ChipFind - документация

Электронный компонент:

Скачать:  PDF   ZIP
Heatsink
For capsule devices
P 17
Features
Dimensions in mm
Dimensions in mm
P 17
1
17-03-2005 ADR
by SEMIKRON
Fig.1 Thermal resistance vs. dissipated power
Fig.5a Thermal resistance and pressure drop vs. air flow
Fig.5b Thermal resistance and pressure drop vs. air flow
Fig.9a Transient thermal impedance vs.time
Fig.9b Transient thermal impedance vs.time
P 17
2
17-03-2005 ADR
by SEMIKRON
Fig.11a Transient thermal impedance vs.time
Fig.11b Transient thermal impedance vs.time
Fig.11c Transient thermal impedance vs.time
Fig.11d Transient thermal impedance vs.time
Fig.11e Transient thermal impedance vs.time
Fig.11f Transient thermal impedance vs.time
P 17
3
17-03-2005 ADR
by SEMIKRON
Dimensions in mm
Dimensions in mm
P 17
4
17-03-2005 ADR
by SEMIKRON