.
3.10.2 Internal Architecture
Each of the two 16MB flash banks consists of 1024 pages organized in 32 blocks, as follows:
Page Each page contains 512 bytes of user data and a 16-byte extra area used to store flash management
and EDC/ECC signature data, as shown in Figure 5. A page is the minimal unit for read/write operations.
Block Each block contains 32 pages (total of 16KB), as shown in Figure 6. A block is the minimal unit
that can be erased, and is sometimes referred to as an erase block.
16 Bytes
512 Bytes
User Data
Flash Management &
ECC/EDC Signature
0.5 KB
Figure 5: Page Structure
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16 Bytes
512 Bytes
Page 0
Page 1
16 KB
Page 31
Page 30
Figure 6: Block Structure
Because of its interleave architecture, DiskOnChip DIMM Plus consists of 1024 dual pages organized in 32 dual
blocks, for a total capacity of 32MB, as shown in Figure 7.
Block 1024 (16KB)
Block 2045 (16 KB)
Block 2046 (16 KB)
Interleaving of Dual Pages in Dual Blocks
Block 0 (16 KB)
Block 1022 (16 KB)
Block 1023 (16 KB)
Figure 7: Interleave Architecture Structure
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4. Hardware
Protection
4.1 Method
of
Operation
DiskOnChip DIMM Plus enables the user to define two partitions that are protected (in hardware) against any
combination of read or write operations. The two protected areas can be configured as read protected or write-
protected, and are protected by a protection key (i.e. password) defined by the user. Each of the protected areas can
be configured separately and can function separately, providing maximal flexibility for the user.
The size and protection attributes (protection key/read/write/changeable/lock) of the protected partition are defined
in the media formatting stage (DFORMAT utility or the format function in the TrueFFS SDK).
In order to set or remove a read/write protection, the protection key (i.e., password) must be used, as follows:
Insert the protection key to remove read/write protection.
Remove the protection key to set read/write protection.
DiskOnChip DIMM Plus has an additional hardware safety measurement. If the Lock option is enabled (by means
of software) and the LOCK# pin is asserted, the protected partition has an additional hardware lock that prevents
read/write access to the partition, even with the use of the correct protection key. The LOCK# pin must be asserted
during DFORMAT (and later when the partition is defined as changeable) to enable the additional hardware safety
lock.
Note: The target volume (i.e. partition) does not have to be mounted before calling a hardware protection routine.
Only one partition can be defined as "changeable"; i.e., its password and attributes are fully configurable at any time
(from read to write, both or none and vise versa). Note that "un-changeable" partition attributes cannot be changed
unless the media is reformatted.
A change of any of the protection attributes causes a reset of the protection mechanism and consequently the
removal of all device protection keys. That is, if the protection attributes of one partition are changed, the other
partition will lose its key-protected read/write protection.
The only way to read or write from a read or write protected partition is to use the insert key call (even DFORMAT
does not remove the protection). This is also true for modifying its attributes (key, read, write and lock enable state).
Read/write protection is disabled in each one of the following events:
Power-down
Change of any protection attribute (not necessarily in the same partition)
Write operation to the IPL area
Removal of the protection key.
For further information on hardware protection, please refer to TrueFFS SDK User Manual or application note AP-
DOC-057 Protection and Security-Enabling Features in DiskOnChip Millennium Plus.
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4.2 Low Level Structure of Protected Area
The first three blocks on DiskOnChip DIMM Plus contain foundry information, the Data Protect structures, Initial
Program Loader (IPL) code, and bad block mapping information. See Figure 8.
Bad Block Table and Factory-Programmed UID
Protected Partition 1 Control
Pages 0-5
Pages 7-12
OTP
Protected Partition 2 Control
Block 0
Block 1
Block 2
Figure 8: Low Level Format DiskOnChip DIMM Plus
Blocks 0, 1 and 2 in DiskOnChip DIMM Plus contain the following information:
Block 0
Bad Block Table (page 2). Contains the mapping information to unusable Erase units on the flash media.
UID (16 bytes). This number is written during the manufacturing stage, and cannot be altered at a later
time.
One Time Programming (OTP) area (pages 7-12). The OTP area is written once and then locked.
Block 1
Data Protect Structure 0. This structure contains configuration information on one of the two user-defined
protected partitions.
Block 2
Data Protect Structure 1. This structure contains configuration information on one of the two user-defined
protected partitions.
IPL Code (1KB). This is the boot code that is downloaded by the DE to the internal boot block.
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5. Modes
of
Operation
DiskOnChip DIMM Plus has three modes of operation:
Reset
Normal
Deep Power-Down.
Mode changes can occur due to any of the following events, as shown in Figure 9:
Assertion of the RSTIN# signal sets the device in Reset mode.
During Power-Up boot detector circuitry sets the device into Reset mode.
A valid write sequence to the DiskOnChip DIMM Plus Control register and the Control Confirmation
register sets the device in Normal mode.
Power down
A valid write sequence, initiated by software sets the device from Normal Mode into Deep Power Down
Mode and vice versa.
Power Off
Reset Mode
Deep
Power-Down
Mode
Normal Mode
Power-Up
Power-Down
Assert RSTIN#
Software Control
Power-Down
Reset
Sequence End
Software Control
Hardware or
Power-Down
Assert RSTIN#
Figure 9: Operation Modes and Related Events
5.1 Normal
Mode
This is the mode in which standard operations involving the flash memory are performed. Normal mode is
automatically entered when a valid write sequence is sent to the DiskOnChip Control register and Control
Confirmation register.
A write cycle occurs when both the CE# and WE# inputs are asserted. Similarly, a read cycle occurs when both the
CE# and OE# inputs are asserted. Because the flash controller generates its internal clock from these CPU cycles
and some read operations return volatile data, it is essential that the specified timing requirements contained in
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section
10.4.1 be met. It is also essential that read and write cycles are not interrupted by glitches or ringing on the
CE#, WE#, OE# address inputs.
Note:
All inputs to DiskOnChip DIMM Plus are Schmidt trigger types to improve noise immunity.
In normal mode, DiskOnChip DIMM Plus responds to every valid hardware cycle. When there is no activity, power
consumption automatically drops to a typical standby current of 400A.
5.2 Reset Mode
In Reset mode, DiskOnChip DIMM Plus ignores all write cycles, except for those to the DiskOnChip Control
register and Control Confirmation register. All register read cycles return a value of 00H.
Before attempting to perform a register read operation, the device is set to Normal mode by TrueFFS software.
5.3 Deep Power-Down Mode
In Deep Power-Down mode, DiskOnChip DIMM Plus internal high current voltage regulators are disabled to reduce
quiescent power consumption. The following signals are also disabled in this mode: input buffers A[12:0], BHE#,
WE#, D[15:0] and OE# (when CE# is negated).
To enter Deep Power-Down mode, a proper sequence must be written to the DiskOnChip. In Deep Power-Down
mode, write cycles have no effect and read cycles return indeterminate data (DiskOnChip DIMM Plus does not drive
the data bus). Entering Deep Power-Down mode and then returning to the previous mode does not affect the value
of any register.
To exit Deep Power-Down mode, perform the following sequence:
Read any address (1FFFH is suggested) three times. The data returned is undefined. The regulators are
enabled at the beginning of the first cycle. The input buffers (A[12:0], BHE#, WE#, D[15:0] and OE#) are
enabled at the end of the third cycle.
Read the selected address one more time (data returned is still undefined).
Applications that require both Deep Power-Down mode and boot detection require BIOS support to ensure that
DiskOnChip DIMM Plus exits from Power-Down mode prior to the expansion ROM scan. Similarly, applications
that use DiskOnChip DIMM Plus as a boot ROM must ensure that the device is not in Deep Power-Down mode
before reading the boot vector/instructions, either by pulsing RSTIN# to the asserted state and waiting for the
BUSY# output to be negated, or by entering Reset mode via software.
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6. TrueFFS
Technology
6.1 General
Description
M-Systems' patented TrueFFS technology was designed to maximize the benefits of flash memory while
overcoming inherent flash limitations that would otherwise reduce its performance, reliability and lifetime. TrueFFS
emulates a hard disk, making it completely transparent to the OS. In addition, since it operates under the OS file
system layer (see Figure 10), it is completely transparent to the application.
Figure 10: TrueFFS Location in System Hierarchy
TrueFFS technology support includes:
Binary driver support for all major OSs
TrueFFS Software Development Kit (TrueFFS SDK)
Boot Software Development Kit (Boot SDK)
Support for all major CPUs, including 8, 16 and 32-bit bus architectures
TrueFFS technology features:
Block device API
Flash file system management
Bad block management
Dynamic virtual mapping
Dynamic and static wear-leveling
Power failure management
Implementation of Reed-Solomon EDC/ECC
Performance optimization
Compatible with all DiskOnChip products
6.1.1 Built-in Operating System Support
The TrueFFS driver is integrated into all major OSs including: Windows CE, NT, NT Embedded, XP, Linux
(various kernels), VxWorks, Nucleus, pSOS, QNX, DOS, BE, LynxOS, EPOC and others. For a complete listing of
all available drivers, please refer to M-Systems' web site http://www.m-sys.com. It is advised to use the latest driver
versions that can be downloaded from the DiskOnChip DIMM Plus web page on the M-Systems' site.
Application
OS File System
TrueFFS
DiskOnChip
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6.1.2 TrueFFS Software Development Kit (SDK)
The basic TrueFFS Software Development Kit (SDK) provides the source code of the TrueFFS driver. It can be used
in an OS-less environment or when special customization of the driver is required for proprietary OSs.
When using DiskOnChip DIMM Plus as the boot replacement device, TrueFFS SDK also incorporates in its source
code the Boot SDK, software that is required for this configuration (this package is also available separately). Please
refer to installation manual IM-DOC-020 Boot SDK for further information on the usage of this software package.
6.1.3 File Management
TrueFFS accesses the flash memory within DiskOnChip DIMM Plus through an 8KB window in the CPU memory
space. It provides block device API, by using standard file system calls, identical to those used by a mechanical hard
disk, to enable reading from and writing to any sector on DiskOnChip. This makes it compatible with any file
system and file system utilities such as diagnostic tools and applications. When using the Flash Allocation Table
(FAT) file system, the data stored on DiskOnChip uses FAT-16.
Note:
Please note that DiskOnChip DIMM Plus is shipped unformatted and contains virgin media.
6.1.4 Bad Block Management
Since NAND flash is an imperfect storage media, it contains some bad blocks that cannot be used for storage
because of their high error rates. TrueFFS automatically detects and maps bad blocks upon system initialization,
ensuring that they are not used for storage. This management process is completely transparent to the user, who
remains unaware of the existence and location of bad blocks, while remaining confident of the integrity of data
stored.
6.1.5 Wear-Leveling
Flash memory can be erased a limited number of times. This number is called the erase cycle limit or write
endurance limit
and is defined by the flash array vendor. The erase cycle limit applies to each individual erase block
in the flash device. In DiskOnChip DIMM Plus, the erase cycle limit of the flash is 100,00 erase cycles. This means
that after approximately 100,00 erase cycles, the erase block begins to make storage errors at a rate significantly
higher than the error rate that is typical to the flash.
In a typical application and especially if a file system is used, a specific page or pages are constantly updated (e.g.,
the page/s that contain the FAT, registry etc.). Without any special handling, these pages would wear out more
rapidly than other pages, reducing the lifetime of the entire flash.
To overcome this inherent deficiency, TrueFFS uses M-Systems patented wear-leveling algorithm. The wear-
leveling algorithm ensures that consecutive writes of a specific sector are not written physically to the same page in
the flash. This spreads flash media usage evenly across all pages, thereby maximizing flash lifetime. TrueFFS wear-
leveling extends the flash lifetime 10 to 15 years beyond the lifetime of a typical application.
Dynamic Wear-Leveling
TrueFFS uses statistical allocation to perform dynamic wear-leveling on newly written data. This not only
minimizes the number of erase cycles per block, it also minimizes the total number of erase cycles. Because a block
erase is the most time-consuming operation, dynamic wear-leveling has a major impact on overall performance. This
impact cannot be noticed during the first write to flash (since there is no need to erase blocks beforehand), but it is
more and more noticeable as the flash media becomes full.
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Static Wear-Leveling
Areas on the flash media may contain static files, characterized by blocks of data that remain unchanged for very
long periods of time, or even for the whole device lifetime. If wear-leveling were only applied on newly written
pages, static areas would never be cycled. This limited application of wear-leveling would lower life expectancy
significantly in cases where flash memory contains large static areas. To overcome this problem, TrueFFS forces
data transfer in static areas as well as in dynamic areas, thereby applying wear-leveling to the entire media.
6.1.6 Power Failure Management
TrueFFS uses algorithms based on "erase after write" instead of "erase before write" to ensure data integrity during
normal operation and in the event of a power failure. Used areas are reclaimed for erasing and writing the flash
management information into them only after an operation is complete. This procedure serves as a check on data
integrity.
The "erase after write" algorithm is also used to update and store mapping information on the flash memory. This
keeps the mapping information coherent even during power failures. The only mapping information held in RAM is
a table pointing to the location of the actual mapping information. This table is reconstructed during power-up or
after reset from the information stored in the flash memory.
To prevent data from being lost or corrupted, TrueFFS uses the following mechanisms:
When writing, copying, or erasing the flash device, the data format remains valid at all intermediate stages.
Previous data is never erased until the operation has been completed and the new data has been verified.
A data sector cannot exist in a partially written state. Either the operation is successfully completed, in
which case the new sector contents are valid, or the operation has not yet been completed or has failed, in
which case the old sector contents remain valid.
6.1.7 Error Detection/Correction
TrueFFS implements a Reed-Solomon Error Correction Code (ECC) algorithm to ensure data reliability. Refer to
section
3.5 for further information on the EDC/ECC mechanism.
6.1.8 Special Features through I/O Control (IOCTL) Mechanism
In addition to standard storage device functionality, the TrueFFS driver provides extended functionality. This
functionality goes beyond simple data storage capabilities to include features such as: format the media, read/write
protect, binary partition(s) access, flash defragmentation and other options. This unique functionality is available in
all TrueFFS-based drivers through the standard I/O control command of the native file system.
For further information, please refer to application note AP-DOC-046 Extended Functions of TrueFFS Driver for
DiskOnChip.
6.1.9 Compatibility
The TrueFFS driver supports all released DiskOnChip products. Upgrading from one product to another requires no
additional software integration.
When using different drivers (e.g. TrueFFS SDK, Boot SDK, BIOS extension firmware, etc.) to access DiskOnChip
DIMM Plus, the user must verify that all software is based on the same code base version. It is also important to use
only tools (e.g. DFORMAT, DINFO, GETIMAGE, etc.) derived from the same version as the firmware version and
the TrueFFS drivers used in the application. Failure to do so may lead to unexpected results, such as lost or
corrupted data. The driver and firmware version can be verified by the sign-on messages displayed, or by the version
information stored in the driver or tool.
Note: When a new M-Systems' DiskOnChip product with new features is released, a new TrueFFS version is
required.
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6.2 8KB Memory Window
TrueFFS utilizes an 8KB memory window in the CPU address space, consisting of four 2KB sections as depicted in
Figure 11. When in Reset mode, read cycles from sections 1 and 2 always return the value 00H to create a fixed and
known checksum. When in Normal mode, these two sections are used for the internal registers. The 1K
Programmable Boot Block is aliased twice, in section 0 and section 3, to support systems that search for a checksum
at the boot stage both from the top and bottom of memory. The addresses described here are relative to the absolute
starting address of the 8KB memory window.
Programmable
boot block
[000H-3FFH]
(2 aliases)
Reset Mode
Flash area
window
(+ aliases)
000H
800H
1000H
1800H
Control
Registers
(+ aliases)
Section 0
Section 1
Section 2
Section 3
Normal Mode
00H
Programmable
boot block
[000H-3FFH]
(2 aliases)
Programmable
boot block
[000H-3FFH]
(2 aliases)
00H
Programmable
boot block
[000H-3FFH]
(2 aliases)
Figure 11: DiskOnChip DIMM Plus Memory Map
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7. Register
Descriptions
This section describes various DiskOnChip DIMM Plus registers and their functions, as listed in Table 2. This
section can be used to enable the designer to better evaluate DiskOnChip technology.
Table 2: DiskOnChip DIMM Plus Registers
Address (Hex) Register Name
1000 Chip Identification (ID)
1002 No
Operation (NOP)
1004
Alias Resolution
1006 DiskOnChip Control
1046 Toggle Bit
1076 DiskOnChip Control Confirmation
7.1 Definition of Terms
The following abbreviations and terms are used within this section:
RFU
Reserved for future use. This bit is undefined during a read cycle and "don't care" during a write cycle.
RFU_0
Reserved for future use; when read, this bit always returns the value 0; when written, software should
ensure that this bit is always set to 0.
RFU_1
Reserved for future use; when read, this bit always returns the value 1; when written, software should
ensure that this bit is always set to 1.
Reset Value Refers to the value immediately present after exiting from Reset mode to Normal mode.
7.2 Reset
Values
All registers return the value 00H while in Reset mode. The Reset value that is written in the register description is
the register value after exiting from Reset mode and entering Normal mode. Please note that the contents of some
registers are undefined at that time (N/A).
7.3 Chip Identification (ID) Register
Description:
This register is used to identify the device residing on the host platform. This register always
returns the value 40H when read.
Address (hex): 1000
Type:
Read only
Reset Value:
40H
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
40H
7.4 No Operation (NOP) Register
Description:
A call to this register results in no operation. To aid in code readability and documentation, it is
recommended that software access this register when performing cycles intended to create a time
delay.
Address (hex): 1002
Type:
Write
Reset Value:
None
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7.5 Alias Resolution Register
Description:
This register enables software to identify multiple DiskOnChip DIMM Plus devices or multiple
aliases in the CPUs memory space. Data written is stored but does not affect the behavior of
DiskOnChip DIMM Plus.
Address (hex): 1004
Type:
Read/Write
Reset Value:
00H
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
D[7:0]
Bit No.
Description
0-7
D[7:0]: Data bits
7.6 DiskOnChip Control Register/Control Confirmation Register
Description:
These two registers are identical and contain information on the operation mode of DiskOnChip.
After writing the required value to the DiskOnChip Control register, the complement of that data
byte must also be written to the Control Confirmation register. The two writes cycles must not be
separated by any other read or write cycles to DiskOnChip DIMM Plus memory space, except for
reads from the Programmable Boot Block space.
Address (hex): 1006/1076
Type: Read/Write
Reset Value:
10H
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
RFU_0
RFU_0
RST_LAT
BDET
MDWREN
Mode[1:0]
Bit No.
Description
0-1
Mode. These bits select the mode of operation, as follows:
00: Reset
01: Normal
10: Deep Power-Down
2
MDWREN (Mode Write Enable). This bit must be set to 1 before changing the mode of operation.
3
BDET (Boot Detect). This bit is set whenever the device has entered Reset Mode as a result of the
Boot Detector triggering. It is cleared by writing a 1 to this bit.
4
RST_LAT (Reset Latch). This bit is set whenever the device has entered the Reset Mode as a
result of the RSTIN# input signal being asserted or the internal voltage detector triggering. It is
cleared by writing a 1 to this bit.
5-7
Reserved for future use
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7.7 Toggle Bit Register
Description:
This register controls the Reed-Solomon ECC logic.
Address (hex): 1046
Type:
Read/Write (except for bits 2 and 7 which are Read Only)
Reset Value:
82H
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
ERROR RFU
ECC_RW
RFU_0
ECC_EN TOGGLE RFU_1 IGNORE
Bit No.
Description
0
IGNORE. When set to a 1, data read from or written to the Flash Data register is not processed by
the ECC unit.
1, 4, 6
Reserved for future use
2
TOGGLE. This read only bit toggles on consecutive reads and serves to identify the presence of
the device.
3
ECC_EN (ECC Enable).
0: Resets the ECC logic and reloads the ECC Syndrome Register[5:0] with their Reset values.
1: Enables the Reed-Solomon ECC and parity generators, allowing new data to be clocked into the
ECC unit.
5
ECC_RW (ECC Read/Write).
0: The ECC unit is in `Read Mode'. In this mode, a block of data and the 6-byte syndrome are read
from flash memory into the ECC unit and are checked for errors. The status of the error detection
process is indicated by the state of the ERROR bit.
1: The ECC unit is put into `Write Mode', where a block of data (512 bytes) is passed through the
ECC unit as it is written into the flash memory. At the end of this pass, TrueFFS reads the 6-byte
syndrome from the ECC Control Register and writes it into the flash.
7
ERROR. This bit is read only. After reading a block of data and six ECC syndrome bytes, this bit
should be examined.
0: No error detected
1: Error detected
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8.
Booting from DiskOnChip DIMM Plus
8.1 Introduction
DiskOnChip DIMM Plus can function both as a flash disk and the system boot device.
If DiskOnChip is configured as a flash disk, it can operate as the OS boot device. DiskOnChip default firmware
contains drivers to enable it to perform as the OS boot device under DOS (see section
8.2). For other OSs, please
refer to the readme file of the TrueFFS driver.
If DiskOnChip DIMM Plus is configured as a flash disk and as the system boot device, it contains the boot loader,
an OS image and a file system. In such a configuration, DiskOnChip DIMM Plus can serve as the only non-volatile
device on board. Refer to section
8.3.2 for further information on boot replacement.
8.2 Boot Procedure in PC Compatible Platforms
When used in PC compatible platforms, DiskOnChip DIMM Plus is connected to an 8KB memory window in the
BIOS expansion memory range, typically located between 0C8000H to 0EFFFFH. During the boot process, the
BIOS loads the TrueFFS firmware into the PC memory and installs DiskOnChip as a disk drive in the system. When
the operating system is loaded, DiskOnChip is recognized as a standard disk. No external software is required to
boot from DiskOnChip.
Figure 12 illustrates the location of the DiskOnChip DIMM Plus memory window in the PC memory map.
Figure 12: DiskOnChip DIMM Plus Memory Window in PC Memory Map
After reset, the BIOS code first executes the Power On Self-Test (POST) and then searches for all expansion ROM
devices. When DiskOnChip DIMM Plus is found, the BIOS code executes from it the IPL (Initial Program Loader)
code, located in the XIP portion of the Programmable Boot Block. This code loads the TrueFFS driver into system
memory, installs DiskOnChip DIMM Plus as a disk in the system, and then returns control to the BIOS code. The
operating system subsequently identifies DiskOnChip DIMM Plus as an available disk. TrueFFS responds by
emulating a hard disk.
From this point onward, DiskOnChip DIMM Plus appears as a standard disk drive. It is assigned a drive letter and
can be used by any application, without any modifications to either the BIOS set-up or the autoexec.bat/
config.sys files. DiskOnChip DIMM Plus can be used as the only disk in the system, with or without a floppy drive,
and with or without hard disks. The drive letter assigned depends on how DiskOnChip DIMM Plus is used in the
system, as follows:
8k
1M
640k
0
Display
RAM
0C8000H
BIOS
0B0000H
0F0000H
0FFFFFH
DiskOnChip
Extended Memory
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If DiskOnChip DIMM Plus is used as the only disk in the system, the system boots directly from it and
assigns it drive C.
If DiskOnChip DIMM Plus is used with other disks in the system:
o DiskOnChip DIMM Plus can be configured as the last drive (the default configuration). The system
assigns drive C to the hard disk and drive D to DiskOnChip DIMM Plus.
o Alternatively, DiskOnChip DIMM Plus can be configured as the system's first drive. The system
assigns drive D to the hard disk and drive C to DiskOnChip DIMM Plus.
If DiskOnChip DIMM Plus is used as the OS boot device when configured as drive C, it must be formatted
as a bootable device by copying the OS files onto it. This is done by using the SYS command when running
DOS.
8.3 Boot Replacement
8.3.1 PC Architectures
In current PC architectures, the first CPU fetch (after reset is negated) is mapped to the boot device area, also known
as the reset vector. The reset vector in PC architectures is located at address FFFF0, by using a Jump command to
the beginning of the BIOS chip (usually F0000 or E0000). The CPU executes the BIOS code, initializes the
hardware and loads DiskOnChip DIMM Plus software using the BIOS expansion search routine (e.g. D0000). Refer
to section
8.2 for a detailed explanation on the boot sequence in PC compatible platforms.
DiskOnChip DIMM Plus implements both disk and boot functions when it replaces the BIOS chip. To enable this,
DiskOnChip DIMM Plus requires a location at two different addresses:
After power-up, DiskOnChip DIMM Plus must be mapped in F segment, so that the CPU fetches the reset
vector from address FFFF0, where DiskOnChip DIMM Plus is located.
After the BIOS code is loaded into RAM and starts execution, DiskOnChip DIMM Plus must be
reconfigured to be located in the BIOS expansion search area (e.g. D0000) so it can load the TrueFFS
software.
This means that the CS# signal must be remapped between two different addresses. For further information on how
to achieve this, refer to application note AP-DOC-047 Designing DiskOnChip as a Flash Disk & Boot Device
Replacement
.
8.3.2 Non-PC Architectures
In non-PC architectures, the boot code is executed from a boot ROM, and the drivers are usually loaded from the
storage device.
When using DiskOnChip DIMM Plus as the system boot device, the CPU fetches the first instructions from the
DiskOnChip DIMM Plus Programmable Boot Block, which contains the IPL. Since in most cases this block cannot
hold the entire boot loader, the Initial Program Loader (IPL) runs minimum initialization, after which the Secondary
Program Loader (SPL) is copied to RAM from flash. The remainder of the boot loader code then runs from RAM.
The IPL and SPL are located in a separate (binary) partition on DiskOnChip DIMM Plus, and can be hardware
protected if required.
For further information on software boot code implementation, refer to application note AP-DOC-070 Writing an
IPL for DiskOnChip Millennium Plus.
DiskOnChip DIMM Plus
30
Preliminary Data Sheet, Rev. 1.2
94-SR-002-08-8L
9. Design
Considerations
9.1 Design
Environment
DiskOnChip DIMM Plus provides a complete design environment consisting of:
Evaluation Boards (EVB) for enabling software integration and development with DiskOnChip DIMM
Plus, even before the target platform is available. An EVB with DiskOnChip DIMM Plus soldered on it is
available with an ISA standard connector and a PCI standard connector for immediate plug and play usage.
Programming solutions
o GANG
programmer
o Programming
house
o On-board
programming
TrueFFS Software Development Kit (SDK) and Boot SDK
DOS Utilities
o DFORMAT
o GETIMG/PUTIMG
o DLOWLVL
Documentation
o Data
Sheet
o Application
Notes
o Technical
Notes
o Articles
o White
Papers

Please visit M-Systems website (
www.m-sys.com
) for the most updated documentation, utilities and drivers.
DiskOnChip DIMM Plus
31
Preliminary Data Sheet, Rev. 1.2
94-SR-002-08-8L
9.2 System
Interface
9.2.1 Typical Design
DiskOnChip DIMM Plus uses an SRAM-like interface that can easily be connected to any microprocessor bus. It
requires 13 address lines, 8 data lines and basic memory control signals (CE#, OE#, WE#), as shown in Figure 13
below. Typically, DiskOnChip DIMM Plus can be mapped to any free 8KB memory space. In a PC compatible
platform, it is usually mapped into the BIOS expansion area. If the allocated memory window is larger than 8KB, an
automatic anti-aliasing mechanism prevents the firmware from being loaded more than once during the ROM
expansion search.
10nF
0.1uF
3.3V
3.3V
A[0:12]
D[0:15]
Address
Data
Byte High Enable
Chip Enable
Output Enable
Write Enable
Reset
Interface Configuration
Lock
BHE#
CE#
OE#
WE#
RSTIN#
LOCK#
IF_CFG
Busy
10KOhm
BUSY#
VCC
DiskOnChip
DIMM Plus
Figure 13: Typical System Interface
Notes: 1. The 0.1F and the 10nF low-inductance high-frequency capacitors must be attached to each of the
device's VCC and GND pins. These capacitors must be placed as close as possible to the package
leads.
2. DiskOnChip DIMM Plus is an edge-sensitive device. CE#, OE# and WE# should be properly
terminated (according to board layout, serial parallel or both terminations) to avoid signal ringing.
DiskOnChip DIMM Plus
32
Preliminary Data Sheet, Rev. 1.2
94-SR-002-08-8L
9.2.2 Connecting Signals
DiskOnChip DIMM Plus uses standard SRAM-like control signals, which should be connected as follows:
Address (A[12:0]) Connect these signals to the host address bus.
Data (D[15:0]) Connect these signals to the host data bus.
Write (WE#) and Output Enable (OE#) Connect these signals to the host WR# and RD# signals,
respectively.
Chip Enable (CE#) Connect this signal to the memory address decoder.
Power-On Reset In (RSTIN#) Connect this signal to the host Power-On Reset signal.
Busy (BUSY#) Connect this signal to an input port. It indicates when the device is ready for first access
after reset.
Byte High Enable (BHE#) This signal definition is compatible with 16 bit platforms that use the
BHE#/BLE# protocol. See section 8.3.4. This signal is only relevant during the boot phase.
Hardware Lock (LOCK#) This signal prevents the use of the Write Protect Key to disable the protection.
8/16 bit Configuration (IF_CFG) This signal is required for configuring the device for 8 or 16-bit access
mode. When negated, the device is configured for 8-bit access mode. When asserted, 16-bit access mode is
operative.
DiskOnChip DIMM Plus derives its internal clock signal from the CE#, OE# and WE# inputs. Since access to
DiskOnChip DIMM Plus' registers is volatile, much like a FIFO or UART, ensure that these signals have clean
rising and falling edges, and are free from ringing that can be interpreted as multiple edges. PC board traces for
these three signals must either be kept short or properly terminated to guarantee proper operation.
9.3 Platform-Specific
Issues
The following section describes hardware design issues.
9.3.1 Wait State
Wait states can be implemented only when DiskOnChip DIMM Plus is designed in a bus that supports a Wait state
insertion, and supplies a WAIT signal.
9.3.2 Big and Little Endian Structures
PowerPC, ARM, and other RISC processors can use either Big or Little Endian structures. The DiskOnChip is a
Little Endian device. Therefore bytes D[7:0] are its Least Significant Byte (LSB) and bytes D[15:8] are its Most
Significant Byte (MSB). Within the bytes, bit D0 and bit D8 are the least significant bits of their respective byte.
When connecting the DiskOnChip to a Big Endian device, make sure to that the bytes of the CPU and the
DiskOnChip match.
Note: Processors, such as the PowerPC, also change the bit ordering within the bytes. Failing to follow these rules
will result in improper connection of the DiskOnChip and will prevent the TrueFFS driver from identifying
the DiskOnChip.
9.3.3 Busy Signal
The Busy signal (BUSY#) indicates that DiskOnChip DIMM Plus has not yet completed internal initialization. After
reset, BUSY# is asserted while the IPL is downloaded into the internal SRAM and the Data Protection Structures
(DPS) are downloaded to the Protection State Machines. Once the download process is completed, BUSY# is
negated. It can be used to delay the first access to DiskOnChip DIMM Plus until it is ready to accept valid cycles.
Note: The TrueFFS driver does NOT use this signal to indicate that the flash is in busy state (e.g. program, read, or
erase).
DiskOnChip DIMM Plus
33
Preliminary Data Sheet, Rev. 1.2
94-SR-002-08-8L
9.3.4 8-Bit/16-Bit Bus Width Interface
DiskOnChip DIMM Plus can be configured for either 8-bit or 16-bit bus operations via the IF_CFG signal.
8-Bit (Byte) Data Access Mode
When configured for 8-bit operation, IF_CFG should be negated. Data should then be driven only on the low data
bus signals D[7:0]. D[15:8] and BHE# are internally pulled up and may be left floating.
16-Bit (Word) Data Access Mode
When configured for 16-bit operation, IF_CFG should be asserted. The following definition is compatible with 16-
bit platforms using the BHE#/BLE# protocol:
When the hosts' BLE# signal asserts DiskOnChip A[0], data is valid on D[7:0].
When the hosts' BHE# signal asserts DiskOnChip BHE#, data is valid on D[15:8].
When both A[0] and BHE# are at logic 0, data is valid on D[15:0].
No data is transferred when both BHE# and A[0] are logic 1.
16-bit hosts that do not support byte transfers may hardwire the A[0] and BHE# inputs to logic 0.
Table 3 shows the active data bus lanes in 16-bit configuration.
Table 3: Active Data Bus Lanes in 16-bit Configuration
Inputs
Data Bus Activity
Transfer Type
BHE# A0 D[7:0]
D[15:8]
0 0
Word
0 1
Odd Byte
1 0
Even
Byte
1 1
No
operation
TrueFFS Driver Modifications
TrueFFS supports a wide range of OSs (see section
6.1.1). The TrueFFS driver is set to work in 8-bit data access
mode as the default. To support 16-bit data access modes and their related memory window allocations, TrueFFS
must be modified. In Windows CE and Windows NT-Embedded, these changes can be implemented through the
Registry Entries. In all other cases, some minor customization is required in the driver. Please refer to the
Installation Manual of each specific driver for further information.
DiskOnChip DIMM Plus
34
Preliminary Data Sheet, Rev. 1.2
94-SR-002-08-8L
10. Product
Specifications
10.1 Environmental Specifications
10.1.1 Operating Temperature Ranges
Commercial Temperature Range: 0C to 70C
Extended Temperature Range:
-40
C to +85
C
10.1.2 Thermal Characteristics
Table 4: Thermal Characteristics
Thermal Resistance (
C/W)
Junction to Case (
JC
): 30
Junction to Ambient (
JA
): 85
10.1.3 Humidity
10% to 90% relative, non-condensing
10.1.4 Endurance
DiskOnChip DIMM Plus is based upon NAND flash technology, which has a limited number of erase cycles. The
TrueFFS wear-leveling algorithm significantly enhances the endurance of the flash, increasing the expected life span
by an order of magnitude. Refer to the life span calculator available on M-Systems' web site (
www.m-sys.com
) for
more information.
10.2 Disk Capacity
Table 5: Disk Capacity (in Bytes)
DOS 6.22
VxWorks
Formatted Capacity
Sectors
Formatted Capacity
Sectors
32,800,768 64,064 32,724,992 63,916
65,601,536 128,128 65,634,304 128,192
98,402,304 192,192 98,467,840 192,320
131,203,072 256,256 131,301,376 256,448
DiskOnChip DIMM Plus
35
Preliminary Data Sheet, Rev. 1.2
94-SR-002-08-8L
10.3 Electrical Specifications
10.3.1 Absolute Maximum Ratings
Table 6: Absolute Maximum Ratings
Parameter Symbol Rating
1
Units
Notes
DC supply voltage V
CC
-0.6 to 4.6
V
Input pin voltage
2
V
IN
-0.6 to Vcc+0.3
V
Input pin current
I
IN
-10 to 10
mA
25C
Storage temperature T
STG
-55 to 150
C
Lead temperature T
LEAD
260
C
10 sec
1. Permanent device damage may occur if absolute maximum ratings are exceeded. Exposure to absolute maximum rating conditions for
extended periods may affect device reliability.
2. The voltage on any pin may undershoot to -2.0V or overshoot to 6.6V for less than 20ns.
10.3.2 Capacitance
Table 7: Capacitance
Parameter
Symbol Conditions Min Typ Max
Unit
Input Capacitance
C
IN
V
IN
= 0V
10
pF
Output Capacitance
C
OUT
V
OUT
= 0V
10
pF
Capacitance is not 100% tested.
10.3.3 DC Electrical Characteristics
Table 8: DC Electrical Characteristics
Parameter
Symbol
Conditions
Min Typ
Max
Unit
System Supply Voltage
V
CC
2.7
3.3
3.6
V
High-level Input Voltage
V
IH
2.1
V
Low-level Input Voltage
V
IL
0.7
V
High-level Output Voltage
V
OH
I
OH
= -8mA;
2.4
V
Low-level Output Voltage
V
OL
I
OL
= 8mA
0.4
V
Input Leakage Current
1,2
I
IL
10
A
Output Leakage Current
I
OZ
10
A
8-bit; Cycle time = 100ns
25
45
mA
Active Supply Current
3
I
CC
16-bit; Cycle time = 100ns
25
45
Deep power-down mode
CE# > V
CC
0.2
All other input 0V or V
CC
10 40 A
Standby Supply Current
I
CCS
Non power-down mode or CE# =V
CC
All other inputs 0V or
V
CC
400 600 A
1. The CE# input includes a pull-up resistor which sources 0.3 ~ 1.4
A at Vin = 0V.
2. The D[15:8] and BHE# inputs each include a pull-up resistor which sources 58 ~ 234
A at Vin = 0V when IF_CFG is logic `0'.
3.
VCC = 3.3V, outputs open.
DiskOnChip DIMM Plus
36
Preliminary Data Sheet, Rev. 1.2
94-SR-002-08-8L
10.3.4 AC Characteristics
Environmental and timing specifications are based on the following conditions.
Table 9: AC Test Conditions
Parameter Value
Unit
Ambient Temperature (T
A
)
-40
C to +85 C
C
Supply Voltage (VCC)
2.7 to 3.6
V
Input Pulse Levels
0 to 2.7
V
Input Rise and Fall Times
3
ns
Input Timing Levels
1.5
V
Output Load (VCCQ = 2.7 to 3.6V)
100
pF
DiskOnChip DIMM Plus
37
Preliminary Data Sheet, Rev. 1.2
94-SR-002-08-8L
10.4 Timing Specifications
10.4.1 Read Cycle Timing
CE#
A[12:0], BHE#
t
REC
(OE)
t
HO
(CE1)
t
SU
(CE0)
t
SU
(CE1)
t
HO
(CE0)
t
HIZ
(D)
t
ACC
t
LOZ
(D)
t
HO
(A)
t
SU
(A)
OE#
D[15:0]
WE#
t (OE FRE0)
Figure 14: Read Cycle Timing
Table 10: Read Cycle Timing Definitions
2.7V - 3.6V
Symbol
Description
Min Max
Units
Tsu(A)
Address to OE# setup time
10
ns
T
HO
(A) OE#
to Address hold time
28
ns
T
SU
(CE0)
1
CE#
to OE# setup time
--
ns
T
HO
(CE0)
2
OE#
to CE# hold time
--
ns
T
HO
(CE1)
OE# or WE# to CE# hold time
6
ns
T
SU
(CE1) CE#
to WE# or OE# setup time
6
ns
T
REC
(OE)
OE# negated to start of next cycle
20
ns
Read access time (RAM)
3,4
103
ns
T
ACC
Read access time (all other addresses)
3
85
ns
T
LOZ
(D) OE#
to D driven
10
ns
T
HIZ
(D) OE#
to D Hi-Z delay
25
ns
1. CE# may be asserted any time before or after OE# is asserted. If CE# is asserted after OE#, all timing relative to when OE# was asserted will
be referenced to the time CE# was asserted.
2. CE# may be negated any time before or after OE# is negated. If CE# is negated before OE#, all timing relative to when OE# was negated
will be referenced to the time CE# was negated.
3. The boot block is located at addresses 0000~07FFH and 1800H~1FFFH. Registers located at addresses 0800H~17FFH have a faster access
time than the boot block. Access to the boot block is not required after the boot process has completed.
4. Systems that do not access the boot block may implement only the read access timing for "all other registers". This will increase the systems
performance, however it will prevent access to the boot block.
DiskOnChip DIMM Plus
38
Preliminary Data Sheet, Rev. 1.2
94-SR-002-08-8L
10.4.2 Write Cycle Timing
CE#
A[12:0], BHE#
t
REC
(WE)
t
HO
(CE1)
t
SU
(CE0)
t
HO
(CE0)
t
HO
(D)
tw(WE)
t
SU
(D)
t
HO
(A)
t
SU
(A)
OE#
D[15:0]
WE#
t
SU
(CE1)
Figure 15: Write Cycle Timing
Table 11: Write Cycle Timing Definitions
2.7V - 3.6V
Symbol
Description
Min Max
Units
t
SU
(A)
Address to WE# setup time
10
ns
t
HO
(A) WE#
to Address hold time
28
ns
WE# asserted width (RAM
46
ns
t
W
(WE)
WE# asserted width
(all other addresses)
47
Twcyc
Write Cycle Time
80
ns
t
SU
(CE0)
1
CE#
to WE# setup time
--
ns
t
HO
(CE0)
2
WE#
to CE# hold time
--
ns
t
HO
(CE1)
OE# or WE# to CE# hold
time
6 ns
t
SU
(CE1)
CE# to WE# or OE#
setup time
6 ns
t
REC
(WE) WE#
to start of next cycle
20
ns
t
SU
(D)
D to WE# setup time
51
ns
t
HO
(D) WE#
to D hold time
0
ns
1. CE# may be asserted any time before or after WE# is asserted. If CE# is asserted after WE#, all timing relative to WE# asserted should be
referenced to the time CE# was asserted.
2. CE# may be negated any time before or after WE# is negated. If CE# is negated before WE#, all timing relative to WE# negated will be
referenced to the time CE# was negated.
tT
WCYC
DiskOnChip DIMM Plus
39
Preliminary Data Sheet, Rev. 1.2
94-SR-002-08-8L
10.4.3 Power-Up Timing
DiskOnChip DIMM Plus is reset by assertion of the RSTIN# input. When this signal is asserted, DiskOnChip
initiates a download procedure from the flash memory into the internal XIP of the Programmable Boot Block.
During this procedure, DiskOnChip DIMM Plus does not respond to read or write accesses.
Host systems that boot from DiskOnChip DIMM Plus must employ either option c below or another method to
guarantee the required timing of the first access. All other host systems can employ any of the following methods to
guarantee first-access timing requirements:
a. Use a software loop to wait at least Tp (BUSY1) before accessing the device after the reset signal is
negated.
b. Poll the state of the BUSY# output.
c. Use the BUSY# output to hold the host CPU in wait state before completing the first access.
RSTIN#
Vcc
BUSY#
Vcc Minimum
Operating Voltage
T
W
(RSTIN)
T
P
(BUSY1)
T
REC
(VCC-RSTIN)
CE#
T
P
(BUSY0)
T
SU
(D-BUSY1)
D (Read cycle)
T
HO
(BUSY-CE)
T
P
(VCC_BUSY0)
Figure 16: Reset Timing
Table 12: Power Up Timing Definitions
Symbol) Description
Min
Max
Units
T
REC
(VCC-RSTIN)
1
VCC stable to RSTIN# 500
s
Tp (VCC-BUSY0)
1
VCC stable to BUSY#
500
s
T
W
(RSTIN)
RSTIN# asserted pulse width
30
ns
T
P
(BUSY0)
RSTIN# to BUSY#
50
ns
T
P
(BUSY1)
2
RSTIN#
to BUSY#
1.3
ms
T
HO
(BUSY-CE)
3
BUSY#
to CE# 0
ns
T
SU
(D-BUSY1)
3
Data valid to BUSY# 0
ns
1. Specified from the final positive crossing of Vcc above 2.7V.
2. If the assertion of RSTIN# occurs during a flash erase cycle, this time could be extended by up to 500
S.
3. Normal read/write cycle timing applies. This parameter applies only when the cycle is extended until the negation of the BUSY# signal.
DiskOnChip DIMM Plus
40
Preliminary Data Sheet, Rev. 1.2
94-SR-002-08-8L
10.5 Mechanical Dimensions
Symbol Min
Nom
Max
A 31.60
31.75
31.9
A1 6.00
BSC
A2 3.20
A3 4.00
A4 20.00
BSC
D 67.45
67.60
67.75
D1 24.50
BSC
D2 63.60
BSC
D3 2.50
BSC
D4 2.10
BSC
D5 4.80
BSC
E*
10.20
e1 23.20
BSC
e2 32.80
BSC
N 144
DiskOnChip DIMM Plus
41
Preliminary Data Sheet, Rev. 1.2
94-SR-002-08-8L
11. Ordering
Information
Order Number: MD2241-Dxxx-V3-T
where:
MD2241
DiskOnChip DIMM Plus
Dxxx
Capacity in Mbyte: 32, 64, 96, 128
V3
Power supply: 3.3V
T
Temperature Range
Blank: Commercial temperature range: 0
C to +70C
X: Extended temperature range: -40
C to +85C
Refer to Table 13 for the combinations currently available and the associated order numbers.
Table 13: Available Combinations
Order Number
Capacity (Mbyte)
Temperature Range
MD2241-D32-V3 32 Commercial
MD2241-D64-V3 64 Commercial
MD2241-D96-V3 96 Commercial
MD2241-D128-V3 128
Commercial
MD2241-D32-V3-X 32
Extended
MD2241-D64-V3-X 64
Extended
MD2241-D96-V3-X 96
Extended
MD2241-D128-V3-X 128
Extended
DiskOnChip DIMM Plus
42
Preliminary Data Sheet, Rev. 1.2
94-SR-002-08-8L
Appendix A: Example Code
This appendix provides example code to verify basic DiskOnChip DIMM Plus operations in the system, mainly
useful at first integration stages.
/*------------------------------------------------------------------------------*/
/*
Identify
DiskOnChip
DIMM
Plus
*/
/*
*/
/* The target of this sequence is to make sure that DiskOnChip DIMM Plus
*/
/* is alive and responds to basic commands.
*/
/*
*/
/* Returns: TRUE if DiskOnChip DIMM Plus responds, otherwise FALSE.
*/
/*------------------------------------------------------------------------------*/
/* Release from Power-Down mode (just in case) by performing 3 consecutive reads
*/
/*
from
anywhere
+
1
from
0x1fff
*/
for(i = 0;( i < 4 ); i++ )
read from offset 0x1fff
/* If DiskOnChip DIMM Plus was in Power-Down mode, it is now in Normal mode
*/
/* If DiskOnChip DIMM Plus was in any other mode, it will remain so.
*/
/*
Set
DiskOnChip
DIMM
Plus
to
Reset
mode
*/
Write 0x1c to offset 0x1006 /* to DiskOnChip Control Register
*/
Write 0xe3 to offset 0x1076 /* to DiskOnChip Control Confirmation Register
*/
/*
Set
DiskOnChip
DIMM
Plus
to
Normal
mode
*/
Write 0x1d to offset 0x1006 /* to DiskOnChip Control Register
*/
Write 0xe2 to offset 0x1076 /* to DiskOnChip Control Confirmation Register
*/
/* Verify that DiskOnChip is in Normal mode.
*/
Read from offset 0x1006 into temp
if (temp&0x01) != 1 return (FALSE)
/* Check Chip ID
*/
Read from offset 0x1000 into temp
if
temp!=0x40
return(FALSE)
/* Check toggle bit
*/
/* The toggle bit should toggle on each consecutive read.
*/
Read from offset 0x1046 into temp1
Read from offset 0x1046 into temp2
Read from offset 0x1046 into temp3
DiskOnChip DIMM Plus
43
Preliminary Data Sheet, Rev. 1.2
94-SR-002-08-8L
If ((temp1&0x04) = (temp1&0x04)) return (FALSE)
If ((temp2&0x04) = (temp2&0x04)) return (FALSE)
If (temp3&0x04) != (temp3&0x04) return (FALSE)
/*
Check
Alias
Resolution
Register
*/
Write 0x16 to offset 0x1004
Read from offset 0x1004 into temp
If temp != 0x16 return (FALSE)
Write 0x03 to offset 0x1004
Read from offset 0x1004 into temp
if temp != 0x03 return (FALSE)
Return (True) /* If True, then DiskOnChip DIMM Plus is alive and responding
*/
DiskOnChip DIMM Plus
44
Preliminary Data Sheet, Rev. 1.2
94-SR-002-08-8L
How to Contact Us
Internet:
http://www.m-sys.com
General Information:
info@m-sys.com
Sales and Technical Information:
techsupport@m-sys.com
USA
M-Systems Inc.
8371 Central Ave, Suite A
Newark CA 94560
Phone: +1-510-494-2090
Fax: +1-510-494-5545
Taiwan
Room B, 13 F, No. 133 Sec. 3
Min Sheng East Road
Taipei, Taiwan
R.O.C.
Tel: +886-2-8770-6226
Fax: +886-2-8770-6295
Japan
M-Systems Japan Inc.
Arakyu Bldg., 5F
2-19-2 Nishi-Gotanda Shinagawa-ku
Tokyo 141-0031
Phone: +81-3-5437-5739
Fax: +81-3-5437-5759
China
25A International Business Commercial Bldg.
Nanhu Rd., Lou Hu District
Shenzhen, China 518001
Phone: +86-755-519-4732
Fax: +86-755-519-4729
Europe & Israel
M-Systems Ltd.
Central Park 2000
7 Atir Yeda St.
Kfar Saba 44425, Israel
Tel: +972-9-764-5000
Fax: +972-3-548-8666
2002 M-Systems Flash Disk Pioneers, Ltd. All rights reserved.
This document is for information use only and is subject to change without prior notice. M-Systems Flash Disk Pioneers Ltd. assumes no
responsibility for any errors that may appear in this document. No part of this document may be reproduced, transmitted, transcribed, stored
in a retrievable manner or translated into any language or computer language, in any form or by any means, electronic, mechanical,
magnetic, optical, chemical, manual or otherwise, without prior written consent of M-Systems.
M-Systems products are not warranted to operate without failure. Accordingly, in any use of the Product in life support systems or other
applications where failure could cause injury or loss of life, the Product should only be incorporated in systems designed with appropriate
and sufficient redundancy or backup features.
Contact your local M-Systems sales office or distributor, or visit our website at
www.m-sys.com
to obtain the latest specifications before
placing your order.
DiskOnChip, DiskOnChip DIMM and TrueFFS are registered trademarks of M-Systems. DiskOnKey TM is a trademark of M-
Systems. Other product names mentioned in this document may be trademarks or registered trademarks of their respective owners and are
hereby acknowledged.